JPH0322698B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a semiconductor device assembly apparatus, and particularly to a semiconductor device assembly apparatus for ceramic cases, glass cases, and the like.

[Prior art]

In conventional devices, semiconductor packages (hereinafter referred to as cases) are supplied and stored with the cases facing upward. This was thought to be natural since the work surface of the case (the surface on which die bonding and wire bonding are performed) faces upward. However, when the case is facing upward, silicon chips from semiconductor pellets (hereinafter referred to as dies) that are generated inside the case cavity during work, wire scraps that get mixed in, and foreign objects that get mixed in while waiting for work remain as they are. It will remain. Today, pattern wiring on the surface of a die is becoming finer and denser, and the distance between each wire connecting an electrode pad and an external lead is also becoming narrower.

Therefore, if silicon chips from the die, wire chips, or other foreign objects get inside the case cavity, this can cause short circuits on the die surface, wires, and tearing of the wires, significantly reducing the quality and reliability of the product. do.

[Purpose of the invention]

The purpose of the present invention is to provide a case reversing mechanism between the case supply section and the working section (die bonding section, wire bonding section) and between the working section and the case storage section, and to place the case downward in areas other than the working section. This prevents foreign objects from entering during work waiting time, and also removes die scraps and wire scraps that are generated and mixed during work, and removes foreign objects from inside the case cavity, resulting in high reliability.
The purpose of the present invention is to provide a semiconductor device assembly device that enables the manufacture of high-quality products.

[Structure of the invention]

According to the present invention, a semiconductor device assembly apparatus includes a die bonder for bonding a semiconductor pellet in a cavity of a semiconductor package, and a wire bonder for bonding an electrode pad of the bonded semiconductor pellet and a lead in a case cavity with a metal wire. There is obtained a semiconductor device assembly apparatus characterized in that a mechanism is added for inverting the semiconductor package while the semiconductor package goes from the supply side to the storage side.

〔Example〕

Next, embodiments of the present invention will be described using the drawings.

FIG. 1 is a configuration diagram of a reversing mechanism in an embodiment of the present invention, and FIG. 2 is a schematic diagram showing the configuration of the present invention.
is the case supply part, c is the case storage part, b is the working part (die bonding part or wire bonding part), d, d' are the case reversing part, 7, 7', 8, 8'
is a case transport rail.

In Figs. 1 and 2, case storage section c (second
The cases 10, which are disposed facing downward (with the working surface facing downwards) as shown in FIG.
The reversing section 1 has a vacuum suction port 2 (piping not shown), and the case 10 is fixed by this. When the case 10 enters the reversing section 1, the motor 6 is rotated by a sensor system (not shown), and when the slit of the slit cam 4, which is an extension of the motor shaft 3, enters the sensor 5, the motor 6 stops. Due to this, case 10
is rotated 180 degrees, that is, inverted, and becomes case 9 with the working surface facing upward.

After this, the case 9 passes through the rail 7' (Fig. 2) to the reversing part after completing the work in the working part (Fig. 2b).
Case 10 is reversed again at d′ (Figure 2) and faces downward.
It is stored in storage section a (Fig. 2) in this state.

〔Effect of the invention〕

As described above, the present invention prevents foreign matter from entering the case cavity while waiting for work, and also allows die scraps and wire scraps generated or mixed in during work to fall, thereby preventing foreign matter from entering the case cavity. This has the effect of removing these foreign substances from the substrate and making it possible to manufacture highly reliable and high quality semiconductor products.

[Brief explanation of drawings]

FIG. 1 is a block diagram of a reversing mechanism part of a mechanism according to an embodiment of the present invention, and FIG. 2 is a schematic diagram of the structure of an embodiment of the present invention. 1... Reversing part, 2... Vacuum suction port, 3... Drive shaft, 4... Slit cam, 5... Sensor, 6...
Motor, 7, 8, 7', 8'... Conveyance rail,
9, 10... Case, a... Storage section, b... Working section, c... Supply section, d, d'... Reversing mechanism section.

Claims (1)

[Claims] 1. A semiconductor device assembly apparatus including a die bonder for bonding a semiconductor pellet in a cavity of a semiconductor package, and a wire bonder for bonding an electrode pad of the bonded semiconductor pellet and a lead in a cavity of a case with a metal wire. 1. A semiconductor device assembly apparatus characterized in that a mechanism is added for inverting the semiconductor device from the supply side to the storage side.