JPH024675B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a manufacturing method for forming a metal thin film on a substrate made of a polymeric material.

Structure of the conventional example and its problems The best method for forming a metal thin film on a substrate made of a polymer material by vacuum evaporation is to deposit the metal film while moving the substrate along a cylindrical can. ing. FIG. 1 schematically shows the internal structure of a vacuum evaporation apparatus using such a method. A substrate 1 made of a polymeric material runs along the circumferential side of a cylindrical can 2 in the direction of the arrow. A metal thin film is formed on this substrate 1 by the evaporation source 5 . 1st
In the figure, 3 is a supply roll, and 4 is a take-up roll. When forming a metal thin film on a substrate made of a polymeric material using such a vacuum evaporation device, a stable metal thin film is formed if the metal thin film is thin, several hundred angstroms or less, but the film is When a metal thin film with a thickness of several hundred Å or more is formed at a high deposition rate of several hundred Å/second or more, the substrate may undergo thermal deformation or thermal decomposition due to radiant heat from the evaporation source or condensation heat of evaporated atoms, resulting in a stable film. It is not possible to form a metal thin film. therefore number
When forming a metal thin film with a thickness of 100 Å or more, it is necessary to take some measures to avoid such thermal damage. Conventionally, one such countermeasure is to reduce heat damage by several tens of Å, which prevents thermal damage.
A thin metal film with the following thickness is deposited, and a potential difference is created between this thin metal film and the cylindrical can.
A method of forming a thin metal film with a thickness of 100 Å or more at a high deposition rate of several 100 Å/second or more has been considered. FIG. 2 schematically shows the internal structure of a vacuum evaporation apparatus using such a method. A substrate 6 made of a polymer material on which a metal thin film is deposited runs on its metal surface in contact with a metal roller 7, and a potential difference is applied between the substrate 6 and the grounded cylindrical can 2 by a power source 8 through the metal roller 7. . When a potential difference is established between the substrate 6 and the cylindrical can 2 in this manner, the substrate 6 sticks to the cylindrical can 2 due to electrostatic attraction. When a thin metal film is formed using the evaporation source 5 while the substrate 6 is stuck to the cylindrical can 2, a thin metal film with a thickness of several hundred Å or more is formed at a high deposition rate of several tens of Å/second or more. The heat received by the substrate 6, such as radiant heat from the evaporation source and condensation heat of evaporated atoms, can be diffused into the cylindrical can 2 by thermal conduction, and the substrate 6 does not undergo thermal deformation or thermal decomposition.

As described above, by creating a potential difference between the cylindrical can and the substrate, it is possible to form a stable film, but in the method shown in Figure 2, a thin metal film is vapor-deposited on the substrate in advance. A conductive layer must be formed in advance, and it is difficult to deposit a stable metal thin film with a thickness of several hundred angstroms or more directly onto a substrate made of a polymeric material at a high deposition rate of several hundred angstroms per second or more. It's impossible.

OBJECTS OF THE INVENTION An object of the present invention is to provide a method for producing a metal thin film using a vacuum evaporation method without causing thermal deformation, thermal decomposition, or wrinkles on a substrate.

Structure of the Invention The present invention is directed to the formation of a cylindrical thin film and a cylindrical thin film when a thin metal film is directly formed by vacuum evaporation on a substrate made of a polymeric material that is running along the circumferential side of a cylindrical can. A method for producing a metal thin film characterized by providing a potential difference between the capacitor and the capacitor.
By the method of the present invention, it is possible to form a metal thin film on a substrate made of a polymeric material without causing thermal deformation, thermal decomposition, or wrinkles.

DESCRIPTION OF EMBODIMENTS FIG. 3 schematically shows the internal structure of a vacuum evaporation apparatus using the method of the present invention. In Figure 3, Figure 1,
Components that are the same as those in FIG. 2 are given the same numbers and their explanations will be omitted. A feature of the apparatus shown in FIG. 3 is that the position of the metal roller 7 has been shifted from between the supply roll 3 and the cylindrical can 2 shown in FIG. 2 to between the cylindrical can 2 and the take-up roll 4. It is. When forming a metal thin film directly on a plate made of a polymer material, the conventional method shown in Figure 2 requires a potential difference between the substrate and the cylindrical can because there is no conductive layer on the substrate. It has been impossible to protect the substrate from thermal damage by attaching it to the substrate using electrostatic attraction. However, in the method according to the present invention shown in FIG. 3, since the metal roller 7 is located between the cylindrical can 2 and the take-up roll 4, the deposited metal thin film is present on the substrate. A potential difference can be provided between the upper metal thin film and the cylindrical can, and the substrate 6 can be stuck to the cylindrical can by electrostatic attraction to protect it from thermal damage. In the method of the present invention, a potential difference is provided through the metal layer formed by the evaporation source, so that the substrate sticks to the cylindrical can from the direct connection between the center of the cylindrical can and the evaporation source as shown in FIG. On the right side, that is, on the take-up roll side, and the substrate 6 is the cylindrical can 2.
Since there is no metal layer yet on the left side of the straight line, that is, on the supply roll side, it is not possible to create a potential difference between the metal layer and the cylindrical can, and the metal layer does not stick to the can. However, since the heat that the substrate 6 receives is mainly radiant heat from the heat source 5 and condensation heat of thermogenic atoms, the substrate 6 receives thermal heat even if it is not attached to the cylindrical can 2 on the supply roll 3 side from the evaporation source 5. Take no damage. If precautions are not taken, thermal damage will occur. From the evaporation source 5 to the take-up roll 4
On the side, the substrate 6 is protected from thermal damage because it sticks to the cylindrical can 2, so the method of the invention can protect the substrate 6 from thermal damage during vacuum deposition.

Next, a specific embodiment of the present invention will be described using FIG. 3. Power supply 8 to metal roller 7
A voltage of 100V is applied. Although a DC power source is shown in Figure 3, an AC power source may also be used. The cylindrical can 2 is grounded. Using such a device, a Ti film of 4000Å/1000Å thick was deposited as a metal thin film on a polyethylene terephthalate substrate with a thickness of 12μm.
Formed at a deposition rate of seconds. The produced film was very stable and showed no heat loss or wrinkles. On the other hand, when no voltage was applied to the metal roller 7, the substrate was thermally decomposed and holes were formed.

Effects of the Invention As described above, the method of the present invention makes it possible to attach a substrate to a cylindrical can using electrostatic attraction, thereby forming a stable metal thin film that is free from heat build-up and wrinkles. Furthermore, since the deposited metal thin film can be used as an electrode, there is no need to make the surface of the substrate conductive in advance.

[Brief explanation of drawings]

1 and 2 are schematic diagrams of the internal structure of a vacuum evaporation apparatus in a conventional method for producing a metal thin film, respectively, and FIG. 3 is a schematic diagram of an internal structure of a vacuum evaporation apparatus in a method for producing a metal thin film according to the present invention. It is. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Cylindrical can, 3... Supply roll, 4... Take-up roll, 5... Evaporation source, 6...
...Substrate on which a metal thin film is deposited, 7.. Metal roller, 8.. Power source for applying voltage to the substrate.

Claims (1)

[Claims] 1. When a thin metal film is directly formed by vacuum evaporation on a substrate made of a polymeric material that is running along the circumferential side of a cylindrical can, the gap between the formed thin metal film and the cylindrical can is A method for producing a metal thin film, characterized by providing a potential difference between the two.