JPH0260238B2 - - Google Patents
Info
- Publication number
- JPH0260238B2 JPH0260238B2 JP5701186A JP5701186A JPH0260238B2 JP H0260238 B2 JPH0260238 B2 JP H0260238B2 JP 5701186 A JP5701186 A JP 5701186A JP 5701186 A JP5701186 A JP 5701186A JP H0260238 B2 JPH0260238 B2 JP H0260238B2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- copper
- treatment
- peel strength
- printed circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 36
- 239000011889 copper foil Substances 0.000 claims description 33
- 238000011282 treatment Methods 0.000 claims description 15
- 238000009713 electroplating Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 7
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000000243 solution Substances 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- JHWIEAWILPSRMU-UHFFFAOYSA-N 2-methyl-3-pyrimidin-4-ylpropanoic acid Chemical compound OC(=O)C(C)CC1=CC=NC=N1 JHWIEAWILPSRMU-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 238000007605 air drying Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QLOKJRIVRGCVIM-UHFFFAOYSA-N 1-[(4-methylsulfanylphenyl)methyl]piperazine Chemical compound C1=CC(SC)=CC=C1CN1CCNCC1 QLOKJRIVRGCVIM-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- -1 glycidoxy group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 238000010979 pH adjustment Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
［産業上の利用分野］
本発明はプリント回路用銅箔の製造方法に関
し、更に詳しくは、この銅箔を基材に接着せしめ
て銅張積層板にしたとき、両者間の剥離強度が大
きく、更に耐薬品性が優れたものとなるプリント
回路用銅箔の製造方法に関する。
［従来の技術］
プリント回路用基板は、例えばフエノール樹脂
含浸基材、若しくはガラス−エポキシ樹脂含浸基
材のような基材と加熱・加圧して積層し、銅張積
層板として実用に供される。そして銅箔の回路形
成不溶の部分をエツチング除去し、所望する回路
網が形成される。
最近、プリント回路が緻密化しており、それに
伴つて回路幅の狭少化が進行している。
このようなことから、銅張積層板においては、
基材と銅箔との剥離強度が大きいこと、更には耐
薬品性、例えば塩酸劣化率、シアン化カリウム劣
化率の小さいこと、などが重要な要求特性として
浮かびあがつている。
このような問題に対処するために、従来、銅箔
には例えば次のような処理が施されている。すな
わち、銅箔の粗面側に硫酸銅酸性電鍍浴を用いて
樹枝状若しくは小球状の銅を電析せしめて表面積
の拡大または物理的な投錯効果を付与することに
より基材との剥離強度を高める方法；または、特
開昭56−87694号公報に記載のように電解クロメ
ート処理を施す方法；などである。
しかしながら、前者の方法の場合、銅張積層板
にしてエツチング処理を施したとき、基板面では
ステインいわゆる積層汚点が多発したり、または
微細な銅がエツチング除去されないまま残留して
絶縁抵抗を悪化させるという実用上の難点が生ず
る。
他方、後者の方法の場合、耐薬品性が満足のい
く水準になく品質の安定保持という点で難点があ
る。
［発明が解決しようとする問題点］
本発明は、基材と組合わせて銅張積層板とした
ときにおける上記した問題を解消し、剥離強度
大、耐薬品性向上を可能たらしめるプリント回路
用銅箔を製造する方法の提供を目的とする。
［問題点を解決するための手段］
本発明のプリント回路用銅箔の製造方法は、銅
箔の粗面側に、シランカツプリング剤と水溶性六
価クロム化合物とを含む混合電鍍浴中で陰極処理
を施すことを特徴とする。
［具体的な説明］
本発明ののプリント回路用銅箔に用いられる銅
箔は、電解銅箔、圧延銅箔などのいずれであつて
もよく格別限定されるものではない。また、銅箔
の厚みに関しても特に限定するものではない。
銅箔としては、その粗面側に予め例えば硫酸銅
酸性電鍍浴を用い、かつ限界電流密度近傍の電流
密度で電鍍処理を施し、粉状銅が脱落しないいわ
ゆるステイン発生を抑制し得る程度に粗面化処理
が施されているものが好適である。
本発明方法においては、まず電鍍液を調製す
る。用いる電鍍液は、シランカツプリング剤と水
溶性六価クロム化合物を含む混合水溶液である。
シランカツプリング剤としては、特公昭60−
15654号公報に記載されているものはいずれも使
用することができる。例えば、γ−アミノプロピ
ルトリエトキシシラン、γ−グリシドオキシプロ
ピルトリメトキシシラン、Ｎ−β−アミノエチル
−γ−アミノプロピルトリメトキシシランなどは
好ましいものである。
また、水溶性六価クロム化合物としては、例え
ば、重クロム酸ナトリウム、クロム酸カリウム、
クロム酸をあげることができる。
本発明にかかる混合電鍍液におけるシランカツ
プリング剤の濃度は0.1〜５重量％、水溶性六価
クロム化合物の濃度は0.1〜１ｇ／であること
が好ましい。両者の濃度がそれぞれこの範囲を外
れると、剥離強度の増強効果、耐薬品性の向上効
果がいずれも減退するからである。
電鍍浴は酸性若しくはアルカリ性のいずれであ
つてもよいが、例えば酸性の場合はPH３以上であ
ることが好ましく、PH３未満の場合は後述する乾
燥処理後に種々の変色が生じるようになつて好ま
しくない。とくに好ましくはPH3.5以上である。
これらPHの調整は硫酸等を用いて行なわれる。
この混合電鍍浴に銅箔を浸漬してその粗面側に
陰極処理を施す。処理は室温下で進められる。
電流密度は0.1〜1.0A／ｄm2であることが好ま
しい。0.1A／ｄm2未満の場合は、剥離強度の増
強効果、耐薬品性の向上効果が減退し、また
1.0A／ｄm2より大きくなると陰極処理時の電圧
上昇を招いて製造上不都合となるからである。
なお、処理時間は１〜60秒の範囲内で適宜選択
すればよい。
最後に、上記陰極処理が施された銅箔を例えば
100〜110℃の乾燥機中で約５分間乾燥して、本発
明にかかるプリント回路用銅箔が得られる。
［発明の実施例］
実施例 １
γ−アミノプロピルトリエトキシシラン濃度
0.1重量％量、重クロム酸ナトリウム濃度0.5ｇ／
量を含有する混合電鍍液を硫酸でPH3.5に調整
したのち、ここに予め粗面化処理を施した厚み
35μｍの銅箔を浸漬し、その粗面側に、電流密度
0.3A／ｄm2、処理時間10秒の条件下で陰極処理
を施した。
銅箔を取出したのち、ただちにそれを100〜110
℃の乾燥器中にいれ約５分間放置した。
得られた銅箔の粗面側をガラス−エポキシ樹脂
含浸基材と重ね合わせ、温度160℃、圧力100Kg／
cm2で40分間加熱加圧処理して縦250mm横250mm厚み
1.6mmの銅張積層板の試験片を製作した。
つぎに、この各試片の剥離強度、耐薬品性を下
記仕様で測定しその結果を一括して表に示した。
(1) 剥離強度
常態における剥離幅0.8mmとしたときの剥離
強度（Kg／cm）としてJISC−6481に準拠して
測定。
(2) 耐薬品性
(イ) 塩酸劣化率（％）：Ａ−Ｂ／Ａ×100
Ａ：常態0.8mm幅の剥離強度
Ｂ：試片を室温下の6N塩酸に60分間浸漬し、
水洗、風乾後における、常態0.8mm幅の剥
離強度
(ロ) シアン化カリウム劣化率（％）：
A′−B′／A′×100
A′：常態0.8mm幅の剥離強度
B′：試片を70℃の10％シアン化カリウム溶
液に30分間浸漬したのち、水洗、風乾後に
おける、常態0.8mm幅の剥離強度
実施例２〜10、比較例１〜３
電鍍浴組成、処理条件を変化させて実施例１と
同様に各種の銅箔を製造した。
これら各銅箔につき実施例１と同様の方法で銅
張積層板を製作しそれぞれ剥離強度、耐薬品性を
測定した。以上の結果を一括して表に示した。
[Industrial Field of Application] The present invention relates to a method for producing copper foil for printed circuits, and more specifically, when this copper foil is bonded to a base material to form a copper-clad laminate, the peel strength between the two is high; Furthermore, the present invention relates to a method for producing copper foil for printed circuits that has excellent chemical resistance. [Prior Art] A printed circuit board is laminated with a base material such as a phenolic resin-impregnated base material or a glass-epoxy resin-impregnated base material by heating and pressurizing, and is put into practical use as a copper-clad laminate. . Then, the portion of the copper foil that is not soluble for circuit formation is etched away to form a desired circuit network. Recently, printed circuits have become more dense and the circuit width has become narrower. For this reason, in copper-clad laminates,
High peel strength between the base material and copper foil, and chemical resistance, such as low hydrochloric acid deterioration rate and potassium cyanide deterioration rate, have emerged as important characteristics required. In order to deal with such problems, copper foil has conventionally been subjected to, for example, the following treatments. That is, by electrodepositing dendritic or small spherical copper on the rough side of the copper foil using a copper sulfate acid electroplating bath, the peel strength with the base material is increased by increasing the surface area or giving a physical throw effect. or a method of performing electrolytic chromate treatment as described in JP-A-56-87694. However, in the case of the former method, when a copper-clad laminate is etched, many stains, so-called lamination stains, occur on the board surface, or fine copper remains without being etched away, worsening insulation resistance. This poses a practical difficulty. On the other hand, in the case of the latter method, chemical resistance is not at a satisfactory level and there are difficulties in maintaining stable quality. [Problems to be Solved by the Invention] The present invention solves the above-mentioned problems when combined with a base material to form a copper-clad laminate, and provides a printed circuit with high peel strength and improved chemical resistance. The purpose of the present invention is to provide a method for manufacturing copper foil. [Means for Solving the Problems] The method for manufacturing a copper foil for printed circuits of the present invention includes coating the rough side of the copper foil in a mixed electroplating bath containing a silane coupling agent and a water-soluble hexavalent chromium compound. It is characterized by cathodic treatment. [Specific Description] The copper foil used in the copper foil for printed circuits of the present invention may be any of electrolytic copper foil, rolled copper foil, etc., and is not particularly limited. Moreover, there is no particular limitation regarding the thickness of the copper foil. The copper foil is roughened to the extent that the rough side of the copper foil is electroplated using, for example, a copper sulfate acid electroplating bath and at a current density near the critical current density to prevent the copper powder from falling off and to suppress the generation of so-called stains. Those that have been subjected to surface treatment are suitable. In the method of the present invention, first, an electroplating solution is prepared. The electroplating solution used is a mixed aqueous solution containing a silane coupling agent and a water-soluble hexavalent chromium compound. As a silane coupling agent,
Any of those described in Publication No. 15654 can be used. For example, γ-aminopropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, N-β-aminoethyl-γ-aminopropyltrimethoxysilane, etc. are preferred. In addition, examples of water-soluble hexavalent chromium compounds include sodium dichromate, potassium chromate,
I can give you chromic acid. The concentration of the silane coupling agent in the mixed electroplating solution according to the present invention is preferably 0.1 to 5% by weight, and the concentration of the water-soluble hexavalent chromium compound is preferably 0.1 to 1 g/g. This is because if the concentrations of both are out of this range, both the effect of increasing peel strength and the effect of improving chemical resistance are diminished. The electroplating bath may be either acidic or alkaline, but for example, if it is acidic, it is preferably PH3 or higher, and if it is less than PH3, various discolorations will occur after the drying treatment described below, which is not preferable. Particularly preferably, the pH is 3.5 or higher.
These pH adjustments are performed using sulfuric acid or the like. A copper foil is immersed in this mixed electroplating bath, and the rough side of the copper foil is subjected to cathode treatment. Processing proceeds at room temperature. The current density is preferably 0.1 to 1.0 A/dm 2 . If it is less than 0.1A/dm2, the effect of increasing peel strength and improving chemical resistance will decrease, and
This is because if it is larger than 1.0 A/dm 2 , the voltage will increase during cathode treatment, which will be inconvenient in manufacturing. Note that the processing time may be appropriately selected within the range of 1 to 60 seconds. Finally, the copper foil that has been subjected to the above cathode treatment is
The copper foil for printed circuits according to the present invention is obtained by drying in a dryer at 100-110° C. for about 5 minutes. [Examples of the invention] Example 1 γ-aminopropyltriethoxysilane concentration
0.1% by weight, sodium dichromate concentration 0.5g/
After adjusting the mixed electroplating solution containing the same amount to PH3.5 with sulfuric acid, the surface was roughened in advance.
A 35 μm copper foil is immersed, and the current density is applied to the rough side of the copper foil.
Cathode treatment was performed under conditions of 0.3 A/dm 2 and treatment time of 10 seconds. After removing the copper foil, immediately heat it to 100~110
It was placed in a dryer at ℃ and left for about 5 minutes. The rough side of the obtained copper foil was overlapped with the glass-epoxy resin impregnated base material, and the temperature was 160℃ and the pressure was 100Kg/
Heat and pressure treated at cm 2 for 40 minutes to a thickness of 250 mm (length) and 250 mm (width).
A test piece of 1.6 mm copper-clad laminate was manufactured. Next, the peel strength and chemical resistance of each specimen were measured according to the following specifications, and the results are collectively shown in the table. (1) Peel strength Measured in accordance with JISC-6481 as peel strength (Kg/cm) when the peel width is 0.8 mm under normal conditions. (2) Chemical resistance (a) Hydrochloric acid deterioration rate (%): A-B/A x 100 A: Normal peel strength at 0.8 mm width B: The specimen was immersed in 6N hydrochloric acid at room temperature for 60 minutes,
After washing with water and air drying, peel strength of 0.8 mm width under normal conditions (b) Potassium cyanide deterioration rate (%): A′−B′／A′×100 A′: Peel strength of 0.8 mm width under normal conditions B′: 70 Peel strength of normal 0.8 mm width after immersion in 10% potassium cyanide solution at ℃ for 30 minutes, washing with water, and air drying Examples 2 to 10, Comparative Examples 1 to 3 Example 1 by changing the electroplating bath composition and treatment conditions Various types of copper foil were manufactured in the same manner. Copper-clad laminates were produced for each of these copper foils in the same manner as in Example 1, and their peel strength and chemical resistance were measured. The above results are summarized in the table.
【表】【table】
【表】
［発明の効果］
以上の説明で明らかなように、本発明方法で得
られたプリント回路用銅箔は、それを用いて製作
した銅張積層板において、基材との剥離強度は向
上し、更には耐薬品性も向上していて有用であ
る。これは、陰極処理によつて銅箔の粗面側に形
成された薄膜の効果であると考えられる。この薄
膜が基材との剥離強度の増強、耐薬品性の向上に
寄与する作用の機構は未だ解明されているわけで
はないが、シランカツプリング剤中の反応性官能
基、例えばアミノ基、ジアミノ基、グリシドキシ
基等が高分子例えばフエノール、エポキシなどの
各樹脂と更に鎖状若しくは環状の炭化水素を連結
するケイ素原子、クロムを含む酸化物とを介在せ
しめて共有結合を形成することにより、上記特性
の向上が企られるものと推考される。[Table] [Effects of the Invention] As is clear from the above explanation, the copper foil for printed circuits obtained by the method of the present invention has a peel strength with respect to the base material of the copper-clad laminate manufactured using it. It is useful because it has improved chemical resistance. This is considered to be an effect of the thin film formed on the rough side of the copper foil by cathodic treatment. Although the mechanism by which this thin film contributes to increasing peel strength with the substrate and improving chemical resistance has not yet been elucidated, it is important to note that reactive functional groups in the silane coupling agent, such as amino groups and diamino group, glycidoxy group, etc. to form a covalent bond by interposing a polymer such as phenol, epoxy, or other resin and an oxide containing a silicon atom or chromium that further connects a chain or cyclic hydrocarbon. It is assumed that an attempt is made to improve the characteristics.
Claims (1)
溶性六価クロム化合物とを含む混合電鍍浴中で陰
極処理を施すことを特徴とするプリント回路用銅
箔の製造方法。 ２ 該混合電鍍浴中のシランカツプリング剤の濃
度が0.1〜５重量％であり、水溶性六価クロム化
合物の濃度が0.1〜1.0ｇ／であり、かつ、陰極
処理時の電流密度が0.1〜1.0A／ｄm2である特許
請求の範囲第１項記載のプリント回路用銅箔の製
造方法。 ３ 該陰極処理を施したのち、乾燥処理を施す特
許請求の範囲第１項のプリント回路用銅箔の製造
方法。[Claims] 1. Production of copper foil for printed circuits, characterized in that the rough side of the copper foil is subjected to cathodic treatment in a mixed electroplating bath containing a silane coupling agent and a water-soluble hexavalent chromium compound. Method. 2 The concentration of the silane coupling agent in the mixed electroplating bath is 0.1 to 5% by weight, the concentration of the water-soluble hexavalent chromium compound is 0.1 to 1.0 g/, and the current density during cathodic treatment is 0.1 to 5% by weight. 1.0 A/dm 2 . The method for producing a copper foil for printed circuits according to claim 1. 3. The method for producing copper foil for printed circuits according to claim 1, which comprises performing a drying treatment after the cathode treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5701186A JPS62216294A (en) | 1986-03-17 | 1986-03-17 | Manufacture of printed circuit copper foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5701186A JPS62216294A (en) | 1986-03-17 | 1986-03-17 | Manufacture of printed circuit copper foil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62216294A JPS62216294A (en) | 1987-09-22 |
| JPH0260238B2 true JPH0260238B2 (en) | 1990-12-14 |
Family
ID=13043499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5701186A Granted JPS62216294A (en) | 1986-03-17 | 1986-03-17 | Manufacture of printed circuit copper foil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62216294A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3292774B2 (en) * | 1994-02-15 | 2002-06-17 | 三井金属鉱業株式会社 | Copper foil for printed wiring board and method for producing the same |
-
1986
- 1986-03-17 JP JP5701186A patent/JPS62216294A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62216294A (en) | 1987-09-22 |
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