JPH0335832B2 - - Google Patents
Info
- Publication number
- JPH0335832B2 JPH0335832B2 JP60273073A JP27307385A JPH0335832B2 JP H0335832 B2 JPH0335832 B2 JP H0335832B2 JP 60273073 A JP60273073 A JP 60273073A JP 27307385 A JP27307385 A JP 27307385A JP H0335832 B2 JPH0335832 B2 JP H0335832B2
- Authority
- JP
- Japan
- Prior art keywords
- cooling mechanism
- heat sink
- integrated circuit
- solder
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/877—Bump connectors and die-attach connectors
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
〔概要〕
本発明のヒートシンク着脱機構は、熱伝導媒体
として集積回路素子とヒートシンク間に介在する
半田を溶融させるための加熱棒を備えた加熱ブロ
ツクが、冷却機構のカバーを取り外すことによつ
て冷却機構本体内へ自在に挿抜できる構成になつ
ている。[Detailed Description of the Invention] [Summary] The heat sink attachment/detachment mechanism of the present invention is such that a heating block equipped with a heating rod for melting solder interposed between an integrated circuit element and a heat sink as a heat conduction medium is attached to a cover of a cooling mechanism. By removing the cooling mechanism, it can be freely inserted into and removed from the cooling mechanism body.
このため、集積回路素子と冷却機構との接合／
分離作業、即ちヒートシンクの着脱作業が著しく
効率化される。 For this reason, the connection between the integrated circuit element and the cooling mechanism/
The separation work, that is, the work of attaching and detaching the heat sink, becomes significantly more efficient.
本発明は大型電算機等に装備される集積回路素
子用冷却装置の改良に係り、特に熱伝導媒体を構
成する半田の溶融手段を合理化したヒートシンク
着脱機構に関する。
The present invention relates to improvements in cooling devices for integrated circuit devices installed in large computers, etc., and more particularly to a heat sink attachment/detachment mechanism that streamlines the means for melting solder constituting a heat transfer medium.
従来のヒートシンク着脱方法としては、例え
ば、
集積回路素子が実装された機板と冷却機構と
を同時に加熱槽に収容して雰囲気温度を上げ、
冷却機構と集積回路素子とを接合している半田
を溶融させる。
Conventional heat sink attachment/detachment methods include, for example, placing a machine board on which integrated circuit elements are mounted and a cooling mechanism in a heating tank at the same time to raise the ambient temperature;
The solder joining the cooling mechanism and the integrated circuit element is melted.
複数個の半田鏝を用いて、冷却機構と集積回
路素子間の半田を同時に溶融させる。 A plurality of soldering irons are used to simultaneously melt the solder between the cooling mechanism and the integrated circuit element.
といつた方法がある。There is a method.
しかしながら上記方法の内、の場合は、集積
回路素子が実装された機板と冷却機構とを一緒に
加熱槽に収容するため、大容量の加熱槽を必要と
する。またの場合は、各所に散在する半田を同
時に溶融させる技術に問題がある。
However, in the case of the above-mentioned method, a large-capacity heating tank is required because the machine board on which the integrated circuit element is mounted and the cooling mechanism are housed together in the heating tank. In this case, there is a problem in the technique of simultaneously melting solder scattered in various places.
本発明はこのような従来の問題点を解決して、
ヒートシンクの着脱作業を効率化するためになさ
れたものである。 The present invention solves these conventional problems and
This was done to make the work of attaching and detaching the heat sink more efficient.
本発明は第１図の実施例に示すように、冷却機
構１８が冷却機構本体１０と冷却機構カバー１１
とに分割されている。そして該冷却機構カバー１
１を取り外すことによつて、加熱ブロツク１５を
冷却機構本体１０内へ挿入できるようになつてい
る。
As shown in the embodiment of FIG.
It is divided into. and the cooling mechanism cover 1
By removing the heating block 1, the heating block 15 can be inserted into the cooling mechanism main body 10.
このように構成されたものにおいては、“冷却
機構カバー１１を取り外して代わりに加熱ブロツ
ク１５を冷却機構本体１０内に挿入する”といつ
た簡単な操作によつて、ヒートシンク５と集積回
路素子１間の半田２を溶融することができるの
で、ヒートシンク着脱作業が著しく簡略化され
る。
With this configuration, the heat sink 5 and the integrated circuit element 1 can be connected by a simple operation such as "removing the cooling mechanism cover 11 and inserting the heating block 15 into the cooling mechanism body 10 instead". Since the solder 2 in between can be melted, the work of attaching and detaching the heat sink is significantly simplified.
以下図面に示した実施例に基づいて本発明を詳
細に説明する。
The present invention will be described in detail below based on embodiments shown in the drawings.
第１図は本発明によるヒートシンク着脱機構の
一実施例を示す側断面図である。 FIG. 1 is a side sectional view showing an embodiment of a heat sink attachment/detachment mechanism according to the present invention.
第１図に示すように、本発明のヒートシンク着
脱機構は、冷却機構１８を構成する冷却機構カバ
ー１１が着脱自在に形成され、ヒートシンク着脱
時は該冷却機構カバー１１が取り外されて代わり
に加熱ブロツク１５が冷却機構本体１０内へ挿入
されるようになつている（このとき加熱ブロツク
１５に付設された加熱棒３と冷却機構１８のヒー
トシンク５とは互いに当接状態となる）。 As shown in FIG. 1, in the heat sink attachment/detachment mechanism of the present invention, a cooling mechanism cover 11 constituting a cooling mechanism 18 is formed to be detachable, and when the heat sink is attached/detached, the cooling mechanism cover 11 is removed and the heating block is replaced. 15 is inserted into the cooling mechanism main body 10 (at this time, the heating rod 3 attached to the heating block 15 and the heat sink 5 of the cooling mechanism 18 are in contact with each other).
そして加熱棒３のヒータ６に通電を行うことに
よつて加熱棒３の温度が上がり、その熱がヒート
シンク５を介して半田２に伝わつて基板２０に実
装された集積回路素子１とヒートシンク５とを接
合している該半田２を溶融させる（半田２の溶融
によつてヒートシンクの着脱が可能になる）。 By energizing the heater 6 of the heating rod 3, the temperature of the heating rod 3 increases, and the heat is transmitted to the solder 2 via the heat sink 5, and the integrated circuit element 1 and the heat sink 5 mounted on the substrate 20 are connected to each other. (The heat sink can be attached and detached by melting the solder 2.)
なお加熱棒３は個々にヒータ６を内蔵してお
り、該ヒータ６に対する通電制御は図示されない
制御装置によつて行われる。 Each of the heating rods 3 has a built-in heater 6, and power supply to the heater 6 is controlled by a control device (not shown).
第２図は加熱ブロツク機構１５の一構成例を示
す側断面図である。図中のバネ７は加熱棒３と前
第１図に示したヒートシンク５とを密接させるべ
く設けられた部材で、加熱棒３を矢印Ａ方向に付
勢する機能を有している。 FIG. 2 is a side sectional view showing an example of the configuration of the heating block mechanism 15. A spring 7 in the figure is a member provided to bring the heating rod 3 and the heat sink 5 shown in FIG. 1 into close contact with each other, and has a function of urging the heating rod 3 in the direction of arrow A.
第３図は冷却機構の一構成例を示す要部側断面
図である。 FIG. 3 is a side sectional view of a main part showing an example of the configuration of the cooling mechanism.
同図に示すように、本発明に用いる冷却機構１
８は冷却機構本体１０と冷却機構カバー１１とに
２分割されている。そして冷却機構として動作す
る時の両者は、ネジ部材３０によつて互いに接合
されている。ガスケツト２５は矢印方向に流動す
る冷媒２１の漏洩を防止するための部材である。 As shown in the figure, cooling mechanism 1 used in the present invention
8 is divided into two parts: a cooling mechanism main body 10 and a cooling mechanism cover 11. When operating as a cooling mechanism, both are connected to each other by a screw member 30. Gasket 25 is a member for preventing leakage of refrigerant 21 flowing in the direction of the arrow.
図中、２２は冷媒入口、２３は冷媒出口であ
る。 In the figure, 22 is a refrigerant inlet, and 23 is a refrigerant outlet.
本発明は以上説明したように、ヒートシンクと
集積回路素子とを結合している熱伝導媒体用の半
田が、冷却機構内に加熱ブロツク機構を挿入して
加熱するといつた簡単な操作によつて溶融される
ため、ヒートシンク着脱操作が著しく簡素化され
る。
As explained above, the present invention melts the solder for the thermal conductive medium that connects the heat sink and the integrated circuit element by a simple operation such as inserting a heating block mechanism into the cooling mechanism and heating it. This greatly simplifies the heat sink attachment/detachment operation.
第１図は本発明によるヒートシンク着脱機構の
一実施例を示す側断面図、第２図は加熱ブロツク
機構１５の一構成例を示す側断面図、第３図は冷
却機構の一構成例を示す要部側断面図である。
図中、１は集積回路素子、２は半田、３は加熱
棒、５はヒートシンク、６はヒータ、７はバネ、
１０は冷却機構本体、１１は冷却機構カバー、１
５は加熱ブロツク、１８は冷却機構、２０は基
板、２１は冷媒、２２は冷媒入口、２３は冷媒出
口、３０はネジ部材をそれぞれ示す。
FIG. 1 is a side sectional view showing an embodiment of the heat sink attaching/detaching mechanism according to the present invention, FIG. 2 is a side sectional view showing an example of the configuration of the heating block mechanism 15, and FIG. 3 is a side sectional view showing an example of the configuration of the cooling mechanism. FIG. In the figure, 1 is an integrated circuit element, 2 is solder, 3 is a heating rod, 5 is a heat sink, 6 is a heater, 7 is a spring,
10 is a cooling mechanism main body, 11 is a cooling mechanism cover, 1
5 is a heating block, 18 is a cooling mechanism, 20 is a substrate, 21 is a refrigerant, 22 is a refrigerant inlet, 23 is a refrigerant outlet, and 30 is a screw member.
Claims (1)
却装置のヒートシンク着脱機構であつて、 該ヒートシンク着脱機構は、冷却機構本体１０
と冷却機構カバー１１とが分離できる冷却機構１
８を具備してなり、該冷却機構カバー１１を外し
た状態でヒートシンク５が半田溶融用の加熱体と
当接可能に露出するように構成したことを特徴と
するヒートシンク着脱機構。[Scope of Claims] 1. A heat sink attachment/detachment mechanism for an integrated circuit device cooling device using solder 2 as a heat conductive medium, the heat sink attachment/detachment mechanism being connected to a cooling mechanism main body 10.
Cooling mechanism 1 in which the and cooling mechanism cover 11 can be separated
8, and is configured such that when the cooling mechanism cover 11 is removed, the heat sink 5 is exposed so as to be able to come into contact with a heating element for melting solder.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60273073A JPS62131550A (en) | 1985-12-03 | 1985-12-03 | Heat-sink attaching and detaching mechanism |
| EP86307669A EP0217676B1 (en) | 1985-10-04 | 1986-10-03 | Cooling system for electronic circuit device |
| US06/914,942 US4879632A (en) | 1985-10-04 | 1986-10-03 | Cooling system for an electronic circuit device |
| DE86307669T DE3688962T2 (en) | 1985-10-04 | 1986-10-03 | Cooling system for an electronic circuit arrangement. |
| US07/079,876 US4920574A (en) | 1985-10-04 | 1987-07-30 | Cooling system for an electronic circuit device |
| US07/079,877 US4783721A (en) | 1985-10-04 | 1987-07-30 | Cooling system for an electronic circuit device |
| US07/261,904 US5126919A (en) | 1985-10-04 | 1988-10-25 | Cooling system for an electronic circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60273073A JPS62131550A (en) | 1985-12-03 | 1985-12-03 | Heat-sink attaching and detaching mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62131550A JPS62131550A (en) | 1987-06-13 |
| JPH0335832B2 true JPH0335832B2 (en) | 1991-05-29 |
Family
ID=17522766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60273073A Granted JPS62131550A (en) | 1985-10-04 | 1985-12-03 | Heat-sink attaching and detaching mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62131550A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3241639B2 (en) | 1997-06-30 | 2001-12-25 | 日本電気株式会社 | Multi-chip module cooling structure and method of manufacturing the same |
| JP6410920B2 (en) * | 2015-03-10 | 2018-10-24 | 三菱電機株式会社 | Power conversion device and refrigeration cycle device |
-
1985
- 1985-12-03 JP JP60273073A patent/JPS62131550A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62131550A (en) | 1987-06-13 |
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