JPH0320161B2 - - Google Patents

Description

[Detailed description of the invention] a. Industrial application field The present invention is directed to a microstrip line (hereinafter referred to as
(abbreviated as MSL)).

b. Prior Art FIG. 3 is a perspective view of a microstrip line to which a method according to the prior art can be applied.

1 is a U-shaped MSL, 2 and 3 are MSLs
It is an input/output MSL connected to 1. The phase reference planes are placed at positions 4 and 5.

The phase amount is changed by changing the line length of the U-shaped MSL. Therefore, U with different line lengths shown in 1a
There is a method of preparing multiple MSLs with a desired line length and selecting one with the desired line length, and a method of cutting a U-shaped MSL and changing the line length.

Since these are small in size, they are used as built-in phase adjustment mechanisms.

c Problems to be Solved by the Invention In the MSL phase adjustment method according to the prior art, conversion work of the U-shaped MSL is unavoidable. Furthermore, when cutting a U-shaped MSL, if the cutting amount is small, it is difficult to accurately cut a thick U-shaped MSL. Furthermore, cutting the MSL using an alumina substrate is difficult.
Therefore, a great deal of time is required for assembly and adjustment, and the defective rate is high, contributing to an increase in costs.

d Means to solve the problem The above problem is solved by two main MSLs, which are arranged in parallel with a distance W equal to 1/4 of the wavelength used, and one end is terminated with a non-reflection end. The longitudinal direction is perpendicular to the main MSL, and both ends and the main
A phase adjustment mechanism consisting of multiple sub-MSLs placed between the main MSLs with small intervals between the MSLs is provided, the sub-MSL to be connected to the main MSL is selected, and both ends of the sub-MSL are connected to the main MSL. and the main power near the connection point.
This was solved by cutting the MSL on the side where the non-reflective termination of the main MSL is present.

e action The phase is adjusted as follows.

Both ends of any sub-MSL among the plurality of sub-MSLs are connected to respective adjacent parts of the main MSL using bonding wires or the like.

The phase is measured at the input and output terminals of the phase adjustment mechanism, and the required phase adjustment amount is calculated from the measured value.

A sub-MSL that provides that phase difference is selected, and the connection points between the sub-MSL and the main MSL are moved to both ends of the sub-MSL and the adjacent parts of the main MSL.

The phase changes depending on the line length. Therefore, the phase changes by changing the connected sub-MSL as described above.

At this time, the line on the opposite side of the input/output terminal of the connection part operates as a stub, so a non-reflection termination is provided.

After the adjustment is completed, the above-mentioned influence is completely removed by cutting with a knife or the like a point near the connection point between the main MSL and the sub-MSL and on the side of the non-reflection termination on the main MSL.

The problem is the extra main MSL that remains during adjustment.
This is due to the stub effect in the area and the occurrence of reflections due to discontinuity in the connection area. An equivalent circuit for this explanation is shown in FIG.

As shown in Figure 2, the extra MSL is inserted in parallel as a stub into the parallel susceptance jB.
However, since this stub is terminated with a non-reflection termination, although it may generate reflection, it does not affect the transmission phase. Therefore, even if a stub exists during adjustment, the phase between the input and output ends can be accurately determined. Furthermore, since this part is separated after adjustment is completed, no reflection occurs during use.

At discontinuities, a considerable amount of parallel susceptance is always generated, resulting in reflected waves. In the present invention, there are two sources from which the same reflection occurs due to the structure, but since the source is selected to be 1/4 of the wavelength of the frequency used, the reflections cancel each other out.

f Embodiment FIG. 1 is a perspective view of a preferred embodiment of a phase adjustment mechanism used to implement the MSL phase adjustment method according to the present invention.

One end of the two main MSLs 12 and 13, which are arranged in parallel with a distance W equal to 1/4 of the wavelength used, is
They are each terminated with non-reflection terminations 23 and 24, and input/output terminals 21 and 22 are provided at the other ends, respectively. A plurality of sub-MLLs 14a, 1 whose longitudinal direction is perpendicular to the two main MSLs 12, 13.
4b, 14c, and 14d are arranged with small intervals between their ends and the main MSL.

In order to select a sub-MSL to be connected to the main MSL, first connect both ends of an arbitrary sub-MSL (for example, 14a) to the adjacent parts P ₁ and P ₂ of the main MSL using a connecting means 15 made of, for example, a bonding wire. do.

Next, the phase difference is measured at the input/output terminals 21 and 22, and the necessary phase correction amount is determined.

Then, the secondary MSL (for example, 14
b) and connect both ends to the main character adjacent to it.
Connect with MSL parts Q ₁ and Q ₂ , and connect to the previous sub-MSL 14a
and disconnect the main MSL parts P ₁ and P ₂ . In this example, the path difference between both connections is the distance P ₁ , Q ₁
The phase difference can be easily determined by dividing the wavelength by this distance.

When the phase adjustment is completed, the main MSL is cut off at points 16a and 16b on the opposite side to the input/output terminals 21 and 22, that is, on the side of the non-reflection terminator, near the Q point.

Note that both main MSLs are formed symmetrically,
That is, it is preferable that the distance from the non-reflection termination to the end point of the secondary MSL be equal for both main MSLs.

g Effect of invention (i) Phase adjustment is extremely easy.

(ii) It is small and lightweight, and has sufficient performance for embedded use.

(iii) Lower defect rate and lower costs.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a preferred embodiment of the phase adjustment mechanism used to carry out the phase adjustment method according to the present invention, FIG. 2 is an equivalent circuit of the phase adjustment mechanism according to the present invention, and FIG. 3 is a conventional example. 1 is a perspective view of a microstrip line to which the phase adjustment method according to the technique can be applied; FIG. 1, 1a...U-shaped microstrip line,
2, 3... Input/output microstrip line, 4,
5... Phase reference plane, 12, 13... Main microstrip line, 14a, 14b, 14c, 14d
... Sub-microstrip line, 15 ... Connection means, 16a, 16b ... Cutting point, 21, 22 ...
Input/output terminals, 23, 24...Reflection-free termination.

Claims (1)

[Claims] 1 Two main microstrip lines arranged in parallel with a distance W equal to 1/4 of the used wavelength λg and terminated at one end with a non-reflection terminal; a plurality of sub-microstrip lines, each having a longitudinal direction perpendicular to the main microstrip line, and arranged between the main microstrip lines with a small interval between each end thereof and the main microstrip line; A phase adjustment mechanism is provided, which selects the sub microstrip line to be connected to the main microstrip line, connects both ends of the sub microstrip line to the main microstrip line, and connects the main microstrip line near the connection point. A method for adjusting the phase of a microstrip line, characterized in that the main microstrip line is cut on the side where the non-reflection termination is present.