JPH0318993B2 - - Google Patents
Info
- Publication number
- JPH0318993B2 JPH0318993B2 JP58203514A JP20351483A JPH0318993B2 JP H0318993 B2 JPH0318993 B2 JP H0318993B2 JP 58203514 A JP58203514 A JP 58203514A JP 20351483 A JP20351483 A JP 20351483A JP H0318993 B2 JPH0318993 B2 JP H0318993B2
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- laser
- processing
- position confirmation
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、切断、穴明け、マーキングなどを行
うためのレーザ加工機に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a laser processing machine for cutting, drilling, marking, etc.
複雑な形状のマーキングなどが行う場合、従来
のレーザ加工機ではコンピユータ制御によりマー
キングしようとするパターンをソフトウエア造型
する必要があり、装置そのものが複雑であるばか
りか、その操作も容易ではなかつた。
When marking complex shapes, conventional laser processing machines require software modeling of the pattern to be marked using computer control, which not only makes the equipment itself complex, but also makes it difficult to operate.
本発明の目的は、極めて簡単な構成によつて、
しかも複雑な形状のマーキングも容易に行いうる
レーザ加工機を提供することにある。
The object of the present invention is to achieve the following by using an extremely simple configuration.
Moreover, it is an object of the present invention to provide a laser processing machine that can easily mark complicated shapes.
以下、本発明の一実施例を図により説明する。
第１図は本発明になるレーザ加工機の原理図、第
２図は第１図のレーザ加工機におけるレーザ光線
のスキヤニングの方法を示す原理図である。１は
不可視波長を持つ加工用レーザを発生する発生装
置、２は発生装置１の加工用レーザの光軸を示
す。３は微弱な可視波長の、例えばHe−Ne（ヘ
リウムネオン）レーザによる位置確認用レーザ光
線を発光する発光装置、４は発光装置３の位置確
認用レーザ光線の光軸を示す。そして、前記２つ
の光軸２，４は互いに直交する方向になつてい
る。５は前記２つの光軸２，４の交叉点にあつて
それぞれの光軸２，４に45度の傾斜角を持つよう
に設けられた第１コールドミラーで、発生装置１
の不可視光線を通過させ、発光装置３の可視光線
を反射させる。この第１コールドミラー５によつ
て光軸２は発光方向に平行に屈折透過して進行
し、光軸４は発光方向に直交する方向に反射して
進行し、その光軸２，４を一致させ新たに光軸６
が形成させる。
Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a principle diagram of a laser beam machine according to the present invention, and FIG. 2 is a principle diagram showing a method of scanning a laser beam in the laser beam machine of FIG. Reference numeral 1 indicates a generator that generates a processing laser having an invisible wavelength, and 2 indicates the optical axis of the processing laser of the generator 1. Reference numeral 3 indicates a light emitting device that emits a position confirmation laser beam of a weak visible wavelength, for example, a He-Ne (helium neon) laser, and 4 indicates the optical axis of the position confirmation laser beam of the light emitting device 3. The two optical axes 2 and 4 are perpendicular to each other. Reference numeral 5 denotes a first cold mirror provided at the intersection point of the two optical axes 2 and 4 so as to have an inclination angle of 45 degrees to each optical axis 2 and 4;
The visible light of the light emitting device 3 is reflected. By this first cold mirror 5, the optical axis 2 is refracted, transmitted and propagated parallel to the emission direction, and the optical axis 4 is reflected and propagated in a direction perpendicular to the emission direction, and the optical axes 2 and 4 are aligned. New optical axis 6
is formed.
１０は光軸６上に設けられたスキヤニング装置
で、第２図に示すように光軸６に直交する軸の周
りに揺動する第１スキヤニングミラー１０ａと、
第１スキヤニングミラー10aの揺動中心軸に直交
する軸の周りに揺動する第２スキヤニングミラー
１０ｂとからなり、第１スキヤニングミラー１０
ａと第２スキヤニングミラー１０１０ｂの揺動に
よつて光軸６を或る平面域１１内にスキヤニング
させ、スキヤニング光軸１２を形成させる。１３
はスキヤニング光軸１２の進行域内にあつて第２
スキヤニングミラー１０ｂから自らの焦点距離だ
け離れた位置に置かれた平行変換レンズで、この
平行変換レンズ１３によつてスキヤニング光軸１
２は平行光線１４となつて進行する。１５は平行
光線１４の進行域内にあつてこの平行光線１４に
45度の傾斜角を持つように設けられた第２コール
ドミラーで、不可視光線を通過させ可視光線を反
射させる。この第２コールドミラー１５によつて
平行線１４はその方向に平行に屈折透過して進行
する加工用レーザ平行光線１６と、この加工用レ
ーザ平行光線１６の直交方向に反射して進行する
位置確認用レーザ平行光線１７とに再分離され
る。またこの第２コールドミラー１５は支点１５
ａを中心として２点鎖線の状態に回動できるよう
に設けられている。 10 is a scanning device provided on the optical axis 6, which includes a first scanning mirror 10a that swings around an axis perpendicular to the optical axis 6, as shown in FIG.
and a second scanning mirror 10b that swings around an axis perpendicular to the swing center axis of the first scanning mirror 10a.
The optical axis 6 is scanned within a certain plane area 11 by the swinging of the second scanning mirror 1010b and the second scanning mirror 1010b, and a scanning optical axis 12 is formed. 13
is within the traveling range of the scanning optical axis 12 and the second
A parallel conversion lens placed at a position separated from the scanning mirror 10b by its own focal length, and the scanning optical axis 1 is
2 travels as parallel rays 14. 15 is within the traveling area of the parallel ray 14, and this parallel ray 14
A second cold mirror installed at a 45-degree angle of inclination allows invisible light to pass through and reflects visible light. By this second cold mirror 15, the parallel line 14 is refracted and transmitted parallel to the direction of the processing laser parallel beam 16, and the processing laser parallel beam 16 is reflected in the orthogonal direction to confirm the position. The laser beam is reseparated into a parallel laser beam 17. In addition, this second cold mirror 15 has a fulcrum 15
It is provided so that it can rotate around point a as shown by the two-dot chain line.
２０は平行光線１６の進行域内に設けられた第
１凸レンズ、２１は平行光線１７の進行域内に設
けられた第２凸レンズである。２２は第２コール
ドミラー１５と第２凸レンズ２１の間にあつて平
行光線１７の進行域内に置かれるマスクで、この
マスク２２は通常の35mmネガフイルムなどで被加
工物にマーキングするパターンを撮影したものを
等尺度の大きさにしたものがそのまま用いられ
る。２３は第２凸レンズ２１からその焦点距離だ
け離れた点に置かれた受光素子、２４は受光素子
２３の動作信号を受け発生装置１からの加工用レ
ーザの発生をON−OFF制御するコントローラで
ある。３０はマーキングを行う被加工物で、第１
凸レンズ２０の焦点近傍に置かれる。 Reference numeral 20 denotes a first convex lens provided within the travel area of the parallel rays 16, and 21 represents a second convex lens provided within the travel area of the parallel rays 17. Reference numeral 22 denotes a mask placed between the second cold mirror 15 and the second convex lens 21 in the travel area of the parallel light ray 17, and this mask 22 is a mask on which a pattern to be marked on the workpiece is photographed using an ordinary 35 mm negative film or the like. The same size of the object is used as is. 23 is a light-receiving element placed at a point separated from the second convex lens 21 by its focal length; 24 is a controller that receives an operation signal from the light-receiving element 23 and controls ON/OFF generation of the processing laser from the generator 1; . 30 is a workpiece to be marked;
It is placed near the focal point of the convex lens 20.
次にかかる構成よりなるレーザ加工機の動作に
ついて説明する。発生装置１から発生される加工
用レーザと発光装置３から発光される位置確認用
レーザ光線は、第１コールドミラー５によつて同
一光軸上を進行し、スキヤニング装置１０によつ
てスキヤニングされ、平行変換レンズ１３によつ
て平行光線１４となつた後、第２コールドミラー
１５によつて再び分離される。分離された位置確
認用レーザ光線はマスク２２を通過して受光素子
２３に至る。マーキング形状を撮影したネガフイ
ルムであるマスク２２は、可視波長レーザである
位置確認用レーザ光線をそのマーキング形状の範
囲内でのみ透過させ、他の域では位置確認用レー
ザ光線を遮断する。そして、受光素子２３は受光
した時だけ動作してコントローラ２４に信号を送
るので、発生装置１はその時だけ加工用レーザを
発生する。従つて、スキヤニング装置１０により
スキヤニングが進むと、マーキングすべき形状に
沿つて加工用レーザが発生され、被加工物３０に
照射されて加工が行われ、所定のパターンのマー
キングが行われる。 Next, the operation of the laser processing machine having such a configuration will be explained. The processing laser generated from the generator 1 and the position confirmation laser beam emitted from the light emitting device 3 travel on the same optical axis by the first cold mirror 5, and are scanned by the scanning device 10. After being converted into parallel light beams 14 by the parallel conversion lens 13, they are separated again by the second cold mirror 15. The separated position confirmation laser beam passes through the mask 22 and reaches the light receiving element 23 . The mask 22, which is a negative film on which the marking shape is photographed, transmits the position confirmation laser beam, which is a visible wavelength laser, only within the range of the marking shape, and blocks the position confirmation laser beam in other areas. Since the light receiving element 23 operates only when it receives light and sends a signal to the controller 24, the generator 1 generates the processing laser only at that time. Therefore, as scanning progresses with the scanning device 10, a processing laser is generated along the shape to be marked, and the workpiece 30 is irradiated and processed, thereby marking a predetermined pattern.
以上の説明から明らかな如く、本発明によれ
ば、重畳手段で重畳された加工用レーザと位置確
認用レーザ光線をスキヤニングさせるスキヤニン
グ装置と、このスキヤニングされた前記加工用レ
ーザと前記位置確認用レーザ光線を分離させるた
めの光学的分離手段と、この分離させた後の前記
位置確認用レーザ光線の一定範囲を通過させるマ
スクと、このマスクを通つた位置確認用レーザ光
線の入力を検出する受光手段と、この受光手段の
動作により前記加工用レーザの発生装置に指令を
与えて前記加工用レーザをオン・オフする制御装
置とを備えた構成よりなるので、任意図形、文字
等の加工パターンを予めコンピユータ等でプログ
ラムしなくても極めて容易に被加工物にマーキン
グすることができる。更に消耗品が不要でマスク
の損傷の恐れもなく、レーザ光線のパワー密度を
犠性にすることがないなどの効果が得られる。
As is clear from the above description, according to the present invention, there is provided a scanning device that scans a processing laser beam and a position confirmation laser beam superimposed by a superimposing means, and a scanning device that scans a processing laser beam and a position confirmation laser beam that are superimposed by a superimposing means. an optical separating means for separating the light beams, a mask for allowing the separated laser beam for position confirmation to pass through a certain range, and a light receiving means for detecting the input of the laser beam for position confirmation that has passed through the mask. and a control device that turns on and off the processing laser by giving commands to the processing laser generator through the operation of the light receiving means, so that processing patterns such as arbitrary figures and characters can be created in advance. It is possible to mark a workpiece extremely easily without programming on a computer or the like. Furthermore, there are advantages such as no consumables are required, there is no risk of damage to the mask, and the power density of the laser beam is not sacrificed.
第１図は本発明になるレーザ加工機の一実施例
を示す原理図、第２図は第１図のレーザ加工機に
おけるレーザ光線のスキヤニングの方法を示す原
理図である。
１……発生装置、３……発光装置、５……第１
コールドミラー、１０……スキヤニング装置、１
３……平行変換レンズ、１５……第２コールドミ
ラー、２０……第１凸レンズ、２１……第２凸レ
ンズ、２２……マスク、２３……受光素子、２４
……制御装置、３０……被加工物。
FIG. 1 is a principle diagram showing an embodiment of a laser beam machine according to the present invention, and FIG. 2 is a principle diagram showing a method of scanning a laser beam in the laser beam machine of FIG. 1... Generator, 3... Light emitting device, 5... First
Cold mirror, 10...Scanning device, 1
3... Parallel conversion lens, 15... Second cold mirror, 20... First convex lens, 21... Second convex lens, 22... Mask, 23... Light receiving element, 24
...Control device, 30...Workpiece.
Claims (1)
装置と、可視波長をもつ微弱な位置確認用レーザ
光線の発光装置と、前記加工用レーザと前記位置
確認用レーザ光線の光軸を一致させるための重畳
手段とを備えたレーザ加工機において、前記重畳
手段で重畳された加工用レーザと位置確認用レー
ザ光線をスキヤニングさせるスキヤニング装置
と、このスキヤニングされた前記加工用レーザと
前記位置確認用レーザ光線を分離させるための光
学的分離手段と、この分離させた後の前記位置確
認用レーザ光線の一定範囲を通過させるマスク
と、このマスクを通つた位置確認用レーザ光線の
入力を検出する受光手段と、この受光手段の動作
により前記加工用レーザの発生装置に指令を与え
て前記加工用レーザをオン・オフする制御装置と
を備えたレーザ加工機。1. A generator for generating a powerful laser beam for processing with an invisible wavelength, a device for emitting a weak laser beam for position confirmation with a visible wavelength, and a device for aligning the optical axes of the processing laser and the laser beam for position confirmation. a scanning device that scans the processing laser and the position confirmation laser beam superimposed by the superposition means; and a scanning device that scans the processing laser and the position confirmation laser beam superimposed by the superposition means; an optical separating means for separating, a mask for allowing the position confirmation laser beam to pass through a certain range after the separation, and a light receiving means for detecting input of the position confirmation laser beam that has passed through the mask; A laser processing machine comprising: a control device that turns on and off the processing laser by giving a command to the processing laser generator according to the operation of the light receiving means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58203514A JPS6096391A (en) | 1983-10-28 | 1983-10-28 | Laser working machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58203514A JPS6096391A (en) | 1983-10-28 | 1983-10-28 | Laser working machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6096391A JPS6096391A (en) | 1985-05-29 |
| JPH0318993B2 true JPH0318993B2 (en) | 1991-03-13 |
Family
ID=16475409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58203514A Granted JPS6096391A (en) | 1983-10-28 | 1983-10-28 | Laser working machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6096391A (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5391893A (en) | 1985-05-07 | 1995-02-21 | Semicoductor Energy Laboratory Co., Ltd. | Nonsingle crystal semiconductor and a semiconductor device using such semiconductor |
| USRE37441E1 (en) | 1982-08-24 | 2001-11-13 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device |
| US6664566B1 (en) | 1982-08-24 | 2003-12-16 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and method of making the same |
| US6346716B1 (en) | 1982-12-23 | 2002-02-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor material having particular oxygen concentration and semiconductor device comprising the same |
| JPS59115574A (en) | 1982-12-23 | 1984-07-04 | Semiconductor Energy Lab Co Ltd | Photoelectric conversion device manufacturing method |
| USRE38727E1 (en) | 1982-08-24 | 2005-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and method of making the same |
| US4727044A (en) | 1984-05-18 | 1988-02-23 | Semiconductor Energy Laboratory Co., Ltd. | Method of making a thin film transistor with laser recrystallized source and drain |
| DE241722T1 (en) * | 1986-03-17 | 1988-02-25 | Cincinnati Milacron Inc., Cincinnati, Ohio | SWITCHING DEVICE FOR LASER BUNDLE. |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5754291Y2 (en) * | 1977-05-09 | 1982-11-24 | ||
| JPS57154389A (en) * | 1981-03-19 | 1982-09-24 | Toshiba Corp | Laser working device |
-
1983
- 1983-10-28 JP JP58203514A patent/JPS6096391A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6096391A (en) | 1985-05-29 |
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