JPH0334221B2 - - Google Patents
Info
- Publication number
- JPH0334221B2 JPH0334221B2 JP60273068A JP27306885A JPH0334221B2 JP H0334221 B2 JPH0334221 B2 JP H0334221B2 JP 60273068 A JP60273068 A JP 60273068A JP 27306885 A JP27306885 A JP 27306885A JP H0334221 B2 JPH0334221 B2 JP H0334221B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- heat exchanger
- solder
- exchanger plate
- heat transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
〔概要〕
本発明の集積回路冷却装置は、集積回路素子側
で発生した熱を冷却ヘツダ側へ伝導する伝熱体と
して熱伝導率の良いハンダを用いている。このた
め本発明を適用すれば、装置の冷却効率を大幅に
向上させることができる。しかもこの接合用ハン
ダは、集積回路素子を実装するための実装用ハン
ダよりも低い融点を持つため、第１の伝熱板と第
２の伝熱板を着脱する際の作業高率を高く保持す
ることができる。DETAILED DESCRIPTION OF THE INVENTION [Summary] The integrated circuit cooling device of the present invention uses solder having good thermal conductivity as a heat transfer body that conducts heat generated on the integrated circuit element side to the cooling header side. Therefore, by applying the present invention, the cooling efficiency of the device can be significantly improved. Moreover, this bonding solder has a lower melting point than the mounting solder for mounting integrated circuit elements, so it maintains a high work rate when attaching and detaching the first heat exchanger plate and the second heat exchanger plate. can do.
本発明は大型電算機等に装備される集積回路冷
却装置の改良に係り、特に集積回路素子と冷却ヘ
ツダ間の伝熱体としてハンダを用いた集積回路冷
却装置に関する。
The present invention relates to an improvement in an integrated circuit cooling device installed in a large-sized computer or the like, and more particularly to an integrated circuit cooling device using solder as a heat transfer body between an integrated circuit element and a cooling header.
第２図は従来の集積回路冷却装置の構成例を示
す要部側断面図である。
FIG. 2 is a side sectional view of a main part showing an example of the configuration of a conventional integrated circuit cooling device.
同図に示すように従来の集積回路冷却装置は、
可撓性弾性構造体、例えばベローズ１０ａ上に配
設された第１の伝熱板９と、集積回路素子１上に
配設されたチツプ２よりも大面積の第２の伝熱板
６と、これら第１、第２の伝熱板９，６を熱的に
連結する可変形性の伝熱体５とによつて構成され
ている。 As shown in the figure, the conventional integrated circuit cooling device
A first heat exchanger plate 9 disposed on a flexible elastic structure, for example, a bellows 10a, and a second heat exchanger plate 6 having a larger area than the chip 2 disposed on the integrated circuit element 1. , and a deformable heat transfer body 5 that thermally connects the first and second heat transfer plates 9 and 6.
そして前記集積回路素子１のチツプ２で発生し
た熱は、第２の伝熱板６→可変形性の伝熱板５→
第１の伝熱板９を介して冷却ヘツダ１０内を矢印
方向に流れる液体冷媒１１に放熱される。図中、
３はチツプ２を収容しているパツケージ、２０は
集積回路素子１が実装されている基板である。 The heat generated in the chip 2 of the integrated circuit element 1 is transferred from the second heat exchanger plate 6 to the deformable heat exchanger plate 5 to
Heat is radiated to the liquid refrigerant 11 flowing in the direction of the arrow in the cooling header 10 via the first heat transfer plate 9 . In the figure,
3 is a package housing the chip 2, and 20 is a substrate on which the integrated circuit element 1 is mounted.
上記第１の放熱板９、可変形性の伝熱体５、第
２の伝熱板６は、可撓性弾性構造体であるベロー
ズ１０ａの矢印Ａ方向への押圧力によつて互いに
密接状態を維持している。 The first heat sink 9, the deformable heat transfer body 5, and the second heat transfer plate 6 are kept in close contact with each other due to the pressing force in the direction of arrow A of the bellows 10a, which is a flexible elastic structure. is maintained.
上記可変形性の伝熱板５は、例えばシリコン系
のゴムをバインダとし、金属或いはアルミナやベ
リリア等の酸化金属をフイラーとする熱伝導性弾
性体である。 The deformable heat transfer plate 5 is a thermally conductive elastic body using, for example, silicone rubber as a binder and metal or an oxidized metal such as alumina or beryllia as a filler.
しかしながら上記集積回路冷却装置において
は、第２の伝熱板６から第１の伝熱板９への熱伝
導が固体を主成分とする前記可変形性の伝熱体５
を介して行われるため、第１の伝熱板９、或いは
第２の伝熱板６の表面に僅かな凹凸や歪等が存在
していても相互間の接触度が損なわれ、冷却効率
が低下するといつた問題点があつた。
However, in the above-mentioned integrated circuit cooling device, heat conduction from the second heat exchanger plate 6 to the first heat exchanger plate 9 is caused by the deformable heat exchanger 5 mainly composed of a solid.
Therefore, even if there are slight irregularities or distortions on the surface of the first heat exchanger plate 9 or the second heat exchanger plate 6, the degree of contact between them will be impaired and the cooling efficiency will be reduced. A problem arose when it decreased.
本発明は上記の問題点を解決するためになされ
たものである。 The present invention has been made to solve the above problems.
本発明の集積回路冷却装置は、第１図に示すよ
うに、集積回路素子１側に配設されたチツプ２よ
りも大面積の第２の伝熱板６と、冷却ヘツダ１０
側に配設された第１の伝熱板９とが実装用ハンダ
７よりも溶融温度の低い接合用ハンダ８によつて
接合される構成になつている。
As shown in FIG. 1, the integrated circuit cooling device of the present invention includes a second heat transfer plate 6 having a larger area than the chip 2 disposed on the integrated circuit element 1 side, and a cooling header 10.
The structure is such that the first heat exchanger plate 9 disposed on the side is bonded by a bonding solder 8 having a lower melting temperature than the mounting solder 7.
このように構成されたものにおいては、第２の
伝熱板６、或いは第１の伝熱板９の表面、つまり
熱伝導面に凹凸や歪があつた場合でも、液体化し
た接合用ハンダ８は双方の面に確実に密接するこ
とが可能なため、両者間の熱伝導率が改善され、
結果的に集積回路冷却装置の効率を向上させるこ
とができる。
With this configuration, even if the surface of the second heat transfer plate 6 or the first heat transfer plate 9, that is, the heat conduction surface, is uneven or distorted, the liquefied bonding solder 8 can be ensured in close contact with both surfaces, improving thermal conductivity between the two,
As a result, the efficiency of the integrated circuit cooling device can be improved.
以下図面に示した実施例に基づいて本発明を詳
細に説明する。
The present invention will be described in detail below based on embodiments shown in the drawings.
第１図は本発明の一実施例を示す要部側断面図
であるが、前記第２図と同一部分には同一符号を
付している。 FIG. 1 is a sectional side view of essential parts showing an embodiment of the present invention, and the same parts as in FIG. 2 are given the same reference numerals.
第１図に示すように、本発明の集積回路冷却装
置は、集積回路素子１側に配設されたチツプ２よ
り大面積の第２の伝熱板６と、冷却ヘツダ１０側
に設けられた第１の伝熱板９とが接合用ハンダ８
を介して接合される、つまり“ハンダ付け”によ
つて接合される構成になつている。しかも、接合
用ハンダ８の融点をT1とすれば、T1は実装用ハ
ンダ７の融点T2に対してT1＜T2の関係を持つ。 As shown in FIG. 1, the integrated circuit cooling device of the present invention includes a second heat transfer plate 6 having a larger area than the chip 2 provided on the integrated circuit element 1 side, and a second heat transfer plate 6 provided on the cooling header 10 side. The first heat exchanger plate 9 and the joining solder 8
The structure is such that the components are joined together by "soldering". Moreover, if the melting point of the joining solder 8 is T 1 , T 1 has a relationship with the melting point T 2 of the mounting solder 7 as T 1 <T 2 .
従つて本発明の集積回路冷却装置によれば、第
１、第２の伝熱板９，６の表面に凹凸や歪等が存
在していても、液化した接合用ハンダ８（冷却ヘ
ツダ１０と集積回路素子１との接合時には接合用
ハンダ８は溶融している）は、これらとは全く無
関係に“ハンダ付け”によつて両者を理想的に接
合することができる。そしてこのことは結果的に
集積回路素子１の冷却効率を大幅に向上させるこ
とになる。 Therefore, according to the integrated circuit cooling device of the present invention, even if there are irregularities or distortions on the surfaces of the first and second heat transfer plates 9, 6, the liquefied bonding solder 8 (cooling header 10 and The bonding solder 8 is melted when bonded to the integrated circuit element 1), so that the two can be ideally bonded by "soldering" regardless of these factors. This results in a significant improvement in the cooling efficiency of the integrated circuit element 1.
なお接合用ハンダ８の融点T1と実装用ハンダ
の融点T2とは、T2−T1＝40〜200（℃）にするこ
とが好ましく、従つて接合用ハンダ８としては錫
＋鉛を主成分とする通常のハンダに、例えばビス
マス等を添加することによつて溶融温度を約85〜
100（℃）程度にまで低下させたハンダを用い、実
装用ハンダ７には溶融温度約185（℃）の共晶ハン
ダを用いるようにすれば、集積回路素子１と冷却
ヘツダ１０との接合作業中に実装用ハンダ７が溶
融するのを防止することができる。 It is preferable that the melting point T 1 of the bonding solder 8 and the melting point T 2 of the mounting solder be T 2 −T 1 =40 to 200 (°C). Therefore, as the bonding solder 8, tin + lead is used. By adding, for example, bismuth to the normal solder that is the main component, the melting temperature can be increased to about 85~
By using solder with a melting temperature of about 100 (°C) and using eutectic solder with a melting temperature of about 185 (°C) as the mounting solder 7, the process of joining the integrated circuit element 1 and the cooling header 10 can be made easier. It is possible to prevent the mounting solder 7 from melting inside.
本発明は以上説明したように、集積回路素子と
冷却ヘツダ間を熱的に接合する手段として“ハン
ダ付け法”を採用している。このため熱伝導面の
精粗とは無関係に集積回路素子と冷却ヘツダとを
熱的に密接させることが可能となり、装置の冷却
効率を著しく向上させ得るといつた効果大なるも
のである。また第１の伝熱板と第２の伝熱板を着
脱する際の作業効率を高く保持することができ
る。
As explained above, the present invention employs the "soldering method" as a means for thermally bonding the integrated circuit element and the cooling header. Therefore, it is possible to bring the integrated circuit element and the cooling header into close thermal contact regardless of the roughness or roughness of the heat conductive surface, and this is a great effect in that the cooling efficiency of the device can be significantly improved. Further, it is possible to maintain high work efficiency when attaching and detaching the first heat exchanger plate and the second heat exchanger plate.
第１図は本発明の集積回路冷却装置の一実施例
を示す要部側断面図、第２図は従来の集積回路冷
却装置の構成を示す要部側断面図である。
図中、１は集積回路素子、２はチツプ、３はパ
ツケージ、５は可変形性の伝熱体、６は第２の伝
熱板、７は実装用ハンダ、８は接合用ハンダ、９
は第１の伝熱板、１０は冷却ヘツダ、１０ａはベ
ローズ、１１は液体冷媒、２０は基板をそれぞれ
示す。
FIG. 1 is a sectional side view of a main part showing an embodiment of an integrated circuit cooling device of the present invention, and FIG. 2 is a sectional side view of a main part showing the configuration of a conventional integrated circuit cooling device. In the figure, 1 is an integrated circuit element, 2 is a chip, 3 is a package, 5 is a deformable heat transfer body, 6 is a second heat transfer plate, 7 is a mounting solder, 8 is a joining solder, 9
10 is a cooling header, 10a is a bellows, 11 is a liquid refrigerant, and 20 is a substrate.
Claims (1)
集積回路素子１上に配設された第２の伝熱板６と
該第１の伝熱板９とを熱的に連結して、該第１の
伝熱板９を液体冷媒１１で冷却する集積回路冷却
装置の構成において、 前記第１の伝熱板９と第２の伝熱板６とを接合
用ハンダ８で接合するようにし、該接合用ハンダ
８の融点をT1、集積回路素子１を実装するとき
の実装用ハンダ７の融点をT2としたときにT1＜
T2となることを特徴とする集積回路冷却装置。[Claims] 1. A first heat transfer plate 9 is provided on a flexible elastic structure,
The second heat exchanger plate 6 disposed on the integrated circuit element 1 and the first heat exchanger plate 9 are thermally connected, and the first heat exchanger plate 9 is cooled with a liquid coolant 11. In the configuration of the integrated circuit cooling device, the first heat exchanger plate 9 and the second heat exchanger plate 6 are bonded with a bonding solder 8, and the melting point of the bonding solder 8 is T1 , and the integrated circuit element When the melting point of the mounting solder 7 when mounting 1 is T 2 , T 1 <
An integrated circuit cooling device characterized by being T 2 .
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60273068A JPS62131546A (en) | 1985-12-03 | 1985-12-03 | Integrated-circuit cooling device |
| EP86307669A EP0217676B1 (en) | 1985-10-04 | 1986-10-03 | Cooling system for electronic circuit device |
| US06/914,942 US4879632A (en) | 1985-10-04 | 1986-10-03 | Cooling system for an electronic circuit device |
| DE86307669T DE3688962T2 (en) | 1985-10-04 | 1986-10-03 | Cooling system for an electronic circuit arrangement. |
| US07/079,876 US4920574A (en) | 1985-10-04 | 1987-07-30 | Cooling system for an electronic circuit device |
| US07/079,877 US4783721A (en) | 1985-10-04 | 1987-07-30 | Cooling system for an electronic circuit device |
| US07/261,904 US5126919A (en) | 1985-10-04 | 1988-10-25 | Cooling system for an electronic circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60273068A JPS62131546A (en) | 1985-12-03 | 1985-12-03 | Integrated-circuit cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62131546A JPS62131546A (en) | 1987-06-13 |
| JPH0334221B2 true JPH0334221B2 (en) | 1991-05-21 |
Family
ID=17522697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60273068A Granted JPS62131546A (en) | 1985-10-04 | 1985-12-03 | Integrated-circuit cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62131546A (en) |
-
1985
- 1985-12-03 JP JP60273068A patent/JPS62131546A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62131546A (en) | 1987-06-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |