JPH0248160B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a device for inspecting and counting chip parts, and in particular, for inspecting and counting chip parts such as chip resistors.
The present invention relates to a chip component inspection/counting device suitable for counting the number of defective products stored in a casing means such as a magazine after inspecting them.

Chip components such as chip resistors generally have a flat rectangular parallelepiped shape, which is extremely small.
For the convenience of automatic wiring on wiring boards, they are stored in a magazine attached to an automatic wiring device and shipped to customers. The magazine has a rectangular cylindrical storage space that is large enough to accommodate the vertical and horizontal lengths of the chip components, and the chip components are stored in one layer in the magazine. The number of such items is counted manually or by optical detection, etc., when the items are stored.

FIG. 1 shows a conventional automatic chip component insertion device. Chip parts 4 sent from the direction of arrow A through the shooter 2 are transferred to the work guide 5 at the end of the shooter 2, and then placed in a magazine 6 arranged with the insertion opening facing the end. The pusher 8, which moves back and forth as shown by arrow B, sequentially transports the materials in the direction of arrow C and stores them therein. In this case, a slit 10 is provided in the middle of the shooter 2, a light source 12 and a fiber sensor 14 are placed across the slit 10, and the chip component 4 passing through the shooter 2 is inserted into the fiber sensor 14.
chip parts 4 so that the light reaching the chip is blocked.
is detecting the passage of. The number of chip parts 4 stored in the magazine 6 is counted by detecting the operation of the pusher 8, and the number of times the pusher 8 is operated is used as the count value.

For this reason, the chip component 4 is
If the magazine 6 is clogged, the pusher 8 will operate even if there is no chip part 4, and the counting will proceed.Therefore, there will be a discrepancy between the number of chips stored in the magazine 6 and the number of chips counted. There is a possibility that the missing magazine 6 will be shipped as a proper one.

Furthermore, if the timing at which the chip parts 4 fall to the position of the work guide 5 is different from the timing at which the pusher 8 operates, the chip parts 4 may be damaged in the pusher 8, and defective products may be transferred to the magazine 6, even if the number of chips is not the correct number. There is an inconvenience that it is counted as

Therefore, the present invention prevents damage to the chip parts to be transferred by being picked up by a suction device, and
The purpose of the present invention is to provide a chip parts inspection/counting device with improved counting accuracy of chip parts being transferred.

That is, the chip component inspection/counting device of the present invention inspects the chip components 4 transferred from the component supply position (supply feeder 24) to the inspection position (inspection table 26) for quality, counts them, and transfers the chip components 4 to other transported locations. In an inspection/counting device for chip parts to be transferred to a position (magazine 6), there is provided a suction device 18 that sucks the chip parts to be transferred to the other transfer position after inspection at the inspection position, and a negative pressure is applied to this suction device. A negative pressure path 28 that applies negative pressure -P from a source to provide suction force to the chip parts to be suctioned; A pressure sensor (differential pressure sensor 36) that detects a pressure change that occurs and generates a component suction detection signal indicating that the chip component has been suctioned by the suction device; The device is equipped with a counting device 38 for counting the number of chip parts.

Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings.

FIG. 2 shows an embodiment of the chip parts counting device of the present invention, and this counting device is installed in a transfer device for transporting chip parts. That is, this transfer device 16 is equipped with a suction device 18 that sucks and transfers the chip component 4 to be transferred, and this suction device 18 is equipped with a pair of suction pins 20 and 22. The suction pin 20 transfers the chip component 4 of the supply feeder 24 forming the component supply position to the adjacent inspection table 26, and the other suction pin 22 transfers the chip component 4 placed on the inspection table 26 to the supply feeder 24. Magazine 6 which constitutes the parts transfer position of
These suction pins 2
The movements of 0 and 22 are controlled by a control device (not shown). The inspection table 26 is provided with an inspection terminal (not shown) to inspect whether the chip component 4 is good or not, and if it is defective, it is removed from the table 26 by a removal device (not shown).

Further, each suction pin 20, 22 has a negative pressure path 28 formed of a resin hose or the like.
8 is connected to a negative pressure source that provides a constant negative pressure -P, and a control valve 3 that controls the supply of negative pressure.
0 and 32 are installed individually. control valve 30,
32 is controlled to open and close at regular intervals by a pressurization control device 34.

A differential pressure sensor 36 is installed in the negative pressure path 28 on the suction pin 22 side as a pressure sensor that outputs a component suction detection signal representing a pressure change when the chip component 4 is suctioned. is applied to the counting device 38, and a component suction detection signal representing the number of chip components 4 suctioned by the suction device 18 is taken out from its output terminal 40.

Figure 3 shows this differential pressure sensor 36 and counting device 38.
A specific circuit configuration example is shown. That is, the differential pressure sensor 36 includes a pressure conversion element 42 and a resistor 4.
4, 46, and 48, a drive power source 50 is connected between one terminal and taken out from between the other terminals. This output is
After being amplified by an amplifier 52, the signal is amplified again by an amplifier 56 via a variable resistor 54, and then provided to a counting circuit 58. The counting circuit 58 can be constructed from an arithmetic device in conjunction with the control device 34 and the like.

The operation will be explained based on the above configuration. The differential pressure sensor 36 extracts the pressure change in the negative pressure path 28 on the suction pin 22 side when the chip component 4 is suctioned as an electrical signal, and its output becomes a pulse signal as shown in FIG. Po is the negative pressure path 2 when the chip part 4 is not adsorbed even if negative pressure -P acts.
The internal pressure of 8, -P (<Po) indicates the internal pressure when the chip part 4 is suctioned, and the presence or absence of suction of the chip part 4 is detected from such different pressures, and the part suction value representing the pressure change is detected. The number of chip parts 4 can be counted by counting the detection signals.

FIG. 5 shows the transfer of the chip part 4 and the timing of application of the negative pressure -P. In this case, it shows that the continuous chip parts 4 are being transferred, and the inspection table 26
A chip component 4 transferred by a suction pin 20 is placed. As shown in A, the suction pins 20, 2
2 descends toward the chip part 4 in the direction of arrow a, and stops on the upper surface of the chip part 4 as shown in B. At this time, or slightly before that time, the control device 34 detects the timing, opens the control valves 30 and 32, and applies negative pressure -P to the negative pressure path 28. As a result, the chip component 4 is sucked by each suction pin 20, 22 and raised in the direction of arrow b. Next, the suction pins 20 and 22 raised to a certain height are subjected to negative pressure.
While applying P, the suction pin 20 is moved in the direction of arrow c as shown in C, and the suction pin 20 is attached to the inspection table 2.
6. After the suction pin 22 is positioned above the magazine 6, it is lowered in the direction of arrow d as shown in D. Incidentally, as the chip component 4 is transferred, the next chip component 4 is transferred to the supply feeder 24.
Next, as shown in E, the control valves 30 and 32 are closed at the timing when the chip component 4 is placed on the top surface of the inspection table 26 and the opening of the magazine 6 is positioned.
Release negative pressure -P. Each chip component 4 is separated from the suction pins 20, 22 and placed on the inspection table 26, while being stored inside the magazine 6, and the suction pins 20, 22 move in the direction of arrow e. next,
Each suction pin 20, 22 moves in the direction of arrow f, as shown in F, and the magazine 6 has chip parts 4.
falls in the direction of arrow g, and the suction pins 20 and 22 return to the positions shown at A. The chip parts 4 on the inspection table 26 are inspected within the time until the suction pins 22 arrive.

In this way, the negative pressure -P accompanying the transfer of the chip parts 4
If the working section of the negative pressure path 2 is constant and the chip part 4 is not attracted even if the negative pressure -P acts, the negative pressure path 2
Since the pressure change at 8 is small, it is possible to detect whether or not the chip component 4 is being transferred, that is, whether it is being stored in the magazine 6, and highly reliable counting can be performed. especially,
Since the transfer means is different from the conventional one, there is no inconvenience such as the chip parts 4 being damaged during the transfer, and it is also possible to eliminate the inconvenience of counting damaged chip parts as genuine ones.

According to experiments, the conventional technology shown in FIG.
200 pieces, 1 or 2 pieces missing is 60 or 70
However, in the embodiments of the present invention, the deficiency of one element was improved to less than 0.5 to 1%.

In addition, in the embodiment, the thing to be transferred and counted is explained as a chip part 4, but this chip part 4 includes not only a chip resistor but also a transistor, a capacitor, etc., and this invention is applicable to small objects having a certain shape. It can also be used for transporting and counting.

Furthermore, although the embodiment has been described by taking the example of storing chip parts in a magazine, the present invention counts the number of chip parts to be transferred as they are transferred.
It is not limited to storage in a magazine.

As explained above, according to the present invention, after inspecting the chip parts transferred from the parts supply position to the inspection position, the chip parts are sucked by the suction device and transferred to another transfer position. A pressure sensor installed in a negative pressure path that applies negative pressure from a pressure source is used to detect pressure changes that occur in the negative pressure path depending on whether or not a chip component is attracted, and the component suction detection signal obtained by the pressure sensor is used to detect the change in pressure. Since the chip parts are counted, the chip parts can be transferred without damaging the chip parts, and the accuracy of counting the chip parts after inspection can be improved.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram showing a conventional automatic chip component insertion device, FIG. 2 is an explanatory diagram showing an embodiment of a chip component counting device of the present invention, and FIG. 3 is a specific diagram of a differential pressure sensor and a counting device. FIG. 4 is an explanatory diagram showing the waveform of the detection output, and FIG. 5 is an explanatory diagram showing the transfer of chip parts. 4... Chip parts, 6... Magazine (other transfer position), 18... Suction device, 24... Supply feeder (components supply position), 26... Inspection table (inspection position),
28... Negative pressure path, 36... Differential pressure sensor (pressure sensor),
38... Counting device, -P... Negative pressure.

Claims (1)

[Scope of Claims] 1. In a chip parts inspection/counting device that inspects chip parts transferred from a parts supply position to an inspection position, counts them, and transfers them to another transfer position after inspecting the chip parts, comprising: inspecting at the inspection position; and a suction device for suctioning the chip parts to be transferred to the other transfer position, and a negative pressure path for applying negative pressure from a negative pressure source to the suction device to apply suction force to the chip parts to be suctioned. and is installed in this negative pressure path, detects pressure changes occurring in the negative pressure path depending on whether or not the chip component is suctioned, and generates a component suction detection signal indicating that the chip component is suctioned by the suction device. A device for inspecting and counting chip components, comprising: a pressure sensor that generates pressure; and a counting device that counts the chip components using the component suction detection signal generated by the pressure sensor.