JPH0334658B2 - - Google Patents
Info
- Publication number
- JPH0334658B2 JPH0334658B2 JP58102906A JP10290683A JPH0334658B2 JP H0334658 B2 JPH0334658 B2 JP H0334658B2 JP 58102906 A JP58102906 A JP 58102906A JP 10290683 A JP10290683 A JP 10290683A JP H0334658 B2 JPH0334658 B2 JP H0334658B2
- Authority
- JP
- Japan
- Prior art keywords
- card
- conductive layer
- module
- terminal
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
- H10W42/276—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Credit Cards Or The Like (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、職別カードなどのICカードに用い
るICモジユールに関し、特にICカードの帯電に
よる静電破壊を防止できるICカード用ICモジユ
ールに関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an IC module used for an IC card such as a job-specific card, and particularly relates to an IC module for an IC card that can prevent electrostatic damage due to charging of the IC card. It is.
従来から職別カードにおいては、磁気などの外
界からの攬乱を受けず、他人が内容を読み取るこ
とが極めて困難であり、信頼性が高く、さらに記
憶容量も磁気ストライプに比べ数10〜100倍と多
いので、最近磁気カードに代わつてICカードが
用いられるようになつた。このICカードを製作
するに当たつては第４図に示す如く基板１にIC
チツプ２を装着したICモジユール３をカード素
材４に予め設けられた凹所５に嵌装して組み立て
られる。このICモジユール３の製造過程では先
ず、プラスチツク製の基板１の所定位置に外部端
子６と、この外部端子６の裏側位置にリード７を
設け、両者の間をスルーホール８により電気的に
接続する。
Traditionally, occupational cards have been unaffected by disturbances from the outside world such as magnetism, making it extremely difficult for others to read their contents, making them highly reliable, and also having a storage capacity several tens to 100 times larger than that of magnetic stripes. Because of this, IC cards have recently come to be used instead of magnetic cards. When manufacturing this IC card, an IC is placed on the board 1 as shown in Figure 4.
The IC module 3 with the chip 2 attached thereto is assembled by fitting it into a recess 5 previously provided in the card material 4. In the manufacturing process of this IC module 3, first, an external terminal 6 is provided at a predetermined position on a plastic substrate 1, a lead 7 is provided on the back side of this external terminal 6, and the two are electrically connected through a through hole 8. .
次に基板１の裏面のほぼ中央にICチツプ２を
固定し、該ICチツプ２のパツド９とリード７の
間をワイヤ１０により接続してボンデイングを行
なう。その後、絶縁性封止樹脂により保護層１１
を形成してICモジユール３が完成する。 Next, an IC chip 2 is fixed approximately at the center of the back surface of the substrate 1, and bonding is performed by connecting the pads 9 of the IC chip 2 and the leads 7 with wires 10. After that, the protective layer 11 is coated with an insulating sealing resin.
is formed to complete IC module 3.
一方、ICカードのカード素材４に予め設けら
れた凹所５に接着性のある充填材を入れたところ
に、完成したICモジユール３を嵌装する。充填
材は充填層１２として空所を充填し、かつカード
素材４に密着してICカードとするか、或いは、
カード素材に嵌合部を設け、ICモジユールを嵌
合後表裏よりシート等でサンドイツチしカード化
するものである。 On the other hand, the completed IC module 3 is fitted into the recess 5 previously provided in the card material 4 of the IC card with an adhesive filler. The filling material fills the void as the filling layer 12 and adheres to the card material 4 to form an IC card, or
A mating part is provided in the card material, and after the IC module is mated, it is sandwiched between the front and back sides using a sheet, etc. to form a card.
このようなICモジユールを装着したICカード
は常に身につけられるものであり、IC、LSIは非
常に小型であるため、カードに埋没させたICモ
ジユールはカードの帯電や外部の静電気の影響に
より回路が破壊される可能性がある。
An IC card equipped with such an IC module is always carried on the body, and since ICs and LSIs are very small, the circuitry of the IC module buried in the card may be affected by the charge on the card or external static electricity. It may be destroyed.
しかし、今後磁気カードと同じようにクレジツ
トカードやバンキングカードとして大量普及する
ことが想定され、その場合には所持者の衣服等と
の摩擦による静電気の発生によるクレームが充分
に考えられる。また、人体等に発生する静電気は
非常に高く、ICカードに内蔵されているIC、LSI
に対し、その回路の静電破壊等の悪影響を与え
る。 However, it is expected that in the future they will become widely used as credit cards and banking cards in the same way as magnetic cards, and in that case, complaints due to the generation of static electricity due to friction with the wearer's clothing, etc. are highly likely. In addition, the static electricity generated in the human body is extremely high, and the ICs and LSIs built into IC cards
However, it has negative effects such as electrostatic damage to the circuit.
すなわち、ICカード部分的に発生した静電気
が、ICとの間の絶縁体の耐圧を超えて絶縁破壊
し、ICを破壊することになるので、このように
従来のICカードは静電気に対しては無防備であ
り、ICカードの普及に伴い、どのような取扱い
を受けるかもしれず、静電気による障害を防止で
きない欠点があつた。 In other words, static electricity generated locally on the IC card exceeds the withstand voltage of the insulator between it and the IC, causing dielectric breakdown and destroying the IC.In this way, conventional IC cards are not resistant to static electricity. They were defenseless, and as IC cards became more widespread, they could be handled in any way, and they had the disadvantage of not being able to prevent damage caused by static electricity.
本発明は、従来の欠点を解消し、ICカードに
発生した静電気によりICデバイスが破壊される
のを防止できるようにしたICカード用ICモジユ
ールを提供することを目的とする。 SUMMARY OF THE INVENTION An object of the present invention is to provide an IC module for an IC card that eliminates the conventional drawbacks and can prevent IC devices from being destroyed by static electricity generated in the IC card.
本発明は、基板１の所定位置に外部端子６と、
該端子の裏側位置にリード７とを設け、両者の間
をスルーホール８により接続し、前記基板１の裏
面にICチツプ２を固定し、このICチツプ２のパ
ツド９とリード７との間をワイヤ１０で接続し、
これらを絶縁性プラスチツクよりなる絶縁層１３
で基板内側に保護固着したICカード用ICモジユ
ールであつて、前記絶縁層１３の全体を被う導電
層１４を形成すると共に、前記外部端子６の外側
にシールド用端子１７を設け、このシールド用端
子１７が前記導電層１４に接続形成され、かつカ
ードの表面に形成された導電層１９と接続される
ように構成されていることを特徴とするICカー
ド用ICモジユールである。
The present invention provides an external terminal 6 at a predetermined position on the substrate 1,
A lead 7 is provided on the back side of the terminal, a through hole 8 is used to connect the two, an IC chip 2 is fixed to the back side of the substrate 1, and a connection is made between the pad 9 of the IC chip 2 and the lead 7. Connect with wire 10,
An insulating layer 13 made of insulating plastic
This is an IC module for an IC card, which is protectively fixed to the inside of the board, in which a conductive layer 14 covering the entire insulating layer 13 is formed, and a shielding terminal 17 is provided outside the external terminal 6, and a shielding terminal 17 is provided outside the external terminal 6. This IC module for an IC card is characterized in that a terminal 17 is connected to the conductive layer 14 and is configured to be connected to a conductive layer 19 formed on the surface of the card.
本発明の一実施例を第１〜３図例で説明する
と、基板１の所定の外側の位置に外部端子６と該
端子の裏側で基板の内側な位置にリード７とを設
け、両者の間をスルーホース８により接続し、前
記基板１の裏面の内側にICチツプ２を固定し、
このICチツプ２のパツド９とリード７との間を
ワイヤ１０で接続し、これらを絶縁性プラスチツ
クよりなる絶縁層１３で基板内側に保護固着した
ICカード用ICモジユールであつて、前記絶縁層
１３の全体を被う導電性インキを用いた導電層１
４を形成すると共に、前記外部端子６の外側にシ
ールド用端子１７を設け、このシールド用端子１
７が前記導電層１４に接続形成され、かつカード
の表面に形成された導電層１９に接続されるよう
に構成されているICカード用ICモジユールであ
る。
An embodiment of the present invention will be described with reference to FIGS. 1 to 3. An external terminal 6 is provided at a predetermined outer position of a board 1, and a lead 7 is provided at a position inside the board on the back side of the terminal, and between the two are connected by a through hose 8, and the IC chip 2 is fixed inside the back surface of the board 1,
The pad 9 of this IC chip 2 and the lead 7 are connected by a wire 10, and these are protected and fixed to the inside of the board with an insulating layer 13 made of insulating plastic.
A conductive layer 1 that is an IC module for an IC card and that uses a conductive ink that covers the entire insulating layer 13.
4, and a shielding terminal 17 is provided outside the external terminal 6, and this shielding terminal 1
7 is an IC module for an IC card which is connected to the conductive layer 14 and is configured to be connected to a conductive layer 19 formed on the surface of the card.
この場合、前記導電層１４は、導電性樹脂を素
材としてプラスチツクの絶縁層１３全体を被うよ
うに形成し、この導電性樹脂としては例えばカー
ボン、銅粉、銀を練り込んだ樹脂を使用すればよ
い。また、絶縁層１３を形成する合成樹脂および
導電層１４を形成する樹脂を硬質樹脂と軟質樹脂
の組み合わせとすることにより、応力破壊を防止
することもできる。 In this case, the conductive layer 14 is made of conductive resin and is formed so as to cover the entire plastic insulating layer 13. As the conductive resin, for example, a resin kneaded with carbon, copper powder, or silver may be used. Bye. Moreover, stress fracture can also be prevented by using a combination of hard resin and soft resin as the synthetic resin forming the insulating layer 13 and the resin forming the conductive layer 14.
なお、前記導電層１４とシールド用端子１７と
はスルーホール１８によつて接続されていて、カ
ード化したコア材１５とオーバレイフイルム１６
の間に導電層１９を設けてある。該導電層１９は
導電性インキで印刷することにより、シールド用
端子１７からICカードの側端面に至り、側端面
に露出するように設ける。 The conductive layer 14 and the shielding terminal 17 are connected through a through hole 18, and the core material 15 formed into a card and the overlay film 16 are connected to each other through a through hole 18.
A conductive layer 19 is provided between them. The conductive layer 19 is printed with conductive ink so as to extend from the shielding terminal 17 to the side end surface of the IC card and to be exposed on the side end surface.
あるいは透明の導電性インキでカードの全面に
印刷（ベタ刷）してもよいし、着色した導電性イ
ンキでカードの全面に地絞、網目等の導通できる
模様を印刷してもよい。 Alternatively, transparent conductive ink may be printed on the entire surface of the card (solid printing), or colored conductive ink may be used to print a conductive pattern such as ground drawing or mesh on the entire surface of the card.
このようにすることによりICモジユールが静
電遮蔽されると共に、カードに部分的に発生した
静電気は導電層１９を通して流れ、カードの側端
面に露出した導電層１９の末端から外部へ流出
し、カード全体が同電位に保たれるから発生した
静電気がICチツプ２に流れ込むこともない。 By doing this, the IC module is shielded from static electricity, and the static electricity generated partially on the card flows through the conductive layer 19 and flows out from the end of the conductive layer 19 exposed on the side edge surface of the card. Since the entire circuit is kept at the same potential, static electricity generated does not flow into the IC chip 2.
方発明は、絶縁性プラスチツクによりなる絶縁
層で基板内側に保護固着したICカード用ICモジ
ユールであつて、前記絶縁層の全体を被う導電層
を形成すると共に、前記外部端子の外側にシール
ド用端子を設け、このシールド用端子が前記導電
層に接続形成され、かつカードの表面に形成され
た導電層と接続されるように構成されていること
により、ICカード用ICモジユールの外部端子に
加わる静電気を中和する働きをもつとともに、シ
ールド用端子が導電層と電気的に接続され、導電
層がカード端部で露出しているからICカードを
手に持つただけでICカード全体の静電気が中和
され、ICカード用ICモジユールに内臓されたIC
チツプを静電気から保護することができ、また、
ICカードをICカード用リーダライタに挿入した
ときにも、ICカードの側面に露出している導電
層とICカード用リーダライタのカード搬送用ガ
イドとが接触することによつてICカード用リー
ダライタとICカード間の電位を同電位とするこ
とができICカードを静電気から保護することが
でき、さらに、導電層は導電性インキを用いてカ
ード素材の表面に自由に形成することができるの
でデザインの制約を受けることなく外観の優れた
ICカードとすることができ、ICカードの帯電に
よるICの静電破壊を効果的に防止できるから、
従来のICモジユールと比較して体積は増加しな
いので、ICカードにコンパクトに実装でき、実
用上極めて大なる効果を奏する。
The present invention is an IC module for an IC card in which an insulating layer made of insulating plastic is protectively fixed to the inside of a substrate, and a conductive layer covering the entire insulating layer is formed, and a shielding layer is formed on the outside of the external terminal. A terminal is provided, and this shielding terminal is connected to the conductive layer and is configured to be connected to the conductive layer formed on the surface of the card, so that the shielding terminal is connected to the external terminal of the IC module for the IC card. In addition to having the function of neutralizing static electricity, the shielding terminal is electrically connected to the conductive layer, and the conductive layer is exposed at the edge of the card, so just holding the IC card in your hand will eliminate static electricity from the entire IC card. Neutralized IC built into IC module for IC card
It can protect the chip from static electricity, and
When the IC card is inserted into the IC card reader/writer, the conductive layer exposed on the side of the IC card contacts the card transport guide of the IC card reader/writer, causing the IC card reader/writer to The potential between the card and the IC card can be made the same, which protects the IC card from static electricity.Furthermore, the conductive layer can be freely formed on the surface of the card material using conductive ink, making it easy to design. Excellent appearance without the limitations of
It can be used as an IC card, and it can effectively prevent electrostatic damage to the IC due to charging of the IC card.
Since the volume does not increase compared to conventional IC modules, it can be compactly mounted on an IC card, and has an extremely large practical effect.
第１図は本発明の実施例のICモジユールの縦
断面図、第２図は使用状態のICカードの断面図、
第３図は平面図、第４図は従来のICカードの一
部断面図である。
１……基板、２……ICチツプ、３……ICモジ
ユール、４……カード素材、５……凹所、６……
外部端子、７……リード、８……スルーホール、
９……パツド、１０……ワイヤ、１１……保護
層、１２……充填層、１３……絶縁層、１４……
導電層、１５……コア材、１６……オーバレイフ
イルム、１７……シールド用端子、１８……スル
ーホール、１９……導電層。
FIG. 1 is a longitudinal sectional view of an IC module according to an embodiment of the present invention, FIG. 2 is a sectional view of an IC card in use,
FIG. 3 is a plan view, and FIG. 4 is a partial sectional view of a conventional IC card. 1... Board, 2... IC chip, 3... IC module, 4... Card material, 5... Recess, 6...
External terminal, 7...Lead, 8...Through hole,
9... Pad, 10... Wire, 11... Protective layer, 12... Filling layer, 13... Insulating layer, 14...
Conductive layer, 15... Core material, 16... Overlay film, 17... Shield terminal, 18... Through hole, 19... Conductive layer.
Claims (1)
の裏側位置にリード７とを設け、両者の間をスル
ーホール８により接続し、前記基板１の裏面に
ICチツプ２を固定し、このICチツプ２のパツド
９とリード７との間をワイヤ１０で接続し、これ
らを絶縁性プラスチツクよりなる絶縁層１３で基
板内側に保護固着したICカード用ICモジユール
であつて、前記絶縁層１３の全体を被う導電層１
４を形成すると共に、前記外部端子６の外側にシ
ールド用端子１７を設け、このシールド用端子１
７が前記導電層１４に接続形成され、かつカード
の表面に形成された導電層１９と接続されるよう
に構成されていることを特徴とするICカード用
ICモジユール。1 An external terminal 6 is provided at a predetermined position on the substrate 1, and a lead 7 is provided on the back side of the terminal, and a through hole 8 is used to connect the two.
This is an IC module for an IC card, in which an IC chip 2 is fixed, a pad 9 of this IC chip 2 and a lead 7 are connected with a wire 10, and these are protected and fixed to the inside of a board with an insulating layer 13 made of insulating plastic. A conductive layer 1 covering the entire insulating layer 13
4, and a shielding terminal 17 is provided outside the external terminal 6, and this shielding terminal 1
7 is formed to be connected to the conductive layer 14, and is configured to be connected to the conductive layer 19 formed on the surface of the card.
IC module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58102906A JPS59228743A (en) | 1983-06-10 | 1983-06-10 | Ic module for ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58102906A JPS59228743A (en) | 1983-06-10 | 1983-06-10 | Ic module for ic card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59228743A JPS59228743A (en) | 1984-12-22 |
| JPH0334658B2 true JPH0334658B2 (en) | 1991-05-23 |
Family
ID=14339902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58102906A Granted JPS59228743A (en) | 1983-06-10 | 1983-06-10 | Ic module for ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59228743A (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0696356B2 (en) * | 1986-03-17 | 1994-11-30 | 三菱電機株式会社 | Thin semiconductor card |
| JPS6339580U (en) * | 1986-09-02 | 1988-03-14 | ||
| US5122860A (en) * | 1987-08-26 | 1992-06-16 | Matsushita Electric Industrial Co., Ltd. | Integrated circuit device and manufacturing method thereof |
| JP3016884B2 (en) * | 1991-02-06 | 2000-03-06 | ローム株式会社 | Thermal head |
| DE4126874C2 (en) * | 1991-08-14 | 1997-05-22 | Orga Kartensysteme Gmbh | Data carrier with integrated circuit |
| JP3173171B2 (en) * | 1991-12-19 | 2001-06-04 | カシオ計算機株式会社 | Information transfer system |
| US5544014A (en) * | 1992-08-12 | 1996-08-06 | Oki Electric Industry Co., Ltd. | IC card having a built-in semiconductor integrated circuit device |
| JPH06183189A (en) * | 1992-12-21 | 1994-07-05 | Toppan Printing Co Ltd | Ic module for ic card |
| EP0647943B1 (en) * | 1993-10-08 | 2000-10-04 | VALTAC, Alex Beaud | Memory device |
| DE4344297A1 (en) * | 1993-12-23 | 1995-06-29 | Giesecke & Devrient Gmbh | Process for the production of identity cards |
| FR2806189B1 (en) * | 2000-03-10 | 2002-05-31 | Schlumberger Systems & Service | REINFORCED INTEGRATED CIRCUIT AND METHOD FOR REINFORCING INTEGRATED CIRCUITS |
| US10977540B2 (en) | 2016-07-27 | 2021-04-13 | Composecure, Llc | RFID device |
| US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
| US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| HUE060022T2 (en) | 2017-10-18 | 2023-01-28 | Composecure Llc | Metal, ceramic or ceramic-coated transaction card with window or window pattern and optional backlight |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5660098A (en) * | 1979-10-23 | 1981-05-23 | Hokushin Electric Works | Method of electrostatically shielding electronic circuit |
-
1983
- 1983-06-10 JP JP58102906A patent/JPS59228743A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59228743A (en) | 1984-12-22 |
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