JPH0254369B2 - - Google Patents
Info
- Publication number
- JPH0254369B2 JPH0254369B2 JP9770982A JP9770982A JPH0254369B2 JP H0254369 B2 JPH0254369 B2 JP H0254369B2 JP 9770982 A JP9770982 A JP 9770982A JP 9770982 A JP9770982 A JP 9770982A JP H0254369 B2 JPH0254369 B2 JP H0254369B2
- Authority
- JP
- Japan
- Prior art keywords
- compounds
- organic
- bis
- ketonitrile
- oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- -1 1-methyl-1,1-ethanediyl Chemical group 0.000 claims description 33
- 239000003054 catalyst Substances 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 15
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 7
- 239000011342 resin composition Substances 0.000 claims description 6
- 239000000047 product Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 10
- 229910015900 BF3 Inorganic materials 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 6
- 125000002560 nitrile group Chemical group 0.000 description 6
- 238000005829 trimerization reaction Methods 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000004644 polycyanurate Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- FYSNRJHAOHDILO-UHFFFAOYSA-N thionyl chloride Chemical compound ClS(Cl)=O FYSNRJHAOHDILO-UHFFFAOYSA-N 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 238000000862 absorption spectrum Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- KTWOOEGAPBSYNW-UHFFFAOYSA-N ferrocene Chemical compound [Fe+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 KTWOOEGAPBSYNW-UHFFFAOYSA-N 0.000 description 3
- 229920006015 heat resistant resin Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 3
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- 239000002841 Lewis acid Substances 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 125000006575 electron-withdrawing group Chemical group 0.000 description 2
- 238000000921 elemental analysis Methods 0.000 description 2
- YAGKRVSRTSUGEY-UHFFFAOYSA-N ferricyanide Chemical compound [Fe+3].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] YAGKRVSRTSUGEY-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- LELOWRISYMNNSU-UHFFFAOYSA-N hydrogen cyanide Chemical compound N#C LELOWRISYMNNSU-UHFFFAOYSA-N 0.000 description 2
- 150000007517 lewis acids Chemical class 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 150000002902 organometallic compounds Chemical class 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 150000003606 tin compounds Chemical class 0.000 description 2
- 150000003609 titanium compounds Chemical class 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- BXJWDOYMROEHEN-UHFFFAOYSA-N tributylstibane Chemical compound CCCC[Sb](CCCC)CCCC BXJWDOYMROEHEN-UHFFFAOYSA-N 0.000 description 2
- 150000003755 zirconium compounds Chemical class 0.000 description 2
- CFMUSUSAXOVNOD-PAMPIZDHSA-L (Z)-1,1,1,5,5,5-hexafluoro-4-oxopent-2-en-2-olate manganese(2+) Chemical compound [Mn+2].FC(F)(F)C(/[O-])=C/C(=O)C(F)(F)F.FC(F)(F)C(/[O-])=C/C(=O)C(F)(F)F CFMUSUSAXOVNOD-PAMPIZDHSA-L 0.000 description 1
- VTGXVUQXDHXADV-UHFFFAOYSA-N 1-methyl-1-oxidopiperidin-1-ium Chemical compound C[N+]1([O-])CCCCC1 VTGXVUQXDHXADV-UHFFFAOYSA-N 0.000 description 1
- NXIHMZUXSZKKBX-UHFFFAOYSA-N 1h-imidazole;trifluoroborane Chemical compound FB(F)F.C1=CNC=N1 NXIHMZUXSZKKBX-UHFFFAOYSA-N 0.000 description 1
- CHZLVSBMXZSPNN-UHFFFAOYSA-N 2,4-dimethylbenzenesulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C(C)=C1 CHZLVSBMXZSPNN-UHFFFAOYSA-N 0.000 description 1
- FFISWZPYNKWIRR-UHFFFAOYSA-N 5-oxidophenazin-5-ium Chemical compound C1=CC=C2[N+]([O-])=C(C=CC=C3)C3=NC2=C1 FFISWZPYNKWIRR-UHFFFAOYSA-N 0.000 description 1
- 239000007848 Bronsted acid Substances 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 102100025027 E3 ubiquitin-protein ligase TRIM69 Human genes 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 101000830203 Homo sapiens E3 ubiquitin-protein ligase TRIM69 Proteins 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- LKQUDAOAMBKKQW-UHFFFAOYSA-N N,N-dimethylaniline N-oxide Chemical compound CN(C)(=O)C1=CC=CC=C1 LKQUDAOAMBKKQW-UHFFFAOYSA-N 0.000 description 1
- LFTLOKWAGJYHHR-UHFFFAOYSA-N N-methylmorpholine N-oxide Chemical compound CN1(=O)CCOCC1 LFTLOKWAGJYHHR-UHFFFAOYSA-N 0.000 description 1
- DRNPGEPMHMPIQU-UHFFFAOYSA-N O.[Ti].[Ti].CCCCO.CCCCO.CCCCO.CCCCO.CCCCO.CCCCO Chemical compound O.[Ti].[Ti].CCCCO.CCCCO.CCCCO.CCCCO.CCCCO.CCCCO DRNPGEPMHMPIQU-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 150000001495 arsenic compounds Chemical class 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000001540 azides Chemical class 0.000 description 1
- NMFMOYLXOPIJHU-UHFFFAOYSA-N benzene-1,3-dicarbonyl cyanide Chemical compound N#CC(=O)C1=CC=CC(C(=O)C#N)=C1 NMFMOYLXOPIJHU-UHFFFAOYSA-N 0.000 description 1
- 150000001622 bismuth compounds Chemical class 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000005626 carbonium group Chemical group 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- PIMYDFDXAUVLON-UHFFFAOYSA-M chloro(triethyl)stannane Chemical compound CC[Sn](Cl)(CC)CC PIMYDFDXAUVLON-UHFFFAOYSA-M 0.000 description 1
- RCTYPNKXASFOBE-UHFFFAOYSA-M chloromercury Chemical compound [Hg]Cl RCTYPNKXASFOBE-UHFFFAOYSA-M 0.000 description 1
- 150000001845 chromium compounds Chemical class 0.000 description 1
- 150000001869 cobalt compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- NLUNLVTVUDIHFE-UHFFFAOYSA-N cyclooctylcyclooctane Chemical compound C1CCCCCCC1C1CCCCCCC1 NLUNLVTVUDIHFE-UHFFFAOYSA-N 0.000 description 1
- SPKJCVZOZISLEI-UHFFFAOYSA-N cyclopenta-1,3-diene;1-cyclopenta-1,3-dien-1-ylethanone;iron(2+) Chemical compound [Fe+2].C=1C=C[CH-]C=1.CC(=O)C1=CC=C[CH-]1 SPKJCVZOZISLEI-UHFFFAOYSA-N 0.000 description 1
- KSFCHHFBQJDGFF-UHFFFAOYSA-L cyclopenta-1,3-diene;dichlorotitanium Chemical compound Cl[Ti]Cl.C1C=CC=C1.C1C=CC=C1 KSFCHHFBQJDGFF-UHFFFAOYSA-L 0.000 description 1
- QRUYYSPCOGSZGQ-UHFFFAOYSA-L cyclopentane;dichlorozirconium Chemical compound Cl[Zr]Cl.[CH]1[CH][CH][CH][CH]1.[CH]1[CH][CH][CH][CH]1 QRUYYSPCOGSZGQ-UHFFFAOYSA-L 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- JJPZOIJCDNHCJP-UHFFFAOYSA-N dibutyl(sulfanylidene)tin Chemical compound CCCC[Sn](=S)CCCC JJPZOIJCDNHCJP-UHFFFAOYSA-N 0.000 description 1
- FFKSUTHTFIDTNU-UHFFFAOYSA-N dibutyl-bis(ethenyl)stannane Chemical compound CCCC[Sn](C=C)(C=C)CCCC FFKSUTHTFIDTNU-UHFFFAOYSA-N 0.000 description 1
- IWQIEVOJUWFMSB-UHFFFAOYSA-N dihexylphosphane Chemical compound CCCCCCPCCCCCC IWQIEVOJUWFMSB-UHFFFAOYSA-N 0.000 description 1
- XWBDWELWBUWSNI-UHFFFAOYSA-N dimethyl 4-nitrobenzene-1,2-dicarboxylate Chemical compound COC(=O)C1=CC=C([N+]([O-])=O)C=C1C(=O)OC XWBDWELWBUWSNI-UHFFFAOYSA-N 0.000 description 1
- HGQSXVKHVMGQRG-UHFFFAOYSA-N dioctyltin Chemical compound CCCCCCCC[Sn]CCCCCCCC HGQSXVKHVMGQRG-UHFFFAOYSA-N 0.000 description 1
- CLVJBRYGLQNRDA-UHFFFAOYSA-N diphenylarsorylbenzene Chemical compound C=1C=CC=CC=1[As](C=1C=CC=CC=1)(=O)C1=CC=CC=C1 CLVJBRYGLQNRDA-UHFFFAOYSA-N 0.000 description 1
- HWMTUNCVVYPZHZ-UHFFFAOYSA-N diphenylmercury Chemical compound C=1C=CC=CC=1[Hg]C1=CC=CC=C1 HWMTUNCVVYPZHZ-UHFFFAOYSA-N 0.000 description 1
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 description 1
- NJVOZLGKTAPUTQ-UHFFFAOYSA-M fentin chloride Chemical compound C=1C=CC=CC=1[Sn](C=1C=CC=CC=1)(Cl)C1=CC=CC=C1 NJVOZLGKTAPUTQ-UHFFFAOYSA-M 0.000 description 1
- BFWMWWXRWVJXSE-UHFFFAOYSA-M fentin hydroxide Chemical compound C=1C=CC=CC=1[Sn](C=1C=CC=CC=1)(O)C1=CC=CC=C1 BFWMWWXRWVJXSE-UHFFFAOYSA-M 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229940093920 gynecological arsenic compound Drugs 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002506 iron compounds Chemical class 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- YWBREQLMDUVNIR-UHFFFAOYSA-N iron(2+);hexacyanide Chemical compound [Fe+2].[Fe+2].[Fe+2].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] YWBREQLMDUVNIR-UHFFFAOYSA-N 0.000 description 1
- DCYOBGZUOMKFPA-UHFFFAOYSA-N iron(2+);iron(3+);octadecacyanide Chemical compound [Fe+2].[Fe+2].[Fe+2].[Fe+3].[Fe+3].[Fe+3].[Fe+3].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] DCYOBGZUOMKFPA-UHFFFAOYSA-N 0.000 description 1
- BQZFDPZOAJMUIU-UHFFFAOYSA-N iron(3+);hexacyanide Chemical compound [Fe+3].[Fe+3].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] BQZFDPZOAJMUIU-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 150000002611 lead compounds Chemical class 0.000 description 1
- 229940049920 malate Drugs 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N malic acid Chemical compound OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 150000002697 manganese compounds Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- MMAXOAIHEPNELR-UHFFFAOYSA-N n,n-dimethylcyclohexanamine oxide Chemical compound C[N+](C)([O-])C1CCCCC1 MMAXOAIHEPNELR-UHFFFAOYSA-N 0.000 description 1
- YHSRJRGROTVVRH-UHFFFAOYSA-N n-butyl-n-methylhydroxylamine Chemical compound CCCCN(C)O YHSRJRGROTVVRH-UHFFFAOYSA-N 0.000 description 1
- KQJBQMSCFSJABN-UHFFFAOYSA-N octadecan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCCCCCCCCCCCCCCCC[O-].CCCCCCCCCCCCCCCCCC[O-].CCCCCCCCCCCCCCCCCC[O-].CCCCCCCCCCCCCCCCCC[O-] KQJBQMSCFSJABN-UHFFFAOYSA-N 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- XEBWQGVWTUSTLN-UHFFFAOYSA-M phenylmercury acetate Chemical compound CC(=O)O[Hg]C1=CC=CC=C1 XEBWQGVWTUSTLN-UHFFFAOYSA-M 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- UHZYTMXLRWXGPK-UHFFFAOYSA-N phosphorus pentachloride Chemical compound ClP(Cl)(Cl)(Cl)Cl UHZYTMXLRWXGPK-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- DBIWHDFLQHGOCS-UHFFFAOYSA-N piperidine;trifluoroborane Chemical compound FB(F)F.C1CCNCC1 DBIWHDFLQHGOCS-UHFFFAOYSA-N 0.000 description 1
- 229920000582 polyisocyanurate Polymers 0.000 description 1
- 239000011495 polyisocyanurate Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000000276 potassium ferrocyanide Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- ILVXOBCQQYKLDS-UHFFFAOYSA-N pyridine N-oxide Chemical compound [O-][N+]1=CC=CC=C1 ILVXOBCQQYKLDS-UHFFFAOYSA-N 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- GTSHREYGKSITGK-UHFFFAOYSA-N sodium ferrocyanide Chemical compound [Na+].[Na+].[Na+].[Na+].[Fe+2].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] GTSHREYGKSITGK-UHFFFAOYSA-N 0.000 description 1
- 239000000264 sodium ferrocyanide Substances 0.000 description 1
- 235000012247 sodium ferrocyanide Nutrition 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 1
- LOJPEGWUHVRGBN-UHFFFAOYSA-J tetrachlorotitanium;triethylalumane Chemical compound [Cl-].[Cl-].[Cl-].[Cl-].[Ti+4].CC[Al](CC)CC LOJPEGWUHVRGBN-UHFFFAOYSA-J 0.000 description 1
- AETLIPLCBDMJOD-UHFFFAOYSA-J tetrachlorotitanium;tris(2-methylpropyl)alumane Chemical compound Cl[Ti](Cl)(Cl)Cl.CC(C)C[Al](CC(C)C)CC(C)C AETLIPLCBDMJOD-UHFFFAOYSA-J 0.000 description 1
- RWWNQEOPUOCKGR-UHFFFAOYSA-N tetraethyltin Chemical compound CC[Sn](CC)(CC)CC RWWNQEOPUOCKGR-UHFFFAOYSA-N 0.000 description 1
- MZIYQMVHASXABC-UHFFFAOYSA-N tetrakis(ethenyl)stannane Chemical compound C=C[Sn](C=C)(C=C)C=C MZIYQMVHASXABC-UHFFFAOYSA-N 0.000 description 1
- WBJSMHDYLOJVKC-UHFFFAOYSA-N tetraphenyllead Chemical compound C1=CC=CC=C1[Pb](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 WBJSMHDYLOJVKC-UHFFFAOYSA-N 0.000 description 1
- CRHIAMBJMSSNNM-UHFFFAOYSA-N tetraphenylstannane Chemical group C1=CC=CC=C1[Sn](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 CRHIAMBJMSSNNM-UHFFFAOYSA-N 0.000 description 1
- XOGGUFAVLNCTRS-UHFFFAOYSA-N tetrapotassium;iron(2+);hexacyanide Chemical compound [K+].[K+].[K+].[K+].[Fe+2].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] XOGGUFAVLNCTRS-UHFFFAOYSA-N 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- YSUXTNDMKYYZPR-UHFFFAOYSA-M tributylstannyl prop-2-enoate Chemical compound CCCC[Sn](CCCC)(CCCC)OC(=O)C=C YSUXTNDMKYYZPR-UHFFFAOYSA-M 0.000 description 1
- REDSKZBUUUQMSK-UHFFFAOYSA-N tributyltin Chemical compound CCCC[Sn](CCCC)CCCC.CCCC[Sn](CCCC)CCCC REDSKZBUUUQMSK-UHFFFAOYSA-N 0.000 description 1
- UYPYRKYUKCHHIB-UHFFFAOYSA-N trimethylamine N-oxide Chemical compound C[N+](C)(C)[O-] UYPYRKYUKCHHIB-UHFFFAOYSA-N 0.000 description 1
- ZMBHCYHQLYEYDV-UHFFFAOYSA-N trioctylphosphine oxide Chemical compound CCCCCCCCP(=O)(CCCCCCCC)CCCCCCCC ZMBHCYHQLYEYDV-UHFFFAOYSA-N 0.000 description 1
- BPLUKJNHPBNVQL-UHFFFAOYSA-N triphenylarsine Chemical compound C1=CC=CC=C1[As](C=1C=CC=CC=1)C1=CC=CC=C1 BPLUKJNHPBNVQL-UHFFFAOYSA-N 0.000 description 1
- VYNGFCUGSYEOOZ-UHFFFAOYSA-N triphenylphosphine sulfide Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)(=S)C1=CC=CC=C1 VYNGFCUGSYEOOZ-UHFFFAOYSA-N 0.000 description 1
- HVYVMSPIJIWUNA-UHFFFAOYSA-N triphenylstibine Chemical compound C1=CC=CC=C1[Sb](C=1C=CC=CC=1)C1=CC=CC=C1 HVYVMSPIJIWUNA-UHFFFAOYSA-N 0.000 description 1
- DCXPBOFGQPCWJY-UHFFFAOYSA-N trisodium;iron(3+);hexacyanide Chemical compound [Na+].[Na+].[Na+].[Fe+3].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] DCXPBOFGQPCWJY-UHFFFAOYSA-N 0.000 description 1
- 150000003658 tungsten compounds Chemical class 0.000 description 1
- 150000003682 vanadium compounds Chemical class 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Description
本発明は絶縁材料耐熱区分C種(常用180℃以
上)の多官能α−ケトニトリル化合物の環化重合
物を含む耐熱性樹脂を与える硬化性樹脂組成物に
関する。
近年、回転電機などの電気機器においては、そ
の大容量化と小型軽量化が進むに従い、耐熱性の
極めて優れた熱硬化性樹脂組成物が要求されてい
る。シアヌレート環を主要構造単位として含むポ
リイソシアヌレートが、耐熱性に優れていること
は、すでに、米国特許第3775380号明細書などに
よつて公知である。このポリシアヌレートは式(1)
に示すように、多官能ニトリル化合物の三量化
(環化重合)反応によつて得られる。
この式(1)の反応は揮発分の生成を伴わない付加
反応であるため、その硬化物は内部に空洞(ボイ
ド)を含まず、高耐熱性の絶縁材料として好適と
思われる。ところで、この三量化による硬化反応
を起こさせるには一般に硫酸、p−トルエンスル
ホン酸、m−キシレンスルホン酸、トリフルオロ
スルホン酸、トリクロロスルホン酸などのブレン
ステツト酸あるいは三弗化ホウ素、無水塩化第二
錫、三弗化ホウ素アミン錯体、有機金属化合物、
有機アミンオキサイド等の触媒を添加する必要が
ある。前者のブレンステツド酸を触媒とする場合
には室温でも反応は十分進行するが、その硬化物
は、200℃以上の高温に保持されたとき、残存し
ている硬化触媒が分解反応の触媒作用をするため
に、耐熱性に劣り、また電気特性も損われるとい
う欠点を有する。一方、三弗化ホウ素、三弗化ホ
ウ素アミン錯塩、有機金属化合物、有機アミンオ
キサイド等を触媒に用いた場合には、十分に硬化
させるためには250℃以上の温度で3日間以上加
熱する必要がある。得られる硬化物は、良好な耐
熱性と電気特性を示すが、硬化にこのような高
温、長時間を要するために、実用的でなかつた。
ところで、ニトリル化合物の三量化反応は、一
官能性モデル化合物を例にとると、式(2)に示すよ
うな機構で進むと考えられる。
従つて、ニトリル基に電子吸引性基を隣接させ
れば、ニトリル基の陽性カルボニウム炭素がさら
に活性化されてニトリル基の三量化反応は容易に
進行すると思われる。電子吸引性基としては酸素
−O−、硫黄−S−、窒素−N−などの原子ある
いはカルボニル基
The present invention relates to a curable resin composition that provides a heat-resistant resin containing a cyclized polymer of a polyfunctional α-ketonitrile compound of insulating material heat-resistant category C class (commonly used at 180° C. or higher). BACKGROUND ART In recent years, as electrical equipment such as rotating electric machines has become larger in capacity, smaller and lighter in weight, there has been a demand for thermosetting resin compositions with extremely excellent heat resistance. It is already known from US Pat. No. 3,775,380 that polyisocyanurate containing a cyanurate ring as a main structural unit has excellent heat resistance. This polycyanurate is expressed by the formula (1)
As shown in , it is obtained by trimerization (cyclization polymerization) reaction of a polyfunctional nitrile compound. Since the reaction of formula (1) is an addition reaction that does not involve the production of volatile matter, the cured product does not contain voids inside and is considered suitable as a highly heat-resistant insulating material. By the way, in order to cause this curing reaction by trimerization, Brønstedt acids such as sulfuric acid, p-toluenesulfonic acid, m-xylenesulfonic acid, trifluorosulfonic acid, and trichlorosulfonic acid, boron trifluoride, and anhydrous dichloride are generally used. tin, boron trifluoride amine complex, organometallic compound,
It is necessary to add a catalyst such as organic amine oxide. When the former Brønsted acid is used as a catalyst, the reaction proceeds sufficiently even at room temperature, but when the cured product is kept at a high temperature of 200°C or higher, the remaining curing catalyst acts as a catalyst for the decomposition reaction. Therefore, it has the drawbacks of poor heat resistance and impaired electrical properties. On the other hand, when boron trifluoride, boron trifluoride amine complex salts, organometallic compounds, organic amine oxides, etc. are used as catalysts, it is necessary to heat them at a temperature of 250°C or higher for three days or more in order to fully cure them. There is. Although the obtained cured product exhibits good heat resistance and electrical properties, it is not practical because curing requires such a high temperature and a long time. By the way, the trimerization reaction of nitrile compounds is thought to proceed according to the mechanism shown in formula (2), taking a monofunctional model compound as an example. Therefore, it is thought that when an electron-withdrawing group is placed adjacent to a nitrile group, the positive carbonium carbon of the nitrile group is further activated and the trimerization reaction of the nitrile group proceeds easily. Electron-withdrawing groups include atoms such as oxygen -O-, sulfur -S-, nitrogen -N-, or carbonyl groups.
【式】が考えられる。これらの
うちで、−O−CN、−S−CN、−NR−CNは容易
に三量化してシアヌレートになることが知られて
いる。しかし、α−ケトニトリル[Formula] can be considered. Among these, -O-CN, -S-CN, and -NR-CN are known to easily trimerize into cyanurate. However, α-ketonitrile
【式】の
三量化反応は知られていない。わずかにα−ケト
ニトリルからのポリマーらしきものがG.BLACK
STOCKによつてJ.Amer Chem.Soc.,34,1080
(1912)に報告されているのみである。即ち、ピ
リジン溶媒中でテレフタロイルクロライドとシア
ン化水素を反応させると300℃付近で熔融する褐
色粉末が得られるという。しかし、この粉末は耐
熱性、電気特性共に悪く、電気絶縁材料として使
用することはできない。
そこで本発明者らは、テレフタロイルシアニド
〔〕の三量化反応について、鋭意検討した。そ
の結果、比較的低温で容易に式(3)の反応が起り得
ることを見出し、本発明に至つた。
すなわち、本発明は例えば電気絶縁材料として
好適な新規な耐熱性樹脂を提供することを目的と
する。その特徴は、式
で示される1,3,5−トリアジン−2,4,6
−トルカルボニル構造を含有する樹脂にある。そ
して、この樹脂は多官能α−ケトニトリル化合物
を、シアヌレート環形成触媒の存在において重合
させることによつて得られる。
本発明において、多官能α−ケトニトリル化合
物としては、1分子中に少なくとも2個のα−ケ
トニトリル基を含む化合物であれば、特別に制限
されない。そのような化合物としては、例えば、
フタロイルシアニド、イソフタロイルシアニド、
テレフタロイルシアニド、α,α′,α″−トリオキ
ソ−1,2,5−ベンゼントリアセトニトリル、
α,α′,α″,α−テトラオキソ−1,2,4,
5−ベンゼンテトラアセトニトリル、4,4′−メ
チレンビス(α−オキソ−ベンゼンアセトニトリ
ル)、4,4′−プロパンジイルビス(α−オキソ
−ベンゼンアセトニトリル)、4,4′−スルホニ
ルビス(α−オキソ−ベンゼンアセトニトリル)、
4,4′−オキシビス(α−オキソ−ベンゼンアセ
トニトリル)、4,4′−〔(1−メチル−1,1−
エタンジイル)ビス(4,1−フエニレンオキ
シ)〕ビス〔α−オキソ−ベンゼンアセトニトリ
ル〕などがある。さらに、4,4′−〔(1−メチル
−1,1−エタンジイル)ビス(4,1−フエニ
レンオキシ)〕ビス〔α,α′−ジオキソ−1,2
−ベンゼンアセトニトリル〕が有用である。これ
らの多官能α−ケトニトリル化合物は、単独もし
くは2種以上併せて用いられる。
前記のようなα−ケトニトリル化合物の重合に
よつて、本発明の耐熱性樹脂を得るに当つては、
シアヌレート環形成触媒が重要な働きをする。そ
のような触媒としては三弗化ホウ素、無水塩化第
二錫、無水塩化アルミニウム、無水塩化第二鉄、
五塩化リン、塩化第二銅、四塩化チタンなどのル
イス酸、三弗化ホウ素モノエチルアミン錯塩、三
弗化ホウ素ピペリジン錯塩、三弗化ホウ素イミダ
ゾール錯塩などの三弗化ホウ素アミン錯体、一般
式
(式中、R1,R2,R3,R4及びR6は水素、アルキ
ル基、アルケニル基、フエニル基、置換フエニル
基を表わし、R5はフエニル基または置換フエニ
ル基を表わす。またQは窒素、リン、ヒ素、アン
チモンもしくはビスマスを表わす)で示されるテ
トラ置換ボレート型錯体などがある。また、四塩
化チタン−トリエチルアルミニウム、四塩化チタ
ン−トリイソブチルアルミニウムなどのチーグラ
ーナツタ系触媒、フエロシアン化第一鉄、フエロ
シアン化第二鉄、フエロシアン化銅、フエロシア
ン化亜鉛、フエロシアン化ナトリウム、フエロシ
アン化カリウム、フエロシアン化カルシウム、フ
エロシアン化バリウム、フエロシアン化リチウ
ム、フエリシアン化第一鉄、フエリシアン化第二
鉄、フエリシアン化銅、フエリシアン化ナトリウ
ム、フエリシアン化カリウム、フエリシアン化カ
ルシウム、フエリシアン化マグネシウム、フエリ
シアン化リチウム等のフエロシアン化金属、フエ
リシアン化金属、テトラフエニル錫、ジブチル錫
スルフアイド、トリブチル錫アクリレート、トリ
フエニル錫クロライド、ヘキサブチルジ錫、ジブ
チルジビニル錫、トリエチル錫クロライド、テト
ラエチル錫、ジブチル錫ジアセテート、ジオクチ
ル錫マレート、トリフエニル錫ヒドロオキサイ
ド、テトラビニル錫などの有機錫化合物、トリブ
チルアンチモン、トリブチルアンチモンオキサイ
ド、トリフエニルアンチモン、トリフエニルアン
チモンスルフアイドなどの有機アンチモン化合
物、テトラフエニル鉛などの有機鉛化合物、酢酸
フエニル水銀、ジフエニル水銀などの有機水銀化
合物、トリフエニルヒ素、トリフエニルヒ素オキ
サイドなどの有機ヒ素化合物、フエロセン(ジシ
クロペンタジエニル鉄)、クロロマーキユリーフ
エロセン、アセチルフエロセン、1,1−ビス
(クロロマーキユロ)フエロセンなどの有機鉄化
合物、ビス(シクロペンタジエニル)チタンジク
ロライド、テトラ(i−プロピル)チタネート、
テトラ(n−ブチル)チタネート、テトラステア
リルチタネート、テトラ(2−エチルヘキシル)
チタネート、ブチルチタネートダイマ、重合テト
ラブチルチタネートなどの有機チタン化合物、ビ
ス(シクロペンタジエニル)ジルコニウムクロラ
イド、テトラエチルジルコネート、テトラ(i−
プロピル)ジルコネート、テトラ(n−ブチル)
ジルコネート、テトラ(n−ペンチル)ジルコネ
ート、テトラ(n−ヘキシル)ジルコネート、テ
トラ(n−オクチル)ジルコネートなどの有機ジ
ルコニウム化合物、トリフエニルホスフインサル
フイド、ジヘキシルホスフインオキサイド、トリ
オクチルホスフインオキサイド、トリフエニルホ
スフインなどの有機リン化合物、ヘキサメチルジ
シラザン、トリフエニルシリコーンアジドなどの
有機シリコーン化合物、オクタカルボニルジコバ
ルトなどの有機コバルト化合物、ヘキサカルボニ
ルクロム、トリカルボニルトルイルクロムなどの
有機クロム化合物、トリフエニルビスマスなどの
有機ビスマス化合物、有機バナジウム化合物、有
機マンガン化合物、有機タングステン化合物など
がある。又、N,N−ジメチル−N−シクロヘキ
シルアミンオキサイド、N,N−ジメチル−N−
フエニルアミンオキサイド、1,4−ジオキソ−
1,4−ジアザ〔2,2,2〕ビシクロオクタ
ン、フエナジン−N−オキサイド、ピリジン−N
−オキサイド、N−メチルモルホリン−N−オキ
サイド、N−メチルピペリジン−N−オキサイ
ド、トリメチルアミンオキサイド、N−エチル−
N−メチル−N−ブチルアミンオキサイドなどの
有機アミンオキサイドなどがある。上記触媒のう
ち、ルイス酸、三弗化ホウ素アミン錯体、有機錫
化合物、有機チタン化合物、有機ジルコニウム化
合物、有機アミンキサイドが特に有効である。
上記触媒の使用量は厳格な限定を要しないが、
上記触媒の少なくとも1種が前記多官能α−ケト
ニトリル化合物に対して0.01〜10重量%の範囲で
用いられ、とくに0.1〜5重量%の範囲が好まし
い。
本発明において、多官能α−ケトニトリル化合
物は、前記触媒を配合された熱硬化性樹脂組成物
として、使用され得る。該組成物は、既述のよう
に付加重合型の無溶剤系であつて、所望に従つて
溶媒を含有することも、また、公知の各種添加
剤、充填剤や顔料などを配合されて使用されるこ
ともできる。そのような組成物は、0〜250℃に
おいて1〜200時間加熱することによつて容易に
硬化する。得られる硬化樹脂は250℃という高温
でも長時間使用できる優れた耐熱性を有してい
る。又、該樹脂は、電気特性、耐薬品性、耐衝撃
性、自己消火性にも優れている。従つて、前記熱
硬化性樹脂組成物は、耐熱性絶縁ワニスや注型用
樹脂、電子部品用モールド樹脂、含浸・積層用樹
脂、印刷配線用樹脂、内装用樹脂など広汎な用途
向けの材料として有用である。
次に、実施例を記して本発明を説明する。
多官能α−ケトニトリル化合物の合成例
4,4′−〔(1−メチル−1,1−エタンジイ
ル)ビス(4,1−フエニレンオキシ)〕ビス
〔α,α′−ジオキソ−1,2−ベンゼンジアセト
ニトリル〕〔〕の合成。撹拌器、温度計、冷却
器付きの2四ツ口フラスコに、ジメチルスルホ
キシド500ml及びビスフエノールA(2,2−ビス
(4−ヒドロキシフエニル)プロパン)114.2g
(0.500mol)を添加し、良く撹拌混合した。それ
から、50%水酸化ナトリウム水溶液80.0gを添加
し、良く撹拌混合し、ビスフエノールAのナトリ
ウム塩を合成した。次に、トルエン300mlを加え、
水を共沸させて除去した。これに1.2−ビス(メ
トキシカルボニル)−4−ニトロベンゼン239.2g
(1.00mol)を添加し、70℃に5時間保持した。
冷却後、沈殿を別した。液に50%の水酸化ナ
トリウム水溶液150.0gを加え、50℃に8時間保
持した。溶媒を減圧留去した後、残渣をメタノー
ルから再結晶し、融点225〜230℃の無色結晶
〔A〕を得た。〔A〕の元素分析結果は次の通りで
あつた。
分析値:C66.7%,H4.3%,O29.0%
C31H24O10としての計算値:
C66.9%,H4.3%,O28.8%
又、〔A〕の酸価は398で、下記の構造として計
算した場合の98.7%の値であつた。
次に、塩化カルシウム管を接続した冷却器をつ
けた1の丸底フラスコに、〔A〕150.0g
(0.270mol)及び塩化チオニル500.0g(4.20mol)
を入れ、80℃に暖め、その温度に5時間保持す
る。過剰の塩化チオニルを留去したのち、乾燥ト
ルエン及びn−ヘキサンで十分洗浄し、無色結晶
〔B〕を165.8g得た。
撹拌器、温度計、還流冷却器を備えた四ツ口フ
ラスコに、脱水精製したN,N−ジメチルアセト
アミド500ml、〔B〕165.8g(0.263mol)及びシ
アン化銅94.3g(1.05mol)を入れ、5時間還流
した。冷却後、過した。液からN,N−ジメ
チルアセトアミドを減圧留去し、154.3gの淡黄
色液状物を得た。該液状物の元素分析結果は次の
通りであつた。
分析値:C70.7%,H3.4%,N9.6%,O16.3%
C35H20N4O6としての計算値:
C70.7%,H3.4%,N9.5%,O16.2%
又、その赤外線吸収スペクトルを測定すると波
数2225cm-1にニトリル基にもとづく吸収が、波数
1680cm-1にカルボニル基にもとづく吸収が認めら
れた。
以上のことから、該生成物は下記の構造〔〕
を有すると考えられる。
実施例 1〜12
前記合成例で得られた〔)50.0gに第1表に
示す触媒を各例とも1.0g添加し、よく撹拌した。
この混合物を180℃/10時間+200℃/5時間加熱
して硬化物を得た。いずれの硬化物の赤外線吸収
スペクトルにも硬化前存在していた波数2225cm-1
のニトリル基にもとづく吸収が減少し、新たにシ
アヌレート環にもとづく1500cm-1の吸収が現われ
た。このことから硬化物はポリシアヌレートであ
ることが分かつた。得られた硬化物は赤褐色の樹
脂でこの硬化物の諸特性は第2表に示す通りで、
優れた耐熱性を示した。The trimerization reaction of [Formula] is not known. G.BLACK is slightly like a polymer made from α-ketonitrile.
STOCK by J.Amer Chem.Soc., 34 , 1080
(1912). That is, when terephthaloyl chloride and hydrogen cyanide are reacted in a pyridine solvent, a brown powder that melts at around 300°C is obtained. However, this powder has poor heat resistance and poor electrical properties and cannot be used as an electrical insulating material. Therefore, the present inventors conducted extensive studies on the trimerization reaction of terephthaloyl cyanide. As a result, they discovered that the reaction of formula (3) can easily occur at relatively low temperatures, leading to the present invention. That is, an object of the present invention is to provide a novel heat-resistant resin suitable as, for example, an electrical insulating material. Its characteristics are the formula 1,3,5-triazine-2,4,6 represented by
-In resins containing a tolucarbonyl structure. This resin is obtained by polymerizing a polyfunctional α-ketonitrile compound in the presence of a cyanurate ring-forming catalyst. In the present invention, the polyfunctional α-ketonitrile compound is not particularly limited as long as it is a compound containing at least two α-ketonitrile groups in one molecule. Such compounds include, for example,
Phthaloyl cyanide, isophthaloyl cyanide,
Terephthaloyl cyanide, α,α′,α″-trioxo-1,2,5-benzenetriacetonitrile,
α, α′, α″, α-tetraoxo-1,2,4,
5-Benzenetetraacetonitrile, 4,4'-methylenebis(α-oxo-benzeneacetonitrile), 4,4'-propanediylbis(α-oxo-benzeneacetonitrile), 4,4'-sulfonylbis(α-oxo- benzeneacetonitrile),
4,4'-oxybis(α-oxo-benzeneacetonitrile), 4,4'-[(1-methyl-1,1-
ethanediyl)bis(4,1-phenyleneoxy)]bis[α-oxo-benzeneacetonitrile]. Furthermore, 4,4'-[(1-methyl-1,1-ethanediyl)bis(4,1-phenyleneoxy)]bis[α,α'-dioxo-1,2
-benzeneacetonitrile] is useful. These polyfunctional α-ketonitrile compounds may be used alone or in combination of two or more. In obtaining the heat-resistant resin of the present invention by polymerizing the α-ketonitrile compound as described above,
A cyanurate ring-forming catalyst plays an important role. Such catalysts include boron trifluoride, anhydrous stannic chloride, anhydrous aluminum chloride, anhydrous ferric chloride,
Lewis acids such as phosphorus pentachloride, cupric chloride, titanium tetrachloride, boron trifluoride amine complexes such as boron trifluoride monoethylamine complex salt, boron trifluoride piperidine complex salt, boron trifluoride imidazole complex salt, general formula (In the formula, R 1 , R 2 , R 3 , R 4 and R 6 represent hydrogen, an alkyl group, an alkenyl group, a phenyl group, or a substituted phenyl group, and R 5 represents a phenyl group or a substituted phenyl group. represents nitrogen, phosphorus, arsenic, antimony, or bismuth). In addition, Ziegler-Natsuta catalysts such as titanium tetrachloride-triethylaluminum, titanium tetrachloride-triisobutylaluminum, ferrous ferrocyanide, ferric ferrocyanide, copper ferrocyanide, zinc ferrocyanide, sodium ferrocyanide, potassium ferrocyanide , calcium ferricyanide, barium ferricyanide, lithium ferricyanide, ferrous ferricyanide, ferric ferricyanide, copper ferricyanide, sodium ferricyanide, potassium ferricyanide, calcium ferricyanide, magnesium ferricyanide, lithium ferricyanide, etc. metal ferricyanide, tin tetraphenyl, dibutyltin sulfide, tributyltin acrylate, triphenyltin chloride, hexabutylditin, dibutyldivinyltin, triethyltin chloride, tetraethyltin, dibutyltin diacetate, dioctyltin malate, triphenyltin hydroxide, Organic tin compounds such as tetravinyltin, organic antimony compounds such as tributylantimony, tributylantimony oxide, triphenyl antimony, triphenyl antimony sulfide, organic lead compounds such as tetraphenyl lead, organic mercury such as phenylmercury acetate, diphenylmercury, etc. compounds, organic arsenic compounds such as triphenyl arsenic, triphenyl arsenic oxide, organic iron compounds such as ferrocene (dicyclopentadienyl iron), chloromercury ferrocene, acetylferrocene, 1,1-bis(chloromercuryuro)ferrocene, Bis(cyclopentadienyl) titanium dichloride, tetra(i-propyl) titanate,
Tetra(n-butyl) titanate, tetrastearyl titanate, tetra(2-ethylhexyl)
Organic titanium compounds such as titanate, butyl titanate dimer, polymerized tetrabutyl titanate, bis(cyclopentadienyl) zirconium chloride, tetraethyl zirconate, tetra(i-
propyl) zirconate, tetra(n-butyl)
Organic zirconium compounds such as zirconate, tetra(n-pentyl)zirconate, tetra(n-hexyl)zirconate, tetra(n-octyl)zirconate, triphenylphosphine sulfide, dihexylphosphine oxide, trioctylphosphine oxide, trif Organic phosphorus compounds such as enylphosphine, organic silicone compounds such as hexamethyldisilazane and triphenyl silicone azide, organic cobalt compounds such as octacarbonyl dicobalt, organic chromium compounds such as hexacarbonylchromium and tricarbonyltolylchromium, triphenyl Examples include organic bismuth compounds such as bismuth, organic vanadium compounds, organic manganese compounds, and organic tungsten compounds. Also, N,N-dimethyl-N-cyclohexylamine oxide, N,N-dimethyl-N-
Phenylamine oxide, 1,4-dioxo-
1,4-diaza[2,2,2]bicyclooctane, phenazine-N-oxide, pyridine-N
-oxide, N-methylmorpholine-N-oxide, N-methylpiperidine-N-oxide, trimethylamine oxide, N-ethyl-
Examples include organic amine oxides such as N-methyl-N-butylamine oxide. Among the above catalysts, Lewis acids, boron trifluoride amine complexes, organic tin compounds, organic titanium compounds, organic zirconium compounds, and organic amine oxides are particularly effective. Although the amount of the catalyst used does not require strict limitations,
At least one of the above catalysts is used in an amount of 0.01 to 10% by weight, particularly preferably 0.1 to 5% by weight, based on the polyfunctional α-ketonitrile compound. In the present invention, a polyfunctional α-ketonitrile compound can be used as a thermosetting resin composition containing the catalyst. As mentioned above, the composition is an addition polymerization type solvent-free system, and may contain a solvent as desired, or may be mixed with various known additives, fillers, pigments, etc. It can also be done. Such compositions are easily cured by heating at 0-250°C for 1-200 hours. The resulting cured resin has excellent heat resistance and can be used for long periods of time even at temperatures as high as 250°C. The resin also has excellent electrical properties, chemical resistance, impact resistance, and self-extinguishing properties. Therefore, the thermosetting resin composition can be used as a material for a wide range of applications such as heat-resistant insulating varnishes, casting resins, mold resins for electronic components, impregnating and laminating resins, printed wiring resins, and interior resins. Useful. Next, the present invention will be described with reference to Examples. Synthesis example of polyfunctional α-ketonitrile compound 4,4′-[(1-methyl-1,1-ethanediyl)bis(4,1-phenyleneoxy)]bis[α,α′-dioxo-1,2-benzenediyl Synthesis of acetonitrile] []. In a 2-four-neck flask equipped with a stirrer, thermometer, and condenser, add 500 ml of dimethyl sulfoxide and 114.2 g of bisphenol A (2,2-bis(4-hydroxyphenyl)propane).
(0.500 mol) and stirred and mixed well. Then, 80.0 g of a 50% aqueous sodium hydroxide solution was added and mixed well with stirring to synthesize the sodium salt of bisphenol A. Next, add 300ml of toluene,
Water was removed azeotropically. To this, 239.2 g of 1,2-bis(methoxycarbonyl)-4-nitrobenzene
(1.00 mol) was added and kept at 70°C for 5 hours.
After cooling, the precipitate was separated. 150.0 g of 50% aqueous sodium hydroxide solution was added to the liquid, and the mixture was maintained at 50°C for 8 hours. After distilling off the solvent under reduced pressure, the residue was recrystallized from methanol to obtain colorless crystals [A] with a melting point of 225-230°C. The elemental analysis results of [A] were as follows. Analytical values: C66.7%, H4.3%, O29.0% Calculated values as C 31 H 24 O 10 :
C66.9%, H4.3%, O28.8% In addition, the acid value of [A] was 398, which was 98.7% of the value calculated using the following structure. Next, add 150.0 g of [A] to a round-bottomed flask (No. 1) equipped with a condenser connected to a calcium chloride tube.
(0.270mol) and thionyl chloride 500.0g (4.20mol)
, warm to 80℃ and hold at that temperature for 5 hours. After distilling off excess thionyl chloride, the residue was thoroughly washed with dry toluene and n-hexane to obtain 165.8 g of colorless crystals [B]. In a four-neck flask equipped with a stirrer, thermometer, and reflux condenser, put 500 ml of dehydrated and purified N,N-dimethylacetamide, 165.8 g (0.263 mol) [B], and 94.3 g (1.05 mol) of copper cyanide. , and refluxed for 5 hours. After cooling, strain. N,N-dimethylacetamide was distilled off from the liquid under reduced pressure to obtain 154.3 g of a pale yellow liquid. The results of elemental analysis of the liquid were as follows. Analytical values: C70.7%, H3.4%, N9.6%, O16.3% Calculated values as C 35 H 20 N 4 O 6 :
C70.7%, H3.4%, N9.5%, O16.2% Also, when its infrared absorption spectrum was measured, absorption based on nitrile group was found at wave number 2225 cm -1 .
Absorption based on carbonyl groups was observed at 1680 cm -1 . From the above, the product has the following structure []
It is thought that it has. Examples 1 to 12 In each case, 1.0 g of the catalyst shown in Table 1 was added to 50.0 g of [) obtained in the above synthesis example, and the mixture was thoroughly stirred.
This mixture was heated at 180°C for 10 hours + 200°C for 5 hours to obtain a cured product. The wave number 2225cm -1 that existed before curing in the infrared absorption spectrum of all cured products
The absorption based on the nitrile group decreased, and a new absorption at 1500 cm -1 based on the cyanurate ring appeared. This revealed that the cured product was polycyanurate. The obtained cured product is a reddish brown resin, and the various properties of this cured product are as shown in Table 2.
It showed excellent heat resistance.
【表】【table】
【表】【table】
【表】
実施例 13
実施例1で得られた〔〕25.0g、テレフタロ
イルシアニド25.0g、および塩化第二錫1.0gを
添加し、よく混合した。この混合物を180℃/10
時間+200℃/5時間加熱して硬化物を得た。そ
の赤外線吸収スペクトルには硬化前存在していた
波数2225cm-1のニトリル基にもとづく吸収が減少
し、新たにシアヌレート環にもとづく1500cm-1の
吸収が現われた。このことから硬化物はポリシア
ヌレートであることが分かつた。得られた硬化物
は赤褐色の樹脂で、その諸特性は第3表に示す通
りで、耐熱性に優れている。
実施例 14
テレフタロイルシアニド50.0gおよび塩化第二
錫、1.0gを混合し、よく撹拌した。この混合物
を実施例14と同様にして赤褐色のポリシアヌレー
トを得た。得られたポリシアヌレートの諸特性は
第3表に示す通りで、優れた耐熱性を示した。[Table] Example 13 25.0 g [] obtained in Example 1, 25.0 g of terephthaloyl cyanide, and 1.0 g of stannic chloride were added and mixed well. This mixture was heated to 180℃/10
A cured product was obtained by heating at +200°C for 5 hours. In the infrared absorption spectrum, the absorption based on the nitrile group at a wave number of 2225 cm -1 that existed before curing decreased, and a new absorption at 1500 cm -1 based on the cyanurate ring appeared. This revealed that the cured product was polycyanurate. The obtained cured product is a reddish-brown resin, and its properties are as shown in Table 3, and it has excellent heat resistance. Example 14 50.0 g of terephthaloyl cyanide and 1.0 g of stannic chloride were mixed and stirred well. This mixture was treated in the same manner as in Example 14 to obtain a reddish brown polycyanurate. The properties of the obtained polycyanurate are shown in Table 3, and it showed excellent heat resistance.
【表】【table】
【表】
測定値
劣化後特性は250℃、 20日間処理後の値
以上、詳述したように本発明によれば、200℃
という比較的低い温度の硬化で、高温における機
械特性および電気特性の優れた耐熱性硬化物が得
られることは明白である。[Table] Measured values Characteristics after deterioration are values after 20 days of treatment at 250℃ As detailed above, according to the present invention, 200℃
It is clear that a heat-resistant cured product with excellent mechanical and electrical properties at high temperatures can be obtained by curing at such a relatively low temperature.
Claims (1)
る多官能α−ケトニトリル化合物と、シアヌレー
ト環形成触媒0.01〜10重量%とを含むことを特徴
とする硬化性樹脂組成物。 2 多官能α−ケトニトリル化合物が4,4′−
〔(1−メチル−1,1−エタンジイル)ビス
(4,1−フエニレンオキシ)〕ビス〔α,α′−ジ
オキソ−1,2−ベンゼンジアセトニトリル〕で
あることを特徴とする特許請求の範囲第1項記載
の硬化性樹脂組成物。[Scope of Claims] 1. A curable resin composition comprising a polyfunctional α-ketonitrile compound having at least two α-ketonitrile groups and 0.01 to 10% by weight of a cyanurate ring-forming catalyst. 2 Polyfunctional α-ketonitrile compound is 4,4′-
[(1-methyl-1,1-ethanediyl)bis(4,1-phenyleneoxy)]bis[α,α′-dioxo-1,2-benzenediacetonitrile] Curable resin composition according to item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9770982A JPS58215422A (en) | 1982-06-09 | 1982-06-09 | Heat-resistant resin, its production and curable composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9770982A JPS58215422A (en) | 1982-06-09 | 1982-06-09 | Heat-resistant resin, its production and curable composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58215422A JPS58215422A (en) | 1983-12-14 |
| JPH0254369B2 true JPH0254369B2 (en) | 1990-11-21 |
Family
ID=14199433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9770982A Granted JPS58215422A (en) | 1982-06-09 | 1982-06-09 | Heat-resistant resin, its production and curable composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58215422A (en) |
-
1982
- 1982-06-09 JP JP9770982A patent/JPS58215422A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58215422A (en) | 1983-12-14 |
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