JPH0311548B2 - - Google Patents
Info
- Publication number
- JPH0311548B2 JPH0311548B2 JP59013007A JP1300784A JPH0311548B2 JP H0311548 B2 JPH0311548 B2 JP H0311548B2 JP 59013007 A JP59013007 A JP 59013007A JP 1300784 A JP1300784 A JP 1300784A JP H0311548 B2 JPH0311548 B2 JP H0311548B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid refrigerant
- integrated circuit
- cooling
- heat transfer
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
- H10W40/475—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling using jet impingement
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/77—Auxiliary members characterised by their shape
- H10W40/772—Bellows
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/877—Bump connectors and die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、冷却板に開口円筒形の液体冷媒室を
複数個形成し、液体冷媒室の開口部の周りにベロ
ーズ又はダイヤフラムのような可撓性弾性構造体
の一端を固着し、可撓性弾性構造体の他端を伝熱
板で塞ぎ、この伝熱板をプリント板上に搭載され
た半導体等の集積回路と接触させるようにした集
積回路冷却装置の改良に関するものである。Detailed Description of the Invention [Technical Field of the Invention] The present invention provides a cooling plate with a plurality of open cylindrical liquid refrigerant chambers, and a flexible structure such as a bellows or a diaphragm around the opening of the liquid refrigerant chamber. An integrated structure in which one end of a flexible elastic structure is fixed, the other end of the flexible elastic structure is closed with a heat transfer plate, and this heat transfer plate is brought into contact with an integrated circuit such as a semiconductor mounted on a printed board. This invention relates to improvements in circuit cooling devices.
第３図は従来の冷却装置を示すものであつて、
１は冷却板、２はプリント板、３は集積回路、４
は伝熱板、５はベローズを示している。冷却板１
の内部には液体冷媒通路１ａ、仕切り板１ｂが設
けられ、また、冷却板１には液体冷却通路１ａに
達する開口が設けられている。この開口の周りに
ベローズ５の一端が固有され、ベローズ５の他端
は伝熱板４で塞がれている。プリント板２の上に
は複数の集積回路３が搭載され、集積回路３の表
面が伝熱板４と接触する。矢印は液体冷媒の流れ
を示す。
FIG. 3 shows a conventional cooling device,
1 is a cooling plate, 2 is a printed board, 3 is an integrated circuit, 4
5 indicates a heat exchanger plate, and 5 indicates a bellows. Cooling plate 1
A liquid refrigerant passage 1a and a partition plate 1b are provided inside the cooling plate 1, and an opening reaching the liquid cooling passage 1a is provided in the cooling plate 1. One end of the bellows 5 is fixed around this opening, and the other end of the bellows 5 is closed with a heat exchanger plate 4. A plurality of integrated circuits 3 are mounted on the printed board 2, and the surface of the integrated circuits 3 is in contact with the heat exchanger plate 4. Arrows indicate the flow of liquid refrigerant.
第３図に示したような従来の集積回路冷却装置
においては、液体冷媒流のうち伝熱板４に接触す
るように迂回して流れるものが少なく、従来装置
は熱伝達に寄与する実効流速が小さいという欠点
があつた。 In the conventional integrated circuit cooling device shown in FIG. 3, only a small amount of the liquid refrigerant flow detours to come into contact with the heat transfer plate 4, and in the conventional device, the effective flow velocity contributing to heat transfer is low. It had the disadvantage of being small.
本発明は、上記の考察に基づくものであつて、
集積回路と伝熱板とを接触させ、伝熱板を液体冷
媒で冷却するように構成された冷却装置におい
て、伝熱板の冷却に寄与する液体冷媒の流れを多
くできるようにした集積回路冷却装置を提供する
ことを目的としている。
The present invention is based on the above considerations, and includes:
In a cooling device configured to bring an integrated circuit and a heat exchanger plate into contact and cool the heat exchanger plate with a liquid refrigerant, an integrated circuit cooling system that increases the flow of the liquid refrigerant that contributes to cooling the heat exchanger plate. The purpose is to provide equipment.
そしてそのため、本発明の冷却装置は、複数の
集積回路を実装したプリント板と、上記集積回路
を冷却するための冷却板とを具備する冷却装置で
あつて、上記冷却板に開口円筒形の液体冷媒室を
複数個設け、隣接する液体冷媒室間を、一方の液
体冷媒室の底部付近から他方の液体冷媒室の開口
付近に至る液体冷媒通路で結び、上記液体冷媒室
の開口の周りにベローズ又はダイヤフラム等の可
撓性弾性構造体の一端を固着し、上記可撓性弾性
構造体の他端を伝熱板で塞ぎ、さらに上記液体冷
媒室の開口付近における液体冷媒通路の口から噴
出される液体冷媒の噴流の中心が液体冷媒室の円
筒形中心軸と交差しないように構成すると共に、
上記集積回路の熱が上記伝熱板に伝達されるよう
構成されていることを特徴とするものである。
Therefore, the cooling device of the present invention is a cooling device comprising a printed board on which a plurality of integrated circuits are mounted, and a cooling plate for cooling the integrated circuits, wherein the cooling plate has an open cylindrical liquid. A plurality of refrigerant chambers are provided, and adjacent liquid refrigerant chambers are connected by a liquid refrigerant passage extending from near the bottom of one liquid refrigerant chamber to near the opening of the other liquid refrigerant chamber, and a bellows is installed around the opening of the liquid refrigerant chamber. Alternatively, one end of a flexible elastic structure such as a diaphragm is fixed, the other end of the flexible elastic structure is closed with a heat transfer plate, and the liquid refrigerant is jetted from the mouth of the liquid refrigerant passage near the opening of the liquid refrigerant chamber. The center of the jet of liquid refrigerant does not intersect with the cylindrical central axis of the liquid refrigerant chamber, and
The device is characterized in that the heat of the integrated circuit is transferred to the heat exchanger plate.
以下、本発明を図面を参照しつつ説明する。 Hereinafter, the present invention will be explained with reference to the drawings.
第１図は本発明の１実施例の側断面図であつて
第２図のＢ−B′線断面図、第２図は第１図のＡ
−A′線断面図である。 FIG. 1 is a side sectional view of one embodiment of the present invention, and is a sectional view taken along line B-B' in FIG.
-A' line sectional view.
第１図および第２図において、６は可変形性の
伝熱体、７は伝熱板、８はリード、９は開口円筒
形の液体冷媒室、１０は液体冷媒通路をそれぞれ
示している。 In FIGS. 1 and 2, 6 indicates a deformable heat transfer body, 7 a heat transfer plate, 8 a lead, 9 an open cylindrical liquid refrigerant chamber, and 10 a liquid refrigerant passage.
冷却板１には、開口円筒形の液体冷媒室９が設
けられている。左側の液体冷媒室９の上側から右
側の液体冷媒室９の下側に至る液体冷媒通路１０
が設けられている。第２図に示すように、この液
体冷媒通路１０の中心線は、液体冷媒室９の中心
軸とは交差しない。液体冷媒室９の開口の周りに
はベローズ５の一端が固着され、他端は伝熱板４
によつて塞がれている。伝熱板４には、可変形性
の伝熱体６が接合的に固着されている。プリント
板２に実装された集積回路３にはダイ付けやソル
ダリングにより伝熱板７が接合接触されている。
集積回路３はリード１１によつてプリント板２の
導体と接続されている。ベローズ等を取付けた冷
却板１を、集積回路３を実装したプリント板２の
上に載せて押し付けると、伝熱板７と伝熱体６は
密に接触する。 The cooling plate 1 is provided with an open cylindrical liquid refrigerant chamber 9 . Liquid refrigerant passage 10 extending from the upper side of the liquid refrigerant chamber 9 on the left side to the lower side of the liquid refrigerant chamber 9 on the right side
is provided. As shown in FIG. 2, the center line of this liquid refrigerant passage 10 does not intersect with the center axis of the liquid refrigerant chamber 9. As shown in FIG. One end of the bellows 5 is fixed around the opening of the liquid refrigerant chamber 9, and the other end is fixed to the heat transfer plate 4.
is blocked by. A deformable heat transfer body 6 is bonded to the heat transfer plate 4 . A heat transfer plate 7 is bonded to the integrated circuit 3 mounted on the printed board 2 by die attachment or soldering.
The integrated circuit 3 is connected to the conductors of the printed circuit board 2 by leads 11. When the cooling plate 1 with bellows etc. attached is placed on the printed board 2 on which the integrated circuit 3 is mounted and pressed, the heat transfer plate 7 and the heat transfer body 6 come into close contact.
左側の液体冷媒通路１０に液体冷媒を供給する
と、液体冷媒は液体冷媒室９内に噴出する。この
噴流は、液体冷媒室９およびベローズ５によつて
形成される空間内を渦を巻いて流れ、流速が衰え
圧力が下がると上方に向い、次の液体冷媒通路１
０を通つて次の液体冷媒室９に噴出される。 When liquid refrigerant is supplied to the left liquid refrigerant passage 10, the liquid refrigerant is spouted into the liquid refrigerant chamber 9. This jet flow swirls in the space formed by the liquid refrigerant chamber 9 and the bellows 5, and when the flow velocity decreases and the pressure decreases, it heads upward and moves to the next liquid refrigerant passage 1.
0 and is ejected to the next liquid refrigerant chamber 9.
冷却板１は、銅やステンレス鋼、合成樹脂で作
ることが出来る。ベローズ５としては、成形ベロ
ーズや溶接ベローズ、電着メツキ・ベローズ、テ
フロン製ベローズを用いることが出来る。伝熱板
４は、熱伝達率の大きい材料、例えばCuやCu合
金で作ることが出来る。可変形性の伝熱体は、例
えばバインダとフイラーとから成り、バインダと
してはシリコン系ゴムを用いることが出来、フイ
ラーとしてはアルミナやベリリヤのような酸化金
属を用いることが出来る。伝熱板７は、集積回路
と熱膨張率が近い材料で作られる。例えば集積回
路がシリコンやGaAsで作られている場合、伝熱
板７はMo又はMo／Cu複合材で作ることが出来
る。なお、ベローズの代りにダイヤフラムを用い
ることも出来る。 The cooling plate 1 can be made of copper, stainless steel, or synthetic resin. As the bellows 5, a molded bellows, a welded bellows, an electrodeposited bellows, or a Teflon bellows can be used. The heat exchanger plate 4 can be made of a material with a high heat transfer coefficient, such as Cu or a Cu alloy. The deformable heat transfer body is composed of, for example, a binder and a filler, and the binder can be made of silicone rubber, and the filler can be made of a metal oxide such as alumina or beryllium. The heat exchanger plate 7 is made of a material having a coefficient of thermal expansion close to that of the integrated circuit. For example, if the integrated circuit is made of silicon or GaAs, the heat exchanger plate 7 can be made of Mo or a Mo/Cu composite. Note that a diaphragm can also be used instead of the bellows.
以上の説明から明らかなように、本発明によれ
ば、液体冷媒通路から噴出した液体冷媒が高速の
噴流となつて液体冷媒室とベローズ等によつて形
成された空間内を渦を巻いて流れるので、熱伝達
に寄与する実効流速を増し、冷却性能を向上させ
ることが出来る。
As is clear from the above description, according to the present invention, the liquid refrigerant spouted from the liquid refrigerant passage turns into a high-speed jet and flows in a swirling manner within the space formed by the liquid refrigerant chamber and the bellows. Therefore, it is possible to increase the effective flow velocity that contributes to heat transfer and improve cooling performance.
第１図は本発明の１実施例の側断面図であつて
第２図のＢ−B′線断面図、第２図はＡ−A′線断
面図、第３図は従来の集積回路冷却装置を示す図
である。
１……冷却板、２……プリント板、３……集積
回路、４……伝熱板、５……ベローズ、６……可
変形性の伝熱体、７……伝熱板、８……リード、
９……開口円筒形の液体冷媒室、１０……液体冷
媒通路。
FIG. 1 is a side sectional view of one embodiment of the present invention, and is a sectional view taken along the line B-B' in FIG. 2, a sectional view taken along the A-A' line in FIG. It is a figure showing an apparatus. DESCRIPTION OF SYMBOLS 1... Cooling plate, 2... Printed board, 3... Integrated circuit, 4... Heat transfer plate, 5... Bellows, 6... Deformable heat transfer body, 7... Heat transfer plate, 8... …Lead,
9... Open cylindrical liquid refrigerant chamber, 10... Liquid refrigerant passage.
Claims (1)
記集積回路を冷却するための冷却板とを具備する
集積回路冷却装置であつて、上記冷却板に開口円
筒形の液体冷媒室を各集積回路対応に複数個設
け、隣接する液体冷媒室間を、一方の液体冷媒室
の底部付近から他方の液体冷媒室の開口付近に至
る液体冷媒通路で結び、上記液体冷媒室の開口の
周りにベローズ又はダイヤフラム等の可撓性弾性
構造体の一端を固着し、上記可撓性弾性構造体の
他端を伝熱板で塞ぎ、さらに上記液体冷媒室の開
口付近における液体冷媒通路の口から噴出される
液体冷媒の噴流の中心が液体冷媒室の円筒形中心
軸と交差しないように構成すると共に、上記集積
回路の熱が上記伝熱板に伝達されるよう構成され
ていることを特徴とする集積回路冷却装置。1. An integrated circuit cooling device comprising a printed circuit board on which a plurality of integrated circuits are mounted and a cooling plate for cooling the integrated circuits, the cooling plate having an open cylindrical liquid coolant chamber corresponding to each integrated circuit. Adjacent liquid refrigerant chambers are connected by a liquid refrigerant passage extending from near the bottom of one liquid refrigerant chamber to near the opening of the other liquid refrigerant chamber, and a bellows or diaphragm is installed around the opening of the liquid refrigerant chamber. etc., one end of a flexible elastic structure is fixed, the other end of the flexible elastic structure is closed with a heat transfer plate, and a liquid is spouted from the mouth of the liquid refrigerant passage near the opening of the liquid refrigerant chamber. Integrated circuit cooling, characterized in that the center of the refrigerant jet flow does not intersect with the cylindrical central axis of the liquid refrigerant chamber, and the integrated circuit is configured such that heat of the integrated circuit is transmitted to the heat transfer plate. Device.
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59013007A JPS60160152A (en) | 1984-01-26 | 1984-01-26 | Cooling device for integrated circuit |
| CA000472335A CA1227886A (en) | 1984-01-26 | 1985-01-17 | Liquid-cooling module system for electronic circuit components |
| AU37943/85A AU552537B2 (en) | 1984-01-26 | 1985-01-21 | Liquid-cooling module system for electronic components |
| EP85400098A EP0151546B1 (en) | 1984-01-26 | 1985-01-22 | Printed circuit board assembly having a liquid-cooling module system |
| DE8585400098T DE3586661T2 (en) | 1984-01-26 | 1985-01-22 | COMPONENT ARRANGEMENT ON A PCB WITH A MODULAR, LIQUID COOLING SYSTEM. |
| KR1019850000461A KR900002214B1 (en) | 1984-01-26 | 1985-01-25 | Printed circuit board assembly |
| ES539843A ES539843A0 (en) | 1984-01-26 | 1985-01-25 | A PRINTED CIRCUIT BOARD ARRANGEMENT FOR ELECTRONIC COMPONENTS |
| BR8500360A BR8500360A (en) | 1984-01-26 | 1985-01-25 | PRINTED CIRCUIT FRAME SET |
| US07/251,978 US5050037A (en) | 1984-01-26 | 1988-09-29 | Liquid-cooling module system for electronic circuit components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59013007A JPS60160152A (en) | 1984-01-26 | 1984-01-26 | Cooling device for integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60160152A JPS60160152A (en) | 1985-08-21 |
| JPH0311548B2 true JPH0311548B2 (en) | 1991-02-18 |
Family
ID=11821112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59013007A Granted JPS60160152A (en) | 1984-01-26 | 1984-01-26 | Cooling device for integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60160152A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2708495B2 (en) * | 1988-09-19 | 1998-02-04 | 株式会社日立製作所 | Semiconductor cooling device |
| JP2712872B2 (en) * | 1991-04-18 | 1998-02-16 | 日本電気株式会社 | Integrated circuit cooling mechanism |
| US6519151B2 (en) | 2001-06-27 | 2003-02-11 | International Business Machines Corporation | Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof |
| US7392660B2 (en) * | 2004-08-05 | 2008-07-01 | Isothermal Systems Research, Inc. | Spray cooling system for narrow gap transverse evaporative spray cooling |
-
1984
- 1984-01-26 JP JP59013007A patent/JPS60160152A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60160152A (en) | 1985-08-21 |
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