JPH0334787B2 - - Google Patents

Description

[Detailed description of the invention]

INDUSTRIAL APPLICATION FIELD The present invention particularly relates to a method for producing a novel sealing cell with improved heat and humidity resistance. BACKGROUND ART Recently, methods for storing electrical and electronic materials using sealing cells have become popular mainly in the electrical and electronic industries. For example, methods for housing integrated circuits (hereinafter referred to as ICs) and transistors using ceramic cells, and methods for encapsulating liquid crystals using glass cells have been widely put into practical use. These sealing cells are the heart of electrical/electronic components and have important functions, and are therefore required to have extremely high physical properties. That is, the materials that make up the cell must be strongly bonded to each other, must have high airtightness, and must also have excellent chemical and physical stability against moisture, heat, and the like. Currently, in manufacturing cells for sealing, a method is generally used in which adhesives are used to bond cell materials, that is, cell base materials and cell adherends. Previously, inorganic adhesives were used as adhesives, but in this case they usually had to be cured at high temperatures of 400 to 500 degrees Celsius, which resulted in poor workability and productivity, and also caused warping and deterioration of the material due to high temperatures. This causes problems such as, as a result, the function of the cell is significantly deteriorated, so its usage has been on the decline. On the other hand, in order to improve the drawbacks of these inorganic adhesives, attempts have been made to develop a number of organic adhesives that can be cured at low temperatures. Currently, most organic adhesives that can be used for this purpose are based on two-component epoxy resins, which have the disadvantage of short pot lives because they are two-component. be. In addition, when manufacturing cells using adhesives, a method is generally used in which the adhesive is screen printed on the cell base material, the adherend material is applied, and the adhesive is heated and cured.
In order to prevent the printed pattern from deforming due to the adhesive flowing when the adherend is applied, preliminary curing is performed to semi-cure the adhesive before heating and curing. When a two-component adhesive is used, this preliminary curing usually takes more than ten hours, which extremely reduces production efficiency. Furthermore, since the degree of this pre-curing subtly affects the physical properties of the final product, strict process control is essential, and restrictive work is forced. In other words, if the two-component adhesive is insufficiently cured during pre-curing, the retention of the printed pattern will deteriorate and a proper adhesive layer will not be obtained.On the other hand, if it is over-cured, the adherend will This may result in insufficient transfer adhesion of the adhesive to the surface, which may adversely affect adhesive performance. One-component epoxy resin adhesives have been developed to improve the operational disadvantages of these two-component adhesives, but the chemical and physical stability of the manufactured cells against moisture, heat, etc. is poor. Poor practicality.
As described above, there is currently no method for manufacturing a sealing cell that is excellent in workability and physical properties, and there is a strong demand for its realization. The applicant first discovered that it does not require high temperature curing like inorganic adhesives, has a long pot life, is suitable for screen printing, and has improved workability such as pre-drying, which is more efficient than pre-curing and easier to manage. The present inventors have provided a method for manufacturing a sealing cell that has improved chemical and physical stability against moisture, heat, etc. of the manufactured cell.
21514). That is, the invention according to the above-mentioned application involves applying an adhesive mainly composed of an epoxy resin having an average molecular weight of 500 or more, a hydrazide compound, a filler, and a solvent onto a cell base material or a cell adherend, After drying, a cell adhesive or a cell base material is applied, respectively, and the cells are cured by heating. Problems to be Solved by the Invention The present invention further improves the invention related to the above-mentioned application, and instead of using an epoxy resin with an average molecular weight of 500 or more, a special By using such an epoxy resin composition, the object is to further improve the high humidity and heat resistance, that is, the durability of the sealing cell against humidity and temperature over a long period of time. More specifically, the purpose is to prevent, for example, moisture from entering through the sealing portion of the cell and disrupting the liquid crystal display pattern. Means for solving the problems, that is, the present invention provides an epoxy resin, a hydrazide compound, a filler,
After applying an adhesive mainly composed of and a solvent onto the cell base material or cell adherend material and pre-drying it,
In the method for producing a sealing cell in which a cell adherend or a cell base material is applied and heated to cure, the following (a) 60 to 80 parts by weight and (b) 20 to 40 parts by weight of the above epoxy resin are used. This is a method of manufacturing a sealing cell characterized by using the following. (a) Polycondensation type epoxy resin () and/or of novolak resin-modified bisphenol A and epihalohydrin, each having a number average molecular weight of 500 to 1600.
Or a polycondensation type epoxy resin () of bisphenol S and epihalohydrins. (b) A liquid epoxy compound with a number average molecular weight of 100 to 500. Function The novolac resin-modified bisphenol A used in the present invention to produce an epoxy resin with an average molecular weight of 500 to 1600 is obtained by reacting a novolac resin obtained by addition condensation of bisphenol A and phenol or cresol and formaldehyde. It is mainly obtained by dehydration condensation of the hydroxyl group of the former and the methylol group of the latter, and the charging ratio is 30-40% by weight of the former and 60-70% by weight of the latter.
It is. If the proportion of bisphenol A is too high, the humidity and temperature resistance of the resulting epoxy resin will decrease. or,
Too much novolak resin reduces adhesion. Epihalohydrins refer to epihalohydrins such as epichlorohydrin and epibromohydrin, and methylepihalohydrins such as methylepichlorohydrin. The reaction for producing an epoxy resin from novolak resin-modified bisphenol A or bisphenol S and epihalohydrin is carried out according to a known polycondensation reaction. (a) novolac resin-modified bisphenol A;
At least one of the polycondensation resin () obtained by the reaction with epihalohydrins and the polycondensation resin () obtained by the reaction of bisphenol S with epihalohydrins is used as an essential component, Of course, there is no problem in using them together. The reason why the number average molecular weight is specified as 500 or more is that if it is less than 500, the adhesive will remain fluid after pre-drying, so when the adherend is applied and heated to harden, the adhesive will flow and deform, resulting in printing problems. This is because the pattern is significantly disturbed and good adhesive performance cannot be achieved. If substrates coated with adhesive are to be stacked and handled after pre-drying, it is desirable to use solid epoxy resin as the main ingredient in order to prevent the blocking phenomenon. The reason for specifying the number average molecular weight to be 1600 or less is that when the molecular weight exceeds 1600, the melting point of the resin gradually increases, requiring strong pressure when stacking the base materials, and furthermore, the adhering base material This is because wetting with the interface of the adhesive may become poor, resulting in a decrease in adhesive strength. Next, the liquid epoxy compound (b) having a number average molecular weight of 100 to 500 is, for example, (1) bisphenol A, bisphenol F, (2) a novolac resin obtained by addition condensation of phenol or cresol and formaldehyde, Polycondensation resins of hydroxy compounds such as tetrahydroxyphenylmethane and resorcinol, (3) polyhydric alcohols such as glycerin and pentaerythritol, etc., and epihalohydrins such as epichlorohydrin and epibromhydrin, and methylepihalohydrins such as methylepichlorohydrin. , a halogenated resin of the polycondensation resin, or
Examples include monoglycidyl ether compounds, and one type or two or more types can be used. Those with a number average molecular weight of 100 to 500 are usually liquid at room temperature. The cell substrate is screen printed, temporarily cured, and heated for the purpose of evaporating the solvent. The standard time is 90℃ for 30 minutes, but after that, when the other base material is stacked, if liquid resin is not added, it will be completely tack-free, and the top and bottom cells will easily shift. This makes it difficult to fully cure the printed material in a state close to the desired liquid state as printed. The blending ratio of the epoxy resin is 20 to 40 parts by weight of the (b) low molecular weight liquid epoxy compound to 60 to 80 parts by weight of the polycondensation type epoxy resin (a). The resin in (a) is the base material for the adhesive,
If this amount is too large, the adhesive will generally become hard and the normal adhesiveness will decrease. Moreover, water absorption becomes large, and the display pattern of the liquid crystal becomes more likely to be disturbed. On the other hand, by adding the liquid epoxy compound (b), it can replace the solvent, and the resin film (a) can increase the crosslinking density and reduce the glass transition point depending on the type and molecular structure of the liquid resin used. This improves the heat resistance and strength of the film, and also imparts flexibility to the film, improving impact resistance and preventing the occurrence of disturbances in the display pattern of the liquid crystal. (b) Adhesion is completely insufficient when used alone. The best results were obtained with the above formulation. Next, the hydrazide compounds used in the present invention include monobasic acid hydrazide compounds such as salicylic acid hydrazide, p-oxybenzoic acid hydrazide, and phenylaminopropionic acid hydrazide;
One or more dibasic acid dihydrazide compounds selected from succinic acid dihydrazide, adipic acid dihydrazide, isophthalic acid dihydrazide, sebacic acid dihydrazide, thiodipropionic acid dihydrazide, furandicarboxylic acid dihydrazide, cyclohexanecarboxylic acid dihydrazide, etc. . Among these, dibasic acid dihydrazide compounds are particularly suitable. These hydrazide compounds act as curing agents for epoxy resins, and when mixed with epoxy resins, they have a long shelf life at room temperature, so the mixture can be used as a one-component epoxy resin. Nevertheless, hydrazide compounds initiate the curing reaction at relatively _low temperatures and have very high It has the effect of imparting heat resistance, cold resistance, and water resistance. The amount of the hydrazide compound to be used is preferably such that the hydrazide group is 1/3 mole to 2/3 mole per mole of epoxy group in the epoxy resin. When mixing the two, in order to uniformly and finely disperse the hydrazide compound, which is generally a solid,
It is preferable to use the mixture by kneading it with a triple roll or the like. Fillers used in the present invention include (1) carbonates such as calcium carbonate and magnesium carbonate, sulfates such as barium sulfate and magnesium sulfate, silicates such as aluminum silicate and zirconium silicate, iron oxide, and titanium oxide. , oxides such as zinc oxide, inorganic fillers such as kaolin, talc, asbestos powder, quartz powder, mica, glass fiber, and (2) polyethylene powder, polypropylene powder, polyvinyl chloride powder, polystyrene powder, polyvinyl acetate powder. , polystyrene, vinyl acetate copolymer powder, polymethacrylate powder, polyurethane powder, polyester powder, urea resin powder, phenolic resin powder,
There are organic fillers such as epoxy resin powder. The amount of these fillers added varies greatly depending on the composition of the adhesive used in the present invention, especially the type of filler itself, but is generally preferably 1 to 100 parts by weight per 100 parts by weight of the epoxy resin. Generally, in the present invention, if the amount of filler is less than 1 part by weight, defects such as poor coating workability and poor retention of the applied pattern are likely to occur. Moreover, if it exceeds 100 parts by weight, it tends to cause problems in coating by screen printing or the like. In addition, when mixing the filler, it is desirable to knead it using a triple roll or the like to make it fine before use, in order to prevent clogging of the screen during screen printing. The solvent used in the present invention has a boiling point of 70 to 250.
℃ is preferable. Specifically, hydrocarbons such as n-heptane, n-octane, n-decane, cyclohexane, benzene, toluene, xylene, ethylbenzene, diethylbenzene, amylbenzene, naphthalene, and pinene, carbon tetrachloride, ethylene chloride, 1, 1,1-trichloroethane,
1,1,1,2-tetrachloroethane, hexachloroethane, trichlorethylene, tetrachlorethylene, 1,2,3-trichloropropane, butyl chloride, amyl chloride, 2-ethylhexyl chloride, ethylene bromide, tetrabrome Halogenated hydrocarbons such as ethane, chlorobenzene, 1,2,4-trichlorobenzene, brombenzene, ethanol, isopropanol, n-amyl alcohol, fusel oil, n-hexanol, methylamino alcohol, 2-ethylbutanol, n -heptanol, n-octanol, n-decanol,
Alcohols such as cyclohexanol, benzyl alcohol, furfuryl alcohol, ethers and acetals such as n-butyl ether, n-hexyl ether, ethyl phenyl ether, 1,4-dioxane, trioxane, diethylacetal, methyl ethyl ketone, methyl-n -Ketones such as butyl ketone, methyl-n-amyl ketone, acetonylacetone, isophorone, cyclohexanone, acetophenone, propyl formate, isobutyl formate, ethyl acetate, n-butyl acetate, benzyl acetate, isoamyl butyrate, ethyl lactate, methyl benzoate , esters such as diethyl oxalate,
Ethylene glycol, methyl cellosolve, methyl cellosolve acetate, cellosolve acetate,
Polyhydric alcohols and their derivatives such as dibutyl cellosolve, methyl carbitol, carbitol acetate, butyl carbitol, propylene glycol, hexylene glycol, sulfur-containing solvents such as dimethyl sulfoxide, formamide, N,N-
These include nitrogen-containing solvents such as dimethylformamide. In the present invention, if the boiling point of the solvent is lower than 70°C,
The solvent evaporates during the storage of the adhesive or during the adhesive application process, increasing the viscosity of the adhesive and significantly impairing workability. If the boiling point is higher than 250°C, the pre-drying process will take a long time, and there is a risk that the solvent will remain in the applied adhesive and impair the performance of the sealant in the cell. This is not preferred because adhesive performance may be insufficient. The reason for adding a solvent in the present invention is to impart fluidity to the adhesive and provide appropriate applicability. Therefore, it is necessary to adjust the amount of solvent added to satisfy these conditions, but in general, 5 to 70 parts by weight per 100 parts by weight of epoxy resin is appropriate. Note that the solvent used may be one type, or a combination of two or more types may be used. The cell base materials used in the present invention include (1) inorganic materials such as glass and ceramics, (2) those in which the above inorganic materials are surface-treated with a surface modifier such as a silane coupling agent, and liquid crystal sealed cells. (3) organic materials such as epoxy resin plates, polyester resin plates, polyimide resin plates, polycarbonate resin plates, and polysulfonate resin plates; Typical examples include materials reinforced with carbon fiber, etc., and (4) materials in (3) above subjected to various surface treatments in the same manner as in (2) above. The cell adherend used in the present invention is the same as the cell base material described above: (1) an inorganic material such as glass or ceramic; (2) a surface treatment of the above inorganic material with a surface modifier such as a silane coupling agent; (3) For liquid crystal sealed cells, those that have been surface-treated to provide transparent electrodes, alignment films, etc. (3) Epoxy resin plates, polyester resin plates, polyimide resin plates, polycarbonate resin plates, polysulfon resin plates, etc. Typical examples include organic materials and materials reinforced with glass fibers, carbon fibers, etc., (4) Materials in (3) above that have been subjected to various surface treatments in the same way as in (2) above, etc. It may have the same material and shape as the substrate for use, or it may be different. Next, to specifically explain a typical manufacturing method of the present invention, an adhesive containing the above-mentioned epoxy resin, a hydrazide compound, a filler, and a solvent is applied as a film onto a cell base material by screen printing. After applying the film to a thickness of 5 to 500 μm and pre-drying it in a drying oven, etc., cover it with the adhesive material for the cell, pressurize it with a collect, pressurize it with a vacuum bottle, etc., and put it in a drying oven, hot plate, heater block, etc. Heat and cure using means such as an infrared heater. Pre-drying here refers to sufficiently volatilizing the solvent contained in the adhesive, and then, when covering with the cell adhesive and heating and curing, drying is done to ensure that the adhesive layer blends in with the bonded area of the adherend. This means maintaining the property of fluidity. Drying conditions are usually 5 minutes to 6 hours at room temperature to 130℃ in an air stream, and 60 to 110℃ considering productivity and economic efficiency.
20 to 120 minutes is preferable. Heat curing in the present invention refers to sufficiently performing a curing reaction between the epoxy resin and the hydrazide compound in the adhesive component, and adhesively bonding the cell base material and the cell adherend material with the adhesive. It means that. The heat curing conditions are usually in air flow.
5 to 120 minutes at 130 to 200°C, preferably 140
20 to 90 minutes at ~180°C is appropriate. Although the present invention is carried out by the method explained above, the four main components of the adhesive used in the present invention, epoxy resin, hydrazide compound, filler, and solvent, are essential, and any one of them is missing. However, the object of the present invention cannot be achieved. Furthermore, it is essential that the manufacturing operation procedure in the present invention follows the above-mentioned steps and order, and if any of them are reversed without omission, the object of the present invention will not be achieved. However, if necessary, the cell base material and cell adhesive material may be
The present invention can also be carried out by replacing the terms with the cell adherend and the cell base material, respectively. In addition, in the present invention, other known curing agents such as aromatic amines, acid anhydrides,
BF ₃ compound, dicyandiamide and its derivatives,
Imidazole and its salts, diaminomaleonitrile and its derivatives, nylon salts, urea derivatives, etc. may be added without any problem as long as they do not impair the effects of the present invention. Furthermore, surface modifiers such as silane coupling agents and titanate coupling agents, pigments, and the like may be used as necessary within a range that does not impair the effects of the present invention. The adhesive used in the method of the present invention contains the various components described above, but from the viewpoint of use in sealing cells, the adhesive used in the method of the present invention has a temperature of 100 to 300% at 25°C as an adhesive containing a solvent. Poise, preferably 150
It is preferable that a coating film applied to a thickness of 1 mm as an adhesive having a viscosity of ~200 poise and containing a solvent has no fluidity even when the coating surface is vertically held after the solvent has evaporated. In the present invention, there are no particular limitations on the method for encapsulating materials such as ICs, transistors, liquid crystals, etc. to be encapsulated in the encapsulation cell.
In combination with the sealing cell, an appropriate method may be used. In the present invention, the adhesive used is a combination of a specific epoxy resin, a specific compound, and a filler and a solvent. Disadvantages of resins include (1) short pot life, (2) requiring a preliminary curing process that is complicated and time-consuming to manage, (3) requiring processes such as measuring and mixing before use.
A revolutionary breakthrough in which cells for sealing can be manufactured by enjoying only the advantages of one-component epoxy resin, avoiding the operational disadvantages such as It is true. That is, the present invention does not require the steps of measuring and mixing the adhesive components, and instead of the above-mentioned pre-curing step, a pre-drying step that is quick and easy to manage can be performed, and the adhesive According to the method of the present invention, the curing time is, for example, 30 to 60 minutes at 160°C, whereas when a conventional two-component epoxy resin adhesive is used, it takes 60 to 90 minutes at the same temperature. Furthermore, the sealing cell manufactured by the method of the present invention has extremely high airtightness, and has excellent heat resistance, cold resistance, and water resistance, and has great practical value as a storage container for electrical and electronic materials. expensive. As described above, the method of the present invention is a dramatic improvement over the conventional level, and is extremely useful as a method that satisfies these demands in these days when there is a strong demand for labor saving and energy saving. Next, the present invention will be specifically explained with reference to Examples, but the present invention is not limited to these Examples. Also, parts refer to parts by weight. Examples and Comparative Examples Table 1 shows the formulations. In Examples 1-2 and Comparative Examples 1-2, (a)
- () is (manufactured by Dainippon Ink Co., Ltd., product name N-880),
(a) - () (manufactured by Dainippon Ink Co., Ltd., product name)
For EXA1514) and (b), (manufactured by Dainippon Ink Co., Ltd., trade name Epicron 830-S), these resins and solvent were heated and mixed in a flask at 70 to 90°C, made homogeneous, and then at room temperature. After cooling, it was taken out, and further a curing agent, a thixotropic agent, etc. were premixed in the proportions shown in each Example and Comparative Example. This mixture was kneaded using three rolls until the primary particles of the powder particles became 3 μm or less to prepare an adhesive. Regarding Comparative Example 3, the heating dissolution operation as described above was not performed, and the curing agent, thixotropic agent, solvent, etc. were added directly to the liquid resin, and the three The mixture was kneaded using this roll to form an adhesive. For Comparative Example 4, a commercially available sealing resin was used. Next, the following various tests were conducted using the above adhesives shown in Examples and Comparative Examples. (1) When continuously screen printing pot life adhesive, 23
℃, under 60% RH condition, screen mask surface,
The time taken until the mesh part was damaged or the time taken until the adhesive was applied under the same conditions as the beginning of printing was measured. (2) Screen printability For each cell substrate coated with adhesive, measure the coating width at 8 locations, 2 locations per side of the applied pattern, calculate the average value, and calculate the 10
The test was carried out for each cell substrate, and the average value was determined. From this, calculations were made according to the following formula, and the following scores were given according to the obtained values. Screen printability = Average value of measured coating width (mm) / Screen pattern width (0.8 mm) x 100 ・ 100 ~ 110 (ideal printing condition) ... 5 points ・ 110 ~ 130 (final physical properties of liquid crystal display cell) (printing condition that has a slight negative effect on
...1 point (3) Pattern retention of screen printing For each liquid crystal display cell, the application width of the screen-printed adhesive and the application width of the melted and fluidized adhesive when heated and cured are determined at 2 points per side of the pattern. Measurements were taken at eight locations in total, and the average value was determined. This was performed on 10 liquid crystal display cells, and the average value was determined. From this, calculations were made according to the following formula, and the following scores were given according to the obtained values. Pattern retention rate = Average value of coating width after heat curing (mm) / Average value of coating width before heat curing (mm) x 100 ・ 110 ~ 130 (ideal flow state) ... 5 points ・ 100 ~ 110 and 130 to 150 (flow state that has a slight negative effect on the final physical properties of the liquid crystal display cell) ...3 points, value over 150 (flow state that has no practical use)
...1 point (4) Surface condition after pre-drying Apply 20μ (wet) of adhesive on a 200mm x 200mm x 1mm glass plate using a Baker applicator, leave it in a hot air dryer at 90℃ for 30 minutes, After taking it out, leave it for 10 minutes at 23℃ and 60%RH.
The surface tack was measured according to JIS Z-0237-1980 adhesive tape/adhesive sheet testing method. The tack value represents the determined diameter of the ball, and it was determined that the larger the value, the greater the tack on the surface. (5) Adhesion boiling test Adhesive was applied by screen printing to a 30mm x 15mm x 1mm Nesa glass surface with a printing width of 1mm and a density of 20μ (wet), and then dried in a hot air dryer at 90℃ for 30 minutes. Hardened. Next, after leaving it at 23℃ and 60% RH for 30 minutes, turn over one side of the Nesa Glass, press it with a clip, and fully cure it at 150℃ for 1 hour. Adhesive strength was measured. The adhesion test was performed by bonding an iron jig to the surface of two pieces of Nesa glass using a two-component quick-curing acrylic adhesive, and pulling the jig outward using an Instron universal tensile tester. Adhesive strength (Kg) was measured. Ten test pieces were prepared for each, and the results were taken as the average value. (6) Humid and heat resistance test Fill an autoclave with water to about 1/5 of its height, set up a shelf to prevent it from coming into contact with water, and place the liquid crystal display cell manufactured using the method below on top of it. Ta. After the autoclave was completely sealed, the internal temperature was adjusted to 120°C ± 2°C. Thereafter, every 2 hours, the liquid crystal display cell was taken out, polarizing plates were applied to both the front and back sides, and a 6V DC voltage was applied between the electrodes. , evaluated the airtight performance of liquid crystal display cells under high humidity conditions. The evaluation is determined by the time when the display pattern begins to be disturbed, and this is measured for 10 liquid crystal display cells.
The average value was determined and evaluated as follows.・More than 50 hours...5 points ・More than 24 hours but less than 50 hours...3 points ・Less than 24 hours...1 point Manufacturing method for liquid crystal display cell Using the adhesive manufactured above, make a digital watch under the conditions shown below. A liquid crystal display cell was manufactured. Cell substrate: A transparent electrode made of indium trioxide is deposited on the surface of a glass plate measuring 10 mm wide, 20 mm long, and 1 mm thick using a conventional method, and then surface treated with a polyimide-based alignment film. What I did. Adherent material for cells: Same as base material for cells. Application process: Apply the above adhesive in a pattern with a width of 0.8 mm and a length of 9 mm in width x 18 mm in height.
It was coated onto the cell substrate using a 300 mesh screen printing plate to a film thickness of 10μ. Pre-drying process: The cell base material coated with adhesive is
It was left in a drying oven at 100°C for 30 minutes. Adhesion step: The cell base material that had been pre-dried and allowed to cool was covered with the cell adherend material, and was left in a drying oven at 160° C. for 30 minutes while being pressurized with a vacuum bottle. Finishing process: Twisted nematic is applied to the sealing cell obtained above.
Biphenyl liquid crystal was injected according to the display method, and the injection hole was sealed using a commercially available two-component epoxy resin to produce a liquid crystal display cell. Further, the rising current time was determined by applying a DC voltage of 6 V between the electrodes with polarizing plates placed on both the front and back surfaces, plotting the rising curve of the initial current value, and displaying the time required for the current to rise to double. The test results of Examples and Comparative Examples are shown in Table 2. Effects of the Invention As is clear from the results in Table 2, the present invention is a method for producing a sealing cell with excellent heat and humidity resistance.

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Claims (1)

[Claims] 1. After applying an adhesive mainly composed of an epoxy resin, a hydrazide compound, a filler, and a solvent onto a cell base material or a cell adherend material and pre-drying it,
In the method for producing a sealing cell in which a cell adherend or a cell base material is applied and heated to cure, the following (a) 60 to 80 parts by weight and (b) 20 to 40 parts by weight of the above epoxy resin are used. A method for manufacturing a sealing cell, characterized by using the following. (a) Polycondensation type epoxy resin () and/or of novolak resin-modified bisphenol A and epihalohydrin, each having a number average molecular weight of 500 to 1600.
Or a polycondensation type epoxy resin () of bisphenol S and epihalohydrins. (b) A liquid epoxy compound with a number average molecular weight of 100 to 500.