JPH0334864B2 - - Google Patents
Info
- Publication number
- JPH0334864B2 JPH0334864B2 JP59055520A JP5552084A JPH0334864B2 JP H0334864 B2 JPH0334864 B2 JP H0334864B2 JP 59055520 A JP59055520 A JP 59055520A JP 5552084 A JP5552084 A JP 5552084A JP H0334864 B2 JPH0334864 B2 JP H0334864B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- cooling
- circuit board
- chip
- top cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
(1) 発明の技術分野
本発明は半導体装置冷却構造、特に回路基板の
素子の冷却を効率良く行なえる冷却装置の構造に
関する。DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a semiconductor device cooling structure, and particularly to a cooling device structure that can efficiently cool elements of a circuit board.
(2) 技術の背景
計算機には半動体チツプが実装された回路基板
の多層構成が用いられ、操作において半導体チツ
プに熱が発生するので回路基板を冷却することが
必要になる。(2) Background of the technology Computers use a multi-layer structure of circuit boards on which semi-moving chips are mounted, and as the semiconductor chips generate heat during operation, it is necessary to cool the circuit boards.
(3) 従来技術と問題点
前記した回路基板の従来の冷却構造としては素
子に冷却用ピストンを押し付ける方法がある。こ
の方法においては回路基板の上方に冷却容器を配
置し、この冷却容器の下側からは指状の冷却用ピ
ストンが延びる構成とし、この冷却用ピストンの
先端で回路基板上の半導体チツプを押え、他方冷
却容器には冷却水を循環させる構造となつてい
る。かかる冷却装置においては、半導体チツプに
対応して数多くの冷却用ピストンを設けなければ
ならないので構造が複雑になり、またそれと半導
体チツプとの接触を保つについて難しい問題があ
る。(3) Prior Art and Problems As a conventional cooling structure for the circuit board described above, there is a method in which a cooling piston is pressed against an element. In this method, a cooling container is placed above the circuit board, a finger-shaped cooling piston extends from the bottom of the cooling container, and the tip of the cooling piston presses the semiconductor chip on the circuit board. On the other hand, the cooling container is structured to circulate cooling water. In such a cooling device, a large number of cooling pistons must be provided corresponding to the semiconductor chips, resulting in a complicated structure, and there is also the problem of maintaining contact between the cooling pistons and the semiconductor chips.
(4) 発明の目的
本発明は上記従来の問題に鑑み、計算機等に使
用される半導体チツプを搭載した回路基板の効率
の良い冷却が可能な冷却構造を提供することを目
的とする。(4) Object of the Invention In view of the above-mentioned conventional problems, an object of the present invention is to provide a cooling structure capable of efficiently cooling a circuit board on which a semiconductor chip used in a computer or the like is mounted.
(5) 発明の構成
そしてこの目的は本発明によれば、複数の半導
体チツプがマトリツクス状にフリツプチツプ実装
された回路基板と、該半導体チツプに接触し、該
回路基板のほぼ全面を覆う如くに取り付けられ、
内部にウイツクが設けられた伝熱用液体が封入さ
れたヒートパイプ構造と一方端部にフイン構造の
放熱用熱交換器が設けられた放熱用上蓋と、該放
熱用上蓋を該半導体チツプに密着せしめる固定用
ハウジングとスプリングとを有することを特徴と
する半導体装置冷却構造によつて達成される。(5) Structure of the Invention According to the present invention, the object is to provide a circuit board on which a plurality of semiconductor chips are flip-chip mounted in a matrix, and a circuit board that is mounted so as to contact the semiconductor chips and cover almost the entire surface of the circuit board. is,
A heat pipe structure in which a heat transfer liquid is sealed with a heat pipe provided inside, a heat dissipation top cover having a heat dissipation heat exchanger having a fin structure at one end, and the heat dissipation top cover tightly attached to the semiconductor chip. This is achieved by a semiconductor device cooling structure characterized by having a fixing housing and a spring.
(6) 発明の実施例 以下本発明実施例を図面によつて詳説する。(6) Examples of the invention Embodiments of the present invention will be explained in detail below with reference to the drawings.
本発明は回路基板に実装されたチツプの冷却の
ため、上蓋をかぶせ、冷却効率を向上させるため
この上蓋をヒートパイプ構造としたものである。 In the present invention, a top cover is provided to cool the chips mounted on the circuit board, and the top cover has a heat pipe structure to improve the cooling efficiency.
第１図は本発明実施例の一部切欠した斜視図、
また第２図は第１図の実施例の断面図である。回
路基板１上には、半導体チツプ（以下にはチツプ
という）２がフリツプチツプ実装され、このチツ
プ２に接触するように放熱用上蓋３が回路基板１
のほぼ全面を覆う如くに取り付けられている。上
蓋３の内部はヒートパイプ構造とするためのウイ
ツク４が作られ、伝熱用液体５が封入されてい
る。ウイツク４は上蓋３の底面上に多数の平行な
細い溝を切刻することによつて形成され、上蓋３
の内部は数個の隔壁９によつて小さなコンパート
メント３ａに分割されている。チツプ２と反対側
にはフイン構造の放熱用熱交換器６が作られてい
る。放熱用上蓋３をチツプ２に密着させるため、
スプリング７、固定用ハウジング８を設ける。上
蓋３は硬くて熱伝導性の小なる材料例えばステン
レスで作るとよい。 FIG. 1 is a partially cutaway perspective view of an embodiment of the present invention;
FIG. 2 is a sectional view of the embodiment shown in FIG. A semiconductor chip (hereinafter referred to as a chip) 2 is flip-chip mounted on the circuit board 1, and a heat dissipation top cover 3 is attached to the circuit board 1 so as to be in contact with the chip 2.
It is installed so as to cover almost the entire surface of the area. A heat pipe structure 4 is formed inside the upper lid 3, and a heat transfer liquid 5 is sealed therein. The wick 4 is formed by cutting a large number of parallel thin grooves on the bottom surface of the top lid 3.
The interior is divided into small compartments 3a by several dividing walls 9. A heat exchanger 6 having a fin structure for heat dissipation is formed on the opposite side from the chip 2. In order to bring the heat dissipation top cover 3 into close contact with the chip 2,
A spring 7 and a fixing housing 8 are provided. The upper cover 3 is preferably made of a hard material with low thermal conductivity, such as stainless steel.
チツプ２で発生した熱は放熱用上蓋３に伝わ
る。そして上蓋３特にコンパートメント３ａを一
つのヒートパイプとして利用し液体５とウイツク
４との共同により熱を熱交換器６に伝え、熱交換
器６から外部に放熱する。本発明の一実施例によ
れば、チツプの冷却を従来例の場合より効率良く
行なえることが確認された。 The heat generated by the chip 2 is transmitted to the heat dissipation top cover 3. The upper cover 3, particularly the compartment 3a, is used as a heat pipe to transfer heat to the heat exchanger 6 through the cooperation of the liquid 5 and the heat pipe 4, and radiates the heat from the heat exchanger 6 to the outside. It has been confirmed that according to one embodiment of the present invention, chips can be cooled more efficiently than in the conventional example.
(7) 発明の効果
以上詳細に説明した如く本発明によれば、回路
基板に実装したチツプに全面的に接触した上蓋か
ら熱を伝えるので、従来の如く個々のチツプと冷
却用ピストンとの接触による冷却に比べ、簡易な
構造で効率良く冷却できるという効果がある。(7) Effects of the Invention As explained in detail above, according to the present invention, heat is transferred from the top lid that is in full contact with the chips mounted on the circuit board, so there is no contact between each chip and the cooling piston as in the conventional case. This has the effect of providing more efficient cooling with a simpler structure than conventional cooling methods.
第１図は本発明実施例の一部切欠した斜視図、
第２図は第１図の実施例の実装状態での断面図で
ある。
１……回路基板、２……半導体チツプ、３……
冷却用上蓋、３ａ……コンパートメント、４……
ウイツク、５……伝達用液体、６……熱交換器、
７……スプリング、８……固定用ハウジング、９
……隔壁。
FIG. 1 is a partially cutaway perspective view of an embodiment of the present invention;
FIG. 2 is a sectional view of the embodiment shown in FIG. 1 in a mounted state. 1... Circuit board, 2... Semiconductor chip, 3...
Cooling top lid, 3a... Compartment, 4...
5... Transfer liquid, 6... Heat exchanger,
7...Spring, 8...Fixing housing, 9
...Bulkhead.
Claims (1)
リツプチツプ実装された回路基板１と、 該半導体チツプ２に接触し、該回路基板１のほ
ぼ全面を覆う如くに取り付けられ、内部にウイツ
ク４が設けられ伝熱用液体が封入されたヒートパ
イプ構造と一方端部にフイン構造の放熱用熱交換
器６が設けられた放熱用上蓋３と、 該放熱用上蓋３を該半導体チツプ２に密着せし
める固定用ハウジング８とスプリング７とを有す
ることを特徴とする半導体装置冷却構造。[Scope of Claims] 1. A circuit board 1 on which a plurality of semiconductor chips 2 are flip-chip mounted in a matrix; A heat dissipation top cover 3 has a heat pipe structure in which a heat transfer liquid is sealed and a heat transfer heat exchanger 6 having a fin structure is provided at one end thereof, and the heat dissipation top cover 3 is attached to the semiconductor chip 2. A semiconductor device cooling structure characterized by having a fixing housing 8 and a spring 7 that are brought into close contact with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59055520A JPS60198848A (en) | 1984-03-23 | 1984-03-23 | Cooler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59055520A JPS60198848A (en) | 1984-03-23 | 1984-03-23 | Cooler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60198848A JPS60198848A (en) | 1985-10-08 |
| JPH0334864B2 true JPH0334864B2 (en) | 1991-05-24 |
Family
ID=13000979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59055520A Granted JPS60198848A (en) | 1984-03-23 | 1984-03-23 | Cooler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60198848A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5109318A (en) * | 1990-05-07 | 1992-04-28 | International Business Machines Corporation | Pluggable electronic circuit package assembly with snap together heat sink housing |
| US5155579A (en) * | 1991-02-05 | 1992-10-13 | Advanced Micro Devices | Molded heat sink for integrated circuit package |
| JPH0629683A (en) * | 1992-03-31 | 1994-02-04 | Furukawa Electric Co Ltd:The | Heat pipe type heat dissipation unit for electronic devices |
| KR100321810B1 (en) * | 1994-09-16 | 2002-06-20 | 타나카 시게노부 | Personal computer cooler with hinged heat pipe |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5732613Y2 (en) * | 1976-12-31 | 1982-07-17 | ||
| JPS5626977U (en) * | 1979-08-08 | 1981-03-12 |
-
1984
- 1984-03-23 JP JP59055520A patent/JPS60198848A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60198848A (en) | 1985-10-08 |
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