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JPH0334576B2 - - Google Patents
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JPH0334576B2 - - Google Patents

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Publication number
JPH0334576B2
JPH0334576B2 JP58026155A JP2615583A JPH0334576B2 JP H0334576 B2 JPH0334576 B2 JP H0334576B2 JP 58026155 A JP58026155 A JP 58026155A JP 2615583 A JP2615583 A JP 2615583A JP H0334576 B2 JPH0334576 B2 JP H0334576B2
Authority
JP
Japan
Prior art keywords
substrate
foreign object
light
detection
detection device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58026155A
Other languages
Japanese (ja)
Other versions
JPS59152625A (en
Inventor
Yukio Uto
Mitsuyoshi Koizumi
Masataka Shiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58026155A priority Critical patent/JPS59152625A/en
Publication of JPS59152625A publication Critical patent/JPS59152625A/en
Publication of JPH0334576B2 publication Critical patent/JPH0334576B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は、フオトマスクやレチクル等の透明基
板面上の異物検出において、特に、基板裏面や検
出面付近の障害物の影響をうけないようにした異
物検出装置に関するものである。
[Detailed Description of the Invention] [Field of Application of the Invention] The present invention is directed to detecting foreign objects on the surface of a transparent substrate such as a photomask or reticle, in particular, to avoid being affected by obstacles on the back surface of the substrate or near the detection surface. The present invention relates to a foreign object detection device.

〔従来技術〕[Prior art]

半導体製造用のフオトマスクやレチクル等の透
面基板上の微小異物の検出では、レーザを基板に
対して斜めから照射し、異物からの散乱光を光電
子増倍管等の受光素子で検出する方法が試みられ
ている。
To detect microscopic foreign objects on transparent substrates such as photomasks and reticles for semiconductor manufacturing, a method is to irradiate the substrate obliquely with a laser and detect the scattered light from the foreign object with a photomultiplier tube or other light-receiving element. is being attempted.

第1図は、その例を示したものである。レーザ
発振器1を出たレーザ光4は、ガルバノミラー2
により偏向され、fθレンズ3を介し、光路4を通
し、透明基板5を、スポツト10が、走査線8に
沿つて移動するように走査される。異物等が存在
しないとレーザ光は反射し、直進する。一方、異
物等が存在すると、その散乱光は全方向に広がる
ので集光レンズ12と受光素子14から成る検出
光学系を走査線8をその延長方向から臨むような
形で設け、異物からの散乱光9を検出するもので
ある。透明基板5は、X方向に等速で移動するこ
とにより、レーザ光4のY方向の走査と併せて、
全面検出ができるようになつている。
FIG. 1 shows an example of this. Laser light 4 emitted from laser oscillator 1 passes through galvano mirror 2
The light beam is deflected by the light beam, and the transparent substrate 5 is scanned through the fθ lens 3 and through the optical path 4 so that the spot 10 moves along the scanning line 8. If there are no foreign objects, the laser beam will be reflected and travel straight. On the other hand, if a foreign object is present, the scattered light will spread in all directions, so a detection optical system consisting of a condenser lens 12 and a light receiving element 14 is installed in such a way that the scanning line 8 is faced from the direction in which it extends. It detects light 9. By moving the transparent substrate 5 at a constant speed in the X direction, in conjunction with the scanning of the laser beam 4 in the Y direction,
Full-scale detection is now possible.

また、最近は、透明基板5への異物付着を防止
するため、ニトロセルローズ製の薄膜7を金属枠
6に貼りつけた構造を持つペリクル膜が使用され
るようになり、この金属枠6でのレーザ光のけら
れを避けるために、照射角ω、検出角θを3〜40
度程度とるようになつてきた。
In addition, recently, in order to prevent foreign matter from adhering to the transparent substrate 5, a pellicle film having a structure in which a thin film 7 made of nitrocellulose is attached to a metal frame 6 has been used. To avoid vignetting of the laser beam, set the illumination angle ω and detection angle θ to 3 to 40.
I've started to take it more seriously.

第2図a〜dは、この装置において、検出され
得る異常散乱光の発生箇所を第1図のA方向から
見たものである。
FIGS. 2 a to 2 d show locations where abnormal scattered light is generated that can be detected in this apparatus, as viewed from direction A in FIG. 1.

まず、レーザ光4を角度ωで検出面上のD点に
照射すると基板5が透明のため、屈折光が基板裏
面Eに到達する。この位置にパターン15(第2
図a)や異物16(第2図b)が存在すると、そ
こからの散乱光が、検出され得る。
First, when the laser beam 4 is irradiated at a point D on the detection surface at an angle ω, the refracted light reaches the back surface E of the substrate because the substrate 5 is transparent. Pattern 15 (second
If a foreign object 16 (FIG. 2b) is present, the scattered light therefrom can be detected.

また、ペリクル膜のある場合には、基板5の上
方にあるペリクルの薄膜7をレーザ光4が横切る
点Fに大きな異物16が存在する場合(第2図
c)や、基板5の表面で反射した光が、ペリクル
膜の金属枠6のエツヂに点Gでぶつかつた場合
(第2図d)に発生する散乱光が検出され得る。
In addition, when there is a pellicle film, if there is a large foreign object 16 at the point F where the laser beam 4 crosses the pellicle thin film 7 above the substrate 5 (FIG. 2c), or if the laser beam 4 is reflected on the surface of the substrate 5. When the scattered light hits the edge of the metal frame 6 of the pellicle membrane at point G (FIG. 2d), the scattered light generated can be detected.

従つて、上記の如き試みられた方法では、裏面
やペリクル膜等の障害物が誤検出の要因となる問
題点があつた。
Therefore, the methods tried above have the problem that obstacles such as the back surface or the pellicle film cause false detection.

〔発明の目的〕[Purpose of the invention]

本発明の目的は上記従来技術の問題点に鑑み、
基板上の回路パターン、ペリクル枠及びペリクル
膜上の異物等によつて生じる散乱光の影響を除去
し、しかも基板表面に位置変動が生じても常に基
板上の異物を正確に検出できるようにした異物検
出装置を提供するにある。
The purpose of the present invention is to solve the problems of the prior art described above.
Eliminates the effects of scattered light caused by foreign objects on the circuit pattern, pellicle frame, and pellicle film on the board, and can always accurately detect foreign objects on the board even if the position of the board surface changes. The present invention provides a foreign object detection device.

〔発明の概要〕[Summary of the invention]

即ち本発明は、上記目的を達成するために、レ
ーザ光源と該レーザ光源からのレーザ光を偏光レ
ーザ光に変換する偏光素子と該偏光素子によつて
偏光された偏光レーザ光を、枠にペリクルを形成
した異物付着防止手段を装着した基板面上に上記
ペリクルを通して照射すべく上記基板面に対して
傾斜させた第1の光軸を有する照明光学系と上記
偏光レーザ光を上記第1の光軸に対して交叉角が
ほぼ90度なる方向に走査する走査光学系とを有す
る照明装置と、上記基板上の異物からの反射光を
上記ペリクルを通して検出すべく上記第1の光軸
と基板面上において交叉角としてほぼ90度で上記
基板面に対して傾斜させた第2の光軸を有する検
出光学系と該検出学系により検出される反射光の
内、上記枠、ペリクル上の異物及び基板上の回路
パターンからの反射光を遮光する遮光素子と該遮
光素子を通過して得られる上記基板上の異物から
の反射光を受光して信号に変換する光電変換装置
とを有する検出装置と、上記基板の表面の上下位
置を検出する基板上下位置検出手段と、該基板上
下位置検出手段によつて検出された基板の表面の
位置が、上記遮光素子を通過して得られる基板上
の異物からの反射光を許容される感度で受光すべ
く許容焦点深度に入るように制御する制御手段と
を備えたことを特徴とする異物検出装置である。
また、本発明は、上記異物検出装置の基板上下位
置検出手段において、上記照明装置と検出装置と
が設置された異物検出位置とは異なる位置に設け
られ、上記制御手段により基板の表面の上下位置
を補正した状態で上記異物検出位置へ移行させる
移動手段を備え、基板上下位置検出手段を容易に
設置できるようにしたことにある。
That is, in order to achieve the above object, the present invention includes a laser light source, a polarizing element that converts the laser light from the laser light source into polarized laser light, and a pellicle for the polarized laser light polarized by the polarizing element. an illumination optical system having a first optical axis tilted with respect to the substrate surface to irradiate the substrate surface with a foreign matter adhesion prevention means formed thereon through the pellicle; an illumination device having a scanning optical system that scans in a direction having an intersecting angle of approximately 90 degrees with respect to the axis; and the first optical axis and the substrate surface for detecting reflected light from a foreign substance on the substrate through the pellicle. A detection optical system having a second optical axis tilted with respect to the substrate surface at an intersection angle of approximately 90 degrees at the top, and of the reflected light detected by the detection optical system, there is no foreign matter on the frame, the pellicle, and the like. A detection device comprising a light shielding element that blocks reflected light from a circuit pattern on a substrate, and a photoelectric conversion device that receives reflected light from a foreign object on the substrate obtained by passing through the light shielding element and converts it into a signal. , a substrate vertical position detection means for detecting the vertical position of the surface of the substrate; and a foreign object on the substrate whose position on the substrate surface detected by the substrate vertical position detection means is obtained by passing through the light shielding element. A foreign object detection device is characterized in that it is equipped with a control means for controlling the depth of focus to fall within an allowable depth of focus in order to receive reflected light from the object with an allowable sensitivity.
Further, the present invention provides that the substrate vertical position detection means of the foreign object detection device is provided at a position different from the foreign object detection position where the illumination device and the detection device are installed, and the control means controls the vertical position of the surface of the substrate. The present invention is provided with a moving means for moving to the foreign object detection position in a corrected state, so that the substrate vertical position detecting means can be easily installed.

〔発明の実施例〕[Embodiments of the invention]

以下本発明を図に示す実施例にもとづいて具体
的に説明する。第3図は本発明に係る異物の基板
付着防止を目的とした透明なペリクル膜体をフオ
トマスク、レチクル等の基板に装着した場合の基
板上の異物を検出する一実施例を示す図である。
即ちレーザ発振器1から出射したレーザ光を偏光
素子15によつてある特定方向の直線偏光波(水
平波)(例えばS偏光)にして、回転または揺動
するモータ2に連結されたガルバノミラー2で全
反射させ、レンズ3を通して基板5に対して斜方
向より照射し、これと交叉角90度なる方向に直線
状に走査して基板面上の異物10から反射したレ
ーザ光を上記走査方向でもつて基板に対し斜方向
に設けた検出装置19で検出するものである。こ
のような構成により高速異物検査が行える。検出
装置19は、検光子17、集光レンズ12、スリ
ツト状遮光装置18、光電変換素子14より成つ
ており、特にスリツト状遮光装置18は第3図B
に示すように基板5面上に存在する異物10の反
射光のみを検出するため設けたものであり、ペリ
クル膜体の枠6上面からの反射光、ペリクル膜1
6上の異物等を基板5面上の異物として誤検出し
ないよう検出区域を限定するためのものである。
The present invention will be specifically described below based on embodiments shown in the drawings. FIG. 3 is a diagram showing an embodiment of detecting foreign matter on a substrate such as a photomask or reticle when a transparent pellicle film body for preventing foreign matter from adhering to the substrate according to the present invention is attached to the substrate.
That is, the laser beam emitted from the laser oscillator 1 is converted into a linearly polarized wave (horizontal wave) (for example, S-polarized light) in a specific direction by a polarizing element 15, and is converted into a linearly polarized wave (horizontal wave) (for example, S-polarized light) in a specific direction by a galvanometer mirror 2 connected to a motor 2 that rotates or oscillates. After total reflection, the laser beam is irradiated obliquely onto the substrate 5 through the lens 3, and scanned in a straight line in a direction that intersects with this at a 90 degree angle, so that the laser beam reflected from the foreign object 10 on the substrate surface is also applied in the above scanning direction. Detection is performed by a detection device 19 provided obliquely to the substrate. With such a configuration, high-speed foreign matter inspection can be performed. The detection device 19 consists of an analyzer 17, a condensing lens 12, a slit-shaped light shielding device 18, and a photoelectric conversion element 14. In particular, the slit-shaped light shielding device 18 is shown in FIG. 3B.
As shown in FIG. 2, it is provided to detect only the reflected light from the foreign matter 10 present on the substrate 5 surface, and the reflected light from the upper surface of the frame 6 of the pellicle film body, the pellicle film 1
This is to limit the detection area so that foreign objects on the surface of the substrate 5 are not mistakenly detected as foreign objects on the surface of the substrate 5.

本方式では、上記異物検査装置に搭載する基板
の板厚のバラツキが異物の検出性能に影響する。
第4図は第3図AのA11矢視のスリツト状遮光装
置18の拡大図である。同図5aは、基板5面上
にレーザ光4の焦点が合致した状態(基板中心面
上にある異物に対してスリツト状遮光装置が中心
位置になるようにしてある)である。同図5b,
5cは基板5の板厚が基準値(この場合5aとす
る)を越えた場合と越えない場合におけるスリツ
ト状遮光装置18内の異物の存在位置を示すもの
であるが基板面の位置が変化するため異物10に
レーザ光が照射されず異物の検出が行えないもの
である。
In this method, variations in the thickness of the board mounted on the foreign object inspection device affect the foreign object detection performance.
FIG. 4 is an enlarged view of the slit-shaped light shielding device 18 as viewed from arrow A11 in FIG. 3A. FIG. 5a shows a state in which the laser beam 4 is focused on the surface of the substrate 5 (the slit-shaped light shielding device is positioned at the center with respect to foreign matter on the center surface of the substrate). Figure 5b,
5c shows the position of foreign matter in the slit-shaped light shielding device 18 when the thickness of the substrate 5 exceeds the reference value (5a in this case) and when it does not, but the position of the substrate surface changes. Therefore, the foreign object 10 is not irradiated with the laser light, making it impossible to detect the foreign object.

第4図に示したものは基板5の板厚が大きく変
化した場合(基板製造のロツトごとのバラツキに
起因する)について説明するものであつた。基板
5に照射するレーザ光4は円形断面をしている。
第5図Aは基板5面上に存在する異物にレーザ光
を照射し、基板5の焦点を変化させている様子を
示す図、Bはその焦点の変化における異物10か
らの反射光の強度変化を示す図である。基板5が
位置変動により上、下に変化すると異物に照射し
ているレーザ光強度も段々弱くなる。ここで異物
5からの反射光強度の80%を許容される均一感度
とするならば、△Zが基板21の許容焦点深度と
することができる。そこで第6図の如く複数個の
検出器20により基板5表面の位置を計測し、計
測値Dより計測平均置Zaを求め基板の一定基準
位置(第4図、第5図において、基板5が5aの
状態にある位置)Zoとの偏差+Zが許容焦点深
度△Z内に入る様に基板5を厚さ方向に変化させ
れば板厚のバラツキ等の補正が可能である。
What is shown in FIG. 4 is intended to explain the case where the thickness of the substrate 5 changes significantly (due to variations from lot to lot in manufacturing the substrate). The laser beam 4 irradiated onto the substrate 5 has a circular cross section.
FIG. 5A is a diagram showing how a laser beam is irradiated to a foreign object existing on the surface of the substrate 5 and the focus of the substrate 5 is changed, and FIG. 5B is a diagram showing the intensity change of the reflected light from the foreign object 10 as the focus changes. FIG. As the substrate 5 moves upward or downward due to positional changes, the intensity of the laser beam irradiating the foreign object also gradually becomes weaker. Here, if 80% of the intensity of the reflected light from the foreign object 5 is assumed to be an allowable uniform sensitivity, then ΔZ can be the allowable depth of focus of the substrate 21. Therefore, as shown in FIG. 6, the position of the surface of the substrate 5 is measured using a plurality of detectors 20, and the measured average position Za is calculated from the measured value D. If the substrate 5 is changed in the thickness direction so that the deviation +Z from Zo (position in the state of 5a) falls within the allowable depth of focus ΔZ, it is possible to correct variations in board thickness, etc.

そこで第7図に示すように、基板5面上(又は
下面でもよい)に複数個の検出器20を設け基板
の位置を計測することにより板厚のバラツキ等の
基板の位置を補正することができる。
Therefore, as shown in FIG. 7, by providing a plurality of detectors 20 on the surface (or the bottom surface) of the substrate 5 to measure the position of the substrate, it is possible to correct the position of the substrate due to variations in board thickness, etc. can.

即ち、本発明は第7図及び第8図に示す如く載
物台21に搭載した基板5の表面位置を基板5面
上に複数個設けた検出器20a〜20dによつて
計測し、基板5の表面が一定基準位置になるよう
にモータ、エアーサーボ等の駆動手段で構成さ
れ、かつ移動機構23に設けられた補正機構22
を駆動し、検査に先立ちあらかじめ板厚等の基板
の位置を補正してから異物検査を行うところにあ
る。即ち斜めから照射されたレーザスポツト4の
反射光をとらえて、基板5を所定位置に設置する
ことは難しいため、上記のような構成をとつた。
第9図は本発明の実施例のブロツク図を示す図で
ある。検出器20a〜20bの信号は加算器24
で加算され平均化回路25で基板5表面の平均位
置を示す信号となり、サーボ回路26はこの信号
によつてモータ駆動回路27に指令を出し、モー
タ28の回転によつて補正機構22を作動して基
板5の板厚等を補正するしくみになつている。
That is, in the present invention, as shown in FIGS. 7 and 8, the surface position of the substrate 5 mounted on the stage 21 is measured by a plurality of detectors 20a to 20d provided on the surface of the substrate 5. The correction mechanism 22 is constituted by a driving means such as a motor, an air servo, etc., and is provided in the moving mechanism 23 so that the surface of the surface is at a constant reference position.
The foreign matter inspection is performed after correcting the position of the board, such as the board thickness, in advance before the inspection. That is, since it is difficult to catch the reflected light of the obliquely irradiated laser spot 4 and install the substrate 5 in a predetermined position, the above-mentioned configuration was adopted.
FIG. 9 is a diagram showing a block diagram of an embodiment of the present invention. The signals from the detectors 20a to 20b are sent to the adder 24.
The servo circuit 26 issues a command to the motor drive circuit 27 based on this signal, and operates the correction mechanism 22 by the rotation of the motor 28. The structure is such that the thickness of the substrate 5, etc. is corrected.

第10図は本発明の板厚補正機構を備え付けた
異物検出装置の一実施例の全体構成を示す図であ
る。載物台21に搭載した基板5は検出器20
a,20d、補正機構22によつて一定基準位置
に表面が合致した状態で、移動機構23により異
物検出部30の下方に送られ異物の検出が行なわ
れるよう構成されている。
FIG. 10 is a diagram showing the overall configuration of an embodiment of a foreign object detection device equipped with a plate thickness correction mechanism of the present invention. The substrate 5 mounted on the stage 21 is the detector 20
a, 20d, the correction mechanism 22 causes the surface to match a certain reference position, and the moving mechanism 23 sends the foreign object below the foreign object detection unit 30 to detect the foreign object.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明によれば、斜方偏
光レーザ光走査照明及び斜方遮光検出の良さを生
かした場合、厚さのバカツキ等によつて基板の表
面位置が僅か変動しても異物の検出感度に微妙に
影響することから、これら両者を満足させて、基
板表面上のペリクル膜体の枠や基板上に形成され
た回路パターンなどの影響を受けずに、異物から
の散乱光を有効に検出して正確に1〜2μm程度の
大きさの微小異物を検出することが出来る効果を
奏する。
As explained above, according to the present invention, when the advantages of obliquely polarized laser beam scanning illumination and obliquely shielded light detection are utilized, even if the surface position of the substrate changes slightly due to uneven thickness, etc., foreign particles can be detected. This has a subtle effect on the detection sensitivity of the foreign matter, so by satisfying both of these requirements, it is possible to eliminate scattered light from foreign objects without being affected by the frame of the pellicle film on the substrate surface or the circuit pattern formed on the substrate. This has the effect of being able to effectively and accurately detect minute foreign matter with a size of about 1 to 2 μm.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の異物検出装置の一例を示す図、
第2図は第1図のA矢視方向からみたレーザスポ
ツトの照射状態を示す図、第3図は本発明に係わ
る異物検出部の一実施例を示す図、第4図は基板
の板厚バラツキ等を示す図、第5図は基板の表面
位置の変動による異物からの反射光強度変化を示
す図、第6図は検出器による基板表面位置の計測
を示す図、第7図は基板面上に検出器を設けたこ
とを示す図、第8図は本発明に係わる基板位置検
出部の一実施例を示す図、第9図はブロツク図を
示す図、第10図は本発明の異物検出装置の一実
施例を示す全体概略構成を示す図である。 5……基板、20……検出器、21……載物
台、22……補正機構、23……移動機構、24
……加算器、25……平均化回路、26……サー
ボ回路、27……モータ駆動回路、28……モー
タ。
FIG. 1 is a diagram showing an example of a conventional foreign object detection device.
FIG. 2 is a diagram showing the irradiation state of the laser spot viewed from the direction of arrow A in FIG. Figure 5 is a diagram showing variations in the intensity of reflected light from foreign objects due to variations in the surface position of the substrate, Figure 6 is a diagram showing measurement of the substrate surface position by a detector, and Figure 7 is a diagram showing the measurement of the substrate surface position. FIG. 8 is a diagram showing an embodiment of the substrate position detection section according to the present invention, FIG. 9 is a diagram showing a block diagram, and FIG. 10 is a diagram showing a foreign object according to the present invention. FIG. 1 is a diagram illustrating an overall schematic configuration of an embodiment of a detection device. 5... Substrate, 20... Detector, 21... Stage, 22... Correction mechanism, 23... Movement mechanism, 24
... Adder, 25 ... Averaging circuit, 26 ... Servo circuit, 27 ... Motor drive circuit, 28 ... Motor.

Claims (1)

【特許請求の範囲】 1 レーザ光源と該レーザ光源からのレーザ光を
偏光レーザ光に変換する偏光素子と該偏光素子に
よつて偏光された偏光レーザ光を、枠にペリクル
を形成した異物付着防止手段を装着した基板面上
に上記ペリクルを通して照射すべく上記基板面に
対して傾斜させた第1の光軸を有する照明光学系
と上記偏光レーザ光を上記第1の光軸に対して交
叉角がほぼ90度なる方向に走査する走査光学系と
を有する照明装置と、上記基板上の異物からの反
射光を上記ペリクルを通して検出すべく上記第1
の光軸と基板面上において交叉角としてほぼ90度
で上記基板面に対して傾斜させた第2の光軸を有
する検出光学系と該検出光学系により検出される
反射光の内、上記枠、ペリクル上の異物及び基板
上の回路パターンからの反射光を遮光する遮光素
子と該遮光素子を通過して得られる上記基板上の
異物からの反射光を受光して信号に変換する光電
変換装置とを有する検出装置と、上記基板の表面
の上下位置を検出する基板上下位置検出手段と、
該基板上下位置検出手段によつて検出された基板
の表面の位置が、上記遮光素子を通過して得られ
る基板上の異物からの反射光を許容される感度で
受光すべく許容焦点深度に入るように制御する制
御手段とを備えたことを特徴とする異物検出装
置。 2 上記基板上下位置検出手段は、上記照明装置
と検出装置とが設置された異物検出位置とは異な
る位置に設けられ、上記制御手段により基板の表
面の上下位置を補正した状態で上記異物検出位置
へ移行させる移動手段を備えたことを特徴とする
特許請求の範囲第1項記載の異物検出装置。 3 上記遮光素子は、検光子とスリツトとで構成
したことを特徴とする特許請求の範囲第1項記載
の異物検出装置。
[Scope of Claims] 1. A laser light source, a polarizing element that converts the laser light from the laser light source into polarized laser light, and a method for preventing foreign matter from adhering to the polarized laser light polarized by the polarizing element by forming a pellicle on the frame. An illumination optical system having a first optical axis inclined with respect to the substrate surface so as to irradiate the substrate surface on which the means is mounted through the pellicle, and the polarized laser beam at an intersecting angle with respect to the first optical axis. an illumination device having a scanning optical system that scans in a direction in which the angle is approximately 90 degrees;
A detection optical system having a second optical axis inclined with respect to the substrate surface at an intersection angle of approximately 90 degrees with the optical axis of the substrate surface, and of the reflected light detected by the detection optical system, the frame , a light shielding element that blocks light reflected from a foreign object on the pellicle and a circuit pattern on a substrate, and a photoelectric conversion device that receives reflected light from the foreign object on the substrate that passes through the light shielding element and converts it into a signal. a detection device having: a substrate vertical position detection means for detecting the vertical position of the surface of the substrate;
The position of the surface of the substrate detected by the substrate vertical position detection means falls within a permissible depth of focus in order to receive the reflected light from the foreign matter on the substrate obtained by passing through the light shielding element with permissible sensitivity. What is claimed is: 1. A foreign object detection device comprising: control means for controlling. 2. The substrate vertical position detection means is provided at a position different from the foreign object detection position where the illumination device and the detection device are installed, and the substrate surface vertical position is corrected by the control means when the foreign object detection position is corrected. 2. The foreign object detection device according to claim 1, further comprising a moving means for moving the foreign object to the foreign object detection device. 3. The foreign object detection device according to claim 1, wherein the light shielding element is composed of an analyzer and a slit.
JP58026155A 1983-02-21 1983-02-21 Device for detecting foreign matter Granted JPS59152625A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58026155A JPS59152625A (en) 1983-02-21 1983-02-21 Device for detecting foreign matter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58026155A JPS59152625A (en) 1983-02-21 1983-02-21 Device for detecting foreign matter

Publications (2)

Publication Number Publication Date
JPS59152625A JPS59152625A (en) 1984-08-31
JPH0334576B2 true JPH0334576B2 (en) 1991-05-23

Family

ID=12185642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58026155A Granted JPS59152625A (en) 1983-02-21 1983-02-21 Device for detecting foreign matter

Country Status (1)

Country Link
JP (1) JPS59152625A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3087384B2 (en) * 1991-10-08 2000-09-11 松下電器産業株式会社 Foreign matter inspection device
JP6119785B2 (en) * 2015-03-17 2017-04-26 大日本印刷株式会社 Foreign matter inspection device, foreign matter inspection method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5671173A (en) * 1979-11-14 1981-06-13 Hitachi Ltd Pattern detection method of printed circuit substrate
JPS5780546A (en) * 1980-11-07 1982-05-20 Nippon Kogaku Kk <Nikon> Detecting device for foreign substance

Also Published As

Publication number Publication date
JPS59152625A (en) 1984-08-31

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