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JPH0250986B2 - - Google Patents
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JPH0250986B2 - - Google Patents

Info

Publication number
JPH0250986B2
JPH0250986B2 JP4795785A JP4795785A JPH0250986B2 JP H0250986 B2 JPH0250986 B2 JP H0250986B2 JP 4795785 A JP4795785 A JP 4795785A JP 4795785 A JP4795785 A JP 4795785A JP H0250986 B2 JPH0250986 B2 JP H0250986B2
Authority
JP
Japan
Prior art keywords
plating
water
pipe
pump
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4795785A
Other languages
Japanese (ja)
Other versions
JPS61207577A (en
Inventor
Haruyoshi Asai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Machine Co Ltd
Original Assignee
Toshiba Machine Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Machine Co Ltd filed Critical Toshiba Machine Co Ltd
Priority to JP4795785A priority Critical patent/JPS61207577A/en
Publication of JPS61207577A publication Critical patent/JPS61207577A/en
Publication of JPH0250986B2 publication Critical patent/JPH0250986B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1603Process or apparatus coating on selected surface areas
    • C23C18/1614Process or apparatus coating on selected surface areas plating on one side
    • C23C18/1616Process or apparatus coating on selected surface areas plating on one side interior or inner surface
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1619Apparatus for electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Description

【発明の詳細な説明】 〔発明の属する技術分野〕 本発明は無電解メツキに係り特に前処理液およ
びメツキ液等をポンプにより強制循環させる循環
式無電解メツキ方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field to Which the Invention Pertains] The present invention relates to electroless plating, and particularly to a circulation type electroless plating method in which a pretreatment liquid, a plating liquid, etc. are forcibly circulated by a pump.

〔従来技術〕[Prior art]

従来の無電解メツキは被メツキ体である物品を
メツキ液等に浸漬する方法であるため複雑な形状
でもメツキ可能であるが、内部が折れ曲つた形状
の通路を有する構造の場合には、空気溜りが発生
しやすく、この空気層によつてメツキ液がこの部
分に触れずメツキされない部分が生じる。従つて
ワーク形状はこの点を常に考慮する必要があつ
た。このため例えば熱交換器のように水平の管状
部分のある物品をメツキする場合、予かじめ2つ
割にして空気溜りを生じる部分がないようにして
からメツキを行いメツキ後機械的或いは溶接等に
より一体にするが、溶接部分のメツキは溶接を不
可能にする。従つてなんらかの方法でこのメツキ
を削除してから溶接をするため2つ割とあいまつ
てコストを高くすると共に作業に長時間を必要と
した。
Conventional electroless plating is a method in which the object to be plated is immersed in a plating solution, so it is possible to plate even complex shapes. Retention tends to occur, and due to this air layer, the plating solution does not touch these areas, resulting in areas that are not plated. Therefore, it was necessary to always take this point into consideration when determining the shape of the workpiece. For this reason, when plating an item that has a horizontal tubular part, such as a heat exchanger, it is necessary to divide it into two parts in advance so that there are no parts that create air pockets before plating. However, the plating of the welded parts makes welding impossible. Therefore, this plating must be removed by some method before welding, which increases the cost and requires a long time to complete the work.

〔発明の目的〕[Purpose of the invention]

本発明はこのような欠点を除去したものでその
目的は、メツキすべき部分が複雑に入りこんだ空
気溜りの生じやすい形状でもメツキ液等を強制循
環させることにより、空気溜りをなくしメツキを
可能にした循環式無電解メツキ方法を提供するこ
とにある。
The present invention eliminates these drawbacks, and its purpose is to eliminate air pockets and enable plating by forcibly circulating the plating liquid, etc., even if the part to be plated has a complicated shape that tends to cause air pockets. An object of the present invention is to provide a circulating electroless plating method.

〔発明の要点〕[Key points of the invention]

本発明の循環式無電解メツキ方法は、入口・出
口を有し内部が折れ曲がつた形式の通路を有する
構造の物品のその内部の通路をメツキするに際
し、その物品を保温ケース内の温水或いはヒータ
で保温し、前記物品の通路の入口・出口に配管を
接続し、この配管を通して前処理液を貯えたタン
クからポンプにより強制循環させ次いで水洗いし
た後、メツキ液をメツキ液タンクからポンプによ
り強制循環させるようにしたことを特徴にしてい
る。
In the circulating electroless plating method of the present invention, when plating the internal passage of an article having a structure having an inlet and an outlet and a bent passage inside, the article is exposed to hot water or hot water in a heat-insulating case. The article is kept warm by a heater, piping is connected to the inlet and outlet of the passage of the article, and the pre-treatment liquid is forced to circulate through the piping from a tank stored with a pump. After washing with water, the plating liquid is forced from the plating liquid tank by a pump. It is characterized by being made to circulate.

〔発明の実施例〕[Embodiments of the invention]

本発明の循環式無電解メツキ方法が適用される
対象物品と、そのメツキを必要とする部分につい
て説明すると、第1図がその物品であり2軸押出
機に用いられるバレル(シリンダともいう)で分
割した内の1つである。
To explain the target article to which the circulating electroless plating method of the present invention is applied and the parts that require plating, Figure 1 shows the article, which is a barrel (also called cylinder) used in a twin-screw extruder. This is one of the divided parts.

1がバレル本体で、2は2軸押出機のスクリユ
軸を挿入する穴である。3は冷却水流路であり、
図に示すようにバレル本体1の内部にあつて折れ
曲つた通路を形成している。この冷却水流路には
工業用水を流す為錆が発生しないよう防錆用のメ
ツキを施している。第2図は第1図のA−A断面
を展開して図示したもので、両端面部にはフタ4
が溶接にて固着され冷却水は洩れないようになつ
ている。5が冷却水の入口とすると6が出口で冷
却水は折れ曲つた通路を循環しバレルを効率よく
冷却するようになつている。
1 is the barrel body, and 2 is a hole into which the screw shaft of the twin-screw extruder is inserted. 3 is a cooling water flow path;
As shown in the figure, a bent passage is formed inside the barrel body 1. Since industrial water flows through this cooling water channel, it is plated to prevent rust from forming. Figure 2 is an expanded view of the A-A cross section in Figure 1, with lids 4 on both end surfaces.
are fixed by welding to prevent cooling water from leaking. 5 is the inlet of the cooling water, and 6 is the outlet, and the cooling water circulates through the bent passage to efficiently cool the barrel.

第3図は上述した第1図のバレルを循環式無電
解メツキをする場合の一実施例を示した図であ
り、第3図に於て、保温ケース11内には防錆剤
を溶かした水12をほぼ満たし、例えば複数の長
い水平の管を垂直の短い管により接続した迷路状
の管路13Aを有するワーク13を水12中に浸
漬し、水12はヒータ14により約90℃に加熱さ
れて温水になされている。そして上記管路13A
がメツキすべき部分である。なお温水による加熱
のほかワーク13に不図示のヒータを直接取付け
てもよい。管路13Aは2本の配管15および1
6に接続され配管15は締切弁17を経て圧縮空
気源18に接続され配管16は締切弁19を経て
大気に解放されている。20はメツキ液タンクで
内部はヒータ21により約90℃に加熱されたメツ
キ液22を貯え、このメツキ液は配管23および
24が挿入され、配管23はポンプ25と締切弁
26を経て配管15にそして配管24は締切弁2
7を経て配管16に接続することにより、メツキ
液22は管路13A内を循環するようになされて
いる。
FIG. 3 is a diagram showing an example in which the barrel shown in FIG. 1 is subjected to circulation electroless plating. In FIG. A workpiece 13 that is almost filled with water 12 and has a maze-like conduit 13A in which, for example, a plurality of long horizontal pipes are connected by short vertical pipes, is immersed in the water 12, and the water 12 is heated to about 90°C by the heater 14. It has been heated. And the pipe line 13A
This is the part that should be removed. In addition to heating with hot water, a heater (not shown) may be directly attached to the workpiece 13. The pipe line 13A has two pipes 15 and 1.
6, the pipe 15 is connected to a compressed air source 18 via a shutoff valve 17, and the pipe 16 is opened to the atmosphere via a shutoff valve 19. Reference numeral 20 denotes a plating liquid tank, which stores plating liquid 22 heated to approximately 90°C by a heater 21, into which pipes 23 and 24 are inserted, and pipe 23 passes through a pump 25 and a shutoff valve 26 to pipe 15. And the pipe 24 is the shutoff valve 2
By connecting the plating liquid 22 to the pipe 16 through the pipe 7, the plating liquid 22 is circulated within the pipe 13A.

前処理を行うため硫酸或いは塩酸等を稀薄した
酸液28は酸タンク29内に貯えられており、酸
液28はメツキ液タンク20の場合と同様に配管
30および31が挿入され、ポンプ32・締切弁
33および34そして配管15および16により
管路13A内を循環するようにされている。酸液
28と同様に前処理のため苛性ソーダ等を溶かし
たアルカリ液35はアルカリタンク36内に貯え
られており、アルカリ液35は配管37および3
8・ポンプ39・締切弁40および41そして配
管15および16により管路13A内を循環する
ようになされている。メツキ液22の洗浄用とし
て水42が水タンク43内に貯えられており、水
42は配管44および45・ポンプ46・締切弁
47および48そして配管15および16により
管路13A内を循環するようになつている。
An acid solution 28 made of diluted sulfuric acid or hydrochloric acid for pretreatment is stored in an acid tank 29, and pipes 30 and 31 are inserted in the same way as in the case of the plating solution tank 20, and a pump 32. The shutoff valves 33 and 34 and the pipes 15 and 16 allow the fluid to circulate within the pipe line 13A. Similar to the acid solution 28, an alkaline solution 35 in which caustic soda or the like is dissolved for pretreatment is stored in an alkali tank 36, and the alkaline solution 35 is connected to pipes 37 and 3.
8, a pump 39, shut-off valves 40 and 41, and pipes 15 and 16 to circulate within the pipe line 13A. Water 42 is stored in a water tank 43 for cleaning the plating liquid 22, and the water 42 is circulated in the pipe line 13A through pipes 44 and 45, a pump 46, shut-off valves 47 and 48, and pipes 15 and 16. It's getting old.

次に前述した実施例の動作を説明する。保温ケ
ース11内の熱水12により約90℃に加熱された
ワーク13のメツキすべき部分である管路13A
を前処理工程として先づ酸洗いする。この場合締
切弁17および19を閉じ締切弁33および34
を開いた後ポンプ32を駆動することにより、酸
液28を酸タンク29から管路30,31,1
5,16等を経て管路13Aに約20分間送つてこ
れを強制循環させる。酸洗い後ポンプ32を停止
すると共に締切弁33および34を閉じた後、水
洗いのため締切弁47および48を開きポンプ4
6を約5分間駆動することにより水タンク43の
水42は管路13Aを循環してこれを水洗する。
Next, the operation of the embodiment described above will be explained. Pipe line 13A which is the part to be plated of workpiece 13 heated to about 90°C by hot water 12 in heat insulation case 11
is first pickled as a pretreatment step. In this case, shut-off valves 17 and 19 are closed and shut-off valves 33 and 34 are closed.
After opening, by driving the pump 32, the acid solution 28 is transferred from the acid tank 29 to the pipes 30, 31, 1.
5, 16, etc., to the conduit 13A for about 20 minutes for forced circulation. After the pickling, the pump 32 is stopped and the shut-off valves 33 and 34 are closed, and then the shut-off valves 47 and 48 are opened for washing with water.
6 for about 5 minutes, the water 42 in the water tank 43 circulates through the pipe 13A and washes it.

水洗い後は締切弁47および48を閉じる。 After washing with water, shutoff valves 47 and 48 are closed.

次いで2回目のアルカリによる前処理工程とし
て締切弁40および41を開きポンプ39を約20
分間駆動することにより、アルカリ液35をアル
カリタンク36から管路37,38,15,16
を経て管路13A内を強制循環させる。アルカリ
洗い終了後前述の酸洗いの場合と同様に水42に
よる水洗いを約5分間行う。この後メツキ工程と
して締切弁26および27を開きポンプ25を駆
動してメツキ液22をメツキ液タンク20から、
管路23,24,15,16等を経て管路13A
内を2時間ないし3時間強制循環させることによ
り管路13Aのメツキ処理を行う。メツキ終了後
前述の酸洗いの場合と同様に約5分間水洗いを行
う最後に締切弁17および19を開くことによ
り、圧縮空気源18の圧縮空気を管路13A内に
送り込んで残つていた水滴を吹き飛ばせれば一連
のメツキ作業は終了する。
Next, as a second alkali pretreatment step, the shutoff valves 40 and 41 were opened and the pump 39 was turned on for about 20 minutes.
By driving for a minute, the alkaline liquid 35 is transferred from the alkaline tank 36 to the pipes 37, 38, 15, 16.
The liquid is forced to circulate through the pipe 13A. After the alkaline washing is completed, washing with water 42 is carried out for about 5 minutes in the same manner as in the case of the pickling described above. After this, as a plating step, the shutoff valves 26 and 27 are opened, the pump 25 is driven, and the plating liquid 22 is discharged from the plating liquid tank 20.
Pipe 13A via pipes 23, 24, 15, 16, etc.
The plating process of the pipe line 13A is performed by forcedly circulating the inside for two to three hours. After the plating is completed, rinse with water for about 5 minutes in the same way as in the case of pickling described above.Finally, by opening the shutoff valves 17 and 19, compressed air from the compressed air source 18 is sent into the pipe 13A, and the remaining water droplets are removed. If you can blow it away, the series of plating operations will be completed.

なお前述の説明では前処理工程として酸次いで
アルカリの順に行つたが逆のアルカリ次いで酸の
順でもよい。またメツキ液・酸・アルカリそして
水のそれぞれにポンプを設けたが、ポンプ(以下
図示を省略する)を1台にしてその吐出管路を締
切弁から管路15に接続しかつ締切弁と管路15
の接続部から開閉弁を介してポンプおよび締切弁
の洗浄用の回路を設ける。そしてポンプの吸込管
路はメツキ液・酸・アルカリそして水の4本設け
それぞれのタンクに挿入すると共に、管路16か
らはそれぞれのタンクに締切弁27,34,4
1,48を介して戻すようにしてもよい。
In the above explanation, the pretreatment process was performed in the order of acid and then alkali, but the order of alkali and then acid may be reversed. In addition, pumps were provided for each of the plating liquid, acid, alkali, and water, but one pump (not shown below) was used, and its discharge pipe was connected from the shutoff valve to pipe 15, and the pipe between the shutoff valve and the pipe was connected to the pipe 15. Road 15
A circuit for cleaning the pump and shut-off valve is provided from the connection part of the pump through an on-off valve. The pump has four suction pipes: plating liquid, acid, alkali, and water, which are inserted into each tank, and shutoff valves 27, 34, and 4 are connected to each tank from pipe 16.
1 and 48.

〔発明の効果〕〔Effect of the invention〕

本発明の循環式無電解メツキ方法は以上説明し
たように、従来は一体のままでは内部に空気溜り
を生じメツキ不可能であつた折れ曲がつた形状部
分が、循環できる形状であれば前処理液とメツキ
液とを強制循環させるようにしたため無電解メツ
キが可能になつた。このため従来は2つ割にして
メツキ後再び一体にしていたものが一体のまま可
能になつたため、コストが低下すると共に作業時
間も大巾短縮される利点を有する。又、2ツ割り
もできないような形状を有する構造の物品でも本
発明により無電解メツキが可能となる等の利点も
有する。
As explained above, in the circulation type electroless plating method of the present invention, if the bent shape part, which conventionally could not be plated due to air pockets inside if it was left as one piece, can be pretreated if it has a shape that allows circulation. Electroless plating has become possible because the liquid and plating solution are forced to circulate. For this reason, what used to be split into two pieces, plated, and then put back together can now be made into one piece, which has the advantage of lowering costs and significantly shortening the working time. Further, the present invention also has the advantage that electroless plating can be applied to articles having a structure that cannot be split into two.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明のメツキ方法を適用する対象物
品である2軸押出機のバレルの斜視図、第2図は
第1図のA−A断面を展開して示した図、第3図
は本発明の一実施例を示す機構図である。 11…保温ケース、13…ワーク、13A…メ
ツキすべき部分、15,16…配管、20…メツ
キ液タンク、22…メツキ液、28…酸液(前処
理液)、29…酸タンク、35…アルカリ液(前
処理液)、36…タンク、42…水、43…水タ
ンク。
Fig. 1 is a perspective view of the barrel of a twin-screw extruder to which the plating method of the present invention is applied, Fig. 2 is an expanded view of the A-A cross section of Fig. 1, and Fig. 3 is FIG. 1 is a mechanism diagram showing an embodiment of the present invention. 11... Heat insulation case, 13... Work, 13A... Part to be plated, 15, 16... Piping, 20... Plating liquid tank, 22... Plating liquid, 28... Acid liquid (pre-treatment liquid), 29... Acid tank, 35... Alkaline liquid (pretreatment liquid), 36...tank, 42...water, 43...water tank.

Claims (1)

【特許請求の範囲】[Claims] 1 入口・出口を有し内部が折れ曲がつた形状の
通路を有する構造の物品のその内部の通路をメツ
キするに際し、その物品を保温ケース内の温水或
いはヒータで保温し、前記物品の通路の入口・出
口に配管を接続し、この配管を通して前処理液を
貯えたタンクからポンプにより強制循環させ次い
で水洗いした後、メツキ液をメツキ液タンクから
ポンプにより強制循環させるようにした循環式無
電解メツキ方法。
1. When plating the internal passage of an article that has an inlet/outlet and a bent-shaped passage, the article is kept warm with hot water or a heater in a heat-insulating case, and the passage of the article is Circulating type electroless plating in which piping is connected to the inlet and outlet, and through these piping, the pre-treatment liquid is forced to circulate from a tank using a pump.After washing with water, the plating liquid is forcibly circulated from the plating liquid tank by a pump. Method.
JP4795785A 1985-03-11 1985-03-11 Circulation type electroless plating method Granted JPS61207577A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4795785A JPS61207577A (en) 1985-03-11 1985-03-11 Circulation type electroless plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4795785A JPS61207577A (en) 1985-03-11 1985-03-11 Circulation type electroless plating method

Publications (2)

Publication Number Publication Date
JPS61207577A JPS61207577A (en) 1986-09-13
JPH0250986B2 true JPH0250986B2 (en) 1990-11-06

Family

ID=12789826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4795785A Granted JPS61207577A (en) 1985-03-11 1985-03-11 Circulation type electroless plating method

Country Status (1)

Country Link
JP (1) JPS61207577A (en)

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US10113237B2 (en) 2012-12-28 2018-10-30 Mitsubishi Heavy Industries, Ltd. Manufacturing method of rotating machine, plating method of rotating machine, and rotating machine

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EP2458030A1 (en) * 2010-11-30 2012-05-30 Alfa Laval Corporate AB Method of coating a part of a heat exchanger and heat exchanger
US11054199B2 (en) * 2019-04-12 2021-07-06 Rheem Manufacturing Company Applying coatings to the interior surfaces of heat exchangers

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US9745863B2 (en) 2012-12-28 2017-08-29 Mitsubishi Heavy Industries Compressor Corporation Method of manufacturing rotary machine, method of plating rotary machine, and rotary machine
US10113237B2 (en) 2012-12-28 2018-10-30 Mitsubishi Heavy Industries, Ltd. Manufacturing method of rotating machine, plating method of rotating machine, and rotating machine

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