JPH0322906B2 - - Google Patents
Info
- Publication number
- JPH0322906B2 JPH0322906B2 JP57177135A JP17713582A JPH0322906B2 JP H0322906 B2 JPH0322906 B2 JP H0322906B2 JP 57177135 A JP57177135 A JP 57177135A JP 17713582 A JP17713582 A JP 17713582A JP H0322906 B2 JPH0322906 B2 JP H0322906B2
- Authority
- JP
- Japan
- Prior art keywords
- bis
- resin composition
- component
- curable resin
- maleimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011342 resin composition Substances 0.000 claims description 14
- 239000004643 cyanate ester Substances 0.000 claims description 11
- 150000001412 amines Chemical class 0.000 claims description 10
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims description 9
- 125000003118 aryl group Chemical group 0.000 claims description 8
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 8
- 125000000962 organic group Chemical group 0.000 claims description 6
- 125000001651 cyanato group Chemical group [*]OC#N 0.000 claims description 4
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims description 3
- 125000002723 alicyclic group Chemical group 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 229910052736 halogen Inorganic materials 0.000 claims description 2
- 150000002367 halogens Chemical group 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 150000002431 hydrogen Chemical group 0.000 claims description 2
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 claims 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- -1 cyanogen halides Chemical class 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 5
- 150000001913 cyanates Chemical class 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229920000768 polyamine Polymers 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- AHZMUXQJTGRNHT-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(C)C1=CC=C(OC#N)C=C1 AHZMUXQJTGRNHT-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- PGKVHYTTXBKQQT-UHFFFAOYSA-N 1-isocyanato-4-[2-(4-isocyanatophenyl)propan-2-yl]benzene Chemical compound C=1C=C(N=C=O)C=CC=1C(C)(C)C1=CC=C(N=C=O)C=C1 PGKVHYTTXBKQQT-UHFFFAOYSA-N 0.000 description 2
- PAMIQIKDUOTOBW-UHFFFAOYSA-N 1-methylpiperidine Chemical compound CN1CCCCC1 PAMIQIKDUOTOBW-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- ZQMIGQNCOMNODD-UHFFFAOYSA-N diacetyl peroxide Chemical compound CC(=O)OOC(C)=O ZQMIGQNCOMNODD-UHFFFAOYSA-N 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- FSQQTNAZHBEJLS-UPHRSURJSA-N maleamic acid Chemical compound NC(=O)\C=C/C(O)=O FSQQTNAZHBEJLS-UPHRSURJSA-N 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- UFKLQICEQCIWNE-UHFFFAOYSA-N (3,5-dicyanatophenyl) cyanate Chemical compound N#COC1=CC(OC#N)=CC(OC#N)=C1 UFKLQICEQCIWNE-UHFFFAOYSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- GUGZCSAPOLLKNG-UHFFFAOYSA-N (4-cyanatophenyl) cyanate Chemical compound N#COC1=CC=C(OC#N)C=C1 GUGZCSAPOLLKNG-UHFFFAOYSA-N 0.000 description 1
- OFIWROJVVHYHLQ-UHFFFAOYSA-N (7-cyanatonaphthalen-2-yl) cyanate Chemical compound C1=CC(OC#N)=CC2=CC(OC#N)=CC=C21 OFIWROJVVHYHLQ-UHFFFAOYSA-N 0.000 description 1
- QMTFKWDCWOTPGJ-KVVVOXFISA-N (z)-octadec-9-enoic acid;tin Chemical compound [Sn].CCCCCCCC\C=C/CCCCCCCC(O)=O QMTFKWDCWOTPGJ-KVVVOXFISA-N 0.000 description 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- XOJRVZIYCCJCRD-UHFFFAOYSA-N 1-[4-[4-(2,5-dioxopyrrol-1-yl)phenoxy]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1OC1=CC=C(N2C(C=CC2=O)=O)C=C1 XOJRVZIYCCJCRD-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 1
- OQOHVOIVSDIGCJ-UHFFFAOYSA-N 1-isocyanato-3-[(3-isocyanatophenyl)-methylphosphoryl]benzene Chemical compound C=1C=CC(N=C=O)=CC=1P(=O)(C)C1=CC=CC(N=C=O)=C1 OQOHVOIVSDIGCJ-UHFFFAOYSA-N 0.000 description 1
- KDLIYVDINLSKGR-UHFFFAOYSA-N 1-isocyanato-4-(4-isocyanatophenoxy)benzene Chemical compound C1=CC(N=C=O)=CC=C1OC1=CC=C(N=C=O)C=C1 KDLIYVDINLSKGR-UHFFFAOYSA-N 0.000 description 1
- CQVMOITWILLRTG-UHFFFAOYSA-N 1-isocyanato-4-[1-(4-isocyanatophenyl)cyclohexyl]benzene Chemical compound C1=CC(N=C=O)=CC=C1C1(C=2C=CC(=CC=2)N=C=O)CCCCC1 CQVMOITWILLRTG-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 1
- ACUUVWABACRCCZ-UHFFFAOYSA-N 2-(2-ethyl-1h-imidazol-5-yl)propanenitrile Chemical compound CCC1=NC=C(C(C)C#N)N1 ACUUVWABACRCCZ-UHFFFAOYSA-N 0.000 description 1
- HYVGFUIWHXLVNV-UHFFFAOYSA-N 2-(n-ethylanilino)ethanol Chemical compound OCCN(CC)C1=CC=CC=C1 HYVGFUIWHXLVNV-UHFFFAOYSA-N 0.000 description 1
- FZZMTSNZRBFGGU-UHFFFAOYSA-N 2-chloro-7-fluoroquinazolin-4-amine Chemical compound FC1=CC=C2C(N)=NC(Cl)=NC2=C1 FZZMTSNZRBFGGU-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- SIQHSJOKAUDDLN-UHFFFAOYSA-N 2-methyl-1-propylimidazole Chemical compound CCCN1C=CN=C1C SIQHSJOKAUDDLN-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- CXLVSQCURAEIKQ-UHFFFAOYSA-N 3,11-diisocyanatotridecane Chemical compound O=C=NC(CC)CCCCCCCC(CC)N=C=O CXLVSQCURAEIKQ-UHFFFAOYSA-N 0.000 description 1
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 description 1
- SESYNEDUKZDRJL-UHFFFAOYSA-N 3-(2-methylimidazol-1-yl)propanenitrile Chemical compound CC1=NC=CN1CCC#N SESYNEDUKZDRJL-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- WECDUOXQLAIPQW-UHFFFAOYSA-N 4,4'-Methylene bis(2-methylaniline) Chemical compound C1=C(N)C(C)=CC(CC=2C=C(C)C(N)=CC=2)=C1 WECDUOXQLAIPQW-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- OMHOXRVODFQGCA-UHFFFAOYSA-N 4-[(4-amino-3,5-dimethylphenyl)methyl]-2,6-dimethylaniline Chemical compound CC1=C(N)C(C)=CC(CC=2C=C(C)C(N)=C(C)C=2)=C1 OMHOXRVODFQGCA-UHFFFAOYSA-N 0.000 description 1
- XECVXFWNYNXCBN-UHFFFAOYSA-N 4-[(4-aminophenyl)-phenylmethyl]aniline Chemical compound C1=CC(N)=CC=C1C(C=1C=CC(N)=CC=1)C1=CC=CC=C1 XECVXFWNYNXCBN-UHFFFAOYSA-N 0.000 description 1
- CJXRYVQHINFIKO-UHFFFAOYSA-N 4-[1-(4-aminophenyl)-1-phenylethyl]aniline Chemical compound C=1C=C(N)C=CC=1C(C=1C=CC(N)=CC=1)(C)C1=CC=CC=C1 CJXRYVQHINFIKO-UHFFFAOYSA-N 0.000 description 1
- ZSQIQUAKDNTQOI-UHFFFAOYSA-N 4-[1-(4-aminophenyl)cyclohexyl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)CCCCC1 ZSQIQUAKDNTQOI-UHFFFAOYSA-N 0.000 description 1
- KIMCSKCETOAMBU-UHFFFAOYSA-N 4-[2-(4-amino-3,5-dibromophenyl)propan-2-yl]-2,6-dibromoaniline Chemical compound C=1C(Br)=C(N)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(N)C(Br)=C1 KIMCSKCETOAMBU-UHFFFAOYSA-N 0.000 description 1
- GGMWECHOWWCLRU-UHFFFAOYSA-N 4-[2-(4-amino-3-chlorophenyl)propan-2-yl]-2-chloroaniline Chemical compound C=1C=C(N)C(Cl)=CC=1C(C)(C)C1=CC=C(N)C(Cl)=C1 GGMWECHOWWCLRU-UHFFFAOYSA-N 0.000 description 1
- UBKRDXUXTYBRHS-UHFFFAOYSA-N 4-[2-(4-amino-3-methylphenyl)propan-2-yl]-2-methylaniline Chemical compound C1=C(N)C(C)=CC(C(C)(C)C=2C=C(C)C(N)=CC=2)=C1 UBKRDXUXTYBRHS-UHFFFAOYSA-N 0.000 description 1
- ZYEDGEXYGKWJPB-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]aniline Chemical compound C=1C=C(N)C=CC=1C(C)(C)C1=CC=C(N)C=C1 ZYEDGEXYGKWJPB-UHFFFAOYSA-N 0.000 description 1
- ZTKDMNHEQMILPE-UHFFFAOYSA-N 4-methoxy-n,n-dimethylaniline Chemical compound COC1=CC=C(N(C)C)C=C1 ZTKDMNHEQMILPE-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004593 Epoxy Chemical class 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- DYSXSHIEICLRBN-UHFFFAOYSA-N OP(O)(=O)OC1=CC=C(OC#N)C=C1 Chemical compound OP(O)(=O)OC1=CC=C(OC#N)C=C1 DYSXSHIEICLRBN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- GXFRMDVUWJDFAI-UHFFFAOYSA-N [2,6-dibromo-4-[2-(3,5-dibromo-4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C(Br)=C(OC#N)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(OC#N)C(Br)=C1 GXFRMDVUWJDFAI-UHFFFAOYSA-N 0.000 description 1
- YKONYNBAMHVIMF-UHFFFAOYSA-N [2,6-dichloro-4-[2-(3,5-dichloro-4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C(Cl)=C(OC#N)C(Cl)=CC=1C(C)(C)C1=CC(Cl)=C(OC#N)C(Cl)=C1 YKONYNBAMHVIMF-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- HEJGXMCFSSDPOA-UHFFFAOYSA-N [4-(4-cyanatophenyl)phenyl] cyanate Chemical group C1=CC(OC#N)=CC=C1C1=CC=C(OC#N)C=C1 HEJGXMCFSSDPOA-UHFFFAOYSA-N 0.000 description 1
- CNUHQZDDTLOZRY-UHFFFAOYSA-N [4-(4-cyanatophenyl)sulfanylphenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1SC1=CC=C(OC#N)C=C1 CNUHQZDDTLOZRY-UHFFFAOYSA-N 0.000 description 1
- BUPOATPDNYBPMR-UHFFFAOYSA-N [4-(4-cyanatophenyl)sulfonylphenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1S(=O)(=O)C1=CC=C(OC#N)C=C1 BUPOATPDNYBPMR-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- PPZSVSGWDQKBIW-UHFFFAOYSA-N [4-bis(4-cyanatophenoxy)phosphanyloxyphenyl] cyanate Chemical compound C1=CC(OC#N)=CC=C1OP(OC=1C=CC(OC#N)=CC=1)OC1=CC=C(OC#N)C=C1 PPZSVSGWDQKBIW-UHFFFAOYSA-N 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical group C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- OWBTYPJTUOEWEK-UHFFFAOYSA-N butane-2,3-diol Chemical compound CC(O)C(C)O OWBTYPJTUOEWEK-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-N cyanic acid Chemical class OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 description 1
- GEQHKFFSPGPGLN-UHFFFAOYSA-N cyclohexane-1,3-diamine Chemical compound NC1CCCC(N)C1 GEQHKFFSPGPGLN-UHFFFAOYSA-N 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- UQLDLKMNUJERMK-UHFFFAOYSA-L di(octadecanoyloxy)lead Chemical compound [Pb+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O UQLDLKMNUJERMK-UHFFFAOYSA-L 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- NWADXBLMWHFGGU-UHFFFAOYSA-N dodecanoic anhydride Chemical compound CCCCCCCCCCCC(=O)OC(=O)CCCCCCCCCCC NWADXBLMWHFGGU-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- JMANVNJQNLATNU-UHFFFAOYSA-N glycolonitrile Natural products N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 150000002440 hydroxy compounds Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- LZKLAOYSENRNKR-LNTINUHCSA-N iron;(z)-4-oxoniumylidenepent-2-en-2-olate Chemical compound [Fe].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O LZKLAOYSENRNKR-LNTINUHCSA-N 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229940049920 malate Drugs 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N malic acid Chemical compound OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- SGGOJYZMTYGPCH-UHFFFAOYSA-L manganese(2+);naphthalene-2-carboxylate Chemical compound [Mn+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 SGGOJYZMTYGPCH-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- JDEJGVSZUIJWBM-UHFFFAOYSA-N n,n,2-trimethylaniline Chemical compound CN(C)C1=CC=CC=C1C JDEJGVSZUIJWBM-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 239000000025 natural resin Substances 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Polyurethanes Or Polyureas (AREA)
Description
【発明の詳細な説明】
本発明は、耐熱性、耐湿性、耐薬品性、耐摩耗
性、接着性、密着性などに優れた硬化性樹脂組成
物に関するもので、詳しくはa.分子中にシアナト
基を2個以上含有する多官能性シアン酸エステ
ル、該シアン酸エステルプレポリマー或いは該シ
アン酸エステルとアミンとのプレポリマー、およ
びb.分子中にN−マレイミド基を2個以上含有す
る多官能性マレイミド、該マレイミドプレポリマ
ー或いは該マレイミドとアミンとのプレポリマー
を必須成分としする硬化性樹脂組成物(A)と、熱可
塑性ポリウレタン樹脂(B)とを混合してなる硬化性
樹脂組成物である。
従来、熱可塑性ポリウレタン樹脂は、耐熱性、
耐薬品等に劣つており、高温で使用する用途、薬
品や溶剤等と接触する用途等には適さないもので
あつた。他方、本発明のa,b成分からなるシア
ン酸エスレテル−マレイミド樹脂は耐熱性、耐薬
品性等には優れていたが、密着性、接着性に関し
て不十分な場合があつた。
本発明者らは以上のような欠点を解消すべく鋭
意研究を重ねた結果、シアン酸エステル−マレイ
ミド樹脂と熱可塑性ポリウレタン樹脂とを組み合
せることにより、耐熱性、耐湿性、耐薬品性、耐
摩耗性、接着性、密着性などに優れた硬化性樹脂
組成物を得ることに成功し、本発明に至つた。
以下、本発明について説明する。
本発明の硬化性樹脂組成物(A)は前記の如く、a
とb成分とを必須成分としてなるものである。ま
ず、a成分である多官能性シアン酸エステルとし
て好適なものは、下記一般式(1)
R(−O−C≡N)n ……(1)
(式中のmは2以上、通常5以下の整数であり、
Rは芳香族性の有機基であつて、上記シアナト基
は該有機基Rの芳香環に結合しているもの)
で表される化合物である。具体的に例示すれば
1,3−又は1,4−ジシアナトベンゼン、1,
3,5−トリシアナトベンゼン、1,3−、1,
4−、1,6−、1,8−、2,6−又は2,7
−ジシアナトナフタレン、1,3,6−トリシア
ナトラタレン、4,4′−ジシアナトビフエニル、
ビス(4−シシアナトフエニル)メタン、2,2
−ビス(4−シアナトフエニル)プロパン、2,
2−ビス(3,5−ジクロロ−4−シアナトフエ
ニル)プロパン、2,2−ビス(3,5−ジブロ
モ−4−シアナトフエニル)プロパン、ビス(4
−シアナトフエニル)エーテル、ビス(4−シア
ナトフエニル)チオエーテル、ビス(4−シアナ
トフエニル)スルホン、トリス(4−シアナトフ
エニル)ホスフアイト、トリス、(4−シアナト
フエニル)ホスフエート、およびノボラツクスと
ハロゲン化シアンとの反応により得られるシアン
酸エステルなどである。これらのほかに特公昭41
−1928、同43−18468、同44−4791、同45−
11712、同46−41112、同47−26853および特開昭
51−63149などに記載のシアン酸エステルも用い
うる。
また、上述した多官能性シアン酸エステルを、
鉱酸、ルイス酸、炭酸ナトリウム或いは塩化リチ
ウム等の塩類、トリブチルホスフイン等のリン酸
エステル類などの存在下に重合させて得られるプ
レポリマーとして用いることができる。これらの
プレポリマーは、前記シアン酸エステル中のシア
ン基が三量化することによつて形成されるsym−
トリアジン環を、一般に分子中に有している。本
発明においては、数平均分子量300〜6000の前記
プレポリマーを用いるのが好ましい。
更に、上記した多官能性シアン酸エステルはア
ミンとのプレポリマーの形でも使用できる。好適
に用いうるアミンを例示すれば、メタまたはパラ
フエニレンジアミン、メタまたはパラキシリレン
ジアミン、1,4−または1,3−シクロヘキサ
ンジアミン、ヘキサヒドロキシリレンジアミン、
4,4′−ジアミノビフエニル、ビス(4−アミノ
フエニル)メタン、ビス(4−アミノフエニル)
エーテル、ビス(4−アミノフエニル)スルホ
ン、ビス(4−アミノ−3−メチルフエニル)メ
タン、ビス(4−アミノ−3,5−ジメチルフエ
ニル)メタン、ビス(4−アミノフエニル)シク
ロヘキサン、2,2−ビス(4−アミノフエニ
ル)プロパン、2,2−ビス(4−アミノ−3−
メチルフエニル)プロパン、2,2−ビス(4−
アミノ−3−クロロフエニル)プロパン、ビス
(4−アミノ−3−クロロフエニル)メタン、2,
2−ビス(4−アミノ−3,5−ジブロモフエニ
ル)プロパン、ビス(4−アミノフエニル)フエ
ニルメタン、3,4−ジアミノフエニル−4′−ア
ミノフエニルメタン、1,1−ビス(4−アミノ
フエニル)−1−フエニルエタン等である。
むろん、上述した多官能性シアン酸エステル、
そのプレポリマー、およびアミンとのプレポリマ
ーは混合物の形で使用できる。
本発明のb成分の多官能マレイミドとして好適
なものは下記一般式(2)
(式中、Rは2価以上、通常5価以下の芳香族ま
たは脂環族性有機基、X1、X2は水素、ハロゲン、
またはアルキル基であり、mは通常2〜5の整数
である。)
で表される化合物である。上式で表されるマレイ
ミド類は無水マレイン酸類とアミノ基を2〜5個
含有するポリアミン類とを反応させマレアミド酸
を調整し、次いでマレアミド酸を脱水環化させる
それ自体公知の方法で製造することができる。用
いるポリアミン類は芳香族ポリアミンであること
が最終樹脂の耐熱性等の点で好ましいが、樹脂の
可擣性や柔軟性が望ましい場合には、脂環族アミ
ンを単独或いは組合せで使用してもよい。また、
ポリアミン類は第一級アミンであることが反応性
の点で望ましいが、第二級アミンも使用できる。
好適なアミン類としては、前記したa成分とのプ
レホリマーの形に使用するアミン類、およびs−
トリアジン環をもつたメラミン類、アニリンとホ
ルマリンとを反応させてベンゼン環をメチレン結
合で結んだポリアミン類等である。
本発明においては、上述した多官能性マレイミ
ドは、所謂モノマーの形で使用する代わりにプレ
ポリマー、上記アミンとのプレポリマーの形で用
いることもできる。
本発明のB成分である熱可塑性ポリウレタン樹
脂とは、分子内に2個以上の水酸基を有するジヒ
ドロキシ化合物類(ポリエーテルやポリエステル
を含む)と2個のイソシアナート基を有するジイ
ソシアナート類とを反応させて得られる熱可塑性
の重合体であり、熱可塑性を保つ範囲内において
3官能以上のものや架橋剤を用いたものであつて
もよいし、又、−NCOのような官能基をもつてい
てもよい。
ジヒドロキシ化合物を具体的に例示すれば、エ
チレングリコール、1,2−及び1,3−プロパ
ンジオール、1,3−、1,4−及び2,3−ブ
タンジオール、1,6−ヘキサンジオール,1,
8−オクタンジオールのようなシオール類;ジエ
チレングリコール、トリエチレングリコール、ポ
リエチレングリコール、ジプロピレングリコー
ル、ポリプロピレングリコール、ジブチレングリ
コール、ポリブチレングリコールのようなポリエ
ーテル型ジオール類;2,2−ビス(4−ビドロ
キシフエニル)プロパン,1,4−フエニレン−
ビス(β−ヒドロキシエチルエーテル)のような
芳香環をもつたジオール類、及びこれらジオール
類おジカルボン酸類−例えば、琥珀酸、アジピン
酸、スペリン酸、アゼライン酸、セバシン酸、テ
レフタル酸、イソフタル酸、無水フタル酸など−
との分子量10000以下、好ましくは、800〜5000の
ポリエステルが例示される。
又、ジイソシアナート類としては、2,2−ビ
ス(4−イソシアナトフエニル)プロパン、ビス
(4−イソシアナトフエニル)メタン、ビス(4
−イソシアナトフエニル)スルホン、ビス(4−
イソシアナトフエニル)エーテル、1,1−ビス
(4−イソシアナトフエニル)シクロヘキサン、
メチル−ビス(3−イソシアナトフエニル)ホス
フインオキシド、1,5−ジイソシアナトナフタ
リン、m−キシリレンジイソシアネート、p−キ
シリレンジイソシアネート、ビス(4−イソシア
ナトヘキシル)メタン、ヘキサメチレンジイソシ
アネートなどが例示される。
本発明の硬化性樹脂組成物の調整方法は、A成
分、B成分をそれぞれ溶媒に溶解または均一に分
解させて混合する方法、無溶剤でA成分、B成分
を室温あるいは加温下に、例えばバンバリーミキ
サー、ヘンシエルミキサー、ロール、押出機等で
均一に混合する方法による。
本発明のA、B両成分の使用量比については特
に限定のないものであるが、耐熱性の用途におい
ては、A成分を50〜99wt%、好ましくは60〜
95wt%用いるのがよい。
本発明は以上の成分の必須とするものであるが
これらの他に更に他の樹脂成分を併用できるもの
がある。これらとしては、単官能又は多官能性ヒ
ドロキシ化合物の(メタ)アクリル酸のエステ
ル、(メタ)アクリル酸のエポキシエステル、(メ
タ)アクリル酸のアルケニルエステルなどの(メ
タ)アクリル酸のエステル及びそれらのプレポリ
マー;ジアリルフタレート、ジビニルベンゼン、
ジアリルベンゼン、トリアルケニルイソシアヌレ
ートなどのポリアリル化合物及びそのプレポリマ
ー;ジシクロペンタジエン及びそのプレポリマ
ー;エポキシ樹脂;フエノール樹脂;ポリビニル
ホルマール、ポリビニルアセタール、ポリビニル
ブチラールなどのポリビニルアセタール樹脂;フ
エノキシ樹脂;OH基もしくはCOOH基をもつた
アクリル樹脂;シリコン樹脂;アルキツド樹脂;
ポリブタジエン、ブタジエン−アクリロニトリル
共重合体、ポリクロロプレン、ブタジエン−スチ
レン共重合体、ポリイソプレン、ブチルゴム、天
然ゴムなどの液状〜elasticなゴム類なども適宜
用いられるものである。
本発明の硬化性樹脂組成物はそれ自体加熱によ
り結合し網状化して多熱性樹脂となる性質を有し
ているが、架橋網状化を促進する目的で、通常は
溶媒を含有させて使用する。このような触媒とし
ては、2−メチルイミダゾール、2−ウンデシル
イミダゾール、2−ヘプタデシルイミダゾール、
2−フエニルイミダゾール、2−エチル−4−メ
チルイミダゾール、1−ベンジル−2−メチルイ
ミダゾール、1−プロピル−2−メチルイミダゾ
ール、1−シアノエチル−2−メチルイミダゾー
ル、1−シアノエチル−2−エチルイミダゾー
ル、1−シアノエチル−2−ウンデシルイミダゾ
ール、1−シアノエチル−2−フエニルイミダゾ
ール、1−シアノエチル−2−エチル−4−メチ
ルイミダゾール、1−グアナミノエチル−2−メ
チルイミダゾールで例示されるイミダゾール類、
さらには、これらのイミダゾール類へのカルボン
酸もしくはその無水物類の付加体など;N,N−
ジメチルベンジルアミン、N,N−ジメチルアニ
リン、N,N−ジメチルトルイジン、N,N−ジ
メチル−p−アニシジン、p−ハロゲノ−N,N
−ジメチルアニリン、2−N−エチルアニリノエ
タノール、トリ−n−ブチルアミン、ピリジン、
キノリン、N−メチルモルホリン、トリエタノー
ルアミン、トリエチレンジアミン、N,N,N′,
N′−テトラメチルブタンジアミン、N−メチル
ピペリジンなどの第3級アミン類;フエノール、
キシレノール、クレゾール、レゾルシン、カテコ
ール、フロログリシンなどのフエノール類;ハフ
テン酸鉛、ステアリン酸鉛、ナフテン酸亜鉛、オ
クチル酸亜鉛、オレイン酸錫、ジブチル錫、マレ
ート、ナフテン酸マンガン、ナフテン酸コバル
ト、アセチルアセトン鉄などの有機金属塩;
SnCl4、ZnCl2、AlCl3などの無機金属塩;過酸化
ベンゾイル、ラウロイルパーオキサイド、カプリ
ルパートキサイド、アセチルパーオキサイド、パ
ラクロロベンゾンイルパーオキサイド、ジ−tert
−ブチル−ジ−パーフタレートなどの過酸化物;
無水マレイン酸、無水フタル酸、無水ラウリル
酸、無水ピロメリツト酸、無水トリメリツト酸、
ヘキサヒドロ無水フタル酸、ヘキサヒドロ無水ト
リメリツト酸、ヘキサヒドロ無水ピロメリツト酸
などの酸無水物;さらには、アゾビスニトリルな
どのアゾ化合物類などが挙げられる。これら触媒
の添加量は、一般的な意味での触媒量の範囲で充
分であり、たとえば金組成物に対して10wt%以
下の量で使用されればよい。
本発明の硬化性樹脂組成物を硬化させるための
温度は、硬化剤や触媒の有無、組成成分の種類な
どによつても変化するが、通常100〜300℃の範囲
で選ばれればよい。この組成物は種々の用途に用
いられるが、成形品、積層品、接着構造物等の製
造に用いられる場合には、加熱硬化に際して圧力
を加えることが好ましく、一般的に言つて0.1〜
500Kg/cm2、好ましくは5〜150Kg/cm2の範囲内で
適宜選ばれる。
本発明の硬化性樹脂脂組成物には、組成物本来
の特性が損なわれない範囲で、所望に応じて種々
の添加物を配合することが出来る。これらの添加
物としては、天然または合成の樹脂類;繊維質補
強材;充填材;染料・顔料;増粘剤;滑剤;カツ
プリング剤;難燃剤など公知の各種添加剤が含ま
れ、所望に応じて適宜組合せて用いられる。
以下、実施例、比較例によつて本発明をさらに
具体的に説明する。尚、実施例、比較例中の部は
特に断らない限り重量部である。
実施例 1
2,2−ビス(4−シアナトフエニル)プロパ
ン500部とビス(4−マレイミドフエニル)メタ
ン500部とを150℃で60分間予備反応させた。これ
に完全熱可塑型ポリウレタン樹脂(商品名;エラ
ストランE−580PNAT、日本エラストラン(株))
600部を加え、N,N−ジメチルホルムアミドと
メチルエチルケトンとの混合溶媒に50℃下、撹拌
しながら溶解させた。
この溶液に触媒としてアセチルアセトン鉄0.1
部を加え均一に混合した後、ガラス織布に含浸・
乾燥してB−stageのプリプレグとした。このプ
リプレグを8枚重ね、上下両面に35μの電解銅箔
を配した構成で温度175℃、圧力40Kg/cm2で120分
間積層成形した。
得られた銅張積層板のテスト結果を第1表に示
した。
実施例 2
2,2−ビス(4−シアニトフエニル)プロパ
ン900部とビス(4−マレイミドフエニル)エー
テル100部とを150℃で150分間予備反応させた。
これに不完全熱可塑型ポリウレタン樹脂(商品
名;Texin、Mobay(株))500部を加え、N,N−
ジメチルホルムアミドとメチルエチルケトンとの
混合溶媒に50℃下、撹拌しながら溶解させた。
この溶液に触媒としてオクチル散亜鉛0.1部を
加え均一に混合した後、ガラス織布に含浸・乾燥
してB−stageのプリプレグとした。このプリプ
レグを用いる他は実施例1と同様とした。得られ
た銅張積層板のテスト結果を第1表に示した。
比較例 1
実施例1において完全熱可塑型ポリウレタン樹
脂を用いない以外は同様とした結果を第1表に示
した。
【表】DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a curable resin composition with excellent heat resistance, moisture resistance, chemical resistance, abrasion resistance, adhesion, adhesiveness, etc. b. Polyfunctional cyanate esters containing two or more cyanato groups, prepolymers of the cyanate esters, or prepolymers of the cyanate esters and amines, and b. A curable resin composition obtained by mixing a curable resin composition (A) containing a functional maleimide, a prepolymer of the maleimide, or a prepolymer of the maleimide and an amine as an essential component, and a thermoplastic polyurethane resin (B). It is. Conventionally, thermoplastic polyurethane resins have high heat resistance,
It has poor chemical resistance and is not suitable for applications that involve high temperatures or contact with chemicals, solvents, etc. On the other hand, the cyanate ester-maleimide resin consisting of components a and b of the present invention had excellent heat resistance, chemical resistance, etc., but was sometimes unsatisfactory in terms of adhesion and adhesion. The inventors of the present invention have conducted extensive research in order to eliminate the above-mentioned drawbacks, and have found that by combining cyanate ester-maleimide resin and thermoplastic polyurethane resin, they have improved heat resistance, moisture resistance, chemical resistance, and resistance. The inventors succeeded in obtaining a curable resin composition with excellent abrasion properties, adhesion properties, adhesion properties, etc., leading to the present invention. The present invention will be explained below. As described above, the curable resin composition (A) of the present invention has a
and component b as essential components. First, a suitable polyfunctional cyanate ester as component a has the following general formula (1) R(-O-C≡N) n ...(1) (m in the formula is 2 or more, usually 5 is an integer below,
R is an aromatic organic group, and the cyanato group is bonded to the aromatic ring of the organic group R. Specific examples include 1,3- or 1,4-dicyanatobenzene, 1,
3,5-tricyanatobenzene, 1,3-,1,
4-, 1,6-, 1,8-, 2,6- or 2,7
-dicyanatonaphthalene, 1,3,6-tricyanatotratalene, 4,4'-dicyanatobiphenyl,
Bis(4-cycyanatophenyl)methane, 2,2
-bis(4-cyanatophenyl)propane, 2,
2-bis(3,5-dichloro-4-cyanatophenyl)propane, 2,2-bis(3,5-dibromo-4-cyanatophenyl)propane, bis(4-cyanatophenyl)propane
-cyanatophenyl) ether, bis(4-cyanatophenyl) thioether, bis(4-cyanatophenyl) sulfone, tris(4-cyanatophenyl) phosphite, tris, (4-cyanatophenyl) phosphate, and obtained by reaction of novolax with cyanogen halides. cyanate esters, etc. In addition to these, the special public
-1928, 43-18468, 44-4791, 45-
11712, 46-41112, 47-26853 and JP-A-Sho
Cyanic acid esters described in 51-63149 and the like can also be used. In addition, the above-mentioned polyfunctional cyanate ester,
It can be used as a prepolymer obtained by polymerization in the presence of mineral acids, Lewis acids, salts such as sodium carbonate or lithium chloride, phosphoric esters such as tributylphosphine, and the like. These prepolymers are sym-
Generally has a triazine ring in the molecule. In the present invention, it is preferable to use the prepolymer having a number average molecular weight of 300 to 6,000. Furthermore, the polyfunctional cyanate esters described above can also be used in the form of prepolymers with amines. Examples of amines that can be suitably used include meta or paraphenylene diamine, meta or para xylylene diamine, 1,4- or 1,3-cyclohexane diamine, hexahydroxylylene diamine,
4,4'-diaminobiphenyl, bis(4-aminophenyl)methane, bis(4-aminophenyl)
Ether, bis(4-aminophenyl)sulfone, bis(4-amino-3-methylphenyl)methane, bis(4-amino-3,5-dimethylphenyl)methane, bis(4-aminophenyl)cyclohexane, 2,2- Bis(4-aminophenyl)propane, 2,2-bis(4-amino-3-
methylphenyl)propane, 2,2-bis(4-
Amino-3-chlorophenyl)propane, bis(4-amino-3-chlorophenyl)methane, 2,
2-bis(4-amino-3,5-dibromophenyl)propane, bis(4-aminophenyl)phenylmethane, 3,4-diaminophenyl-4'-aminophenylmethane, 1,1-bis(4- aminophenyl)-1-phenylethane and the like. Of course, the above-mentioned polyfunctional cyanate ester,
The prepolymers, and the prepolymers with amines, can be used in the form of mixtures. A preferred polyfunctional maleimide as component b of the present invention is represented by the following general formula (2): (In the formula, R is an aromatic or alicyclic organic group with a valence of 2 or more and usually 5 or less, X 1 and X 2 are hydrogen, halogen,
or an alkyl group, and m is usually an integer of 2 to 5. ) is a compound represented by Maleimides represented by the above formula are produced by a method known per se, in which maleic anhydride and polyamines containing 2 to 5 amino groups are reacted to prepare maleamic acid, and then maleamic acid is cyclized by dehydration. be able to. The polyamines used are preferably aromatic polyamines in terms of the heat resistance of the final resin, but if flexibility and flexibility of the resin are desired, alicyclic amines may be used alone or in combination. good. Also,
It is desirable that the polyamines be primary amines in terms of reactivity, but secondary amines can also be used.
Suitable amines include the amines used in the form of a preformer with component a mentioned above, and s-
These include melamines with a triazine ring, and polyamines made by reacting aniline with formalin and linking benzene rings with methylene bonds. In the present invention, the above-mentioned polyfunctional maleimide can be used in the form of a prepolymer, or a prepolymer with the above-mentioned amine, instead of being used in the form of a so-called monomer. The thermoplastic polyurethane resin which is component B of the present invention includes dihydroxy compounds (including polyethers and polyesters) having two or more hydroxyl groups in the molecule and diisocyanates having two isocyanate groups. It is a thermoplastic polymer obtained by reaction, and it may be a polymer with trifunctional or higher functionality or a crosslinking agent within the range that maintains thermoplasticity, or it may have a functional group such as -NCO. You can leave it there. Specific examples of dihydroxy compounds include ethylene glycol, 1,2- and 1,3-propanediol, 1,3-, 1,4- and 2,3-butanediol, 1,6-hexanediol, 1 ,
Shiols such as 8-octanediol; polyether type diols such as diethylene glycol, triethylene glycol, polyethylene glycol, dipropylene glycol, polypropylene glycol, dibutylene glycol, polybutylene glycol; 2,2-bis(4- (hydroxyphenyl)propane, 1,4-phenylene-
Diols with an aromatic ring such as bis(β-hydroxyethyl ether), and dicarboxylic acids of these diols, such as succinic acid, adipic acid, superric acid, azelaic acid, sebacic acid, terephthalic acid, isophthalic acid, Phthalic anhydride, etc.
Examples include polyesters having a molecular weight of 10,000 or less, preferably 800 to 5,000. In addition, examples of diisocyanates include 2,2-bis(4-isocyanatophenyl)propane, bis(4-isocyanatophenyl)methane, and bis(4-isocyanatophenyl)propane.
-isocyanatophenyl)sulfone, bis(4-
isocyanatophenyl) ether, 1,1-bis(4-isocyanatophenyl)cyclohexane,
Methyl-bis(3-isocyanatophenyl)phosphine oxide, 1,5-diisocyanatonaphthalene, m-xylylene diisocyanate, p-xylylene diisocyanate, bis(4-isocyanatohexyl)methane, hexamethylene diisocyanate, etc. Illustrated. The method for preparing the curable resin composition of the present invention includes a method of dissolving component A and component B in a solvent or dissolving them uniformly and mixing them, and a method of mixing component A and component B without a solvent at room temperature or under heating, for example. By a method of uniformly mixing with a Banbury mixer, Henschel mixer, roll, extruder, etc. There is no particular limitation on the usage ratio of both components A and B in the present invention, but in heat-resistant applications, component A should be used in an amount of 50 to 99 wt%, preferably 60 to 99 wt%.
It is best to use 95wt%. Although the above-mentioned components are essential for the present invention, other resin components may also be used in combination. These include esters of (meth)acrylic acid such as esters of (meth)acrylic acid of monofunctional or polyfunctional hydroxy compounds, epoxy esters of (meth)acrylic acid, alkenyl esters of (meth)acrylic acid, and their like. Prepolymer; diallyl phthalate, divinylbenzene,
Polyallyl compounds such as diallylbenzene and trialkenyl isocyanurate and their prepolymers; dicyclopentadiene and their prepolymers; epoxy resins; phenolic resins; polyvinyl acetal resins such as polyvinyl formal, polyvinyl acetal, and polyvinyl butyral; phenoxy resins; OH groups or Acrylic resin with COOH group; Silicone resin; Alkyd resin;
Liquid to elastic rubbers such as polybutadiene, butadiene-acrylonitrile copolymer, polychloroprene, butadiene-styrene copolymer, polyisoprene, butyl rubber, and natural rubber may also be used as appropriate. The curable resin composition of the present invention itself has the property of being bonded and reticulated by heating to become a multithermal resin, but in order to promote crosslinking and reticulation, it is usually used in the form of a solvent. Such catalysts include 2-methylimidazole, 2-undecylimidazole, 2-heptadecyl imidazole,
2-Phenylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-propyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethylimidazole , 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, and imidazoles exemplified by 1-guanaminoethyl-2-methylimidazole,
Furthermore, adducts of carboxylic acids or their anhydrides to these imidazoles; N,N-
Dimethylbenzylamine, N,N-dimethylaniline, N,N-dimethyltoluidine, N,N-dimethyl-p-anisidine, p-halogeno-N,N
-dimethylaniline, 2-N-ethylanilinoethanol, tri-n-butylamine, pyridine,
Quinoline, N-methylmorpholine, triethanolamine, triethylenediamine, N,N,N',
Tertiary amines such as N'-tetramethylbutanediamine and N-methylpiperidine; phenol,
Phenols such as xylenol, cresol, resorcin, catechol, phlologlycin; lead haftate, lead stearate, zinc naphthenate, zinc octylate, tin oleate, dibutyltin, malate, manganese naphthenate, cobalt naphthenate, iron acetylacetonate Organometallic salts such as;
Inorganic metal salts such as SnCl 4 , ZnCl 2 , AlCl 3 ; benzoyl peroxide, lauroyl peroxide, caprylic peroxide, acetyl peroxide, parachlorobenzonyl peroxide, di-tert
- peroxides such as butyl-di-perphthalate;
Maleic anhydride, phthalic anhydride, lauric anhydride, pyromellitic anhydride, trimellitic anhydride,
Acid anhydrides such as hexahydrophthalic anhydride, hexahydro trimellitic anhydride, and hexahydropyromellitic anhydride; and furthermore, azo compounds such as azobisnitrile are included. The amount of these catalysts to be added is sufficient within a general range of catalytic amounts, and may be used, for example, in an amount of 10 wt % or less based on the gold composition. The temperature for curing the curable resin composition of the present invention varies depending on the presence or absence of a curing agent and catalyst, the types of composition components, etc., but it may be generally selected within the range of 100 to 300°C. This composition is used for various purposes, but when used for manufacturing molded products, laminates, adhesive structures, etc., it is preferable to apply pressure during heat curing, and generally speaking, the pressure is applied to a pressure of 0.1 to
It is suitably selected within the range of 500 Kg/cm 2 , preferably 5 to 150 Kg/cm 2 . The curable resin composition of the present invention may contain various additives as desired, as long as the original properties of the composition are not impaired. These additives include various known additives such as natural or synthetic resins; fibrous reinforcing materials; fillers; dyes and pigments; thickeners; lubricants; coupling agents; and flame retardants. They are used in appropriate combinations. Hereinafter, the present invention will be explained in more detail with reference to Examples and Comparative Examples. In addition, parts in Examples and Comparative Examples are parts by weight unless otherwise specified. Example 1 500 parts of 2,2-bis(4-cyanatophenyl)propane and 500 parts of bis(4-maleimidophenyl)methane were preliminarily reacted at 150°C for 60 minutes. This is a completely thermoplastic polyurethane resin (product name: Elastolan E-580PNAT, Nippon Elastolan Co., Ltd.)
600 parts were added and dissolved in a mixed solvent of N,N-dimethylformamide and methyl ethyl ketone at 50°C with stirring. This solution contains 0.1 iron acetylacetonate as a catalyst.
After adding and mixing evenly, impregnate the glass woven cloth.
It was dried to obtain a B-stage prepreg. Eight sheets of this prepreg were laminated and laminated and molded for 120 minutes at a temperature of 175° C. and a pressure of 40 kg/cm 2 with 35 μm electrolytic copper foil arranged on both the top and bottom surfaces. The test results of the obtained copper clad laminates are shown in Table 1. Example 2 900 parts of 2,2-bis(4-cyanitophenyl)propane and 100 parts of bis(4-maleimidophenyl)ether were preliminarily reacted at 150°C for 150 minutes.
To this, 500 parts of incomplete thermoplastic polyurethane resin (trade name: Texin, Mobay Co., Ltd.) was added, and N, N-
It was dissolved in a mixed solvent of dimethylformamide and methyl ethyl ketone at 50°C with stirring. To this solution, 0.1 part of octyl dust zinc was added as a catalyst and mixed uniformly, and then a glass woven fabric was impregnated and dried to obtain a B-stage prepreg. The procedure was the same as in Example 1 except that this prepreg was used. The test results of the obtained copper clad laminates are shown in Table 1. Comparative Example 1 Table 1 shows the same results as in Example 1 except that the fully thermoplastic polyurethane resin was not used. 【table】
Claims (1)
官能性シアン酸エステル、該シアン酸エスツレ
ルプレポリマー或いは該シアン酸エステルとア
ミンとのプレポリマーおよび b 分子中にN−マレイミド基を2個以上含有す
る多官能性マレイミド、該マレイミドプレポリ
マー或いは該マレイミドとアミンとのプレポリ
マーを必須成分とする硬化性樹脂組成物(A)と、
熱可塑性ポリウレタン樹脂(B)とを混合してなる
硬化性樹脂組成物。 2 該a成分の多官能性シアン酸エステルが、下
記一般式(1)で表され、該b成分の多官能性マレイ
ミドが下記一般式(2)で表される特許請求の範囲第
1項記載の硬化性樹脂組成物。 一般式(1):R(−O−C≡N)n ……(1) (式中のmは2以上、通常5以下の整数であり、
Rは芳香族性の有機基であつて、上記シアナト基
は該有機基Rの芳香環に結合しているもの。) 一般式(2) (式中のRは2価、通常5価以下の芳香族又は脂
環族性の有機基で、X、Xは水素、ハロゲン、ま
たはアルキル基であり、mは通常2〜5の整数で
ある。 3 該A成分が50〜99重量%、該B成分が50〜1
重量%の範囲で配合してなるものである特許請求
の範囲第1項記載の硬化性樹脂組成物。[Scope of Claims] 1 a. A polyfunctional cyanate ester having two or more cyanato groups in the molecule, the estrel cyanate prepolymer or a prepolymer of the cyanate ester and an amine, and b. A curable resin composition (A) containing as an essential component a polyfunctional maleimide containing two or more maleimide groups, the maleimide prepolymer, or the prepolymer of the maleimide and an amine;
A curable resin composition formed by mixing a thermoplastic polyurethane resin (B). 2. Claim 1, wherein the polyfunctional cyanate ester as component a is represented by the following general formula (1), and the polyfunctional maleimide as the b component is represented by the following general formula (2). curable resin composition. General formula (1): R(-O-C≡N) n ...(1) (m in the formula is an integer of 2 or more and usually 5 or less,
R is an aromatic organic group, and the cyanato group is bonded to the aromatic ring of the organic group R. ) General formula (2) (R in the formula is a divalent, usually pentavalent or less aromatic or alicyclic organic group, X is hydrogen, halogen, or an alkyl group, and m is usually an integer of 2 to 5. 3 The A component is 50 to 99% by weight, and the B component is 50 to 1% by weight.
The curable resin composition according to claim 1, wherein the curable resin composition is blended in a range of % by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57177135A JPS5966455A (en) | 1982-10-08 | 1982-10-08 | Curable resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57177135A JPS5966455A (en) | 1982-10-08 | 1982-10-08 | Curable resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5966455A JPS5966455A (en) | 1984-04-14 |
| JPH0322906B2 true JPH0322906B2 (en) | 1991-03-27 |
Family
ID=16025789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57177135A Granted JPS5966455A (en) | 1982-10-08 | 1982-10-08 | Curable resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5966455A (en) |
-
1982
- 1982-10-08 JP JP57177135A patent/JPS5966455A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5966455A (en) | 1984-04-14 |
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