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JPH0245823B2 - - Google Patents
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JPH0245823B2 - - Google Patents

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Publication number
JPH0245823B2
JPH0245823B2 JP57127184A JP12718482A JPH0245823B2 JP H0245823 B2 JPH0245823 B2 JP H0245823B2 JP 57127184 A JP57127184 A JP 57127184A JP 12718482 A JP12718482 A JP 12718482A JP H0245823 B2 JPH0245823 B2 JP H0245823B2
Authority
JP
Japan
Prior art keywords
defect
flaw detection
probe
ultrasonic
channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57127184A
Other languages
Japanese (ja)
Other versions
JPS5917154A (en
Inventor
Akio Suzuki
Hiroshi Kajikawa
Tadashi Nishihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP57127184A priority Critical patent/JPS5917154A/en
Priority to US06/514,864 priority patent/US4524622A/en
Priority to EP83304211A priority patent/EP0102176B1/en
Priority to DE8383304211T priority patent/DE3373709D1/en
Publication of JPS5917154A publication Critical patent/JPS5917154A/en
Publication of JPH0245823B2 publication Critical patent/JPH0245823B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04Analysing solids
    • G01N29/06Visualisation of the interior, e.g. acoustic microscopy
    • G01N29/0609Display arrangements, e.g. colour displays
    • G01N29/0618Display arrangements, e.g. colour displays synchronised with scanning, e.g. in real-time
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04Analysing solids
    • G01N29/11Analysing solids by measuring attenuation of acoustic waves
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/225Supports, positioning or alignment in moving situation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/26Arrangements for orientation or scanning by relative movement of the head and the sensor
    • G01N29/265Arrangements for orientation or scanning by relative movement of the head and the sensor by moving the sensor relative to a stationary material
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/36Detecting the response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/38Detecting the response signal, e.g. electronic circuits specially adapted therefor by time filtering, e.g. using time gates
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4445Classification of defects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/04Wave modes and trajectories
    • G01N2291/044Internal reflections (echoes), e.g. on walls or defects

Landscapes

  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Description

【発明の詳細な説明】 本発明は、超音波法による欠陥の検出方法に関
し、材料の内部に生じた横次状欠陥等の欠陥の方
向、傾き、大きさ、深さを高速で検出し、かつそ
の欠陥の有害度を判定することを目的とする。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for detecting defects using an ultrasonic method. The purpose is to determine the degree of harmfulness of the defect.

鋳造材には、鋳造工程において内部にこもつた
ガス等によつて材料中に横穴状の空胴が発生する
ことがある。この場合、その使用目的により欠陥
の形状とそれが材料強度に及ぼす有害度が明らか
にされているものも少くなく、数種の鋳造材にお
いては、欠陥の有害度がその平面透影図上の大き
さで規定されている。しかし、材料にかかる応力
の方向性から、同じ長さの横穴状欠陥がX方向に
ある場合とY方向にある場合とでは、有害度が異
なるのが通常である。逆に云えば、材料強度的に
許容され得る欠陥の大きさがX方向とY方向とで
異なるのが普通である。このような状況のもとで
は、横穴状欠陥の形状(方向、傾き、大きさ)を
正確に認識することが必要である。
In cast materials, horizontal hole-like cavities may occur in the material due to gas trapped inside during the casting process. In many cases, the shape of the defect and its harmful effect on the strength of the material are clarified depending on the purpose of use. regulated by size. However, due to the directionality of the stress applied to the material, the level of harm is usually different depending on whether a horizontal hole-like defect of the same length is located in the X direction or in the Y direction. Conversely, the size of defects that can be tolerated in terms of material strength usually differs between the X direction and the Y direction. Under such circumstances, it is necessary to accurately recognize the shape (direction, inclination, size) of the horizontal hole-like defect.

処で、このような内部欠陥の検出方法として、
被検材の内部に超音波ビームを発信し、欠陥から
のエコーを受信する超音波法が従来から提供され
かつ実用に供されている。しかし、従来の超音波
法は、単に探触子を被検材の探傷域内で所定方向
に移動させてエコーを捉えるだけであるため、そ
のエコーを表示媒体上に表示した探傷パターンか
ら判定し得る要素は極く限られたものであり、横
穴状欠陥の形状を完全に捉えることは困難であつ
た。
However, as a method for detecting such internal defects,
2. Description of the Related Art Ultrasonic methods that transmit an ultrasonic beam into the interior of a material to be inspected and receive echoes from defects have been conventionally provided and put into practical use. However, in the conventional ultrasonic method, the probe is simply moved in a predetermined direction within the flaw detection area of the test material and the echoes are captured, so the echoes cannot be determined from the flaw detection pattern displayed on the display medium. The number of elements was extremely limited, and it was difficult to completely capture the shape of the hole-like defect.

そこで、本発明者等は、被検材内部の探傷領域
で回転中心と交差するように超音波ビームを送受
する斜角探触子を用い、この斜角探触子を回転中
心廻りに回転させながら360゜の各方向から超音波
ビームの送受を行ない、探傷ゲート内に生じたエ
コーのピーク値を超音波ビームの入射方向に対応
させて表示媒体上に探傷パターンとして表示し、
この探傷パターンから欠陥の方向、傾き、大き
さ、深さを判定する方法を発明した。これは、従
来の超音波法と異なり、被検材内部の欠陥の形
状、即ち方向、傾き、大きさ、深さを確実に認識
できる利点がある。しかし、探触子が1個である
ため、深さを識別するには、探傷深さを変えなが
ら同様の動作を数回繰返す必要があり、探傷時間
が多少長くなる欠点がある。また欠陥の有害度の
判定は作業員が行なうので、小さな材料の探傷の
場合には別段問題ないが、特に大きな材料を探傷
する際には採用できず、また現場でオンラインに
より探傷し有害度を判定すると云うことはできな
い。
Therefore, the present inventors used an angle probe that transmits and receives an ultrasonic beam in a flaw detection area inside the test material so as to intersect the center of rotation, and rotated the angle probe around the center of rotation. The ultrasonic beam is transmitted and received from each direction of 360 degrees, and the peak value of the echo generated within the flaw detection gate is displayed as a flaw detection pattern on the display medium in correspondence with the incident direction of the ultrasonic beam.
We have invented a method to determine the direction, inclination, size, and depth of defects from this flaw detection pattern. Unlike the conventional ultrasonic method, this method has the advantage of being able to reliably recognize the shape, ie, direction, inclination, size, and depth of defects inside the specimen. However, since there is only one probe, in order to identify the depth, it is necessary to repeat the same operation several times while changing the flaw detection depth, which has the disadvantage that the flaw detection time is somewhat longer. In addition, since the degree of toxicity of defects is determined by the worker, there is no particular problem when detecting small materials, but it cannot be used when detecting particularly large materials, and the degree of toxicity is determined by on-site flaw detection online. I cannot say that I have judged it.

本発明は、このような問題点に鑑み、探傷深さ
の異なる複数個の斜角探触子を同時に使用し、複
数チヤンネルの探傷パターンを求めることにより
深さに関する認識も一挙に行なうと共に、その探
傷パターンに含まれている欠陥情報を相関法を利
用して解読し、オンラインで極く短時間のうちに
有害度を判定するものであつて、その特徴とする
ところは、被検材内部の欠陥を超音波法により検
出するに際し、被検材内部の探傷領域で回転中心
と交差するように超音波ビームを送受しかつ探傷
深さの異なる複数チヤンネルの斜角探触子を用
い、この各チヤンネルの斜角探触子を回転中心廻
りに回転させながら360゜の各方向から夫々超音波
ビームを送受し、各チヤンネルの探傷ゲート内に
生じたエコーのピーク値を各チヤンネル毎に夫々
入射方向に対応させた複数個の探傷パターンをつ
くり、この各探傷パターンと予め設定された参照
パターンとの相関を求めることにより欠陥の方
向、傾き、大きさ、深さを解読し、その結果から
欠陥の有害度を判定する点にある。
In view of these problems, the present invention uses a plurality of angle probes with different flaw detection depths at the same time and obtains flaw detection patterns of multiple channels, thereby simultaneously recognizing the depth. The defect information included in the flaw detection pattern is decoded using a correlation method, and the degree of toxicity is determined online in a very short time. When detecting defects using the ultrasonic method, an angle probe with multiple channels of different depths is used to transmit and receive an ultrasonic beam so as to intersect the rotation center in the detection area inside the material being tested. While rotating the bevel probe of each channel around the center of rotation, ultrasonic beams are transmitted and received from each direction of 360°, and the peak value of the echo generated within the flaw detection gate of each channel is measured in each direction of incidence for each channel. By creating multiple flaw detection patterns corresponding to the The point is to judge the degree of harm.

次に本発明の原理を説明する。第1図A,Bは
屈折角θの斜角探触子1を用いて斜角式超音波探
傷法により被検材2中の傾きηの横穴状欠陥3を
探傷する場合の超音波ビーム4の路程を示す。但
しθηとする。第1図A,Bに示す如く、探触
子1を回転中心廻り始線位置(欠陥を材表面に投
影した時の長手方向の位置)から矢印方向へと1
回転させながら超音波ビーム4を発信した場合、
超音波ビーム4が欠陥3に垂直に入射する方向
は、始線からα1、α2回転した位置の2方向ある。
これを図中の符号を用いて示すと、P→Q→R→
Q→PとP′→Q′→R′→Q′→R′で示される。従つ
て、αとηとθとの間には、簡単な幾何計算から
次式の関係があることが分る。
Next, the principle of the present invention will be explained. FIGS. 1A and 1B show an ultrasonic beam 4 when detecting a horizontal hole-like defect 3 with an inclination η in a test material 2 by the oblique ultrasonic flaw detection method using an oblique probe 1 with a refraction angle θ. It shows the route of However, it is assumed to be θη. As shown in Fig. 1A and B, the probe 1 is moved 1 in the direction of the arrow from the starting line position (the position in the longitudinal direction when the defect is projected onto the material surface) around the center of rotation.
When the ultrasonic beam 4 is transmitted while rotating,
There are two directions in which the ultrasonic beam 4 is perpendicularly incident on the defect 3: positions rotated by α 1 and α 2 from the starting line.
This is shown using the symbols in the figure: P→Q→R→
It is shown as Q→P and P'→Q'→R'→Q'→R'. Therefore, it can be seen from a simple geometrical calculation that the following relationship exists between α, η, and θ.

cos(α2−α1/2)=tanη/tanθ 実際に、探触子1を回転させながら、第1図B
に示した入射点の軌跡Cに沿つて超音波ビーム4
を送受し、その時に得られたエコーのピーク値を
入射方向αに対してプロツトすると、第2図に示
したような探傷パターンが得られる。このような
探傷パターンの角度に関する特徴は式で決めら
れ、ピーク値の最大は欠陥3の大きさで定まるも
のである。欠陥3の大きさとエコー高さとの関係
は、従来から用いられている探傷方程式を利用す
ることもできるし、人工欠陥からの実測値を利用
することもできる。このようなことから、第2図
に示した探傷パターンは、欠陥3の方向、傾き、
大きさの情報を含んでいるものであることが分
る。
cos (α 2 − α 1 /2) = tan η / tan θ Actually, while rotating the probe 1,
The ultrasonic beam 4 is transmitted along the trajectory C of the incident point shown in
When the peak value of the echo obtained at that time is plotted against the incident direction α, a flaw detection pattern as shown in FIG. 2 is obtained. The angle-related characteristics of such a flaw detection pattern are determined by a formula, and the maximum peak value is determined by the size of the defect 3. For the relationship between the size of the defect 3 and the echo height, a conventional flaw detection equation can be used, or an actual value from an artificial defect can be used. For this reason, the flaw detection pattern shown in Fig. 2 is based on the direction and inclination of the defect 3.
It turns out that it contains size information.

通常、始線の方向を被検材2の形状の特別な方
向、例えば長手方向等に選ぶので、欠陥3の方向
はそのような始線から測ることになる。その時は
欠陥3の方向は、次式で与えられる。
Usually, the direction of the starting line is selected to be a special direction of the shape of the material 2 to be inspected, such as the longitudinal direction, so the direction of the defect 3 is measured from such the starting line. At that time, the direction of defect 3 is given by the following equation.

β1+β2/2(β2−β1180゜) β1+β2/2+180゜(β2−β1180゜) また欠陥3の傾きηは、次式より求められる。 β 12 /2 (β 2 −β 1 180°) β 12 /2+180° (β 2 −β 1 180°) The slope η of the defect 3 can be obtained from the following equation.

cos(β2−β1/2)=tanη/tanθ(β2−β1180゜
) cos(180゜−β2−β1/2)=tanη/tanθ(β2−β1
180゜) このような操作は、図形認識力が備わつた人間
ならば実行することができるのであるが、それに
は多大な時間が必要である。一方、実用的な面か
ら考えて欠陥3の傾きは±2.5゜の誤差で0゜〜45゜ま
でが検出判断できれば十分である。そこで、上記
のような判定を機械に実行させる手段として相関
法を利用した。
cos (β 2 - β 1 /2) = tan η / tan θ (β 2 - β 1 180°) cos (180 ° - β 2 - β 1 /2) = tan η / tan θ (β 2 - β 1
180°) Such operations can be performed by people who have the ability to recognize shapes, but it takes a lot of time. On the other hand, from a practical point of view, it is sufficient if the inclination of the defect 3 can be detected and determined from 0° to 45° with an error of ±2.5°. Therefore, we used a correlation method as a means of having a machine perform the above-mentioned judgments.

相互相関の処理は次式で与えられる。 The cross-correlation process is given by the following equation.

C(S)=1/360∫360 0r(α)f(α+S)dα ここに、f(α)、r(α)は0α360で定義
された任意の関数である。相互相関処理は、近
年、画像処理におけるパターン認識技術、通信技
術におけるエラー補正技術等に応用されている
が、本発明は探傷パターンを図形を考えて、未知
の探傷パターンを既知の参照パターンと比較し
て、最も類似点の高い参照パターンと相似とみな
すものである。
C(S)=1/360∫ 360 0 r(α) f(α+S) dα Here, f(α) and r(α) are arbitrary functions defined by 0α360. In recent years, cross-correlation processing has been applied to pattern recognition technology in image processing, error correction technology in communication technology, etc., but the present invention considers the shape of the flaw detection pattern and compares an unknown flaw detection pattern with a known reference pattern. The pattern is then considered similar to the reference pattern with the highest similarity.

この処理を簡単に説明すると、以下のようにな
る。第3図はひとつの探傷パターンと5種類の参
照パターンr1(α)〜r5(α)の例を示す。人間の
場合、本来のパターン認識機能から山の数、山と
山との距離、山の傾斜を比べることができる。そ
して、探傷パターンと参照パターンとの重なりを
調べて、最も重なり具合いの大きかつたr4(α)
と同じであると判断する。このような操作が相関
処理であり、どの程度重なり合つているかと云う
ことを定量的にするために、重なり合つている部
分の面積に比例した値としての式が導入された
ものである。式におけるSは、上述したように
2つのパターンを重ね合すときの横軸のずれの量
である。
A brief explanation of this process is as follows. FIG. 3 shows an example of one flaw detection pattern and five types of reference patterns r 1 (α) to r 5 (α). Humans can compare the number of mountains, the distance between them, and the slope of the mountains using their natural pattern recognition capabilities. Then, check the overlap between the detection pattern and the reference pattern, and find the one with the greatest degree of overlap r 4 (α)
is determined to be the same as Such an operation is a correlation process, and in order to quantitatively determine the degree of overlap, a formula has been introduced as a value proportional to the area of the overlapped portion. S in the equation is the amount of shift on the horizontal axis when two patterns are superimposed as described above.

この場合、参照パターンは、本来、横穴状人工
欠陥から実測により、或いは式に従つて計算に
より作成するものであり、それらの人工欠陥の特
性(方向、傾き)は既知であるので、ずれの量S
は、人工欠陥の方向と、今、検出した欠陥の方向
のずれを与えるものである。
In this case, the reference pattern is originally created from the horizontal hole-like artificial defect by actual measurement or by calculation according to a formula, and since the characteristics (direction, inclination) of these artificial defects are known, the amount of deviation can be calculated. S
gives the deviation between the direction of the artificial defect and the direction of the defect just detected.

以上のような原理を応用して、参照パターンと
して方向と長さと反射面の深さが同じで、傾きが
0、5、10、15、20、25、30、35、40、45゜の10
種類の横穴人工欠陥から得られたものを用意して
おき、今得られたばかりの探傷パターンと相関を
とることにより、欠陥の方向、傾きを検出するこ
とができる。この時の参照パターンは、最大値を
一定にしておくと、欠陥の分類が最もうまくでき
る。また、相関法はS/N向上のための信号処理
にもよく用いられるように、第4図に示すような
探傷パターンが多くの雑音を含む場合にも有効で
ある。このような雑音を含む探傷パターン(実際
の探傷において通常の場合である)に対しては、
山の数、山と山との距離を測ると云うような操作
は、機械にとつては極めて困難である。
Applying the above principle, we created 10 reference patterns with the same direction, length, and depth of the reflective surface, and with inclinations of 0, 5, 10, 15, 20, 25, 30, 35, 40, and 45 degrees.
The direction and inclination of the defect can be detected by preparing data obtained from various types of side-hole artificial defects and correlating them with the flaw detection pattern just obtained. Defect classification can be best achieved by keeping the maximum value of the reference pattern constant at this time. Furthermore, the correlation method is also effective when the flaw detection pattern as shown in FIG. 4 contains a lot of noise, as it is often used for signal processing to improve S/N. For flaw detection patterns containing such noise (which is the usual case in actual flaw detection),
Operations such as measuring the number of mountains and the distance between them are extremely difficult for machines.

次に本発明における欠陥検出装置の一実施例を
説明する。第5図及び第6図は4探触子型の局部
水浸法による検出装置を示し、5はX軸及びY軸
方向に走査可能に設けられた支持板で、この支持
板5の下側面に、被検材2上を移動自在な水槽6
が設けられ、この水槽6内に探触子回転機構7が
配置され、かつその内部に水8が供給されてい
る。探触子回転機構7は軸受9,10を介して支
持板5上の軸受ケース11に回転自在に保持され
た筒状の回転軸12と、この回転軸12の下端に
装着された探触子ホルダー13とを有し、その探
触子ホルダー13には周方向に90゜のピツチで4
個の斜角探触子14,15,16,17が組込ま
れている。探触子14,15,16,17は被検
材2の表面から20mmの範囲を8mmのピツチで探傷
できるように配置したが、これに限定されるもの
ではない。各探触子14,15,16,17は例
えば屈折角θが45゜超音波ビーム14a,15a,
16a,17aのビーム径が9.2mmであつて、第
7図に示すようにその各超音波ビーム14a,1
5a,16a,17aが深さ2.5、7.5、12.5、
17.5mmの位置で回転中心と交差するように、夫々
回転中心から僅かずつ距離を変えて配置されてい
る。従つて、探触子14,15,16,17を1
回転させた時、夫々の探傷ゲート14b,15
b,16b,17b内のエコーを受信すれば、そ
の探傷領域は第7図に示す如く算盤玉状(斜線で
示す部分)となり、この範囲にある欠陥のエコー
を捉えることができる。18は探触子回転機構7
を駆動するモータ、19は探触子回転機構7の回
転角を検出するロータリエンコーダであつてこれ
らは支持板5に装着されており、ベルト伝動機構
20,21を介して回転軸12に連動連結されて
いる。22は探触子回転機構7の各探触子14,
15,16,17に対して超音波信号を送受する
ためのスリツプリングである。
Next, an embodiment of the defect detection device according to the present invention will be described. 5 and 6 show a detection device using a four-probe type local water immersion method, 5 is a support plate provided to be able to scan in the X-axis and Y-axis directions, and the lower surface of this support plate 5. , a water tank 6 that can be moved freely over the test material 2
A probe rotation mechanism 7 is disposed within the water tank 6, and water 8 is supplied therein. The probe rotation mechanism 7 includes a cylindrical rotating shaft 12 rotatably held in a bearing case 11 on a support plate 5 via bearings 9 and 10, and a probe mounted on the lower end of this rotating shaft 12. holder 13, and the probe holder 13 has four probes arranged at a pitch of 90° in the circumferential direction.
Angle angle probes 14, 15, 16, and 17 are incorporated. Although the probes 14, 15, 16, and 17 are arranged so that they can detect flaws within a range of 20 mm from the surface of the test material 2 at a pitch of 8 mm, the present invention is not limited thereto. For example, each probe 14, 15, 16, 17 has an ultrasonic beam 14a, 15a, with a refraction angle θ of 45°.
The beam diameter of the ultrasonic beams 16a and 17a is 9.2 mm, and as shown in FIG.
5a, 16a, 17a are depth 2.5, 7.5, 12.5,
They are arranged at slightly different distances from the rotation center so that they intersect with the rotation center at a position of 17.5 mm. Therefore, the probes 14, 15, 16, 17 are
When rotated, the respective flaw detection gates 14b and 15
If echoes within b, 16b, and 17b are received, the detection area becomes an abacus bead shape (the shaded area) as shown in FIG. 7, and echoes of defects within this range can be captured. 18 is the probe rotation mechanism 7
19 is a rotary encoder that detects the rotation angle of the probe rotation mechanism 7. These are mounted on the support plate 5, and are interlocked and connected to the rotation shaft 12 via belt transmission mechanisms 20 and 21. has been done. 22 each probe 14 of the probe rotation mechanism 7;
This is a slip ring for transmitting and receiving ultrasonic signals to and from terminals 15, 16, and 17.

第8図は信号処理装置のブロツク図を示し、こ
の第8図を参照しながら探傷時の動作を説明す
る。23は探触子回転機構7をX軸、Y軸方向に
走査する走査機構、24はこの走査機構23を制
御するコントローラである。25,26,27,
28は4チヤンネルCH1、CH2、CH3、CH4の探
触子14,15,16,17に対応して設けられ
たパルサレシーバ、29,30,31,32はア
ナログピークホールド回路であり、探傷時に探触
子回転機構7を回転させながら各探触子14,1
5,16,17により被検材2に対して超音波ビ
ーム14a,15a,16a,17aを送信する
とその被検材2内の欠陥3からの反射エコーが探
触子14,15,16,17を経てパルサレシー
バ25,26,27,28により受信され、探傷
ゲート14b,15b,16b,17bに生じた
信号のピーク値をアナログピークホールド回路2
9,30,31,32がホールドする。33,3
4,35,36はピーク値をA/D変換器、3
7,38,39,40はシフトレジスタであり、
(360/128)゜毎に128の入射方向からピーク値、
即ち、探傷パターンを一時記憶する。なお、入射
方向はロータリエンコーダ19により検出されて
おり、探傷パターンは各チヤンネル毎に入射方向
に対応して作成されることは云うまでもない。4
1はRAM、ROM等のメモリーで、後述するよ
うにこれには10種類の参照パターンが記憶されて
いる。42はデータセレクタ、43はデイジタル
相関器であつて、データセレクタ42を通して各
チヤンネル毎に送られて来る探傷パターンとメモ
リー41に収められた参照パターンとの相関処理
を順次行なう。44はデイジタルピークデイテク
タで、各チヤンネルの探傷パターンと参照パター
ンとの相関値の最大値を検出する。またこの時の
ずれ量Sをデータラツチ45により検出する。こ
のようにして検出された各チヤンネル毎の相関値
の最大値Cmi(i=1、2、3、4)とずれ量Si
(i=1、2、3、4)、及び走査機構23の現在
位置(x、y)は、データセレクタ46により順
序付けられてシフトレジスタ47に格納される。
なお、デイジタル相関器43以降の信号処理は、
後述の如くコンピユータを用いたソフトウエアで
も実行できるが、その場合には長い時間を要する
のが普通である。
FIG. 8 shows a block diagram of the signal processing device, and the operation during flaw detection will be explained with reference to FIG. 23 is a scanning mechanism that scans the probe rotation mechanism 7 in the X-axis and Y-axis directions, and 24 is a controller that controls this scanning mechanism 23. 25, 26, 27,
28 is a pulser receiver provided corresponding to the probes 14, 15, 16, and 17 of 4 channels CH 1 , CH 2 , CH 3 , and CH 4 , and 29 , 30 , 31 , and 32 are analog peak hold circuits. , each probe 14,1 while rotating the probe rotation mechanism 7 during flaw detection.
When the ultrasonic beams 14a, 15a, 16a, 17a are transmitted to the specimen 2 by the probes 5, 16, 17, the reflected echo from the defect 3 in the specimen 2 is transmitted to the probes 14, 15, 16, 17. are received by the pulser receivers 25, 26, 27, 28 through the analog peak hold circuit 2, and the peak values of the signals generated at the flaw detection gates 14b, 15b, 16b, 17b are transferred to the analog peak hold circuit 2.
9, 30, 31, 32 hold. 33,3
4, 35, 36 are A/D converters for peak values, 3
7, 38, 39, 40 are shift registers,
Peak value from 128 incident directions every (360/128)°,
That is, the flaw detection pattern is temporarily stored. Note that the direction of incidence is detected by the rotary encoder 19, and it goes without saying that a flaw detection pattern is created for each channel corresponding to the direction of incidence. 4
1 is a memory such as RAM or ROM, which stores 10 types of reference patterns as described later. 42 is a data selector, and 43 is a digital correlator, which sequentially performs correlation processing between the flaw detection pattern sent for each channel through the data selector 42 and the reference pattern stored in the memory 41. A digital peak detector 44 detects the maximum correlation value between the flaw detection pattern of each channel and the reference pattern. Also, the amount of deviation S at this time is detected by the data latch 45. The maximum value Cmi (i=1, 2, 3, 4) of the correlation value for each channel detected in this way and the deviation amount Si
(i=1, 2, 3, 4) and the current position (x, y) of the scanning mechanism 23 are ordered by the data selector 46 and stored in the shift register 47.
Note that the signal processing after the digital correlator 43 is as follows.
Although it can be executed using software using a computer as described later, it usually takes a long time in that case.

デイジタル相関器43の出力をD/A変換した
ものを第9図に示し、またその時の探傷パターン
を第10図に示す。この時の欠陥3は、第11図
A,Bに示す通りである。欠陥3の傾きηは24゜
であり、第9図から25゜の参照パターンと最大の
相関をとつていることが分る。また相関のピーク
値が+60゜だけ中心(=0゜)からずれていること
から、この欠陥3の方向は被検材2の特定方向に
対して60゜の方向にあることが分る。
FIG. 9 shows the D/A converted output of the digital correlator 43, and FIG. 10 shows the flaw detection pattern at that time. The defect 3 at this time is as shown in FIGS. 11A and 11B. The slope η of defect 3 is 24°, and it can be seen from FIG. 9 that it has the maximum correlation with the reference pattern of 25°. Furthermore, since the peak value of the correlation is shifted from the center (=0°) by +60°, it can be seen that the direction of this defect 3 is 60° with respect to the specific direction of the specimen 2.

このような判断は、実際にはインターフエース
48を通してシフトレジスタ47のデータをコン
ピユータ(図示省略)に転送することにより容易
かつ高速に実行させることができる。以下にコン
ピユータ内での処理を述べる。
Such a determination can actually be easily and quickly executed by transferring the data in the shift register 47 to a computer (not shown) through the interface 48. The processing within the computer will be described below.

第7図に示したように各チヤンネルの超音波ビ
ーム14a,15a,16a,17aは、被検材
2中で重なつているので、ひとつの欠陥3から複
数個のチヤンネルに有意な相関値Cmiが出現す
る。従つて、その場合には、欠陥3の反射面の深
さを次式により計算する。
As shown in FIG. 7, the ultrasonic beams 14a, 15a, 16a, and 17a of each channel overlap in the test material 2, so one defect 3 has a significant correlation value Cmi for multiple channels. appears. Therefore, in that case, the depth of the reflective surface of the defect 3 is calculated using the following formula.

次に、欠陥3の反射面が超音波ビームの中心線
上からずれていることを補正する。
Next, the deviation of the reflecting surface of the defect 3 from the center line of the ultrasonic beam is corrected.

C′mi={1+k|d−di|/di}Cmi ここに、kは探触子径、周波数等に依存した比
例定数である。このようにして得られたC′miか
ら欠陥3の長さを判定することができる。第12
図に直径がφ2で長さがl、傾き35゜の欠陥から得
られた探傷パターンと傾きη=35゜の参照パター
ンとの相関値の最大値の実測値(X印)を示す。
このようなデータから受信音圧のずれが相関値に
及ぼす効果を計算し、kを決定することができ
る。
C′mi={1+k|d−di|/di}Cmi Here, k is a proportionality constant depending on the probe diameter, frequency, etc. The length of the defect 3 can be determined from C′mi obtained in this way. 12th
The figure shows the actual measured value (marked with an X) of the maximum correlation value between a flaw detection pattern obtained from a defect with a diameter of φ2, a length of l, and an inclination of 35° and a reference pattern with an inclination of η = 35°.
From such data, it is possible to calculate the effect of the received sound pressure shift on the correlation value and determine k.

なお、探傷中、探触子回転機構7のXY位置
(欠陥のXY位置に対応している)は、コントロ
ーラ24からデータセレクタ46を介してシフト
レジスタ47に格納され、インターフエース48
を介して相関最大値等のデータと共にコンピユー
タに転送される。そして、このデータは後に有害
欠陥の探傷データの表示の時に、欠陥3の位置情
報としてCRT上に表示される。第8図中、49
はタイミングコントローラである。探触子回転機
構7は電子走査型探触子に置き換えることも可能
である。
During flaw detection, the XY position of the probe rotation mechanism 7 (corresponding to the XY position of the defect) is stored in the shift register 47 from the controller 24 via the data selector 46, and is stored in the shift register 47 via the interface 48.
The data is transferred to the computer along with data such as the maximum correlation value. Then, this data is later displayed on the CRT as position information of the defect 3 when displaying the detection data of the harmful defect. 49 in Figure 8
is a timing controller. The probe rotation mechanism 7 can also be replaced with an electronic scanning probe.

第13図はコンピユータ50のソフトウエア上
で欠陥3の形状認識を行なう場合の信号の流れを
示すブロツク図である。なお、第8図と同一名称
物については同一符号を付し、説明を省略する。
この場合には、パルサレシーバ25,26,2
7,28、アナログピークホールド回路29,3
0,31,32及びA/D変換器33,34,3
5,36を経て、探触子14,15,16,17
の回転角に対応して得られたエコーのピーク値を
1回転分収集してメモリー51に記憶し、探傷パ
ターンを作成する。メモリー51はコンピユータ
50の外部メモリになつており、探触子14,1
5,16,17が次の回転における第回目の超音
波ビームを送受する前に、DMAによりメモリー
51の探傷パターンをコンピユータ50のインタ
ーフエース52を介して内部メモリ53に転送す
る。コンピユータ50はCPU54、探傷データ
を表示するCRTデイスプレー55、探傷データ
を格納するフロツピーデイスク56等を有する。
FIG. 13 is a block diagram showing the flow of signals when the shape of the defect 3 is recognized on the software of the computer 50. Components with the same names as those in FIG. 8 are denoted by the same reference numerals, and explanations thereof will be omitted.
In this case, the pulsar receivers 25, 26, 2
7, 28, analog peak hold circuit 29, 3
0, 31, 32 and A/D converters 33, 34, 3
5, 36, probes 14, 15, 16, 17
The peak values of the echoes obtained corresponding to the rotation angles are collected for one rotation and stored in the memory 51 to create a flaw detection pattern. The memory 51 serves as an external memory for the computer 50, and the probes 14,1
5, 16, and 17 transmit and receive the first ultrasonic beam in the next rotation, the flaw detection pattern in the memory 51 is transferred to the internal memory 53 via the interface 52 of the computer 50 by DMA. The computer 50 includes a CPU 54, a CRT display 55 for displaying flaw detection data, a floppy disk 56 for storing flaw detection data, and the like.

コンピユータ50は第14図に示すフローチヤ
ートに従つて信号を処理する。なお、第14図
中、探傷パターンはAi(α)で示し、その添字i
はチヤンネル、αは回転角である。参照パターン
はRj(α)で示し、そのjは欠陥の傾きを示す。
Ai(α)とRj(α)との相関式は、 Rji(S)=1/360∫360 0Ai(α)Rj(α+S)dα で与えられる。この式はソフトウエアとして一
般に提供されている。
Computer 50 processes the signals according to the flowchart shown in FIG. In Fig. 14, the flaw detection pattern is indicated by Ai (α), and its subscript i
is the channel and α is the rotation angle. The reference pattern is denoted by Rj (α), where j indicates the slope of the defect.
The correlation equation between Ai (α) and Rj (α) is given by Rji (S) = 1/360∫ 360 0 Ai (α) Rj (α + S) dα. This formula is generally provided as software.

本発明を鋳造製プロベラ57の探傷に適用した
場合について説明する。このプロペラ57の探傷
域58は第15図に示す斜線部の如く1200×800
mm/翼であり探傷深さが表面から20mmとする。こ
の探傷域58に含まれる横穴状の欠陥3を検出
し、その中から有害な欠陥だけを出力するのであ
るが、プロペラ57の有害欠陥は応力のかかる方
向を考慮して周方向への投影長さlcで評価する。
また有害度は欠陥3の先端深さqによつても異な
る。従つて、欠陥3の有害度は、第16図A,B
に示す欠陥投影長さlcと第17図に示す欠陥先端
深さqとによつて定義される。このことからコン
ピユータ50は、最終処理として次のことを行な
う。
A case will be described in which the present invention is applied to flaw detection of a cast prober 57. The flaw detection area 58 of this propeller 57 is 1200 x 800 as shown in the shaded area in Fig. 15.
mm/wing, and the flaw detection depth is 20 mm from the surface. The horizontal hole-shaped defects 3 included in this flaw detection area 58 are detected, and only harmful defects are output from them. However, the harmful defects of the propeller 57 are determined by the projected length in the circumferential direction, taking into account the direction in which stress is applied. Evaluate by slc.
Further, the degree of harmfulness also differs depending on the depth q of the tip of the defect 3. Therefore, the degree of harmfulness of defect 3 is as shown in Fig. 16 A and B.
It is defined by the defect projection length lc shown in FIG. 17 and the defect tip depth q shown in FIG. From this, the computer 50 performs the following as final processing.

(i) 欠陥投影長さlcの計算 lc=lcosη*sinα ここでlは欠陥の実長、ηは欠陥の傾き、α
は半径方向を始線とした欠陥の方向である。
(i) Calculation of defect projected length lc lc = lcosη*sinα where l is the actual length of the defect, η is the slope of the defect, α
is the direction of the defect starting from the radial direction.

(ii) 欠陥先端深さqの計算 q=Max{0,(d−1/2lsinη)} ここでdは欠陥の中心深さ (iii) 欠陥出力するか否かの判定 0≦q≦10のときlc≧4mm 0≦q≦20のときlc≧8mm これを許容投影欠陥寸法として二段階に分け
て定義する。
(ii) Calculation of defect tip depth q q=Max{0, (d-1/2lsinη)} Here, d is the center depth of the defect (iii) Determination of whether to output the defect 0≦q≦10 When lc≧4mm When 0≦q≦20, lc≧8mm These are defined as allowable projected defect dimensions in two stages.

従つて、コンピユータ50は、第14図のフロ
ーチヤートに示すように、の計算を行ない、
の何れかの条件を満たすとき、プリンタ上に
XY位置の情報と共に有害欠陥として出力する。
Therefore, the computer 50 performs the calculation as shown in the flowchart of FIG.
on the printer when any of the conditions are met.
Output as a harmful defect along with XY position information.

以上実施例に詳述したように本発明方法によれ
ば、探傷深さの異なる複数チヤンネルの斜角探触
子を用い、これら探触子を同時に回転させながら
超音波ビームの送受を行ない、各チヤンネルの探
傷ゲート内に生じたエコーのピーク値を捉えて探
傷パターンを得るので、1個の探触子による場合
のように探傷深さを変えながら同一箇所を数回に
わたつて探傷する必要がなく、能率的に作業を行
なうことができる。また、各チヤンネルの探傷ゲ
ート内に生じたエコーのピーク値を各チヤンネル
毎に夫々入射方向に対応させた複数個の探傷パタ
ーンをつくり、この各探傷パターンと予め設定さ
れた参照パターンとの相関を求めることにより欠
陥の方向、傾き、大きさ、深さを解読するので、
第7頁第示す式を応用して欠陥の方向性を簡単
かつ確実に解読することができるし、また既知の
参照パターンをたくみに利用して、第9頁及び第
16頁に示す式〜の単純なデジタル計算にて、
パターン化された探傷信号から高速にて欠陥の方
向、傾き、および大きさを判断することが可能に
なる。しかも第19頁に示す式〜を用いた計算
により、欠陥の有害度も単純な信号処理で極めて
高速に行うことができる。従つて、探傷パターン
そのものから判定する場合に比較してコンピユー
タやハードウエアの論理回路を用いた機械による
判定が容易であり、この点でも高速化を著しく促
進できる。
As described in detail in the embodiments above, according to the method of the present invention, bevel probes with multiple channels with different flaw detection depths are used, and ultrasonic beams are transmitted and received while rotating these probes at the same time. Since the flaw detection pattern is obtained by capturing the peak value of the echo generated within the flaw detection gate of the channel, it is not necessary to detect the same location several times while changing the flaw detection depth, unlike when using a single probe. You can work efficiently without any problems. In addition, multiple flaw detection patterns are created in which the peak value of the echo generated within the flaw detection gate of each channel corresponds to the incident direction, and the correlation between each of these flaw detection patterns and a preset reference pattern is calculated. By determining the direction, slope, size, and depth of the defect,
The directionality of defects can be easily and reliably deciphered by applying the formula shown on page 7, and by skillfully utilizing known reference patterns,
By simple digital calculation of the formula ~ shown on page 16,
It becomes possible to determine the direction, inclination, and size of defects at high speed from patterned flaw detection signals. Moreover, by calculating the degree of harmfulness of a defect using the formula shown on page 19, it is possible to calculate the degree of harmfulness of a defect extremely quickly with simple signal processing. Therefore, compared to the case of making a judgment based on the flaw detection pattern itself, it is easier to make a judgment by a machine using a computer or hardware logic circuit, and in this respect as well, speeding up can be significantly promoted.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本発明の実施例を例示するものであつ
て、第1図A,Bは超音波ビームの路程を示す説
明図、第2図は探傷パターンの波形図、第3図は
相関処理の説明図、第4図は実際の探傷パターン
の波形図、第5図は探触子回転機構部の断面図、
第6図は探触子ホルダー部の底面図、第7図は探
傷領域の説明図、第8図はブロツク図、第9図は
デイジタル相関器の出力をD/A変換した時の波
形図、第10図は傾きη≒24゜の欠陥から得られ
た探傷パターンの波形図、第11図A,Bはその
欠陥の説明図、第12図は欠陥の長さと最大相関
値の比との関係を示す説明図、第13図はブロツ
ク図、第14図はフローチヤート、第15図はプ
ロペラの部分平面図、第16図A,Bは有害欠陥
の説明図、第17図は欠陥の先端深さと許容投影
欠陥長さとの関係を示す説明図である。 1,14,15,16,17……斜角探傷器、
2……被検材、3……欠陥、4,14a,15
a,16a,17a……超音波ビーム、7……探
触子回転機構、14b,15b,16b,17b
……探傷ゲート、25,26,27,28……パ
ルサレシーバ、29,30,31,32……アナ
ログピークホールド回路、37,38,39,4
0……A/D変換器、41,51……メモリー、
43……デイジタル相関器、50……コンピユー
タ。
The drawings illustrate an embodiment of the present invention, and FIG. 1A and B are explanatory diagrams showing the path of an ultrasonic beam, FIG. 2 is a waveform diagram of a flaw detection pattern, and FIG. 3 is an explanation of correlation processing. Figure 4 is a waveform diagram of an actual flaw detection pattern, Figure 5 is a sectional view of the probe rotation mechanism,
Fig. 6 is a bottom view of the probe holder, Fig. 7 is an explanatory diagram of the flaw detection area, Fig. 8 is a block diagram, Fig. 9 is a waveform diagram when the output of the digital correlator is D/A converted, Figure 10 is a waveform diagram of a flaw detection pattern obtained from a defect with an inclination η≒24°, Figures 11A and B are explanatory diagrams of the defect, and Figure 12 is the relationship between the length of the defect and the ratio of the maximum correlation value. Fig. 13 is a block diagram, Fig. 14 is a flowchart, Fig. 15 is a partial plan view of the propeller, Fig. 16 A and B are explanatory drawings of harmful defects, Fig. 17 is the depth of the tip of the defect. FIG. 3 is an explanatory diagram showing the relationship between the projection defect length and the allowable projected defect length. 1, 14, 15, 16, 17...bevel angle flaw detector,
2... Test material, 3... Defect, 4, 14a, 15
a, 16a, 17a... Ultrasonic beam, 7... Probe rotation mechanism, 14b, 15b, 16b, 17b
...Flaw detection gate, 25, 26, 27, 28... Pulsar receiver, 29, 30, 31, 32... Analog peak hold circuit, 37, 38, 39, 4
0...A/D converter, 41, 51...memory,
43...digital correlator, 50...computer.

Claims (1)

【特許請求の範囲】[Claims] 1 被検材内部の欠陥を超音波法により検出する
に際し、被検材内部の探傷領域で回転中心と交差
するように超音波ビームを送受しかつ探傷深さの
異なる複数チヤンネルの斜角探触子を用い、この
各チヤンネルの斜角探触子を回転中心廻りに回転
させながら360゜の各方向から夫々超音波ビームを
送受し、各チヤンネルの探傷ゲート内に生じたエ
コーのピーク値を各チヤンネル毎に夫々入射方向
に対応させた複数個の探傷パターンをつくり、こ
の各探傷パターンと予め設定された参照パターン
との相関を求めることにより欠陥の方向、傾き、
大きさ、深さを解読し、その結果から欠陥の有害
度を判定することを特徴とする超音波法による欠
陥の検出方法。
1. When detecting defects inside a material to be inspected using the ultrasonic method, an angle probe is used in which an ultrasonic beam is transmitted and received so as to intersect the center of rotation in the flaw detection area inside the material to be inspected, and multiple channels with different detection depths are used. The bevel probe of each channel is rotated around the center of rotation while transmitting and receiving ultrasonic beams from each direction of 360°, and the peak value of the echo generated within the flaw detection gate of each channel is calculated. A plurality of flaw detection patterns are created for each channel, each corresponding to the direction of incidence, and by determining the correlation between each of these flaw detection patterns and a preset reference pattern, the direction and inclination of the defect can be determined.
A defect detection method using an ultrasonic method, which is characterized by deciphering the size and depth and determining the degree of harmfulness of the defect from the results.
JP57127184A 1982-07-20 1982-07-20 Method and device for detecting defect by ultrasonic wave method Granted JPS5917154A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP57127184A JPS5917154A (en) 1982-07-20 1982-07-20 Method and device for detecting defect by ultrasonic wave method
US06/514,864 US4524622A (en) 1982-07-20 1983-07-18 Method and apparatus of ultrasonic flaw detection
EP83304211A EP0102176B1 (en) 1982-07-20 1983-07-20 Method and apparatus for ultrasonic flaw detection
DE8383304211T DE3373709D1 (en) 1982-07-20 1983-07-20 Method and apparatus for ultrasonic flaw detection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57127184A JPS5917154A (en) 1982-07-20 1982-07-20 Method and device for detecting defect by ultrasonic wave method

Publications (2)

Publication Number Publication Date
JPS5917154A JPS5917154A (en) 1984-01-28
JPH0245823B2 true JPH0245823B2 (en) 1990-10-11

Family

ID=14953752

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57127184A Granted JPS5917154A (en) 1982-07-20 1982-07-20 Method and device for detecting defect by ultrasonic wave method

Country Status (1)

Country Link
JP (1) JPS5917154A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003279550A (en) * 2002-03-22 2003-10-02 Kyoji Honma Intelligent Ultrasonic Testing System Using Neural Network
JP2010175560A (en) * 2006-06-22 2010-08-12 Siltronic Ag Method and apparatus for detecting mechanical defect of ingot block made of semiconductor material
JP2012202963A (en) * 2011-03-28 2012-10-22 Mitsubishi Heavy Ind Ltd Ultrasonic test apparatus

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0711509B2 (en) * 1984-12-10 1995-02-08 三菱重工業株式会社 Turbine component deterioration detection device
SG138524A1 (en) 2006-06-22 2008-01-28 Siltronic Ag Method and apparatus for detection of mechanical defects in an ingot piece composed of semiconductor material
JP5153223B2 (en) 2007-06-21 2013-02-27 株式会社ブンリ Dirty liquid processing equipment
JP2020024090A (en) * 2016-11-08 2020-02-13 株式会社日立製作所 Ultrasonic measuring device and method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2298921A5 (en) * 1973-01-29 1976-08-20 Commissariat Energie Atomique ULTRASONIC CONTROL PROCESS FOR HIGH THICKNESS WELDING AND IMPLEMENTATION DEVICES
JPS5339594Y2 (en) * 1975-01-20 1978-09-26

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003279550A (en) * 2002-03-22 2003-10-02 Kyoji Honma Intelligent Ultrasonic Testing System Using Neural Network
JP2010175560A (en) * 2006-06-22 2010-08-12 Siltronic Ag Method and apparatus for detecting mechanical defect of ingot block made of semiconductor material
JP2012202963A (en) * 2011-03-28 2012-10-22 Mitsubishi Heavy Ind Ltd Ultrasonic test apparatus

Also Published As

Publication number Publication date
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