JPH0252639B2 - - Google Patents
Info
- Publication number
- JPH0252639B2 JPH0252639B2 JP18516183A JP18516183A JPH0252639B2 JP H0252639 B2 JPH0252639 B2 JP H0252639B2 JP 18516183 A JP18516183 A JP 18516183A JP 18516183 A JP18516183 A JP 18516183A JP H0252639 B2 JPH0252639 B2 JP H0252639B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- acid
- polyethylene glycol
- stencil paper
- sensitive stencil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- -1 phosphate ester Chemical class 0.000 claims description 17
- 239000002202 Polyethylene glycol Substances 0.000 claims description 14
- 229920001223 polyethylene glycol Polymers 0.000 claims description 14
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 11
- 150000002148 esters Chemical class 0.000 claims description 9
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 8
- 229920000728 polyester Polymers 0.000 claims description 8
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 6
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 6
- 239000000194 fatty acid Substances 0.000 claims description 6
- 229930195729 fatty acid Natural products 0.000 claims description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 6
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000002985 plastic film Substances 0.000 claims description 6
- 229920006255 plastic film Polymers 0.000 claims description 6
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 150000002009 diols Chemical class 0.000 claims description 5
- 150000004665 fatty acids Chemical class 0.000 claims description 5
- 229910019142 PO4 Inorganic materials 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 claims description 3
- 239000010452 phosphate Substances 0.000 claims description 3
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 2
- 125000001931 aliphatic group Chemical group 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 claims description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 claims description 2
- 238000006068 polycondensation reaction Methods 0.000 claims description 2
- ITAMCOCNZJPJDF-UHFFFAOYSA-N 1-(6-aminopurin-9-yl)propan-2-yloxymethyl-phenoxyphosphinic acid Chemical compound C1=NC2=C(N)N=CN=C2N1CC(C)OCP(O)(=O)OC1=CC=CC=C1 ITAMCOCNZJPJDF-UHFFFAOYSA-N 0.000 claims 1
- 239000010408 film Substances 0.000 description 21
- 229910052783 alkali metal Inorganic materials 0.000 description 4
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 4
- 239000002585 base Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000000839 emulsion Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000006082 mold release agent Substances 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 229920001986 Vinylidene chloride-vinyl chloride copolymer Polymers 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- BTVWZWFKMIUSGS-UHFFFAOYSA-N dimethylethyleneglycol Natural products CC(C)(O)CO BTVWZWFKMIUSGS-UHFFFAOYSA-N 0.000 description 1
- GWTCIAGIKURVBJ-UHFFFAOYSA-L dipotassium;dodecyl phosphate Chemical compound [K+].[K+].CCCCCCCCCCCCOP([O-])([O-])=O GWTCIAGIKURVBJ-UHFFFAOYSA-L 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003827 glycol group Chemical group 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid group Chemical group C(CCCCCCC\C=C/CCCCCCCC)(=O)O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920000131 polyvinylidene Polymers 0.000 description 1
- 229940033623 potassium lauryl phosphate Drugs 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
- B41N1/245—Stencils; Stencil materials; Carriers therefor characterised by the thermo-perforable polymeric film heat absorbing means or release coating therefor
Landscapes
- Printing Plates And Materials Therefor (AREA)
Description
【発明の詳細な説明】
本発明は、多孔性支持体にプラスチツクフイル
ムを貼り合わせた感熱性孔版原紙に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat-sensitive stencil paper in which a plastic film is bonded to a porous support.
典具帖紙、合成樹脂抄造紙、各種織布、不織布
などの支持体に、厚さ２〜10ミクロン程度の塩化
ビニル、塩化ビニリデン―塩化ビニル共重合体、
ポリプロピレン、ポリエチレンなどの熱可塑性樹
脂よりなるプラスチツクフイルムを貼り合わせた
感熱性孔版原紙が知られている。このような原紙
から孔版原紙を作成する方法として、原稿を原紙
のフイルムに密着させて赤外線を含む光を照射
し、赤外線をより多く吸収して温度の高くなる原
稿の黒領域に接したフイルム部分だけを融すか、
凝集させて穿孔することが従来採用されている。
また、近年、感熱プリンター、感熱フアクシミリ
などの感熱素子を原紙に接し加熱することにより
穿孔することも提案されている。 Vinyl chloride, vinylidene chloride-vinyl chloride copolymer, and vinyl chloride with a thickness of about 2 to 10 microns are used on supports such as Tengucho paper, synthetic resin paper, various woven fabrics, and non-woven fabrics.
2. Description of the Related Art Heat-sensitive stencil paper having a plastic film made of a thermoplastic resin such as polypropylene or polyethylene bonded thereto is known. In order to create stencil paper from such base paper, the original is brought into close contact with the film of the original paper and irradiated with light containing infrared rays. Melt only the
Conventionally, agglomeration and perforation have been adopted.
In recent years, it has also been proposed to make perforations by bringing a heat-sensitive element, such as a heat-sensitive printer or a heat-sensitive facsimile, into contact with base paper and heating it.
原稿を孔版原紙のフイルムに密着させて、赤外
線を照射して孔版作成する工程において赤外線が
過大に照射される場合、フイルムの溶融により、
フイルムと原稿が融着し、原紙より分離する場合
フイルムが破損したり、また変形を起し、謄写印
刷において印刷物の画質の鮮明性を著るしく低下
することがある。 If an excessive amount of infrared rays is irradiated during the process of making a stencil by placing the manuscript in close contact with the stencil film and irradiating it with infrared rays, the film may melt, causing
When the film and original document are fused and separated from the base paper, the film may be damaged or deformed, and the sharpness of the image quality of the printed matter may be significantly reduced in mimeograph printing.
また、感熱素子を用いて孔版を作成する場合に
おいては、フイルムの溶融により感熱素子とフイ
ルムが融着し、著しい場合は、孔版原紙が走行し
なかつたり、また走行がスムーズでないため画像
のズレが起ることがある。 In addition, when creating a stencil using a heat-sensitive element, the heat-sensitive element and the film may fuse together due to melting of the film, and in severe cases, the stencil paper may not move or may not move smoothly, resulting in misalignment of the image. It can happen.
このような原稿とフイルムとの融着を防止する
ため、従来、ポリ塩化ビニリデン―塩化ビニル共
重合体等のフイルムに、脂肪酸単体または脂肪酸
エステル、または脂肪酸アマイドを練り込んだ
り、また前記フイルム面上にステアリン酸ソーダ
またはシリコーン離型剤を塗布することが行われ
ている。 In order to prevent such fusion between the original and the film, conventionally, a fatty acid alone, a fatty acid ester, or a fatty acid amide is kneaded into a film such as polyvinylidene chloride-vinyl chloride copolymer, or a fatty acid amide is added to the film surface. Applying sodium stearate or a silicone mold release agent to the mold is practiced.
しかし、このような方法で原稿とフイルムとの
融着を防止することは、製造コストが高価であつ
たり、フイルムと離型剤との接着が弱く、離型層
がフイルムより脱落したり、又離型剤と印刷イン
キとの離型性がなく、離型剤が印刷インキの通過
を妨げ、印刷が不鮮明となつたりする等の問題が
ある。 However, preventing the fusion between the document and the film using such a method is expensive, the adhesion between the film and the release agent is weak, the release layer may fall off from the film, or the release layer may fall off from the film. There is a problem that the mold release agent does not have the ability to release the printing ink, and the mold release agent prevents the printing ink from passing through, resulting in unclear printing.
本発明は、上述のごとき欠点を伴うことなく、
原稿との融着がない、また感熱素子との融着のな
い感熱性孔版原紙を提供することにある。 The present invention does not have the above-mentioned drawbacks, and
It is an object of the present invention to provide a heat-sensitive stencil paper that is not fused to an original or a heat-sensitive element.
即ち、本発明における感熱性孔版原紙は、多孔
質支持体に熱可塑性樹脂よりなるプラスチツクフ
イルムをラミネートし、さらに前記フイルム表面
に、炭素数８〜18のモノ又はジアルキルリン酸エ
ステルのアルカリ金属塩の単体又は混合物から成
るか、或いは(イ)芳香族及び脂肪族ジカルボン酸類
の少なくとも一種、(ロ)炭素数２〜４のジオール類
の少なくとも一種、及び(ハ)分子量2000以上のポリ
エチレングリコール化合物とを重縮合して得られ
る分子量3000以上のポリエステル共重合体から成
る離型層を設けたものである。 That is, the heat-sensitive stencil paper of the present invention is obtained by laminating a plastic film made of a thermoplastic resin on a porous support, and further coating the surface of the film with an alkali metal salt of a mono- or dialkyl phosphate having 8 to 18 carbon atoms. Consists of a single substance or a mixture, or (a) at least one aromatic and aliphatic dicarboxylic acid, (b) at least one diol having 2 to 4 carbon atoms, and (c) a polyethylene glycol compound with a molecular weight of 2000 or more. A release layer made of a polyester copolymer with a molecular weight of 3000 or more obtained by polycondensation is provided.
本発明のアルキルリン酸エステルのアルカリ金
属塩、或いはポリエステル共重合物が感熱性孔版
原紙の離型層として極めて良好であるのは、フイ
ルムに強固に配向、吸着又は接着をし、比較的耐
熱性の良い離型性を示す薄膜が形成されるからで
あり、アルキルリン酸エステルのアルカリ金属塩
の場合はリン酸基のフイルムへの配向性と、アル
カリ基の滑性、離型性により、ポリエステル共重
合物の場合は、例えばテレフタル酸ジメチルとエ
チレングリコールの縮合によるポリエステル結合
のプラスチツクフイルムとの親和性と、分子量
2000以上のポリエチレングリコール部分の滑性、
離型性によるものと考えられる。 The reason why the alkali metal salt of alkyl phosphate ester or the polyester copolymer of the present invention is extremely suitable as a release layer for heat-sensitive stencil paper is that it is strongly oriented, adsorbed or adhered to the film, and is relatively heat resistant. This is because a thin film is formed that exhibits good mold releasability, and in the case of alkali metal salts of alkyl phosphate esters, polyester In the case of copolymers, for example, the affinity with the plastic film of polyester bonds resulting from the condensation of dimethyl terephthalate and ethylene glycol, and the molecular weight
Lubriciousness of polyethylene glycol parts over 2000,
This is thought to be due to mold releasability.
しかし、本発明はこの機構の推定により限定さ
れるものではない。 However, the present invention is not limited by the estimation of this mechanism.
本発明において用いられる多孔質支持体として
は典具帖紙、合成繊維抄造紙、各種織布、不織布
などを用い得る。又、プラスチツクフイルムとし
ては、塩化ビニル―塩化ビニリデン共重合体、ポ
リエステル、ポリエチレン、ポリプロピレンなど
の厚さ１―10ミクロンのフイルムを用い得る。さ
らに多孔質支持体とフイルムとを貼合せるには、
ポリ酢酸ビニル樹脂、ポリアクリル酸エステル樹
脂などのエマルジヨン又は溶液を用いてラミネー
トさせる。 As the porous support used in the present invention, tengujo paper, synthetic fiber paper, various woven fabrics, non-woven fabrics, etc. can be used. As the plastic film, a film having a thickness of 1 to 10 microns may be used, such as vinyl chloride-vinylidene chloride copolymer, polyester, polyethylene, polypropylene, or the like. Furthermore, in order to bond the porous support and the film,
Lamination is performed using an emulsion or solution of polyvinyl acetate resin, polyacrylic acid ester resin, etc.
本発明に用いられる炭素数８〜18のモノ又はジ
アルキルリン酸エステルとしては、例えば、リン
酸のモノ又はジ高級アルキル又はアルケニル・エ
ステル例えばラウリル、セチル、ステアリル、オ
レイン・エステルなどのアルカリ金属塩、例え
ば、リチウム、ナトリウム、カリウム塩などが挙
げられる。 Examples of mono- or dialkyl phosphoric acid esters having 8 to 18 carbon atoms used in the present invention include mono- or di-higher alkyl or alkenyl esters of phosphoric acid, such as alkali metal salts such as lauryl, cetyl, stearyl, and oleic esters; Examples include lithium, sodium, and potassium salts.
又、ポリエステル共重合体の例としては、芳香
族ジカルボン酸類としてテレフタル酸、イソフタ
ル酸、フタル酸、２，６―ナフタレンジカルボン
酸等及びテレフタル酸ジアルキルエステルの様な
それらのエステルが、脂肪族ジカルボン酸類とし
てセバシン酸等及びそのエステルが使用できる。 Examples of polyester copolymers include aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, phthalic acid, 2,6-naphthalenedicarboxylic acid, and esters thereof such as terephthalic acid dialkyl esters; As such, sebacic acid and its esters can be used.
これらジカルボン酸類は単独に用いるのみなら
ず、混合して用いてもよい。 These dicarboxylic acids may be used not only singly but also in combination.
例えば、テレフタル酸ジアルキルエステルを主
体とし、ジ量のイソフタル酸、フタル酸、２，６
―ナフタレンジカルボン酸、セバシン酸又はそれ
らのエステルを混合してもよい。 For example, terephthalic acid dialkyl ester is the main ingredient, and di-amounts of isophthalic acid, phthalic acid, 2,6
-Naphthalene dicarboxylic acid, sebacic acid or their esters may be mixed.
ジオール類としては、エチレングリコール、ジ
エチレングリコール、プロピレングリコール、及
びブタンジオール等が使用できる。 As the diols, ethylene glycol, diethylene glycol, propylene glycol, butanediol, etc. can be used.
これら芳香族ジカルボン酸類及び脂肪族ジカル
ボン酸類とジオール類は、それぞれ単独でも２種
以上使用しても良いし、片側単独で、残りの一方
を２種以上使用してもよい。 These aromatic dicarboxylic acids, aliphatic dicarboxylic acids, and diols may be used alone or two or more types, or one side may be used alone and the other side may be used two or more types.
分子量2000以上のポリエチレングリコール化合
物としては、例えば、ポリエチレングリコール、
ポリエチレングリコールのモノエーテル、例え
ば、ポリエチレングリコールの高級アルコールモ
ノエーテル又はモノフエニールエータルなど、及
びポリエチレングリコールのモノエステル例えば
ポリエチレングリコールの高級脂肪酸モノエステ
ル又はモノフエニールエステルなどを用いること
ができる。 Examples of polyethylene glycol compounds having a molecular weight of 2000 or more include polyethylene glycol,
Monoethers of polyethylene glycol, such as higher alcohol monoethers or monophenyl ethers of polyethylene glycol, and monoesters of polyethylene glycol, such as higher fatty acid monoesters or monophenyl esters of polyethylene glycol, can be used.
実施例 １
工程１：厚さ３ミクロンのポリエステルフイル
ムを12ｇ／m2の典具帖紙に酢酸ビニル系エマルジ
ヨンで貼り合わせて、標準感熱性孔版原紙を作成
した。Example 1 Step 1: A standard heat-sensitive stencil paper was prepared by laminating a 3 micron thick polyester film onto a 12 g/m 2 Tengujo paper using a vinyl acetate emulsion.
工程２：つぎにこの工程１で得た標準感熱性孔
版原紙のフイルム面上に、ラウリルリン酸カリウ
ム塩（モノ及びジエステルの混合物）の３％水溶
液を塗布乾燥して、塗布量約0.2ｇ／m2の離型層
を形成した。 Step 2: Next, on the film surface of the standard heat-sensitive stencil paper obtained in Step 1, a 3% aqueous solution of potassium lauryl phosphate (a mixture of mono- and diesters) is applied and dried to give a coating amount of about 0.2 g/ A mold release layer of m 2 was formed.
次に、上記の工程１で得られた標準感熱性孔版
原紙と、上記の工程２で得られた感熱性孔版原紙
とを、三菱電機(株)製感熱フアクシミリFA―80で
孔版し、通常の輪転謄写印刷機で印刷し、比較評
価した。結果は、耐熱性離型層を設けていない工
程１で得られた孔版原紙は感熱フアクシミリで穿
孔中、感熱素子と原紙のフイルムが融着し、途中
で原紙の送行が止まり、製版することが出来なか
つた。一方、工程２で得られた本発明の孔版原紙
は、いずれもフアクシミリの走行がスムーズであ
り、良好な印刷物を得ることが出来た。 Next, the standard heat-sensitive stencil paper obtained in step 1 above and the heat-sensitive stencil paper obtained in step 2 above were stenciled using a heat-sensitive facsimile FA-80 manufactured by Mitsubishi Electric Corporation. It was printed on a rotary mimeograph machine and comparatively evaluated. The result was that while the stencil paper obtained in step 1, which did not have a heat-resistant release layer, was being perforated with a heat-sensitive facsimile, the heat-sensitive element and the film of the stencil were fused, and the feeding of the stencil stopped midway, making it impossible to make a stencil. I couldn't do it. On the other hand, the stencil paper of the present invention obtained in Step 2 all ran smoothly in facsimile, and good printed matter could be obtained.
実施例 ２
実施例１の工程で得た標準感熱性孔版原紙のフ
イルム面上に、テレフタール酸ジメチル150部、
エチレングリコール41部、分子量3000のポリエチ
レングリコールモノフエニルエーテルを縮合して
得られた分子量約5000のポリエステル共重合物の
２％エマルジヨンを塗布乾燥して、塗布量約0.1
ｇ／m2の離型層を形成した。Example 2 On the film surface of the standard heat-sensitive stencil paper obtained in the process of Example 1, 150 parts of dimethyl terephthalate,
A 2% emulsion of a polyester copolymer with a molecular weight of approximately 5,000 obtained by condensing 41 parts of ethylene glycol and polyethylene glycol monophenyl ether with a molecular weight of 3,000 is applied and dried to obtain a coating amount of approximately 0.1
A release layer of g/m 2 was formed.
このものを実施例１と同様に三菱電機(株)製感熱
フアクシミリFA―80で孔版して、印刷したとこ
ろ、工程２で得られた本発明の孔版原紙と同様の
結果を得た。 When this material was stenciled and printed using a thermal facsimile FA-80 manufactured by Mitsubishi Electric Co., Ltd. in the same manner as in Example 1, the same results as the stencil paper of the present invention obtained in Step 2 were obtained.
Claims (1)
チツクフイルムを貼合せたラミネート型の感熱性
孔版原紙において、前記フイルムの表面に、炭素
数８〜18のモノ又はジアルキルリン酸エステルの
アルカリ金属塩の単体又は混合物から成るか、或
いは(イ)芳香族及び脂肪族ジカルボン酸類の少なく
とも一種、(ロ)炭素数２〜４のジオール類の少なく
とも一種、及び(ハ)分子量2000以上のポリエチレン
グリコール化合物の少なくとも一種とを重縮合し
て得られる分子量3000以上のポリエステル共重合
体から成る離型層を設けたことを特徴とする感熱
性孔版原紙。 ２ 芳香族ジカルボン酸類がテレフタル酸，イソ
フタル酸，フタル酸，２，６―ナフタレンジカル
ボン酸及びそれらのエステルであることを特徴と
する特許請求の範囲第１項の感熱性孔版原紙。 ３ 脂肪族ジカルボン酸類がセバシン酸及びその
エステルであることを特徴とする特許請求の範囲
第１項の感熱性孔版原紙。 ４ ジオール類がエチレングリコール，ジエチレ
ングリコール，プロピレングリコール，及びブタ
ンジオールであることを特徴とする特許請求の範
囲第１項ないし第３項のいずれかの感熱性孔版原
紙。 ５ 分子量2000以上のポリエチレングリコール化
合物がポリエチレングリコール、そのモノエーテ
ル、及びそのモノエステルから選ばれたものであ
ることを特徴とする特許請求の範囲第１項ないし
第４項のいずれかの感熱性孔版原紙。 ６ モノエステルがポリエチレングリコールの高
級脂肪酸モノエステル、又はモノフエニールエス
テルであり、モノエーテルがポリエチレングリコ
ールの高級アルコールモノエーテル又はモノフエ
ニールエーテルであることを特徴とする特許請求
の範囲第５項の感熱性孔版原紙。[Scope of Claims] 1. A laminate-type heat-sensitive stencil paper in which a porous support and a plastic film made of a thermoplastic resin are laminated together, in which a mono- or dialkyl phosphate ester having 8 to 18 carbon atoms is coated on the surface of the film. (a) at least one kind of aromatic and aliphatic dicarboxylic acids, (b) at least one diol having 2 to 4 carbon atoms, and (c) having a molecular weight of 2000 or more. 1. A heat-sensitive stencil paper comprising a release layer made of a polyester copolymer having a molecular weight of 3,000 or more obtained by polycondensation with at least one type of polyethylene glycol compound. 2. The heat-sensitive stencil paper according to claim 1, wherein the aromatic dicarboxylic acids are terephthalic acid, isophthalic acid, phthalic acid, 2,6-naphthalene dicarboxylic acid, and esters thereof. 3. The heat-sensitive stencil paper according to claim 1, wherein the aliphatic dicarboxylic acid is sebacic acid and its ester. 4. The heat-sensitive stencil paper according to any one of claims 1 to 3, wherein the diols are ethylene glycol, diethylene glycol, propylene glycol, and butanediol. 5. The heat-sensitive stencil plate according to any one of claims 1 to 4, wherein the polyethylene glycol compound having a molecular weight of 2000 or more is selected from polyethylene glycol, its monoether, and its monoester. Base paper. 6. The heat-sensitive device according to claim 5, wherein the monoester is a higher fatty acid monoester of polyethylene glycol or a monophenyl ester, and the monoether is a higher alcohol monoether or monophenyl ether of polyethylene glycol. Stencil stencil paper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18516183A JPS6078788A (en) | 1983-10-05 | 1983-10-05 | Heat-sensitive screen printing stencil paper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18516183A JPS6078788A (en) | 1983-10-05 | 1983-10-05 | Heat-sensitive screen printing stencil paper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6078788A JPS6078788A (en) | 1985-05-04 |
| JPH0252639B2 true JPH0252639B2 (en) | 1990-11-14 |
Family
ID=16165895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18516183A Granted JPS6078788A (en) | 1983-10-05 | 1983-10-05 | Heat-sensitive screen printing stencil paper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6078788A (en) |
-
1983
- 1983-10-05 JP JP18516183A patent/JPS6078788A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6078788A (en) | 1985-05-04 |
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