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JPH0252880B2 - - Google Patents
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JPH0252880B2 - - Google Patents

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Publication number
JPH0252880B2
JPH0252880B2 JP58159506A JP15950683A JPH0252880B2 JP H0252880 B2 JPH0252880 B2 JP H0252880B2 JP 58159506 A JP58159506 A JP 58159506A JP 15950683 A JP15950683 A JP 15950683A JP H0252880 B2 JPH0252880 B2 JP H0252880B2
Authority
JP
Japan
Prior art keywords
board
contact
printed board
type
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58159506A
Other languages
Japanese (ja)
Other versions
JPS6052083A (en
Inventor
Yoshio Tokutake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58159506A priority Critical patent/JPS6052083A/en
Publication of JPS6052083A publication Critical patent/JPS6052083A/en
Publication of JPH0252880B2 publication Critical patent/JPH0252880B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Description

【発明の詳細な説明】 (a) 発明の技術分野 本発明は電子部品が実装されたプリント板の所
定箇所にコンタクトを当接させ、測定器による試
験を行う際のプリント板の識別方法に関する。
DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a method for identifying a printed board when a contact is brought into contact with a predetermined location of a printed board on which electronic components are mounted and a test is performed using a measuring instrument.

(b) 従来技術と問題点 プリント板に電子部品を実装する場合は、先づ
基板のスルホールに電子部品のリード端子片を実
装面より挿入し、スルホールより突出された端子
片は所定の長さに切断するカツテイングが行なわ
れる。次に半田面がボンデイングされ、基板のラ
ンドに端子片を半田付することが行なわれる。こ
のように電子部品が実装されて完成されたプリン
ト板は一般的に電子部品の実装誤りまたは特性の
劣下などの異状がないかチエツクが行なわれる。
(b) Prior art and problems When mounting electronic components on a printed circuit board, first insert the lead terminal piece of the electronic component from the mounting surface into the through hole of the board, and the terminal piece protruding from the through hole has a predetermined length. Cutting is performed. Next, the solder surface is bonded, and the terminal pieces are soldered to the lands of the board. A completed printed circuit board with electronic components mounted thereon is generally checked for abnormalities such as mounting errors in the electronic components or deterioration of characteristics.

このチエツクは第1図に示す試験装置が用いら
れて行なわれる。第1図はプリント板の試験装置
のa図は構成図、b図は説明図である。
This check is carried out using the test apparatus shown in FIG. In FIG. 1, figure a is a configuration diagram and figure b is an explanatory diagram of a printed board testing apparatus.

第1a図に示すように、電子部品4が実装され
て形成されたプリント板の基板1を装着する盤面
2Aを有するテーブル2と、盤面2Aに所定ピッ
チで配列された貫通孔2Bのそれぞれに設けられ
たコンタクト3を突出させる駆動部6と、コンタ
クト3を介して装着されたプリント板に所定の信
号を入出力する測定部5と、テストデータ9およ
び操作盤8の指令によつて測定部5と駆動部6と
を制御する制御部7とによつて構成されている。
As shown in FIG. 1a, a table 2 has a board surface 2A on which a printed circuit board 1 on which electronic components 4 are mounted is mounted, and through holes 2B are arranged at a predetermined pitch on the board surface 2A. a driving unit 6 for projecting the contacts 3 that have been inserted, a measuring unit 5 for inputting/outputting a predetermined signal to the attached printed circuit board via the contacts 3, and a measuring unit 5 for projecting the contacts 3 according to the test data 9 and commands from the operation panel 8. and a control section 7 that controls the drive section 6.

基板1に実装された電子部品4の端子にコンタ
クト3を当接する場合は第1b図の説明図に示す
ように行なわれる。電子部品4のリード端子4A
は基板1のスルホール1Cに挿入され、ランド1
Dに半田8によつて固着されており、このように
端子4Aが半田付けされた半田面1Bは盤面2A
に圧接されている。一般的に基板1のランド1D
は所定の基準ピツチによつて設けられているた
め、貫通孔2Bに設けられたコンタクト3のピツ
チPはこの基準ピツチに合致するように形成され
ている。
The contact 3 is brought into contact with the terminal of the electronic component 4 mounted on the substrate 1 as shown in the explanatory diagram of FIG. 1b. Lead terminal 4A of electronic component 4
is inserted into the through hole 1C of the board 1, and the land 1
D with solder 8, and the solder surface 1B to which the terminal 4A is soldered in this way is connected to the board surface 2A.
is pressed against. Generally, land 1D of board 1
is provided by a predetermined reference pitch, so the pitch P of the contact 3 provided in the through hole 2B is formed to match this reference pitch.

そこで、試験すべき端子4Aに位置したコンタ
クト3の例えば3―1,3―3を矢印A方向に突
出するようにスライドさせ、このスライドによつ
てコンタクト3―1,3―3の先端は端子4Aに
当接される。これにより端子4Aとコンタクト3
―1,3―3とは電気導通が得られるため、コン
タクト3―1と3―3との間にテスト信号Sを送
出することで電子部品4の特性試験が行なわれ
る。
Therefore, the contacts 3, for example, 3-1 and 3-3 located at the terminal 4A to be tested are slid so as to protrude in the direction of arrow A, and by this sliding, the tips of the contacts 3-1 and 3-3 are It is brought into contact with 4A. This allows terminal 4A and contact 3
Since electrical continuity is obtained between contacts 3-1 and 3-3, a characteristic test of electronic component 4 is performed by sending a test signal S between contacts 3-1 and 3-3.

したがつて、実装面1Aに電子部品4が固着さ
れた基板1は半田面1Bが盤面2Aに圧接するよ
うに矢印方向に装着され、操作盤8より所定のテ
ストデータ9を指定することで、テストデータ9
によつて試験すべき所定の端子4Aに位置したコ
ンタクト3を突出させ、端子4Aにコンタクト3
を当接させて測定部5よりテスト信号Sを出力さ
せることでそれぞれ端子4Aの間の試験が順次行
なわれる。尚、このようなテスト信号Sは一般的
に誤接続などがあつても電子部品4が破損されな
い微小電位のものが用いられる。
Therefore, the board 1 with the electronic components 4 fixed to the mounting surface 1A is mounted in the direction of the arrow so that the solder surface 1B is in pressure contact with the board surface 2A, and by specifying predetermined test data 9 from the operation panel 8, Test data 9
The contact 3 located at the predetermined terminal 4A to be tested is made to protrude by the
By bringing the terminals 4A into contact with each other and outputting the test signal S from the measuring section 5, a test between the terminals 4A is sequentially performed. Incidentally, such a test signal S is generally used at a minute potential that will not damage the electronic component 4 even if there is a misconnection or the like.

このようなプリント板の試験ではプリント板の
種類によつてそれぞれ異なつたテストデータを用
いなければならない。そこで、試験に際してはプ
リント板の種類を識別する必要があり、その識別
は第2図に示すように行なわれていた。第2図は
従来のプリント板の試験方法におけるプリント板
の識別を示す説明図である。
In testing such printed boards, different test data must be used depending on the type of printed board. Therefore, during testing, it was necessary to identify the type of printed board, and this identification was performed as shown in FIG. FIG. 2 is an explanatory diagram showing identification of printed boards in a conventional printed board testing method.

基板1の所定箇所10にプリント板の種別を表
示し、作業者の目視によつて判別し操作盤8によ
つてそのプリント板の種別を入力することが行な
われる。更に、基板1に実装された電子部品4の
一部に種別を記憶させ、記憶された種別を読み取
る方法などが用いられていた。このような記憶さ
れた種別を読み取る場合は電源供給部12と識別
部11とを設け、電源供給部12からコンタクト
3を介して基板1の電源路の端子4Aに電源を供
給し、識別部11はコンタクト3を介して出力信
号を受け装着されたプリント板の種別を判別する
ことが行なわれる。
The type of printed board is displayed at a predetermined location 10 on the board 1, and the operator visually identifies the type and inputs the type of printed board using the operation panel 8. Furthermore, a method has been used in which a type is stored in a part of the electronic component 4 mounted on the board 1 and the stored type is read. When reading such a stored type, a power supply section 12 and an identification section 11 are provided, and power is supplied from the power supply section 12 to the terminal 4A of the power supply path of the board 1 via the contact 3, and the identification section 11 receives an output signal through the contact 3 to determine the type of printed board mounted.

このような方法では前者は人手を要し、更に誤
識別が生じる欠点を有している。また、後者は試
験前のプリント板に電源を供給しなければならな
く、もし誤接続などがある場合は実装された電子
部品4を損傷させ、更に、改造などによつてプリ
ント板の構成を変更した場合はその記憶された種
別を訂正するためには多くの工数を要する問題を
有していた。
The former method requires manpower and has the disadvantage of causing erroneous identification. In addition, in the latter case, power must be supplied to the printed board before testing, and if there is an incorrect connection, the mounted electronic components 4 may be damaged, and the configuration of the printed board may be changed due to modification etc. In this case, there is a problem in that it requires a lot of man-hours to correct the stored type.

(c) 発明の目的 本発明の目的はプリント板の試験に際して、コ
ンタクト板の基板に設けられた端子片の所定箇所
に当接することでプリント板の種別が判別できる
ようにし、前述の問題点を除去したものを提供す
るものである。
(c) Purpose of the Invention The purpose of the present invention is to enable the type of printed circuit board to be determined by contacting a predetermined location of a terminal piece provided on the substrate of a contact plate when testing a printed circuit board, and to solve the above-mentioned problems. The removed version is provided.

(d) 発明の構成 本発明の目的は、かゝるプリント板の識別方法
において、半田面には所定の端子間が配線パター
ンにより短絡および開放されることでプリント板
の種別を記録する端子群を設け、該端子群にコン
タクトを当接し該種別が判別されることを特徴と
するプリント板の識別方法により達成される。
(d) Structure of the Invention The object of the present invention is to provide a printed circuit board identification method that includes a terminal group on the solder surface that records the type of the printed circuit board by short-circuiting and opening between predetermined terminals according to a wiring pattern. This is achieved by a printed board identification method characterized in that the type is determined by providing a terminal group and contacting the terminal group with a contact.

(e) 発明の実施例 以下本発明を第3図を参考に詳細に説明する。
第3図のa,b図は本発明によるプリント板の試
験方法の一実施例を示す説明図である。
(e) Embodiments of the Invention The present invention will be described in detail below with reference to FIG.
FIGS. 3a and 3b are explanatory diagrams showing an embodiment of the printed board testing method according to the present invention.

第3a図に示すように、基板1の所定箇所には
複数の端子13を設け、試験に際しては先づコン
タクト3をそれぞれ端子13に当接させ前述の測
定部5によつて電子部品4が実装されたプリント
板の種別を判別するようにしたものである。この
ような端子13による種別の識別は第3b図に示
すように形成することで行なえる。前述の駆動部
6によつてスライドされるコンタクト3―11〜
3―1n,3―21〜3―2nに対向する基板1
のランド1Dに端子13が設けられており、例え
ば所定のプリント板に対してはコンタクト3―1
1と3―12および3―1nと3―2nが当接す
る箇所に位置したランド1Dにはパターン配線な
どによつて点線に示すように電気導通が得られる
ように配線14を接続する。これにより、それぞ
れのコンタクト3―11〜3―1n,3―21〜
3―2nを端子13に当接させ測定部5によつて
各コンタクト間の導通の有無によつて種別を識別
することができる。
As shown in FIG. 3a, a plurality of terminals 13 are provided at predetermined locations on the board 1, and during testing, the contacts 3 are brought into contact with each terminal 13, and the electronic component 4 is mounted by the aforementioned measuring section 5. This system is designed to determine the type of printed board that has been printed. Identification of the type using the terminal 13 can be performed by forming it as shown in FIG. 3b. Contacts 3-11~ slid by the aforementioned drive unit 6
Substrate 1 facing 3-1n, 3-21 to 3-2n
A terminal 13 is provided on the land 1D of, for example, a contact 3-1 for a predetermined printed board.
A wiring 14 is connected to the land 1D located at a location where 1 and 3-12 and 3-1n and 3-2n contact each other by pattern wiring or the like so as to obtain electrical continuity as shown by dotted lines. As a result, each contact 3-11 to 3-1n, 3-21 to
3-2n is brought into contact with the terminal 13, and the type can be identified by the measuring section 5 based on the presence or absence of conduction between each contact.

したがつて、プリント板の種別によつてそれぞ
れの端子13の間を接続すれば、盤面2Aに基板
1を装着し、先づコンタクト3を駆動部6によつ
て駆動させ、端子13に当接させ測定部5によつ
て各端子13間の接続形態によつてプリント板の
種別を識別する。次に、この識別によつて制御部
7はそのプリント板に適用されるテストデータ9
を選択しテストデータ9による試験の実行を行う
ことができる。
Therefore, if the terminals 13 are connected depending on the type of printed board, the board 1 is mounted on the board surface 2A, and the contacts 3 are first driven by the drive unit 6 and brought into contact with the terminals 13. The type of printed circuit board is identified by the contact measurement unit 5 based on the connection form between each terminal 13. Next, based on this identification, the control section 7 determines the test data 9 to be applied to the printed board.
The test can be executed using the test data 9 by selecting .

このように形成すると、従来のように電源供給
することなくプリント板の種別の識別を行うこと
ができる。
When formed in this way, the type of printed board can be identified without supplying power as in the conventional case.

(f) 発明の効果 以上説明したように本発明は基板1にはコンタ
クト3に当接される複数の端子13の間はプリン
ト板の種別によつて所定の配線14の接続を行う
ことで、プリント板の試験に際してコンタクト3
を介して測定部5によつてプリント板の種別を識
別するようにしたものである。
(f) Effects of the Invention As explained above, the present invention connects the plurality of terminals 13 that come into contact with the contacts 3 on the board 1 with predetermined wiring 14 depending on the type of printed board. Contact 3 when testing printed boards
The type of printed board is identified by the measuring section 5 through the .

これにより、従来のようにプリント板の識別に
際して電源を供給することは不要であり、したが
つて、実装された電子部品4を損傷することはな
くなる。更に、改造などによつてプリント板の種
別が変更となつても、端子13間の配線14の切
断および接続で容易に対処でき実用効果は大であ
る。
Thereby, it is not necessary to supply power when identifying a printed board as in the conventional case, and therefore, the mounted electronic components 4 will not be damaged. Furthermore, even if the type of printed board is changed due to modification or the like, this can be easily handled by cutting and connecting the wiring 14 between the terminals 13, which has a great practical effect.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はプリント板の試験装置のa図は構成
図、b図は説明図、第2図は従来のプリント板の
識別方法の説明図、第3図のa,b図は本発明に
よるプリント板の識別方法の説明図を示す。 図中において、1は基板、2はテーブル、3は
コンタクト、4は電子部品、5は測定部、6は駆
動部、7は制御部、8は操作台、9はテストデー
タ、11は識別部、12は電源供給部、13は端
子、14は配線を示す。
Figure 1 is a block diagram of a printed board testing device, Figure b is an explanatory diagram, Figure 2 is an explanatory diagram of a conventional printed board identification method, and Figures a and b of Figure 3 are printed circuit boards according to the present invention. An explanatory diagram of a board identification method is shown. In the figure, 1 is a board, 2 is a table, 3 is a contact, 4 is an electronic component, 5 is a measurement part, 6 is a drive part, 7 is a control part, 8 is an operating table, 9 is test data, 11 is an identification part , 12 is a power supply unit, 13 is a terminal, and 14 is a wiring.

Claims (1)

【特許請求の範囲】[Claims] 1 スルホールを貫通した電子部品のリード端子
片が半田面で半田付けされたプリント板と、該プ
リント板を装着する盤面と、該半田面に対向して
所定ピツチで配列された複数のコンタクトと、該
コンタクトを選択して該端子片に当接する駆動部
と、該コンタクトを介して信号を入出力する測定
部とを備えると共に、前記半田面には所定の端子
間が配線パターンにより短絡および開放されるこ
とで前記プリント板の種別を記録する端子群を設
け、該端子群に前記コンタクトを当接し該種別が
判別されることを特徴とするプリント板の識別方
法。
1. A printed board to which a lead terminal piece of an electronic component passing through a through hole is soldered on a soldering surface, a board surface to which the printed board is attached, and a plurality of contacts arranged at a predetermined pitch opposite to the soldering surface; It includes a drive unit that selects the contact and abuts the terminal piece, and a measurement unit that inputs and outputs a signal through the contact, and the solder surface has wiring patterns that are short-circuited and opened between predetermined terminals. A method for identifying a printed board, characterized in that a group of terminals for recording the type of the printed board is provided, and the type is determined by bringing the contacts into contact with the group of terminals.
JP58159506A 1983-08-31 1983-08-31 Method of identifying printed board Granted JPS6052083A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58159506A JPS6052083A (en) 1983-08-31 1983-08-31 Method of identifying printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58159506A JPS6052083A (en) 1983-08-31 1983-08-31 Method of identifying printed board

Publications (2)

Publication Number Publication Date
JPS6052083A JPS6052083A (en) 1985-03-23
JPH0252880B2 true JPH0252880B2 (en) 1990-11-14

Family

ID=15695256

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58159506A Granted JPS6052083A (en) 1983-08-31 1983-08-31 Method of identifying printed board

Country Status (1)

Country Link
JP (1) JPS6052083A (en)

Also Published As

Publication number Publication date
JPS6052083A (en) 1985-03-23

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