JPH033542B2 - - Google Patents
Info
- Publication number
- JPH033542B2 JPH033542B2 JP57163004A JP16300482A JPH033542B2 JP H033542 B2 JPH033542 B2 JP H033542B2 JP 57163004 A JP57163004 A JP 57163004A JP 16300482 A JP16300482 A JP 16300482A JP H033542 B2 JPH033542 B2 JP H033542B2
- Authority
- JP
- Japan
- Prior art keywords
- viscous substance
- plate
- pin
- holes
- plate making
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3465—Application of solder
- H05K3/3485—Application of solder paste, slurry or powder
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
本発明は、クリーム状ハンダ等の粘性物質の塗
出方法に関し、その目的とするところは、プリン
ト基板等の段差のある被検出物体の多数個所への
同時塗出を可能にすることにある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for dispensing a viscous substance such as creamy solder, and its purpose is to simultaneously dispense a viscous substance such as a printed circuit board to multiple locations on an object to be detected with differences in level. It is about making it possible.
従来の印刷による塗出方法について第４図によ
り説明する。本体ベース４１上に左右に平行移動
する構造を有するスライドベツド４２があり、該
ベツト４２の中央にはプリント基板等の被印刷物
４３を保持するためのベツドの窪み４４を設け、
該窪み４４に平面形状の被印刷物４３をセツトす
る。印刷を行う場合、スライドベツト４２はエア
ーシリンダー４０に依り図面上右方向に移動させ
る。この時、製版２上にはクリーム状ハンダから
成る粘性物質１０を準備しておき、エアーシリン
ダー７に依りスクレツパー９を下げる。この時、
製版２とスクレツパー９との間隔は0.5〜１mm程
度にする。又、スキージ３はエアーシリンダー６
に依り上方に上げておく、スキージ３及びスクレ
ツパー９を取り付けた取付板５をエアーシリンダ
ー８で図面上左方向に移動すると、製版２上には
粘性物質１０が一定の厚みでコーテイングされ
る。そして取付板５が最も左へ行つた状態でスク
レツパー９はエアーシリンダー７で上昇し、スキ
ージ３をエアーシリンダー６で下げる。この時、
スキージ３は、製版２に対して１〜３Kgの圧力を
かけ、前記取付板５をシリンダー８に依り右方向
へ移動する。取付板５が最も右へ移動した状態で
スキージ３をシリンダー６で上昇する。スライド
ベツド４２はシリンダー４０に依り左方向に移動
する（元の位置に戻す）。その結果、前記被印刷
物上には製版２が形成された穴形状（パターン形
状）に対応した粘性物質１０が印刷形成される。 A conventional printing method will be explained with reference to FIG. There is a slide bed 42 on the main body base 41 which has a structure that moves horizontally in parallel, and a recess 44 in the bed for holding a printing material 43 such as a printed circuit board is provided in the center of the bed 42.
A planar printing material 43 is set in the depression 44. When printing, the slide bed 42 is moved rightward in the drawing by the air cylinder 40. At this time, a viscous substance 10 made of creamy solder is prepared on the plate making 2, and the scraper 9 is lowered by the air cylinder 7. At this time,
The interval between the plate making 2 and the scraper 9 is approximately 0.5 to 1 mm. Also, the squeegee 3 is an air cylinder 6.
When the mounting plate 5 to which the squeegee 3 and scraper 9 are attached is moved to the left in the drawing using the air cylinder 8, the viscous substance 10 is coated on the plate making 2 with a constant thickness. Then, with the mounting plate 5 moved to the leftmost position, the scraper 9 is raised by the air cylinder 7, and the squeegee 3 is lowered by the air cylinder 6. At this time,
The squeegee 3 applies a pressure of 1 to 3 kg to the plate making 2, and the mounting plate 5 is moved to the right by the cylinder 8. With the mounting plate 5 moved to the far right, the squeegee 3 is raised using the cylinder 6. The slide bed 42 is moved to the left by the cylinder 40 (returned to its original position). As a result, the viscous substance 10 corresponding to the hole shape (pattern shape) formed by the plate 2 is printed on the printing substrate.
しかし、前記従来例の印刷方法には、被印刷物
が平面形状である場合は良いが、被印刷物上に
種々の個別部品が形成されていたり、または、被
印刷物が枠体に組込まれているように、被印刷物
に高低段差がある場合は印刷は不可能である等の
欠点があつた。 However, although the conventional printing method described above is good when the printing material is flat, it is difficult to use the printing method when various individual parts are formed on the printing material, or when the printing material is incorporated into a frame. Another drawback was that printing was impossible if the printing material had a difference in height.
本発明は上記欠点を解消したもので、以下、そ
の一実施例を図面により説明する。 The present invention eliminates the above-mentioned drawbacks, and one embodiment thereof will be described below with reference to the drawings.
第１図は本発明の粘性物質の塗出方法の要部概
略正面図、第２図は同製版の斜視図、第３図は粘
性物質を被塗出物体に塗出する説明図であり、こ
こで、これ等の図面によつて、本発明の全体的な
構成、並びに動作を説明すると、第２図第３図に
おいて、製版枠１に取り付けた板状の製版２は穴
２ａを有する構造であり、該穴２ａに粘性物質１
０を予め充填しておき、該穴２ａ上部に対応させ
て押出しピン１４を配置し、該穴２ａ下部に被塗
出物体１９を配設した構造である。次に第１図に
依りその動作を説明する。なお、本発明における
粘性物質とは、例えばクリーム状ハンダ、パテ状
の接着剤及びクリーム等である。 FIG. 1 is a schematic front view of the main part of the method for applying a viscous substance of the present invention, FIG. 2 is a perspective view of the same plate making, and FIG. 3 is an explanatory diagram of applying the viscous substance to an object. Here, the overall structure and operation of the present invention will be explained with reference to these drawings. In FIGS. 2 and 3, the plate-shaped plate 2 attached to the plate making frame 1 has a structure having holes 2a , and the viscous substance 1 is placed in the hole 2a.
0 is filled in advance, an extrusion pin 14 is arranged corresponding to the upper part of the hole 2a, and an object to be coated 19 is arranged in the lower part of the hole 2a. Next, the operation will be explained with reference to FIG. Note that the viscous substance in the present invention includes, for example, creamy solder, putty-like adhesive, cream, and the like.
先ず、製版２の穴２ａに粘性物質１０を充填す
る方法は、通常使用されているスクリーン印刷法
と同じである。製版２に粘性物質１０を充填する
前に、予めスライドプレート１１をシリンダー１
２に依り図面上左へ動かしておく。そこで、前述
の印刷方法で示した様に、スキージ３及びスクレ
ツパー９を用いて製版２の穴２ａに粘性物質１０
を充填し、その後、スライドプレート１１をシリ
ンダー１２に依り元へ戻す。 First, the method of filling the holes 2a of the plate 2 with the viscous substance 10 is the same as the commonly used screen printing method. Before filling the plate making 2 with the viscous substance 10, the slide plate 11 is placed in the cylinder 1 in advance.
Move it to the left on the drawing according to step 2. Therefore, as shown in the above-mentioned printing method, the viscous material 10 is inserted into the hole 2a of the plate making 2 using the squeegee 3 and the scraper 9.
After that, the slide plate 11 is returned to its original position by the cylinder 12.
次に、製版２上方にはピンブロツク１５が配置
され、該ピンブロツク１５には前記製版２の穴２
ａに対応した複数本の押出しピン１４が各々ピン
ブロツク１５内に移動可能なようにバネ１３で付
勢されてピンブロツクの下面に保持されている。
そして、該ピンブロツク１５がアクチエータ１６
に依り下降し、製版２の穴２ａに充填した粘性物
質１０は押出しピン１４により押出され、該押出
しピン１４の下端部に付着する。更に、押出しピ
ン１４を下降させると、表面に個別部品２２を有
するプリント基板２０を枠体２３に組込んだもの
から成る被塗出物体１９の、塗出必要な部分の先
ず高位置Ｈに或る押出しピン１４が当たる。ま
た、更に押出しピン１４を下降させると、次には
塗出必要な部分である低位置Ｌに他の押出しピン
１４が当たる。この時、高位置Ｈに当つた押出し
ピン１４は前記バネ１３の弾圧力に抗してピンブ
ロツク１５内にその移動距離だけ移動するように
なつている。押出しピン１４の当つた個所は粘性
物質１０が付着する。なお、第１図において、１
７は位置決め板、１８は位置決めブロツク、２１
は枠体２３に取り付けた支切り板である。 Next, a pin block 15 is arranged above the plate making 2, and the pin block 15 has holes 2 in the plate making 2.
A plurality of push-out pins 14 corresponding to a are urged by springs 13 and held on the lower surface of the pin block 15 so that they can each move into the pin block 15.
Then, the pin block 15 acts as an actuator 16.
The viscous substance 10 filled in the holes 2a of the plate-making plate 2 is pushed out by the push-out pin 14 and adheres to the lower end of the push-out pin 14. Further, when the push-out pin 14 is lowered, the part to be coated of the object to be coated 19, which consists of a printed circuit board 20 having individual parts 22 on its surface assembled into a frame 23, is first placed at a high position H. The push-out pin 14 hits. Further, when the push-out pin 14 is lowered further, another push-out pin 14 hits the low position L, which is the part that needs to be coated. At this time, the push-out pin 14 that has hit the high position H moves into the pin block 15 by the moving distance against the elastic force of the spring 13. The viscous substance 10 adheres to the area where the extrusion pin 14 hits. In addition, in Figure 1, 1
7 is a positioning plate, 18 is a positioning block, 21
is a support plate attached to the frame body 23.
叙上のように、本発明によれば、たとえ被検出
物体１９に高低の段差があつても、その被検出物
体１９の多数個所へ粘性物質を同時に塗出するこ
とが可能であり、生産性にすぐれているという顕
著な効果を奏する。 As described above, according to the present invention, even if the object to be detected 19 has a height difference, it is possible to apply the viscous substance to multiple locations on the object to be detected 19 at the same time, thereby improving productivity. It has a remarkable effect of being excellent.
第１図は本発明の粘性物質の塗出方法に係る塗
出装置全体を示す要部概略正面図、第２図は同装
置に使用する製版の斜視図、第３図は粘性物質を
被検出物体に塗出する説明図、第４図は従来の印
刷方法に係るスクリーン印刷機を示す概略正面図
である。
２…製版、２ａ…製版２の穴、１０…粘性物
質、１３…バネ、１４…押出しピン、１５…ピン
ブロツク、１９…被検出物体。
Fig. 1 is a schematic front view of main parts showing the entire coating device according to the viscous substance coating method of the present invention, Fig. 2 is a perspective view of the plate making used in the device, and Fig. 3 is a viscous substance to be detected. FIG. 4, which is an explanatory diagram for painting an object, is a schematic front view showing a screen printer according to a conventional printing method. 2... Plate making, 2a... Hole of plate making 2, 10... Viscous substance, 13... Spring, 14... Extrusion pin, 15... Pin block, 19... Object to be detected.
Claims (1)
粘性物質を充填し、上端をバネで付勢した押出し
ピンを前記穴に対応して前記製版の上方に配置
し、該押出しピンを押し下げることにより該押出
しピンの下端部で前記粘性物質を押し出して被塗
出物体に付着させることを特徴とる粘性物質の塗
出方法。1 Fill the holes of a plate-making plate with a plurality of holes at predetermined locations with a viscous substance, place an extrusion pin whose upper end is biased by a spring above the plate-making plate in correspondence with the holes, and press the extrusion pin. A method for applying a viscous substance, characterized in that the viscous substance is pushed out at the lower end of the extrusion pin by pressing down, and the viscous substance is adhered to the object to be coated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57163004A JPS5952566A (en) | 1982-09-18 | 1982-09-18 | Application of viscous substance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57163004A JPS5952566A (en) | 1982-09-18 | 1982-09-18 | Application of viscous substance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5952566A JPS5952566A (en) | 1984-03-27 |
| JPH033542B2 true JPH033542B2 (en) | 1991-01-18 |
Family
ID=15765361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57163004A Granted JPS5952566A (en) | 1982-09-18 | 1982-09-18 | Application of viscous substance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5952566A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60223193A (en) * | 1984-03-06 | 1985-11-07 | ノ−ザン・テレコム・リミテツド | Device and method for coating solder paste on circuit board |
| DE10201120A1 (en) * | 2002-01-15 | 2003-07-31 | Bosch Gmbh Robert | Device for applying a medium at an application position on a substrate |
| CN110899892B (en) * | 2019-12-16 | 2021-03-30 | 东莞市硕动自动化设备有限公司 | Electrical component pin positioning and welding integrated machine for assembling circuit board |
-
1982
- 1982-09-18 JP JP57163004A patent/JPS5952566A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5952566A (en) | 1984-03-27 |
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