JPH0257468B2 - - Google Patents
Info
- Publication number
- JPH0257468B2 JPH0257468B2 JP9402586A JP9402586A JPH0257468B2 JP H0257468 B2 JPH0257468 B2 JP H0257468B2 JP 9402586 A JP9402586 A JP 9402586A JP 9402586 A JP9402586 A JP 9402586A JP H0257468 B2 JPH0257468 B2 JP H0257468B2
- Authority
- JP
- Japan
- Prior art keywords
- vapor phase
- liquid
- tank
- section
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012808 vapor phase Substances 0.000 claims description 43
- 239000007788 liquid Substances 0.000 claims description 31
- 238000005476 soldering Methods 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000009834 vaporization Methods 0.000 claims description 3
- 230000008016 vaporization Effects 0.000 claims description 3
- 238000001816 cooling Methods 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000006071 cream Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000012442 inert solvent Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
- B23K1/015—Vapour-condensation soldering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明は、蒸気相受板部を有する気相式はんだ
付け装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a vapor phase soldering device having a vapor phase receiving plate portion.
（従来の技術）
従来の気相式はんだ付け装置は、第２図に示さ
れるように蒸気槽１１の下部に液槽部１２を設
け、この液槽部１２内に収容された液（例えばフ
ツ素系不活性溶剤）１３を液加熱部（ヒータ）１
４によつて蒸発させることにより、前記蒸気槽１
１内に蒸気相１５を形成し、この蒸気相１５に対
して前記蒸気槽１１の一側に設けられた搬入口部
１６から被はんだ付け物としてのプリント配線基
板１７をコンベヤ１７ａにより搬入して、前記蒸
気相１５が有する気化潜熱により基板と搭載部品
とをリフローはんだ付けし、前記蒸気槽１１の他
側に設けられた搬出口部１８を経て前記基板１７
を外部に搬出するようにしている。前記搬入口部
１６および搬出口部１８の内部には冷却コイル１
９が設けられ、この冷却コイル１９の凝縮作用に
よつて前記蒸気相１５の外部への漏出が防止され
ている。(Prior Art) As shown in FIG. 2, a conventional vapor phase soldering apparatus includes a liquid tank section 12 at the bottom of a steam tank 11, and a liquid (for example, a foot) contained in the liquid tank section 12. Inert solvent) 13 to liquid heating section (heater) 1
4, the steam tank 1 is
A vapor phase 15 is formed in the steam tank 1, and a printed wiring board 17 as an object to be soldered is carried into the vapor phase 15 through an inlet 16 provided on one side of the steam tank 11 by a conveyor 17a. , the board and the mounted components are reflow soldered by the vaporization latent heat of the vapor phase 15, and the board 17 is soldered through the outlet section 18 provided on the other side of the steam tank 11.
We are trying to take it outside. A cooling coil 1 is installed inside the loading port 16 and the loading port 18.
9 is provided, and the condensing action of this cooling coil 19 prevents the vapor phase 15 from leaking to the outside.
（発明が解決しようとする問題点）
この従来の気相式はんだ付け装置は、前記蒸気
相１５が前記液槽部１２の上端開口から盛上がる
ように液槽部１２の範囲内で形成されるので、こ
の第２図に示されるように液槽部１２が小形の場
合は前記プリント配線基板１７に作用する蒸気相
１５の領域も小さく、蒸気相の十分な加熱による
確実なリフローはんだ付けができないおそれがあ
る。また前記液槽部１２を大型にした場合は高価
な液１３を多量に必要とすることになる。(Problems to be Solved by the Invention) In this conventional vapor phase soldering apparatus, the vapor phase 15 is formed within the range of the liquid tank part 12 so as to rise from the upper end opening of the liquid tank part 12. As shown in FIG. 2, when the liquid tank 12 is small, the area of the vapor phase 15 acting on the printed wiring board 17 is also small, and there is a possibility that reliable reflow soldering cannot be achieved by sufficient heating of the vapor phase. There is. Furthermore, if the liquid tank section 12 is made large, a large amount of the expensive liquid 13 will be required.
本発明の目的は、液槽部を大型にすることなく
簡単な手段で蒸気槽の内部に大きな蒸気相領域を
形成できるようにすることにある。 An object of the present invention is to enable a large vapor phase region to be formed inside a steam tank by simple means without increasing the size of the liquid tank.
（問題点を解決するための手段）
本発明は、蒸気槽１１の下部に液槽部１２を設
け、この液槽部１２に収容された液１３を液加熱
部１４により蒸発させて蒸気槽１１内に蒸気相１
５を形成し、この蒸気相１５に対して前記蒸気槽
１１の一側に設けられた搬入口部１６から被はん
だ付け物１７を搬入して前記蒸気相１５が有する
気化潜熱によりリフローはんだ付けを行い、前記
蒸気槽１１の他側に設けられた搬出口部１８を経
て被はんだ付け物１７を外部に搬出する気相式は
んだ付け装置において、前記液槽部１２の上端か
ら被はんだ付け物搬入側および搬出側に、前記蒸
気相１５を高いレベルに保持するための蒸気相受
板部２１を設けたものである。
(Means for Solving the Problems) The present invention provides a liquid tank section 12 at the lower part of the steam tank 11, and evaporates the liquid 13 accommodated in the liquid tank section 12 by a liquid heating section 14. vapor phase 1 within
5 is formed, and objects to be soldered 17 are carried into this vapor phase 15 through an inlet 16 provided on one side of the steam tank 11, and reflow soldering is performed using the latent heat of vaporization of the vapor phase 15. In a vapor phase soldering apparatus in which the objects to be soldered 17 are carried out and carried out to the outside through an outlet section 18 provided on the other side of the steam tank 11, the objects to be soldered are carried in from the upper end of the liquid tank section 12. A vapor phase receiving plate portion 21 for maintaining the vapor phase 15 at a high level is provided on the side and the discharge side.
（作用）
本発明は、蒸気相１５が蒸気相受板部２１の上
面に盛上がるように形成され、蒸気槽１１の内部
に搬入された被はんだ付け物１７は蒸気相１５中
に十分な時間挿入される。(Function) In the present invention, the vapor phase 15 is formed so as to bulge on the upper surface of the vapor phase receiving plate portion 21, and the object to be soldered 17 carried into the steam tank 11 is inserted into the vapor phase 15 for a sufficient time. be done.
（実施例）
以下、本発明を第１図に示される実施例を参照
して詳細に説明する。なお第２図に示された従来
例と同様の部分には同一符号を付してその説明を
省略する。(Example) Hereinafter, the present invention will be explained in detail with reference to an example shown in FIG. Note that the same parts as in the conventional example shown in FIG. 2 are given the same reference numerals, and the explanation thereof will be omitted.
前記液槽部１２の上端から被はんだ付け物とし
てのプリント配線基板１７を搬入する側および搬
出する側に、前記蒸気相１５を高いレベルに保持
するためのフイン状の蒸気相受板部２１を水平に
設ける。 A fin-shaped vapor phase receiving plate portion 21 for holding the vapor phase 15 at a high level is provided on the side where the printed wiring board 17 as a soldering object is carried in and out from the upper end of the liquid tank portion 12. Install horizontally.
さらに前記搬入口部１６の内部に被はんだ付け
物予加熱部（ヒータ）２２を設けるとともに、前
記搬出口部１８の内部に被はんだ付け物冷却部
（例えば液体窒素噴出ユニツト）２３を設ける。 Furthermore, a soldering object preheating section (heater) 22 is provided inside the carry-in port section 16, and a soldering object cooling section (for example, a liquid nitrogen jetting unit) 23 is provided inside the carrying-out port section 18.
そうして、前記液槽部１２内の液１３から蒸発
生成された蒸気相１５は蒸気相受板部２１との流
体抵抗によつてこの蒸気相受板部２１の上面に盛
上がるように形成されるので、前記予加熱部２２
によつて所定温度まで予加熱されたプリント配線
基板１７は、蒸気槽１１の内部のほぼ全域におい
て蒸気相１５中に十分な時間挿入され、確実に基
板上のクリームはんだが溶融され、基板に搭載部
品がはんだ付けされる。そしてこの基板１７は搬
出時に前記冷却部２３によつて急冷される。 Then, the vapor phase 15 generated by evaporation from the liquid 13 in the liquid tank section 12 is formed to bulge on the upper surface of the vapor phase receiving plate section 21 due to fluid resistance with the vapor phase receiving plate section 21. Therefore, the preheating section 22
The printed wiring board 17, which has been preheated to a predetermined temperature by the steam bath 11, is inserted into the vapor phase 15 for a sufficient period of time to ensure that the cream solder on the board is melted and mounted on the board. The parts are soldered. Then, this substrate 17 is rapidly cooled by the cooling section 23 at the time of being carried out.
なお前記蒸気相１５は、図示しない液回収ユニ
ツトによつて凝縮され液槽部１２に循環される。 The vapor phase 15 is condensed by a liquid recovery unit (not shown) and circulated to the liquid tank section 12.
本発明によれば、液槽部の上端に設けた蒸気相
受板部によつて蒸気相を高いレベルに保持するよ
うにしたから、液槽部を大型化することなく蒸気
槽の内部に大きな蒸気相領域を形成でき、この蒸
気相から被はんだ付け物に十分な熱を与えて確実
なはんだ付けを行うことができる。
According to the present invention, since the vapor phase is maintained at a high level by the vapor phase receiving plate provided at the upper end of the liquid tank, there is no need to increase the size of the liquid tank. A vapor phase region can be formed, and sufficient heat can be applied to the object to be soldered from this vapor phase to ensure reliable soldering.
第１図は本発明の気相式はんだ付け装置の一実
施例を示す断面図、第２図は従来の気相式はんだ
付け装置の断面図である。
１１……蒸気槽、１２……液槽部、１３……
液、１４……液加熱部、１５……蒸気相、１６…
…搬入口部、１７……被はんだ付け物、１８……
搬出口部、２１……蒸気相受板部。
FIG. 1 is a sectional view showing an embodiment of a vapor phase soldering apparatus according to the present invention, and FIG. 2 is a sectional view of a conventional vapor phase soldering apparatus. 11...Steam tank, 12...Liquid tank section, 13...
liquid, 14...liquid heating section, 15...vapor phase, 16...
... Carrying inlet section, 17... Item to be soldered, 18...
Export port section, 21... vapor phase receiving plate section.
Claims (1)
収容された液を液加熱部により蒸発させて蒸気槽
内に蒸気相を形成し、この蒸気相に対して前記蒸
気槽の一側に設けられた搬入口部から被はんだ付
け物を搬入して前記蒸気相が有する気化潜熱によ
りリフローはんだ付けを行い、前記蒸気槽の他側
に設けられた搬出口部を経て被はんだ付け物を外
部に搬出する気相式はんだ付け装置において、前
記液槽部の上端から被はんだ付け物搬入側および
搬出側に、前記蒸気相を高いレベルに保持するた
めの蒸気相受板部を設けたことを特徴とする気相
式はんだ付け装置。1. A liquid tank part is provided at the lower part of the steam tank, the liquid contained in this liquid tank part is evaporated by a liquid heating part to form a vapor phase in the steam tank, and one part of the vapor tank is The objects to be soldered are carried in through the carry-in port provided on the side, reflow soldering is performed using the latent heat of vaporization of the vapor phase, and the objects are transferred through the carry-in port provided on the other side of the steam tank. In a vapor phase soldering apparatus that carries out the vapor phase to the outside, a vapor phase receiving plate part for maintaining the vapor phase at a high level is provided from the upper end of the liquid tank part to the carry-in side and the carry-out side of the soldering object. A vapor phase soldering device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9402586A JPS62252669A (en) | 1986-04-23 | 1986-04-23 | Gaseous phase soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9402586A JPS62252669A (en) | 1986-04-23 | 1986-04-23 | Gaseous phase soldering device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62252669A JPS62252669A (en) | 1987-11-04 |
| JPH0257468B2 true JPH0257468B2 (en) | 1990-12-05 |
Family
ID=14099020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9402586A Granted JPS62252669A (en) | 1986-04-23 | 1986-04-23 | Gaseous phase soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62252669A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0686649U (en) * | 1993-05-27 | 1994-12-20 | アンドウコンバーター株式会社 | Knee rest |
-
1986
- 1986-04-23 JP JP9402586A patent/JPS62252669A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0686649U (en) * | 1993-05-27 | 1994-12-20 | アンドウコンバーター株式会社 | Knee rest |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62252669A (en) | 1987-11-04 |
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