JPH029760B2 - - Google Patents
Info
- Publication number
- JPH029760B2 JPH029760B2 JP56104778A JP10477881A JPH029760B2 JP H029760 B2 JPH029760 B2 JP H029760B2 JP 56104778 A JP56104778 A JP 56104778A JP 10477881 A JP10477881 A JP 10477881A JP H029760 B2 JPH029760 B2 JP H029760B2
- Authority
- JP
- Japan
- Prior art keywords
- acoustic matching
- matching layer
- layer
- acoustic
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Transducers For Ultrasonic Waves (AREA)
Description
【発明の詳細な説明】
本発明は、複数の圧電振動子が配設された超音
波探触子の製造方法の改良に関し、特に音響整合
層を圧電振動子に接着する際生じる悪影響を除去
し、音響特性の向上を図りうる超音波探触子の製
造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in the manufacturing method of an ultrasonic probe equipped with a plurality of piezoelectric vibrators, and in particular to eliminating the adverse effects that occur when an acoustic matching layer is bonded to the piezoelectric vibrators. , relates to a method of manufacturing an ultrasonic probe that can improve acoustic characteristics.
超音波探触子は超音波診断装置等において広く
利用されている。電子走査を行うためには、複数
の圧電振動子を一列又は複数列に配列した配列型
超音波探触子を用いることが必要となる。 Ultrasonic probes are widely used in ultrasonic diagnostic equipment and the like. In order to perform electronic scanning, it is necessary to use an array type ultrasonic probe in which a plurality of piezoelectric vibrators are arranged in one or more rows.
このような配列型超音波探触子は第1図の様な
工程で従来作成されていた。 Such an array type ultrasonic probe has conventionally been produced by a process as shown in FIG.
即ち、第1図Aの様にダンパー等の保持部材1
上に圧電振動子層2を接着等によつて設ける。 That is, as shown in FIG. 1A, a holding member 1 such as a damper, etc.
A piezoelectric vibrator layer 2 is provided thereon by adhesive or the like.
次に第1図Bの様に圧電振動子層2を覆う如
く、音響整合層3を圧電振動子層2に接着剤4に
よつて接着する。更に、第1図Cの如く、音響整
合層3側からカツター等により音響整合層3及び
圧電振動子層2を短冊状に切断し、分離された音
響整合層30を備える圧電振動子20を複数形成
する。保持部材1がダンパーであれば、第1図C
の形で配列型超音波探触子を構成し、保持部材1
がダンパーでなく、単なる保持具であれば、保持
具から外された後別に用意されたダンパーに取付
けられて、配列型超音波探触子を構成する。 Next, as shown in FIG. 1B, the acoustic matching layer 3 is bonded to the piezoelectric vibrator layer 2 with an adhesive 4 so as to cover the piezoelectric vibrator layer 2. Furthermore, as shown in FIG. 1C, the acoustic matching layer 3 and the piezoelectric vibrator layer 2 are cut into strips using a cutter or the like from the acoustic matching layer 3 side, and a plurality of piezoelectric vibrators 20 each having the separated acoustic matching layer 30 are formed. Form. If the holding member 1 is a damper, Fig. 1C
An array type ultrasonic probe is constructed in the form of a holding member 1.
If it is not a damper but a simple holder, it is removed from the holder and attached to a separately prepared damper to form an array-type ultrasonic probe.
このような従来の製造方法では、圧電振動子層
2と音響整合層3とを接着する際には、両者の接
合面積が大のため、接着剤4のにげ場がなく、接
着剤4の層厚が厚くなる。 In such a conventional manufacturing method, when bonding the piezoelectric vibrator layer 2 and the acoustic matching layer 3, since the bonding area between the two is large, there is no place for the adhesive 4 to sag. The layer thickness becomes thicker.
このため、接着剤層4への音響的減衰、反射が
生じ易く、又音響整合層3の見かけ上の厚みが大
となつてしまい、音響的整合がとれにくいという
問題がある。 Therefore, acoustic attenuation and reflection to the adhesive layer 4 are likely to occur, and the apparent thickness of the acoustic matching layer 3 becomes large, causing problems in that it is difficult to achieve acoustic matching.
しかも、前述の接合面積の大のため、接着剤層
4の厚みの不均一性が大となつて、均一な音響特
性を阻害したり、接着剤層4中の気泡などがぬけ
にくく音響的悪影響が大きい。 Furthermore, due to the large bonding area mentioned above, the non-uniformity of the thickness of the adhesive layer 4 becomes large, which may impede uniform acoustic characteristics, or make it difficult for air bubbles in the adhesive layer 4 to escape, resulting in adverse acoustic effects. is large.
本発明は、上記の点に鑑みてなされたもので、
整合層による音響的整合を確実にとり、音波の放
射面の面積が大きい場合にも、音響整合層を接着
することによる音響特性の劣化を防止し、かつ、
配列された複数の圧電振動子の所定数毎に分離さ
れた音響整合層を形成できる超音波探触子の製造
方法を提供することを目的としている。超音波探
触子の製造方法を提供するにある。 The present invention has been made in view of the above points, and
Acoustic matching is ensured by the matching layer, and even when the area of the sound wave radiation surface is large, deterioration of acoustic characteristics due to adhesion of the acoustic matching layer is prevented, and
It is an object of the present invention to provide a method for manufacturing an ultrasonic probe that can form acoustic matching layers separated by a predetermined number of arranged piezoelectric vibrators. The present invention provides a method for manufacturing an ultrasonic probe.
以下、図面に従い本発明を詳細に説明する。 Hereinafter, the present invention will be explained in detail with reference to the drawings.
第2図は本発明の一実施例工程説明図であり、
第1図で示したものと同一のものは同一の記号で
示してある。 FIG. 2 is a process explanatory diagram of an embodiment of the present invention,
Components that are the same as those shown in FIG. 1 are designated by the same symbols.
本発明では、先づ第2図Aに示す様に、保持部
材1上に短冊状の複数の圧電振動子20を形成す
る。このためには、第1図Aの如く、保持部材1
上に層上の圧電振動子2を形成し、音響整合層3
を設ける前に、圧電振動子層2を短冊状に切断
し、分離された短冊状の複数の圧電振動子20を
形成すればよい。このような短冊状圧電振動子2
0を形成する方法として、予じめ切断された圧電
振動子20を保持部材1上に配列する方法もあ
る。 In the present invention, first, a plurality of rectangular piezoelectric vibrators 20 are formed on the holding member 1, as shown in FIG. 2A. For this purpose, as shown in FIG. 1A, a holding member 1
A layered piezoelectric vibrator 2 is formed on top, and an acoustic matching layer 3 is formed.
Before providing the piezoelectric vibrator layer 2, the piezoelectric vibrator layer 2 may be cut into strips to form a plurality of separated piezoelectric vibrators 20 in the strip shape. Such a strip-shaped piezoelectric vibrator 2
As a method of forming 0, there is also a method of arranging pre-cut piezoelectric vibrators 20 on the holding member 1.
次に、第2図Bに示す如く、短冊状の圧電振動
子20の複数をまたがる様に、音響整合層3を設
ける。音響整合層3は接着剤4によつて個々の分
離された短冊状の圧電振動子20に接着される。 Next, as shown in FIG. 2B, an acoustic matching layer 3 is provided so as to straddle the plurality of strip-shaped piezoelectric vibrators 20. The acoustic matching layer 3 is adhered to each separated strip-shaped piezoelectric vibrator 20 by an adhesive 4.
更に、第2図Cに示す如く、音響整合層3を切
断して分離された音響整合層30を形成する。 Furthermore, as shown in FIG. 2C, the acoustic matching layer 3 is cut to form separated acoustic matching layers 30.
これにより、配列型超音波探触子が形成される
ことになる。 As a result, an array type ultrasonic probe is formed.
上述の第2図Bの工程における作用を第3図に
より詳細に説明する。第3図は第2図Bの部分断
面図であり、図中、第2図で示したものと同一の
ものは同一の記号で示してある。 The operation in the step shown in FIG. 2B described above will be explained in detail with reference to FIG. 3. FIG. 3 is a partial sectional view of FIG. 2B, in which the same parts as shown in FIG. 2 are designated by the same symbols.
分離された圧電振動子20の間には、切断溝2
1が形成されているので、音響整合層3が接着剤
4によつて接着される際に、接着剤4が切断溝2
1に少しづつ逃げることができる。このため、実
質的に接着面積を小さくしたような効果が生じ、
接着剤4の層の厚みを非常に薄くすることができ
るので、音響的減衰、反射が小さくなる。又、こ
の切断溝2によつて接着剤の不均一も除去出来、
接着剤4の気泡も容易に抜け出すことが可能なた
め、音響的悪影響が小さくなる。 A cutting groove 2 is formed between the separated piezoelectric vibrators 20.
1 is formed, so that when the acoustic matching layer 3 is bonded with the adhesive 4, the adhesive 4 is attached to the cutting groove 2.
You can escape little by little. For this reason, an effect similar to that of actually reducing the bonding area is created,
Since the thickness of the layer of adhesive 4 can be made very thin, acoustic attenuation and reflection are reduced. Moreover, unevenness of adhesive can be removed by this cutting groove 2.
Since air bubbles in the adhesive 4 can also be easily removed, adverse acoustic effects are reduced.
更に、圧電振動子の切断溝2は第3図の如く、
中空となることから、弾性的に隣接する振動子同
志が音響的に遮へいされる効果が生じ、各々の振
動子の独立性が良くなり、配列型超音波探触子と
して位相制御等に適する良好な特性が得られる。 Furthermore, the cutting groove 2 of the piezoelectric vibrator is as shown in FIG.
Since it is hollow, it has the effect of acoustically shielding adjacent transducers from each other, improving the independence of each transducer, making it suitable for phase control etc. as an array type ultrasonic probe. characteristics can be obtained.
しかも、圧電振動子20と音響整合層3とを高
温で接合する場合には、両者の膨張係数の差によ
つて、いずれか一方にソリが生ずる恐れがある
が、本発明では、切断溝21が膨張係数の差によ
る伸び縮みを吸収するため、ソリが生じないとい
う効果も発揮しうる。 Moreover, when the piezoelectric vibrator 20 and the acoustic matching layer 3 are bonded together at a high temperature, warpage may occur in either one due to the difference in coefficient of expansion between the two, but in the present invention, the cutting groove 21 absorbs the expansion and contraction caused by the difference in expansion coefficients, so it can also be effective in preventing warping.
ところで、上記音響整合層30(第2図C)の
ように音響整合層3の板を短冊状の圧電振動子2
0のすべてに対応して切断すると、薄い音響整合
層3は切断の工程で割れが生じ易く、大きな放射
面を有する超音波探触子の製造は、非常に困難で
ある。そこで本発明では、第4図に示すように第
2図のA及びB工程後、3つの圧電振動子20に
対し1つの音響整合層31が割当てられる様、音
響整合層3を切断した。 By the way, as in the acoustic matching layer 30 (FIG. 2C), the plate of the acoustic matching layer 3 is attached to the rectangular piezoelectric vibrator 2.
If the thin acoustic matching layer 3 is cut in accordance with all 0 points, the thin acoustic matching layer 3 is likely to crack during the cutting process, and it is extremely difficult to manufacture an ultrasonic probe having a large radiation surface. Therefore, in the present invention, as shown in FIG. 4, after steps A and B in FIG. 2, the acoustic matching layer 3 is cut so that one acoustic matching layer 31 is assigned to three piezoelectric vibrators 20.
つまり、音響整合層31による音響的整合を確
実にとり、音波の放射面の面積が大きい場合に
も、音響整合層31を接着剤による音響特性の劣
化から防止するだけでなく、音響整合層3として
接着された板を切断することにより圧電振動子2
0をそれぞれ所定数含む分離された音響整合層と
して形成でき、切断工程での割れが少なくなつ
て、歩留りが向上し、かつ工程が簡単になる。さ
らに個々の圧電振動子20の厚みと幅の寸法比が
1に近く断面が正方形に近いと複数の振動モード
を生じて特性が劣化するという問題も解決され
る。すなわち圧電振動子20をそれぞれ所定数含
むように音響整合層3を切断することによつて、
振動子の厚みに比して幅を実質的に大きくしたこ
とと等価になり、単一の振動モードで確実に励振
することができ特性の向上を望める。 In other words, the acoustic matching layer 31 not only ensures acoustic matching and prevents the acoustic characteristics of the acoustic matching layer 31 from deteriorating due to the adhesive even when the area of the sound wave radiation surface is large, but also prevents the acoustic matching layer 31 from deteriorating its acoustic characteristics due to the adhesive. Piezoelectric vibrator 2 is created by cutting the bonded plate.
They can be formed as separate acoustic matching layers each containing a predetermined number of zeros, which reduces cracking during the cutting process, improves yield, and simplifies the process. Furthermore, if the thickness-to-width dimension ratio of each piezoelectric vibrator 20 is close to 1 and the cross section is close to a square, the problem of generation of multiple vibration modes and deterioration of characteristics is also solved. That is, by cutting the acoustic matching layer 3 to include a predetermined number of piezoelectric vibrators 20,
This is equivalent to substantially increasing the width of the vibrator compared to its thickness, and it is possible to reliably excite in a single vibration mode and improve the characteristics.
このように、本発明によれば、分離された複数
の圧電振動子を形成した後に、圧電振動子に音響
整合層を接着剤で接着するので、分離された圧電
振動子間の溝が接着剤の逃げ場を提供し、従つて
接着剤による層を薄くすることが出来る。しか
も、圧電振動子をそれぞれ所定数含む音響整合層
に切断する工程で、振動子間についてもその分離
が確保され、かつ薄い音響整合層の割れが生じに
くいから、製造歩留りの向上が図れ、また音響的
減衰、反射が小さくなつて、接着剤による音響的
悪影響を少なくするとともに実質的に音響整合層
の厚みを増加させることがないので、音響整合性
を損なうこともない。又、前述の逃げ場の提供に
よつて、接着剤層の厚みの不均一がなくなり、又
接着剤の気泡の除去も容易に行えるため、音響特
性が一層向上する。 As described above, according to the present invention, after forming a plurality of separated piezoelectric vibrators, the acoustic matching layer is bonded to the piezoelectric vibrators with an adhesive, so that the grooves between the separated piezoelectric vibrators are The adhesive layer can therefore be thinned. Moreover, in the process of cutting piezoelectric vibrators into acoustic matching layers each containing a predetermined number, separation between the vibrators is ensured, and cracks in the thin acoustic matching layers are less likely to occur, improving manufacturing yield. Acoustic attenuation and reflection are reduced, reducing the adverse acoustic effects of the adhesive, and since the thickness of the acoustic matching layer is not substantially increased, acoustic matching is not impaired. Further, by providing the above-mentioned escape area, non-uniformity in the thickness of the adhesive layer is eliminated, and air bubbles in the adhesive can be easily removed, so that the acoustic characteristics are further improved.
更に、高温接合する際には、この溝によつて圧
電振動子と音響整合層との膨張係数の差によるソ
リを吸収して、ソリを防止することが出来る。 Furthermore, during high-temperature bonding, the grooves can absorb warpage due to the difference in expansion coefficients between the piezoelectric vibrator and the acoustic matching layer, thereby preventing warpage.
尚、本発明は上述の実施例に限られず、本発明
の主旨に従い、種々の変形が可能であり、これら
を本発明の範囲から排除するものではない。 Note that the present invention is not limited to the above-described embodiments, and various modifications can be made in accordance with the gist of the present invention, and these are not excluded from the scope of the present invention.
第1図は従来の製造方法工程説明図、第2図は
本発明の一実施例工程説明図、第3図は第2図の
一部工程の部分断面図、第4図は本発明の他の実
施例説明図である。
図中の記号は以下を示す。
1……保持部材、2……圧電振動子層、3……
音響整合層、4……接着剤、20……圧電振動
子、21……切断溝、30,31……分離された
音響整合層。
FIG. 1 is an explanatory diagram of a conventional manufacturing method process, FIG. 2 is a process explanatory diagram of an embodiment of the present invention, FIG. 3 is a partial sectional view of a part of the process of FIG. It is an explanatory diagram of an example. The symbols in the figure indicate the following. 1... Holding member, 2... Piezoelectric vibrator layer, 3...
Acoustic matching layer, 4... Adhesive, 20... Piezoelectric vibrator, 21... Cutting groove, 30, 31... Separated acoustic matching layer.
Claims (1)
ンスと整合をとるための音響整合層が形成される
超音波探触子の製造方法において、保持部材上に
相互に分離して配列された複数の圧電振動子を形
成する工程と、これら圧電振動子の全放射面を覆
うように前記音響整合層となる所定の厚さの板を
その裏面に塗布した接着剤により接着する工程
と、前記接着された板を切断することにより前記
圧電振動子をそれぞれ所定数含む分離された音響
整合層として形成する工程からなることを特徴と
する超音波探触子の製造方法。1. In a method for manufacturing an ultrasound probe in which an acoustic matching layer for matching the acoustic impedance of an object to be inspected is formed on the sound wave radiation surface side, a plurality of a step of forming a piezoelectric vibrator, a step of adhering a plate of a predetermined thickness that will become the acoustic matching layer so as to cover the entire radiation surface of the piezoelectric vibrator with an adhesive applied to the back surface thereof, 1. A method of manufacturing an ultrasonic probe, comprising the step of forming separate acoustic matching layers each containing a predetermined number of the piezoelectric transducers by cutting the plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56104778A JPS586462A (en) | 1981-07-04 | 1981-07-04 | Production of ultrasonic probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56104778A JPS586462A (en) | 1981-07-04 | 1981-07-04 | Production of ultrasonic probe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS586462A JPS586462A (en) | 1983-01-14 |
| JPH029760B2 true JPH029760B2 (en) | 1990-03-05 |
Family
ID=14389930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56104778A Granted JPS586462A (en) | 1981-07-04 | 1981-07-04 | Production of ultrasonic probe |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS586462A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4053822B2 (en) * | 2002-06-10 | 2008-02-27 | 日本碍子株式会社 | Piezoelectric / electrostrictive device and manufacturing method thereof |
| US7621028B2 (en) * | 2007-09-13 | 2009-11-24 | General Electric Company | Method for optimized dematching layer assembly in an ultrasound transducer |
| KR101354604B1 (en) * | 2012-01-16 | 2014-01-23 | 삼성메디슨 주식회사 | Ultrasound Probe and Manufacturing Method thereof |
| JP6641723B2 (en) * | 2015-05-08 | 2020-02-05 | コニカミノルタ株式会社 | Ultrasonic transducer and manufacturing method thereof, ultrasonic probe, and ultrasonic imaging apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52132577A (en) * | 1976-04-30 | 1977-11-07 | Tokyo Shibaura Electric Co | Method of producing probe for ultrasonic diagnostic device |
| JPS54131380A (en) * | 1978-03-31 | 1979-10-12 | Hitachi Medical Corp | Dumbbell type ultrasonic wave detecting contacting piece |
| JPS5574300A (en) * | 1978-11-30 | 1980-06-04 | Nippon Dempa Kogyo Co Ltd | Manufacture for array type ultrasonic wave probe |
-
1981
- 1981-07-04 JP JP56104778A patent/JPS586462A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS586462A (en) | 1983-01-14 |
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