JPH0262517B2 - - Google Patents
Info
- Publication number
- JPH0262517B2 JPH0262517B2 JP21694386A JP21694386A JPH0262517B2 JP H0262517 B2 JPH0262517 B2 JP H0262517B2 JP 21694386 A JP21694386 A JP 21694386A JP 21694386 A JP21694386 A JP 21694386A JP H0262517 B2 JPH0262517 B2 JP H0262517B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramics
- adhesive
- joining
- joint
- heating current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 68
- 239000000853 adhesive Substances 0.000 claims description 34
- 230000001070 adhesive effect Effects 0.000 claims description 34
- 238000010438 heat treatment Methods 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 11
- 238000003825 pressing Methods 0.000 claims description 5
- 239000007789 gas Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 229910052689 Holmium Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 239000000567 combustion gas Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 150000004673 fluoride salts Chemical class 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- KJZYNXUDTRRSPN-UHFFFAOYSA-N holmium atom Chemical compound [Ho] KJZYNXUDTRRSPN-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- -1 ittrim Chemical compound 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 235000013024 sodium fluoride Nutrition 0.000 description 1
- 239000011775 sodium fluoride Substances 0.000 description 1
- 150000004763 sulfides Chemical class 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、セラミツクス同志を加圧または接近
させながら接合を行うセラミツクスの接合方法に
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for joining ceramics, in which ceramics are joined while being pressed together or brought close to each other.
[従来の技術]
本出願人は、例えば非導電性セラミツクスの接
合部に、高温で導電性を有する接着剤を介在さ
せ、その接合部を加熱すると共に接合部に高電圧
を印加するセラミツクスの接合方法を提案した。[Prior Art] The present applicant has proposed a technique for joining ceramics, for example, by interposing an adhesive that is conductive at high temperature in the joint of non-conductive ceramics, heating the joint, and applying a high voltage to the joint. proposed a method.
第5図は、従来のセラミツクスの接合方法を実
施する装置の概略図であつて、パイプ状のセラミ
ツクス同志を上下に配置して接合する場合を示し
ている。1a,1bはパイプ状の非導電性セラミ
ツクス、2はセラミツクス1a,1bの接合面に
塗布した接着剤、3は高圧電源、4a,4bは吹
管、5a,5bは電源3に接続されている放電電
極であつて、接合部との間〓が各々2mm程度にな
るように対向して配設されている。6はセラミツ
クス1a,1bを搭載する回転台、7は回転台6
を駆動するモータである。 FIG. 5 is a schematic diagram of an apparatus for carrying out a conventional method for joining ceramics, and shows a case in which pipe-shaped ceramics are arranged one above the other and joined together. 1a and 1b are pipe-shaped non-conductive ceramics, 2 is an adhesive applied to the joint surface of the ceramics 1a and 1b, 3 is a high-voltage power source, 4a and 4b are blowpipe tubes, and 5a and 5b are electric discharges connected to the power source 3. The electrodes are arranged facing each other so that the distance between them and the joint portion is approximately 2 mm. 6 is a turntable on which the ceramics 1a and 1b are mounted, 7 is a turntable 6
This is the motor that drives the.
このような構成において、何ら上下方向に拘束
されていない上部材のセラミツクス1aと下部材
のセラミツクス1bとの間に、例えばペースト状
の接着剤2を介在させたものを回転台6に搭載し
て、モータ7によりパイプ状セラミツクスの中心
を軸にして30〜200rpmで回転させながら、吹管
4a,4bからの燃焼性ガス炎で接着剤2を含む
接合部を850〜900℃に均一に加熱する。さらに、
セラミツクスの内径、外径、材質、電極数等に応
じて放電電極5a,5b間に1000〜10000Vの電
圧を印加すると、上記加熱に伴つて接着剤2の導
電性が増加することにより、放電電極5a,5b
と接着剤2との間で放電が発生し、数100mA以
上の電流が接着剤2に通電される。その結果、接
着剤2がジユール熱によつて高温に加熱され溶融
し、上部材のセラミツクス1aの自重による力の
みが下部材のセラミツクス1bに加わつて接合が
完了する。 In such a configuration, a paste-like adhesive 2, for example, is interposed between the ceramics 1a of the upper member and the ceramics 1b of the lower member, which are not restrained in the vertical direction, and are mounted on the rotary table 6. While the pipe-shaped ceramic is rotated at 30 to 200 rpm by the motor 7 around the center thereof, the joint including the adhesive 2 is uniformly heated to 850 to 900°C with the combustible gas flame from the blowpipe 4a, 4b. moreover,
When a voltage of 1,000 to 10,000 V is applied between the discharge electrodes 5a and 5b depending on the inner diameter, outer diameter, material, number of electrodes, etc. of the ceramic, the conductivity of the adhesive 2 increases with the heating, and the discharge electrode 5a, 5b
A discharge occurs between the adhesive 2 and the adhesive 2, and a current of several 100 mA or more is passed through the adhesive 2. As a result, the adhesive 2 is heated to a high temperature by the Joule heat and melts, and only the force due to the weight of the ceramics 1a of the upper member is applied to the ceramics 1b of the lower member to complete the bonding.
ここで、高温において導電性を有する接着剤と
して、カオリン、Al2O3、SiO2等のガラス成分を
主成分とし、銅、ニツケル、マンガン、インジウ
ム、モリブテン、亜鉛等の酸化物、硫化物、塩化
物等、ランタン、インジウム、バナジウム、ホル
ミウム、イツトリム等の希土類元素の酸化物、モ
リブデン、マンガン、タングステン、鉄、銅、
銀、ニツケル、錫、亜鉛等の金属、フツ化カルシ
ウム、フツ化ナトリウム等のフツ化物等を適宜配
合した公知の接着剤を例示できる。また、燃焼性
ガスとしては、都市ガス、プロパンガス、水素・
酸素ガス等の燃焼ガスを適宜単独または混合して
用いればよい。 Here, the adhesive having conductivity at high temperatures is mainly composed of glass components such as kaolin, Al 2 O 3 and SiO 2 , and oxides and sulfides such as copper, nickel, manganese, indium, molybdenum, and zinc. chlorides, oxides of rare earth elements such as lanthanum, indium, vanadium, holmium, ittrim, molybdenum, manganese, tungsten, iron, copper,
Examples include known adhesives containing metals such as silver, nickel, tin, zinc, and fluorides such as calcium fluoride and sodium fluoride. In addition, combustible gases include city gas, propane gas, hydrogen,
Combustion gas such as oxygen gas may be used alone or in combination as appropriate.
[発明が解決しようとする問題点]
まず、前述した上部材の非導電性セラミツクス
が極端に重い場合には、接着剤を含む接着部をガ
ス炎により加熱し、続いて通電により加熱し始め
ると、接着剤が溶融し始めて、接着部の外部に押
し出される作用が著しく高まる。したがつて、接
着剤を介したセラミツクス接合部の溶融部の厚み
が極端に狭くなるために、加熱溶融による通電路
の断面積が減少して、接合部に十分な加熱溶融断
面積が得られないので、十分な接着強度が得られ
ない問題があつた。[Problems to be Solved by the Invention] First, if the non-conductive ceramic of the upper member described above is extremely heavy, heating the bonded part containing the adhesive with a gas flame, and then starting heating it with electricity. , the adhesive begins to melt and its ability to be pushed out of the bond increases significantly. Therefore, the thickness of the melted part of the ceramic bonded part via the adhesive becomes extremely narrow, and the cross-sectional area of the current-carrying path due to heating and melting decreases, making it impossible to obtain a sufficient heat-melted cross-sectional area in the joint. There was a problem that sufficient adhesive strength could not be obtained.
つぎに、上部材の非導電性セラミツクスが極端
に軽い場合には、前述した加熱により接着剤が溶
融し始めるが、この場合外部に押し出される作用
が殆んどないので、通電路が確保されて、接着剤
が十分に反応して接合される。ところが、上部材
が軽い関係上、接合部には接着剤中に含まれる気
体分子が高温反応により膨張または物理・化学反
応による気体分子の発生により、いわゆるブロー
ホールとして残存するために、十分な接合強度が
得られない問題があつた。例えば、接着剤中に含
まれる成分が加熱により酸化するので、接合部に
は大量の酸化物を含有する。したがつて、接合体
を高温で長期間使用すると、接合部の経年変化に
伴つて接合強度が低下する問題があつた。 Next, if the non-conductive ceramic of the upper member is extremely light, the adhesive will begin to melt due to the heating described above, but in this case, there is almost no action of pushing it outward, so a current-conducting path is secured. , the adhesive will fully react and be bonded. However, because the upper member is light, the gas molecules contained in the adhesive expand due to high-temperature reactions, or gas molecules are generated due to physical and chemical reactions at the joint, remaining as so-called blowholes, resulting in insufficient bonding. There was a problem that the strength could not be obtained. For example, since the components contained in the adhesive are oxidized by heating, the joint contains a large amount of oxide. Therefore, when the bonded body is used at high temperatures for a long period of time, there is a problem in that the bond strength decreases as the bonded portion changes over time.
一方、高温において導電性を有するセラミツク
ス同志を接合する場合には、前述した接着剤を介
在させることなく接合できるが、高温加熱により
酸化した溶融部が生成されることになり、上部材
が極端に軽いと、接合後の接合部には大量の酸化
物を含有することになるので、前述と同様に接合
強度が低下する問題があつた。 On the other hand, when bonding ceramics that are conductive at high temperatures, it is possible to bond them without using the adhesive described above, but the high temperature heating generates oxidized molten parts, causing the upper member to become extremely If it is light, the bonded portion after bonding will contain a large amount of oxide, resulting in the same problem of reduced bonding strength as described above.
[問題点を解決するための手段]
上記の問題点を解決するために、第1の発明は
セラミツクスを突合せた接合部に加熱用電流を通
電して接合する際に、上記の加熱用電流の通電終
了直前または直後までは接合部の加圧力をP1と
し、通電終了直前または直後以降は加圧力をP2
とし、かつP1>P2にすることを特徴としている。
第2の発明はセラミツクスを突合せた接合部に加
熱用電流を通電して接合する際に、上記の加熱用
電流の通電終了直前または直後までは溶融部の厚
みをL1とし、通電終了直前または直後以降は溶
融部の厚みをL2とし、かつL1>L2にすることを
特徴としている。[Means for Solving the Problems] In order to solve the above problems, the first invention provides a first invention in which the heating current is applied when the ceramics are joined by applying a heating current to the joint portion where the ceramics are butted. Immediately before or after the end of energization, the pressure at the joint is P1, and just before or after the end of energization, the pressure is P2.
, and P1 > P2.
The second invention is that when a heating current is applied to a joint where ceramics are abutted to join them, the thickness of the molten part is set to L1 immediately before or immediately after the end of the application of the heating current, and Hereafter, the thickness of the melted part is set to L2, and the characteristics are that L1>L2.
[作用]
例えば、接着剤を介したセラミツクス同志を突
合せた接合部を、ガス炎および通電により加熱し
て、接着剤が十分に反応するまでは、セラミツク
スを接合方向に必要以上に加圧または接近させな
いようにする。接着剤が十分に反応した状態で
は、セラミツクスを接合方向に積極的に加圧また
は接近させて、接合後の溶融部の厚みを極力小さ
な適正値に維持させることにより、接着剤中に含
まれる気体分子を押しつぶして接合部におけるブ
ローホールの発生を抑え、または酸化物を押し出
すことによつて、接合強度の大なる接合部を得る
ことができる。一方、接合反応におけるセラミツ
クス分子間の熱拡散作用に基づく接合作用を促進
させる効果を狙うことも可能で、より効果的な接
合が得られる。[Function] For example, by heating a joint where ceramics are butted together with an adhesive between them using a gas flame and electricity, do not pressurize or approach the ceramics unnecessarily in the joining direction until the adhesive has sufficiently reacted. Try not to let it happen. When the adhesive has sufficiently reacted, the gas contained in the adhesive can be removed by actively pressurizing or approaching the ceramics in the joining direction to maintain the thickness of the molten part after joining to an appropriate value as small as possible. A joint with high joint strength can be obtained by suppressing the occurrence of blowholes at the joint by squeezing molecules or by extruding oxides. On the other hand, it is also possible to aim for the effect of promoting the bonding effect based on the thermal diffusion effect between ceramic molecules in the bonding reaction, and more effective bonding can be obtained.
[実施例]
以下、本発明を図面を参照して説明する。第1
図は、第1の発明の接合方法を実施する装置の概
略図であつて、第5図と同様にパイプ状のセラミ
ツクス同志を上下に配置して接合する場合を示し
ており、また同一構成部分については同一符号を
付している。第2図は、第1図の実施例に適用し
た場合の加圧パターンを示す図であつて、横軸お
よび縦軸はそれぞれ接合経過時間Tおよび加圧力
Pを表わしている。第1図において、1a′,1
b′はパイプ状の導電性セラミツクス、3は高圧電
源、4a,4bは吹管5a,5bは電源3に接続
されている放電電極であつて、接合部との間〓が
各々2mm程度になるように対向して配設されてい
る。6はセラミツクス1a′,1b′を搭載する回転
台、7は回転台6を駆動するモータ、8は上部材
のセラミツクス1a′を接合方向に加圧するための
例えばエアシリンダ、9は上部材1a′を把持する
チヤツク、10はエアシリンダ8で発生する力を
支障なくチヤツク9に伝達するための回転ヘツ
ド、11,12は第1および第2の電磁弁であ
る。[Example] The present invention will be described below with reference to the drawings. 1st
The figure is a schematic diagram of an apparatus for carrying out the bonding method of the first invention, and shows the case where pipe-shaped ceramics are arranged one above the other and bonded together, similar to FIG. 5, and also shows the same constituent parts. The same reference numerals are used for the same reference numbers. FIG. 2 is a diagram showing a pressurizing pattern when applied to the embodiment of FIG. 1, in which the horizontal and vertical axes represent the elapsed bonding time T and the pressurizing force P, respectively. In Figure 1, 1a', 1
b' is a pipe-shaped conductive ceramic, 3 is a high-voltage power source, 4a and 4b are blowpipe 5a and 5b are discharge electrodes connected to the power source 3, and the distance between them and the joint is about 2 mm. is placed opposite to. 6 is a rotary table on which the ceramics 1a' and 1b' are mounted; 7 is a motor for driving the rotary table 6; 8 is, for example, an air cylinder for pressurizing the upper member ceramics 1a' in the welding direction; 9 is an upper member 1a'. 10 is a rotary head for transmitting the force generated by the air cylinder 8 to the chuck 9 without any trouble; 11 and 12 are first and second solenoid valves.
このような構成において、下部材のセラミツク
ス1b′を回転台6に搭載し、その上に上部材のセ
ラミツクス1a′を載値して、セラミツクス1a′の
上部をチヤツク9により把持する。ここで、セラ
ミツクス1a′,1b′の接合部に後述する加熱用電
流を通電するに当り、接合面での沿面放電を抑え
つつ接合面近傍での通電路を確保する必要があ
り、まず第2図に示す接合開始時点Taで第1の
電磁弁11を開き第2の電磁弁12を閉じて、小
さな加圧力P1がエアシリンダ8を介して上部材
のセラミツクス1a′と下部材のセラミツクス1
b′との間に加わるようにする。ここで、加圧力
P1としては例えば0.5g〜10g/mm2が適正である。
つぎに、モータ7によりパイプ状セラミツクスの
中心を軸にして30〜200rpmで回転させながら、
吹管4a,4bからのガス炎で接合部850〜900℃
に均一に加熱する。さらに、セラミツクス1a′,
1b′の外径および内径が例えば各々15mmφ、11mm
φの場合には、放電電極5a,5b間に6000Vの
電圧を印加すると、上記加熱に伴つて接合面近傍
の導電性が増加することにより、時刻Tfで放電
電極5a,5bを接合面近傍との間で放電が発生
し、0.5A程度の加熱用電流がこの部分が流れる。
その結果、この部分がジユール熱によつて高温に
加熱され溶融し始めるが、なお当初の加圧力P1
を維持しつつ接合面が接合に適した状態になるま
でさらに通電を行い、この加熱用電流の最適通電
終了時点Tnもしくは通電終了直前の時点Tmま
たは通電終了直後の時点Toで、電磁弁11を閉
じると同時に電磁弁12を開く。その後は大きな
加圧力P2が上部材のセラミツクス1a′と下部材
のセラミツクス1b′との間に加わるようにして圧
接が完了する。ここで、加圧力P2としてはP1の
2〜50倍が適正である。なお、加圧力P1とP2と
はP1<P2なる関係が望ましい。 In this configuration, the lower ceramic member 1b' is mounted on the rotary table 6, the upper ceramic member 1a' is placed thereon, and the upper part of the ceramic member 1a' is gripped by the chuck 9. Here, when applying a heating current to the joint between the ceramics 1a' and 1b', which will be described later, it is necessary to secure a current conduction path near the joint surface while suppressing creeping discharge at the joint surface. At the welding start point Ta shown in the figure, the first solenoid valve 11 is opened and the second solenoid valve 12 is closed, and a small pressurizing force P1 is applied to the upper member ceramic 1a' and the lower member ceramic 1 through the air cylinder 8.
so that it is added between b′. Here, the pressure
A suitable value for P1 is, for example, 0.5 g/mm 2 to 10 g/mm 2 .
Next, while rotating at 30 to 200 rpm around the center of the pipe-shaped ceramics with the motor 7,
Gas flame from blowpipe 4a, 4b heats the joint to 850-900℃
Heat evenly. Furthermore, ceramics 1a′,
For example, the outer diameter and inner diameter of 1b' are 15mmφ and 11mm, respectively.
In the case of φ, when a voltage of 6000 V is applied between the discharge electrodes 5a and 5b, the conductivity near the joint surface increases with the above heating, so that the discharge electrodes 5a and 5b are connected to the vicinity of the joint surface at time Tf. A discharge occurs between the two, and a heating current of about 0.5A flows through this part.
As a result, this part is heated to a high temperature by Joule heat and begins to melt, but the initial pressure P1
The solenoid valve 11 is further energized while maintaining the heating current until the bonding surface is in a state suitable for bonding, and the solenoid valve 11 is turned on at the optimum time point Tn at which the heating current ends, at the time Tm immediately before the end of the energization, or at the time To immediately after the end of the energization. At the same time as closing, the solenoid valve 12 is opened. Thereafter, a large pressurizing force P2 is applied between the ceramics 1a' of the upper member and the ceramics 1b' of the lower member, and the pressure welding is completed. Here, the appropriate pressing force P2 is 2 to 50 times that of P1. Note that it is desirable that the pressing forces P1 and P2 have a relationship of P1<P2.
第3図は、第2の発明の接合方法を実施する装
置の概略図であつて、第1図および第5図と同様
にパイプ状のセラミツクス同志を上下に配置して
接合する場合を示しており、また同一構成部分に
ついては同一符号を付している。第4図は、第3
図の実施例に適用した合の上部材の変位パターン
を示す図であつて、横軸および縦軸はそれぞれ接
合経過時間Tおよび溶融部の厚みLを表わしてい
る。第3図において、3,4a,5a,5b,
6,7および10については、第1図と同様であ
るので説明を省略する。1a,1bは非導電性セ
ラミツクス、2は接着剤、13は上部材のセラミ
ツクス1aを任意のパターンに動作させることが
できる板カム、14は板カムのパターンに沿つて
回転するローラ、15は支持具、16は連結棒で
ある。 FIG. 3 is a schematic diagram of an apparatus for carrying out the joining method of the second invention, and shows a case in which pipe-shaped ceramics are arranged one above the other and joined together, similar to FIGS. 1 and 5. The same components are given the same reference numerals. Figure 4 shows the third
It is a diagram showing a displacement pattern of the joining member applied to the example shown in the figure, in which the horizontal and vertical axes represent the joining elapsed time T and the thickness L of the fused portion, respectively. In FIG. 3, 3, 4a, 5a, 5b,
6, 7, and 10 are the same as those in FIG. 1, so their explanations will be omitted. 1a and 1b are non-conductive ceramics, 2 is an adhesive, 13 is a plate cam that can move the upper member ceramic 1a in any pattern, 14 is a roller that rotates along the pattern of the plate cam, and 15 is a support. The tool 16 is a connecting rod.
このような構成において、上部材のセラミツク
ス1aと下部材のセラミツクス1bとの間に、例
えばペースト状の接着剤2を介在させたものを回
転台6に搭載して、セラミツクス1aの上部をチ
ヤツク9により把持する。ここで、接着剤2に後
述する加熱用電流を通電するに当り、この部分で
の通電路の断面積を十分に確保する必要があり、
まず第4図に示す接合開始時点Taで、溶融部の
厚みLが例えばL1=200μmになるように、ロー
ラ14を第3図に示す位置Aにセツトし、その後
は図示しない駆動装置により、板カム13をX方
向に移動させる。つぎに、モータ7によりパイプ
状セラミツクスの中心を軸にして30〜200rpmで
回転させながら、吹管4a,4bからのガス炎で
接着剤2を含む接合部を850〜900℃に均一に加熱
する。さらに、セラミツクス1a,1bの外径お
よび内径が例えば各々15mmφ、11mmφの場合に
は、放電電極5a,5b間に6000Vの電圧を印加
すると、上記加熱に伴つて接着剤2の導電性が増
加することにより、時刻Tfで放電電極5a,5
bと接着剤2との間で放電が発生し、0.5A程度
の加熱用電流がこの部分を流れる。その結果、こ
の部分がジユール熱によつて高温に加熱され溶融
し始めるが、溶融部の厚みL1を維持しつつ接着
剤2が接合に適した状態になるまでさらに通電を
行い、この加熱用電流の最適通電終了時点Tnも
しくは通電終了直前の時点Tmまたは通電終了後
の時点Toで、ローラ14が第3図に示す位置B
に達するように板カム13を移動させる。その後
は位置Cまで移動させることにより、上部材のセ
ラミツクス1aと下部材のセラミツクス1bとの
溶融部の厚みLを極力小さな値、例えばL2=5μ
mとして接合を完了する。なお、溶融部の厚みを
L1とL2とはL1>L2なる関係が望ましい。 In such a configuration, a paste adhesive 2, for example, is interposed between the ceramics 1a of the upper member and the ceramics 1b of the lower member, and is mounted on the rotary table 6, and the upper part of the ceramics 1a is placed on the chuck 9. grip by. Here, when applying a heating current to the adhesive 2, which will be described later, it is necessary to ensure a sufficient cross-sectional area of the current-carrying path in this part.
First, at the joining start point Ta shown in FIG. 4, the roller 14 is set at position A shown in FIG. The cam 13 is moved in the X direction. Next, while the motor 7 rotates the ceramic pipe at 30 to 200 rpm around the center thereof, the joint containing the adhesive 2 is uniformly heated to 850 to 900°C using gas flames from the blowpipe 4a and 4b. Furthermore, when the outer and inner diameters of the ceramics 1a and 1b are, for example, 15 mmφ and 11 mmφ, respectively, when a voltage of 6000 V is applied between the discharge electrodes 5a and 5b, the conductivity of the adhesive 2 increases with the heating. By this, the discharge electrodes 5a, 5 at time Tf
A discharge occurs between b and the adhesive 2, and a heating current of about 0.5 A flows through this part. As a result, this part is heated to a high temperature by Joule heat and begins to melt, but while maintaining the thickness L1 of the melted part, electricity is further applied until the adhesive 2 is in a state suitable for joining, and this heating current is applied. At the optimum energization end time Tn, the time Tm immediately before the energization end, or the time To after the energization end, the roller 14 is at the position B shown in FIG.
The plate cam 13 is moved so that it reaches . Thereafter, by moving to position C, the thickness L of the fused portion between the upper member ceramic 1a and the lower member ceramic 1b is set to a value as small as possible, for example, L2 = 5μ.
The joining is completed as m. In addition, the thickness of the melted part
It is desirable that L1 and L2 have a relationship of L1>L2.
以上の説明では、導電性セラミツクスの場合は
加圧する例を、非導電性の場合は接近させる例を
示したが、逆に導電性セラミツクスの場合に接近
させ、また非導電性セラミツクスの場合に加圧さ
せながら接合することもできる。さらに、接近と
加圧を組み合せて接合することもできる。 In the above explanation, an example was shown in which pressure is applied in the case of conductive ceramics, and an example in which pressure is applied in the case of non-conductive ceramics, but conversely, in the case of conductive ceramics, it is applied close to each other, and in the case of non-conductive ceramics, pressure is applied. It is also possible to join while applying pressure. Furthermore, it is also possible to join by a combination of approach and pressurization.
[発明の効果]
以上のように本発明によれば、加熱用電流の略
最適通電終了時点までは接合部に弱加圧力を与
え、または溶融部の厚みを適宜の値に維持させる
ことにより、接合部での加熱用電流の通電路の断
面積を確保することができる。また、上記電流の
略最適通電終了時点以降に接合部に強加圧力を与
え、または溶融部の厚みを極力小さくして接合す
ることにより、接合強度のバラツキを小さくし、
かつ強度の大なる接合体をを得ることができる。[Effects of the Invention] As described above, according to the present invention, by applying a weak pressurizing force to the joint part or maintaining the thickness of the molten part at an appropriate value until the end of the approximately optimal heating current, It is possible to secure a cross-sectional area of the current-carrying path for the heating current at the joint. In addition, by applying a strong pressure to the joint after the end of the approximately optimum current flow, or by reducing the thickness of the molten part as much as possible, the variation in joint strength can be reduced.
Moreover, a bonded body with high strength can be obtained.
第1図は第1の発明の接合方法を実施する装置
の概略図、第2図は第1図の実施例に適用した場
合の加圧パターンを示す図、第3図は第2の発明
の接合方法を実施する装置の概略図、第4図は第
3図の実施例に適用した場合の上部材の変位パタ
ーンを示す図、第5図は従来のセラミツクスの接
合方法を実施する装置の概略図である。
1a,1b,1a′,1b′……セラミツクス、2
……接着剤、3……高圧電源、4a,4b……吹
管、5a,5b……放電電極。
FIG. 1 is a schematic diagram of an apparatus for carrying out the joining method of the first invention, FIG. 2 is a diagram showing a pressure pattern when applied to the embodiment of FIG. 1, and FIG. FIG. 4 is a diagram showing the displacement pattern of the upper member when applied to the embodiment shown in FIG. 3; FIG. 5 is a schematic diagram of an apparatus for implementing the conventional ceramic bonding method. It is a diagram. 1a, 1b, 1a', 1b'...ceramics, 2
...Adhesive, 3...High voltage power supply, 4a, 4b...Blowpipe, 5a, 5b...Discharge electrode.
Claims (1)
突合せ、または高温において導電性を有する接着
剤を介在させてセラミツクスを突合せ、接合部を
ガス炎により加熱すると共に、前記接合部に電圧
を印加することによる加熱用電流を通電して接合
する方法において、前記セラミツクス同志を接合
方向に加圧力を与えながら接合を行うセラミツク
スの接合方法。 2 前記加圧力を前記加熱用電流の通電終了直前
または直後まではP1とし、通電終了直前または
直後以降はP2とし、かつP1<P2である特許請求
の範囲第1項に記載のセラミツクスの接合方法。 3 高温において導電性を有するセラミツクス突
合せ、または高温において導電性を有する接着剤
を介在させてセラミツクスを突合せ、接合部をガ
ス炎により加熱すると共に、前記接合部に電圧を
印加することによる加熱用電流を通電して接合す
る方法において、前記セラミツクス同志を接合方
向に接近させ溶融部の厚みLを変化させながら接
合を行うセラミツクスの接合方法。 4 前記溶融部の厚みLを前記加熱用電流の通電
終了直前または直後まではL1とし、通電終了直
前または直後以降はL2とし、かつL1>L2である
特許請求の範囲第3項に記載のセラミツクスの接
合方法。[Claims] 1. Ceramics that are electrically conductive at high temperatures are butted together, or ceramics are butted together with an adhesive that is electrically conductive at high temperatures, and the bonded portion is heated with a gas flame and a voltage is applied to the bonded portion. A method of joining ceramics by applying a heating current to the ceramics, wherein the ceramics are joined while applying pressure in the joining direction. 2. The method of joining ceramics according to claim 1, wherein the pressing force is P1 immediately before or immediately after the heating current ends, and P2 immediately before or after the end of the heating current, and P1<P2. . 3. Butting ceramics that are conductive at high temperatures, or butting ceramics with an adhesive that is conductive at high temperatures, heating the joint with a gas flame, and applying a voltage to the joint to generate a heating current. A method of joining ceramics by applying an electric current to the ceramics, in which the ceramics are brought close to each other in the joining direction and joining is performed while changing the thickness L of the molten part. 4. The ceramic according to claim 3, wherein the thickness L of the melted portion is L1 immediately before or immediately after the heating current ends, and L2 immediately before or after the end of the heating current, and L1>L2. joining method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21694386A JPS63225583A (en) | 1986-09-12 | 1986-09-12 | Ceramic joining method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21694386A JPS63225583A (en) | 1986-09-12 | 1986-09-12 | Ceramic joining method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63225583A JPS63225583A (en) | 1988-09-20 |
| JPH0262517B2 true JPH0262517B2 (en) | 1990-12-25 |
Family
ID=16696362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21694386A Granted JPS63225583A (en) | 1986-09-12 | 1986-09-12 | Ceramic joining method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63225583A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021256297A1 (en) | 2020-06-15 | 2021-12-23 | リードファーマ株式会社 | Bridged nucleoside and nucleotide |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0500937A4 (en) | 1990-06-28 | 1993-09-15 | Daihen Corporation | Method of electrically joining ceramics, device used therefor and adhesive agent therefor |
| JP5864328B2 (en) * | 2012-03-28 | 2016-02-17 | 三井金属鉱業株式会社 | Ceramic bonded body manufacturing equipment |
-
1986
- 1986-09-12 JP JP21694386A patent/JPS63225583A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021256297A1 (en) | 2020-06-15 | 2021-12-23 | リードファーマ株式会社 | Bridged nucleoside and nucleotide |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63225583A (en) | 1988-09-20 |
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