JPH029752B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a multi-plate solid-state imaging device in which a plurality of solid-state imaging devices receive light separated by a prism.

FIG. 1 shows an example of a three-plate solid-state imaging device using a conventional prism and three solid-state imaging devices. In the figure, prism 1 allows blue, red,
Solid-state image sensors 2a, 2b, and 2c are arranged on each optical path of the green light. Each solid-state image sensor 2a, 2b, 2c houses a light receiving element 4a, 4b, 4c inside a ceramic package 3a, 3b, 3c, respectively, and a glass plate 5a, 5
The light receiving elements 4a, 4b, and 5c are arranged so that the respective lights are correctly incident on the light receiving surfaces of the light receiving elements 4a, 4b, and 4c.

However, in a solid-state imaging device having such a configuration, the prism 1, the light receiving element 4a,
It is difficult to position each solid-state image sensor 2a, 2b, 2c so as to obtain a relative positional relationship with each light-receiving surface of 4a, 4c, and the prism 1 and the solid-state image sensor 2a, 2b, 2c are difficult to position. Being independently arranged and fixed also causes an increase in the volume of the entire imaging device.

An object of the present invention is to provide a compact and lightweight solid-state imaging device that can position a light receiving element with high precision to obtain a clear image.

In order to achieve such an object, the solid-state imaging device according to the present invention has each solid-state imaging element closely fixed directly to the surface of a prism. Hereinafter, a solid-state imaging device according to the present invention will be explained in detail using the drawings.

FIG. 2 is a cross-sectional view showing an embodiment in which the solid-state imaging device according to the present invention is applied to a three-plate solid-state imaging device, and the same or corresponding parts as in FIG. 1 will be described in detail using the same symbols. It is omitted. In the figure, solid-state image sensors 2a, 2b, and 2c are closely attached to each optical path on the surface of a prism 1, with the light-receiving surfaces of the light-receiving elements 4a, 4b, and 4c facing each light beam, respectively. In this case, each light receiving element 4a, 4
The conductive leads 6a, 6b, 6c formed on the surface of the prism 1 by a thick film printing method are not housed in a package, and the bonding pads 7a are attached to the conductive leads 6a, 6b, 6c as shown for 4a in FIG. ,7
By soldering or CCB method etc. through b, 7c,
directly attached. The surface of the prism 1 also has a positioning pattern 8 as shown in FIG.
a, 8b, 8c are printed at the same time, and the light receiving elements 4a, 4b, 4c follow these patterns 8a, 8b, 8c.
8c to place it in a predetermined position. Furthermore,
Protective films 9a, 9b, 9c are attached to the back surfaces of the respective light receiving elements 4a, 4b, 4c.

As described above, since each of the light receiving elements 4a, 4b, 4c is directly fixed to the surface of the prism 1, the assembly accuracy of the light receiving elements 4a, 4b, 4c depends only on the flatness of the surface of the prism 1. It is determined accordingly. Therefore, by controlling the machining accuracy of the prism 1 in advance, the light receiving element 4 can be
It becomes possible to match the focal length between a, 4b, 4c and the optical system with high precision, and the light receiving element 4
Extremely clear captured images can be obtained at a, 4b, and 4c.

In addition, the conductive lead 6 on the surface of the prism 1
A, 6b, 6c and the light receiving elements 4a, 4b, 4c can be connected to the bonding pads 7a, 7b, 7c at the same time, which improves reliability and simplifies assembly work, making full automation possible. Become.

Furthermore, unlike the conventional prism 1, there is no need for work tolerance for mounting the light receiving elements 4a, 4b, 4c at predetermined positions independently of the prism 1, or for wire bonding for electrical connection. Furthermore, since the package cages 3a, 3b, and 3c, which have sufficient rigidity by themselves, are not necessarily required, the device can be made smaller and lighter.

FIG. 5 is a cross-sectional view showing an embodiment in which the solid-state imaging device according to the present invention is applied to a two-plate solid-state imaging device, and the same or equivalent parts as in FIG. Explanation has been omitted. In the figure, each solid-state image sensor 2a, 2b
Filters 10a, 10 are placed on the light receiving elements 4a, 4b of
b is formed, but in this case as well, 2 is shown in Figure 6.
As shown in FIG.
The conductive leads 6a and 6b formed on the surface of the conductive leads 6a and 6b are directly fixed. Therefore, by processing the prism 1, the relative positional relationship between the optical system and the light receiving elements 4a, 4b can be determined with high precision, and the device can be made smaller and lighter.

In addition, in the embodiment described above, the filter 10
Although the filters 10b and 10b are formed on the chips of the light receiving elements 4a and 4b, this filter 1
0a and 10b may be formed on the surface of the prism 1, for example, as shown in FIG.

As explained above, according to the solid-state imaging device according to the present invention, the light-receiving surface of the solid-state imaging device is closely fixed on the surface of the prism that constitutes the optical system that splits incident light, so that the solid-state imaging device can be easily processed. Using the surface of the prism as a reference surface, it is possible to arrange the light-receiving surface with respect to the optical system with high positional accuracy, so an extremely clear image can be obtained. Furthermore, compared to the conventional case in which the solid-state image sensor is attached separately from the prism, the device can be made smaller and lighter. Furthermore, by forming conductive leads on the surface of the prism, it is possible to fix the light-receiving element to the prism and make electrical connections at the same time, simplifying the assembly process, improving reliability, and automating the work. It has various excellent effects such as making it easier to use.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a conventional solid-state imaging device, FIG. 2 is a sectional view showing an embodiment of the solid-state imaging device according to the present invention, and FIG. 3 is a solid-state imaging device in the solid-state imaging device shown in FIG. FIG. 4 is a cross-sectional view showing a method of bringing the device into close contact with a prism, FIG. 4 is a plan view showing a method of positioning the solid-state imaging device at a predetermined position on the surface of the prism, and FIG. 5 is a diagram showing another solid-state imaging device according to the present invention. FIG. 6 is a cross-sectional view showing a method of closely contacting the solid-state imaging device to the prism in the solid-state imaging device of FIG. 5, and FIG. FIG. 3 is a cross-sectional view showing a method of closely contacting a solid-state image sensor to a prism. 1... Prism, 2a, 2b, 2c... Solid-state imaging device.

Claims (1)

[Claims] 1 Comprising a prism that separates incident light into light of predetermined color components and emits it, a conductive lead formed on the surface of the prism, and a solid-state image sensor that receives the light emitted from the prism, A solid-state imaging device, characterized in that the solid-state imaging device is fixedly disposed on the conductive lead via its bonding pad.