JPH0326569B2 - - Google Patents
Info
- Publication number
- JPH0326569B2 JPH0326569B2 JP58128498A JP12849883A JPH0326569B2 JP H0326569 B2 JPH0326569 B2 JP H0326569B2 JP 58128498 A JP58128498 A JP 58128498A JP 12849883 A JP12849883 A JP 12849883A JP H0326569 B2 JPH0326569 B2 JP H0326569B2
- Authority
- JP
- Japan
- Prior art keywords
- outer leads
- crystal resonator
- base
- leads
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0504—Holders or supports for bulk acoustic wave devices
- H03H9/0528—Holders or supports for bulk acoustic wave devices consisting of clips
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【発明の詳細な説明】
本発明は、水晶振動子の製造方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a crystal resonator.
一般に水晶振動子はベース11と、このベース
11の孔に挿通され、これにガラス封着された1
対のリード12と、リード12の先端部間に保持
された水晶片13と、水晶片13をカバーするキ
ヤツプ14とから成る。リード12は、キヤツプ
14内において水晶片13を保持する板状のイン
ナリード15と、ベース11を貫通して外方へ延
出する線状のアウタリード16とから成る。この
ような水晶振動子においては、アウタリード16
の相互間隔が不ぞろいである。これは、リード1
2がベース11に対して傾いて取付けられるた
め、あるいはリード12を構成する線材自体に曲
りがあるため等の理由によるものである。アウタ
リード16の相互間隔が不ぞろいであるため、完
成した水晶振動子のアウタリード16を後に配線
基板の所定間隔の端子挿入孔へ挿入する作業を自
動化することができない。従つてこの作業は能率
の悪い手作業で行われている。 Generally, a crystal resonator includes a base 11, a crystal unit inserted into a hole in the base 11, and a crystal unit sealed with glass.
It consists of a pair of leads 12, a crystal piece 13 held between the tips of the leads 12, and a cap 14 that covers the crystal piece 13. The lead 12 consists of a plate-shaped inner lead 15 that holds the crystal piece 13 within the cap 14, and a linear outer lead 16 that penetrates the base 11 and extends outward. In such a crystal resonator, the outer lead 16
The mutual spacing between them is uneven. This is lead 1
This is due to the fact that the leads 12 are mounted at an angle with respect to the base 11, or the wires forming the leads 12 themselves are bent. Since the mutual spacing of the outer leads 16 is uneven, it is not possible to automate the process of later inserting the outer leads 16 of the completed crystal resonator into terminal insertion holes at predetermined intervals on the wiring board. Therefore, this work is performed manually, which is inefficient.
本発明は従来の水晶振動子における上記のよう
な問題点に着目してなされたもので、水晶振動子
の製造工程中に、アウタリードをプレス成型して
相互間隔を一定にする過程を加えることにより、
後の配線基板への取付け作業が容易でそれの自動
化が可能な水晶振動子を安価に量産しうるように
することを目的としている。 The present invention was made by focusing on the above-mentioned problems in conventional crystal resonators, and by adding a process to the manufacturing process of the crystal resonator by press-molding the outer leads to make the mutual spacing constant. ,
The purpose of this invention is to mass-produce a crystal resonator that can be easily and automatically attached to a wiring board later on at a low cost.
以下図について本発明の実施例を説明する。第
1図は水晶振動子の製造過程を示す。ここにおい
て、リード2はアウタリード6とインナリード5
とから成る。アウタリード6は線材から成り、そ
の先端部は、ベース1に穿された1対の孔1a,
1a内に挿通され、ここにガラス封着されてい
る。このアウタリード6のベース1から上方へ突
出した部位には、第3図の如く、後に水晶片3を
保持するための板状のインナリード5が溶着され
る。このインナリード5は、アウタリード6と一
体に形成することもできる。 Embodiments of the invention will be described below with reference to the figures. FIG. 1 shows the manufacturing process of a crystal resonator. Here, lead 2 is outer lead 6 and inner lead 5.
It consists of The outer lead 6 is made of a wire rod, and its tip end is connected to a pair of holes 1a bored in the base 1.
It is inserted into 1a and sealed there with glass. As shown in FIG. 3, a plate-shaped inner lead 5 for holding the crystal piece 3 later is welded to a portion of the outer lead 6 that projects upward from the base 1. The inner lead 5 can also be formed integrally with the outer lead 6.
しかして、第1図に示すように形成されたもの
を第4図の如く治具20上に保持して型21,2
2,23にてプレス成型する。即ち、アウタリー
ド6,6の外側に下型22,23を臨ませ、両ア
ウタリード6,6間に上型21を下降させる。両
アウタリード6,6は、型21,22,23の形
状に沿つて変形し、第2図、第4図の如く、両者
間の間隔が一定に整えられる。この間隔は、後に
水晶振動子を取付ける配線基板25に穿たれた端
子挿入孔25a,25aの間隔に等しいものとす
る。なお、この配線基板25の端子挿入孔25a
は、ICチツプ等の回路素子の一般的端子間隔と
等しくすることができる。また、アウタリード6
の先端部には扁平部6aが形成される。この扁平
部の形成によりアウタリード6はICフレーム等
の扁平な端子と同形となり、これらと同等に画一
的に取扱い可能となる。この扁平部は追加的工程
により周辺を切落して整形することができる。 The mold formed as shown in FIG. 1 is then held on a jig 20 as shown in FIG.
Press molding is performed in steps 2 and 23. That is, the lower molds 22 and 23 are placed outside the outer leads 6 and 6, and the upper mold 21 is lowered between the outer leads 6 and 6. Both outer leads 6, 6 are deformed along the shapes of the molds 21, 22, 23, and the distance between them is kept constant as shown in FIGS. 2 and 4. This spacing is equal to the spacing between terminal insertion holes 25a, 25a drilled in the wiring board 25 to which the crystal resonator will be later mounted. Note that the terminal insertion hole 25a of this wiring board 25
can be made equal to the general terminal spacing of circuit elements such as IC chips. Also, outer lead 6
A flat portion 6a is formed at the tip. By forming this flat portion, the outer lead 6 has the same shape as a flat terminal of an IC frame, etc., and can be handled uniformly in the same manner as these. This flattened portion can be shaped by cutting off its periphery in an additional step.
第2図の状態のものへ第3図の如く水晶片3を
取付け、これにキヤツプ4を被せて水晶振動子が
完成する。 A crystal piece 3 is attached as shown in Fig. 3 to the state shown in Fig. 2, and a cap 4 is placed on it to complete the crystal resonator.
以上説明してきたように、本発明は、相互間隔
の不ぞろいなアウタリード6,6を型21,2
2,23にてプレス成型してその間隔を一定に調
整する工程を含むものであるから、後にこのアウ
タリード6,6を配線基板25に穿たれた所定間
隔の端子挿入孔25a,25aに挿入してハンダ
付する作業を自動化することができ、量産により
その製造コストの従来の1/3程度まで下げること
ができる。 As explained above, the present invention provides outer leads 6, 6 with uneven mutual spacing between molds 21, 2.
Since the outer leads 6, 6 are press-molded in steps 2 and 23 and the spacing thereof is adjusted to a constant value, the outer leads 6, 6 are later inserted into the terminal insertion holes 25a, 25a formed at a predetermined interval in the wiring board 25, and soldered. The attachment work can be automated, and mass production can reduce manufacturing costs to about 1/3 of conventional costs.
第1図乃至第3図は水晶振動子の組立過程を順
を追つて示す正面図、第4図はプレス成型過程を
示す正面図、第5図は従来の方法により組立てら
れた水晶振動子の正面図である。
1……ベース、2……リード、3……水晶片、
4……キヤツプ、5……インナリード、6……ア
ウタリード、20……治具、21……上型、2
2,23……下型、25……配線基板、25a…
…端子挿入孔。
Figures 1 to 3 are front views showing the assembly process of a crystal resonator step by step, Figure 4 is a front view showing the press molding process, and Figure 5 is a front view of the crystal resonator assembled by the conventional method. It is a front view. 1...base, 2...lead, 3...crystal piece,
4...Cap, 5...Inner lead, 6...Outer lead, 20...Jig, 21...Upper mold, 2
2, 23...lower mold, 25...wiring board, 25a...
...Terminal insertion hole.
Claims (1)
ら成るアウタリード6,6の上部を挿入して、こ
の孔1a,1a内にガラス封着した後、ベース1
を治具20上に保持させ、ベース1から延出した
一対のアウタリード6,6の外側に夫々相互の外
側間隔を定めるための同形一対の下型22,23
を配置し、両アウタリード6,6間に相互の外側
間隔を定めるための上型21を下降させ、これら
の型21,22,23間でアウタリード6,6を
プレス成型して相互間隔を配線基板25の端子挿
入孔25aの間隔と等しく一定に整える工程を含
むことを特徴とする水晶振動子の製造方法。 2 下型22,23の間に配置された、両アウタ
リード6,6間に上型21を下降させることによ
り、アウタリード6,6をプレス成型して相互間
隔を配線基板25の端子挿入孔25aの間隔と等
しく一定に整えると同時に、アウタリード6,6
の先端を扁平にする工程を含むことを特徴とする
特許請求の範囲1に記載の水晶振動子の製造方
法。[Scope of Claims] 1. After inserting the upper parts of outer leads 6, 6 made of wire into the pair of holes 1a, 1a of the base 1, and sealing them with glass in the holes 1a, 1a, the base 1
are held on a jig 20, and a pair of lower molds 22, 23 of the same shape are provided on the outside of the pair of outer leads 6, 6 extending from the base 1, respectively, for determining the outer distance between them.
The upper mold 21 for determining the mutual outer spacing between both outer leads 6, 6 is lowered, and the outer leads 6, 6 are press-molded between these molds 21, 22, 23 to adjust the mutual spacing between the wiring board. A method for manufacturing a crystal resonator, comprising the step of adjusting the interval to be equal to the interval between the terminal insertion holes 25a of No. 25. 2 By lowering the upper die 21 between the outer leads 6, 6 disposed between the lower dies 22, 23, the outer leads 6, 6 are press-molded and their mutual spacing is adjusted to the size of the terminal insertion hole 25a of the wiring board 25. At the same time, the outer leads 6, 6 are made uniformly equal to the interval.
The method for manufacturing a crystal resonator according to claim 1, further comprising the step of flattening the tip of the crystal resonator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12849883A JPS6020612A (en) | 1983-07-14 | 1983-07-14 | Manufacture of crystal resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12849883A JPS6020612A (en) | 1983-07-14 | 1983-07-14 | Manufacture of crystal resonator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6020612A JPS6020612A (en) | 1985-02-01 |
| JPH0326569B2 true JPH0326569B2 (en) | 1991-04-11 |
Family
ID=14986225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12849883A Granted JPS6020612A (en) | 1983-07-14 | 1983-07-14 | Manufacture of crystal resonator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6020612A (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5146621Y2 (en) * | 1971-04-15 | 1976-11-10 | ||
| JPS4830364U (en) * | 1971-08-16 | 1973-04-13 | ||
| JPS50103148U (en) * | 1974-01-29 | 1975-08-26 |
-
1983
- 1983-07-14 JP JP12849883A patent/JPS6020612A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6020612A (en) | 1985-02-01 |
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