JPH032662B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an overlay laminating apparatus for laminating an overlay film onto a printed circuit board.

(Prior Art) As a method of manufacturing a printed circuit board, the surface of a cathodized metal surface other than the portion that will become the circuit pattern is masked with a resist agent, which is an insulating material.
A conductor circuit for a printed circuit board is formed by electrodepositing a metal such as copper on the metal surface by plating, and the conductor circuit thus formed is transferred to a predetermined insulating substrate,
It is known to then apply the overlay to produce the required printed circuit board.

Conventionally, as a method of covering an overlay, an overlay film is used, and as shown in FIG.
There is a method in which a laminator 4 consisting of a and 4b directly sandwiches these and pressurizes them to cover the circuit 1.

(Problems to be Solved by the Invention) However, in the above-mentioned conventional laminator, since the laminator directly sandwiches and presses the substrate and overlay film, there are problems such as speed difference, misalignment, and pressure balance of the pressure rolls during pressurization. Due to changes, etc., the circuit 1, the substrate 2, and the overlay film 3 are "squeezed" in the direction of arrow A or B in FIG. A gap 5 called an air pocket may be generated between the overlay film 3 and the substrate 2, or the adhesion of the overlay film 3 to the substrate 2 may be insufficient. The occurrence of wrinkles not only reduces the commercial value of the product, but also causes a lack of stability in the dimensions of the circuit, leading to defective products. Insufficient adhesion to No. 2 causes peeling and generation of wrinkles or voids.

The present invention has been made in order to solve the above problems, and provides an overlay lamination device that enables lamination of overlays by applying pressure to a substrate, a circuit adhered to the substrate, and an overlay film without applying any "straining". The purpose is to provide.

(Means for Solving the Problems) In order to achieve the above object, according to the present invention, an overlay film covering the abutting circuit pattern is placed on a substrate to which the circuit pattern is connected, and the overlay film is laminated with a laminator and printed. An overlay lamination apparatus for forming a circuit board includes a belt conveyance mechanism that integrally conveys the substrate on which the overlay film is placed between two metal belts provided with elastic members, and a belt conveyance mechanism that integrally conveys the substrate; a heat roll disposed to integrally press the overlay film and the substrate via the metal belts; and a heat roll disposed downstream of the heat roll of the belt conveyance mechanism to press the overlay film and the substrate together via the metal belts. Overlay lamination, which includes a cooling roll that presses a film and the substrate, and an overlay film that covers a circuit pattern is placed on a substrate to which a circuit pattern is bonded, and is laminated by a laminator to form a printed circuit board. In the device,
a belt conveyance mechanism that integrally conveys the substrate on which the overlay film is mounted by sandwiching the substrate between two metal belts provided with elastic members; a heating roll that integrally presses the overlay film and the substrate; an oven disposed upstream of the heating roll of the belt conveyance mechanism that heats the overlay film and the substrate; and an oven that heats the overlay film and the substrate. The cooling roll is disposed downstream of the roll and presses the overlay film and the substrate via the metal belts.

(Function) A substrate with a circuit adhered thereto and an overlay film placed on the substrate so as to cover the circuit are integrally sandwiched between two metal belts of a belt conveyance mechanism. These substrates and overlay film are conveyed integrally by the belt conveyance mechanism. During transportation, the substrate and overlay film are heated in an oven, and then the substrate and overlay film are laminated by applying pressure with a hot roll through each of these metal belts. After the overlay film is laminated onto the substrate, it is further cooled under pressure with a cooling roll via each of the metal belts to complete the lamination of the overlay film. The speed difference between the two rolls is absorbed by the rolls sliding on the surface of the metal belt. This produces a printed circuit board.

(Example) An example of the present invention will be described below in detail based on the accompanying drawings.

FIG. 1 shows an overlay laminating apparatus to which the present invention is applied, and the overlay laminating apparatus 10 includes first and second belt conveyance mechanisms 11 and 12, an oven 13,
It is composed of a heat roll 14, a cooling roll 15, and a belt drive device 16. The first belt conveyance mechanism 11 is composed of two pulleys 20 and 21 arranged horizontally at a predetermined interval, and a belt 22 horizontally wound between these pulleys 20 and 21. The second belt conveyance mechanism 12 is arranged above the first belt conveyance mechanism 11, and includes two pulleys 25 and 26 arranged horizontally at a predetermined interval slightly shorter than the interval between the pulleys 20 and 21. It is constituted by a belt 27 horizontally stretched between these pulleys 25 and 26. The belts 22 and 27 of each of these belt conveying mechanisms 11 and 12 are arranged parallel to each other and facing each other at a predetermined interval along the longitudinal direction. Moreover, each of these belts 22,
27 is stretched horizontally by a belt tensioner (not shown). Each of these belts 22, 27 is, for example, a metal belt 22a, 27a as shown in FIG.
Elastic members such as silicone rubber 22b and 27b having a wall thickness of approximately 0.2 to 0.5 mm are adhered to the surface of the substrate to provide properties such as heat resistance and oil resistance. Note that a fluororesin called Teflon, which has excellent heat resistance and chemical resistance, may be used instead of silicone rubber.

The oven 13 is arranged on the inlet side of the belt conveyance mechanisms 11 and 12, and is equipped with a heater and a blower (both not shown).
Hot air is sent to and heats a substrate 2, which will be described later, and an overlay film 3 placed on the substrate 2, which are carried into and conveyed by these belt conveyance mechanisms 11 and 12. The temperature of this hot air is, for example, 60℃
The temperature is set at an appropriate temperature in the range of ~110°C.

The heat roll 14 is disposed upstream of each belt conveyance mechanism 11, 12, and is composed of a plurality of pressure rolls 30 and 31, 32 and 33, for example, and the rolls 30 and 32 are arranged on the inside of the belt 22. The rolls 3 are arranged at predetermined intervals along the longitudinal direction of the belt 22 and in contact with the inner surface of the belt 22.
1 and 33 are arranged inside the belt 27, facing each of the rolls 30 and 32 and in contact with the inner surface of the belt 27, respectively. Each of these rolls 30
- 33 are each made of a metal member, and at least one roll of each set of rolls, for example, roll 3
1 and 33 are heated to a predetermined temperature by a heater (not shown).

The cooling roll 15 is arranged downstream of the heating roll 14 of the belt conveyance mechanisms 11 and 12, and is arranged in plurality, for example, two.
It is composed of a pair of pressure rolls 35 and 36, 37 and 38, and the rolls 35 and 37 are in contact with the inner surface of the belt 22 at a predetermined interval along the longitudinal direction of the belt 22. The rolls 36 and 38 are arranged inside the belt 27, facing each of the rolls 35 and 37, and in contact with the inner surface of the belt 27. Each of these rolls 35 to 38 is formed of a metal member, and at least one roll in each set of rolls, such as rolls 36 and 38, is connected to a cooling system (not shown) and cooled to a predetermined temperature.

The drive device 16 drives each one of the pulleys 22 and 26 of each belt conveyance mechanism 11 and 12 separately,
It also includes drive motors 40 and 41 that move each belt 22 and 27 in the same direction shown by arrow A, rotation sensors 42 and 43 that detect the rotational speed of each pulley 22 and 26, and a motor control circuit 45. ing. The control circuit 45 controls each of these pulleys 21 and 21 based on signals input from each rotation sensor 42 and 43.
The rotational speeds of belts 22 and 27 are detected, and the moving speeds of belts 22 and 27 are calculated from these rotational speeds. Then, the deviation of the moving speed of the other belt 27 with respect to the belt 22 is determined based on the moving speed of one of the belts, for example, the belt 22, and the motor 41 drives the other belt 27 so as to set this deviation to 0. The rotational speed of the two belts 22 and 27 is controlled to be the same, and the moving speed of the two belts 22 and 27 is controlled to be the same. That is, belts 22 and 27 are synchronized.

The action will be explained below.

The substrate 2 is placed on the carry-in end of the belt 22 of the belt conveyance mechanism 11. A circuit (circuit pattern) 1 is adhesively fixed onto the substrate 2, and an overlay film 3 is placed on the circuit 1 to cover the entire upper surface of the substrate 2. The substrate 2 is a belt 2
2 is conveyed in the direction of arrow A, and is caught between the belt 22 and the belt 27 of the belt conveyance mechanism 12 along the way. The substrate 2 and the overlay film 3 are placed in the oven 13 after being conveyed by the belt 22 until reaching the hot roll 14.
The mixture is heated to an appropriate temperature between 60° and 110°C. Since the moving distance for heating the substrate 2 and overlay film 3 can be increased, sufficient heat can be applied to them for a long time, and as a result, the distance between the circuit 1, substrate 2, and overlay film 3 Air trapped in the voids can be effectively discharged.

The substrate 2 and the overlay film 3, which have been conveyed while being sandwiched between the two belts 22 and 27, and which have been heated and vented in the oven 13, are sequentially rolled by the rolls 30 and 31, 32 and 33 of the heat roll 14. The pressure is applied via the respective belts 22 and 27. The substrate 2 and the overlay film 3 are sandwiched between the belts 22 and 27 and are indirectly pressurized, so they receive force from the plane, and each roll 30 to
33 misalignment and the influence of changes in pressure balance are eliminated.

Furthermore, since each of the belts 22 and 27 is made of metal, even if a speed difference occurs between the rolls 30 to 33, the speed difference is absorbed by the rolls slipping, and the "iron" by the rolls 30 to 33 is absorbed. I don't receive it. Furthermore, each belt 22, 27 is made of silicone rubber 2.
2b and 27b, and as a result, as shown in FIG. 2, the overlay film 3 is laminated onto the substrate 2 very well, with almost no air pockets being generated. Moreover, the substrate 2 and the overlay film 3 are brought into close contact with each other very well. In addition, since the circuit 1 bonded to the substrate 2 is not subjected to the above-mentioned "straining", it does not shift.
The dimensional stability of the circuit 1 is ensured.

The laminated substrate 2 and overlay film 3 are cooled under pressure by a cooling roll 14 while being sandwiched between belts 22 and 27 in the same manner as described above. Also in this cooling roll 15, the substrate 2
The laminated overlay film 3 is not subjected to the "straining" as described above, and as a result, the circuit 1 is cooled with dimensional changes suppressed, and the dimensional stability of the circuit 1 is ensured. be done. The substrate 2, on which the overlay film 3 is laminated, is cooled through the cooling roll 15 and transferred to the belt conveyance mechanism 1.
It is discharged from the discharge ends 1 and 12. The required printed circuit board is thus formed.

(Effects of the Invention) As explained above, according to the present invention, an overlay lamination apparatus that places an overlay film covering a circuit pattern on a substrate to which a circuit pattern is bonded, and laminates the overlay film using a laminator to form a printed circuit board. a belt conveyance mechanism for sandwiching the substrate on which the overlay film is placed between two metal belts provided with elastic members and conveying them integrally; and each of the metal belts disposed on the belt conveyance mechanism. a heating roll that integrally presses the overlay film and the substrate through the belt conveyance mechanism; Since the configuration is equipped with a cooling roll that presses the overlay film, when laminating the overlay film on the board, the core of each roll is Misalignment,
The influence of changes in pressure balance, etc. is eliminated, and since each of the belts is made of metal, even if a speed difference occurs between the rolls, the speed difference is absorbed by the roll slippage, and as a result, To prevent the generation of wrinkles and air pockets in the overlay film without applying "straining" to the substrate, the overlay film, and the circuit pattern, and to ensure the stability of the dimensions of the circuit pattern. Furthermore, it is possible to significantly improve the adhesion between the substrate and the overlay film 3, making it possible to produce a high-quality and extremely good printed circuit board, and widening the range of permissible conditions during production. This makes it possible to easily manufacture the circuit board.

Furthermore, in an overlay lamination apparatus that forms a printed circuit board by placing an overlay film covering the circuit pattern on the board on which the circuit pattern is adhered, and laminating the layers using a laminator, the board on which the overlay film is placed is covered with an elastic member. a belt conveyance mechanism that integrally conveys these by sandwiching them between two metal belts; and a belt conveyance mechanism that integrally presses the overlay film and the substrate via each of the metal belts disposed in the belt conveyance mechanism. a heat roll, an oven disposed upstream of the heat roll of the belt conveyance mechanism to heat the overlay film and the substrate, and an oven disposed downstream of the heat roll of the belt mechanism and passing through each of the metal belts. By having a configuration including a cooling roll that presses the overlay film and the substrate, it is possible to more effectively remove air accumulated between the substrate, the overlay film, and the circuit pattern. This has the excellent effect of further suppressing the occurrence of air pockets.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing an embodiment of an overlay lamination apparatus according to the present invention, FIG. 2 is a sectional view of a main part showing overlay lamination, and FIG. 3 is a diagram showing overlay lamination using a conventional laminator. 1... Circuit pattern (circuit), 2... Board, 3
...Overlay film, 5...Air pool, 1
1, 12... Belt conveyance mechanism, 13... Oven, 14... Heat roll, 15... Cooling roll, 1
6... Drive mechanism, 22, 27... Belt, 42,
43...Sensor, 45...Control circuit.

Claims (1)

[Scope of Claims] 1. An overlay film covering a circuit pattern is placed on a substrate to which a circuit pattern is adhered, and the overlay film is placed in an overlay lamination device that forms a printed circuit board by laminating the layers with a laminator. a belt conveyance mechanism that integrally conveys the substrate by sandwiching the substrate between two metal belts provided with elastic members; and a belt conveyance mechanism that is disposed in the belt conveyance mechanism and conveys the overlay film and the substrate via the respective metal belts. and a cooling roll disposed downstream of the heating roll of the belt conveyance mechanism and pressing the overlay film and the substrate via each of the metal belts. Overlay lamination equipment. 2. In an overlay lamination apparatus in which an overlay film covering a circuit pattern is placed on a board on which a circuit pattern is adhered, and the layers are laminated by a laminator to form a printed circuit board, the board on which the overlay film is placed is covered with an elastic member. a belt conveyance mechanism that integrally conveys these by sandwiching them between two metal belts; and a belt conveyance mechanism that integrally presses the overlay film and the substrate via each of the metal belts disposed in the belt conveyance mechanism. a heat roll, an oven disposed upstream of the heat roll of the belt conveyance mechanism to heat the overlay film and the substrate, and an oven disposed downstream of the heat roll of the belt mechanism and passing through each of the metal belts. An overlay laminating apparatus comprising: a cooling roll that presses the overlay film and the substrate.