JPH0337125B2 - - Google Patents
Info
- Publication number
- JPH0337125B2 JPH0337125B2 JP55188569A JP18856980A JPH0337125B2 JP H0337125 B2 JPH0337125 B2 JP H0337125B2 JP 55188569 A JP55188569 A JP 55188569A JP 18856980 A JP18856980 A JP 18856980A JP H0337125 B2 JPH0337125 B2 JP H0337125B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- tool
- light beam
- light
- rotating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
Description
【発明の詳細な説明】
［技術分野］
本発明は、旋盤加工やスピニング加工のように
素材を回転させながら加工する加工装置の被加工
材表面に形成された凹凸を表面に接触しないで測
定する回転体の表面粗さ測定装置に関するもので
ある。[Detailed Description of the Invention] [Technical Field] The present invention measures irregularities formed on the surface of a workpiece of a processing device that processes the material while rotating it, such as lathe processing or spinning processing, without contacting the surface. The present invention relates to a surface roughness measuring device for a rotating body.
［背景技術］
従来の非接触型の表面粗さ計としては、第１図
及び第２図に示すように、光切断法を使つた装置
がある。この装置は、回転中の被加工材１の加工
表面７に帯状光を照射し、その反射光をテレビカ
メラ１４で撮像することにより加工表面７の凹凸
状態を観測するものであり、数μｍよりも大きい
凹凸を測定する際には観測系（すなわち、テレビ
カメラ１４）を被加工材１の加工表面７に十分に
近付ける必要がある。すなわち、凹凸が大きい場
合には反射光の強度が向きによつて大きく変化す
るから、観測系を加工表面７に十分に近付けなけ
れば、必要な反射光を観測系に入射させることが
できないのである。しかしながら、このように被
加工材１に観測系であるテレビカメラ１４を近接
配置すると、飛散した切削油がテレビカメラ１４
のレンズに付着して、正確な測定ができなくなる
という問題が発生し、また、切削くずが観測系に
引掛かることがあり、作業に危険を及ぼすことが
あつた。[Background Art] As a conventional non-contact type surface roughness meter, there is a device using a light cutting method, as shown in FIGS. 1 and 2. This device irradiates the processing surface 7 of the rotating workpiece 1 with band-shaped light and images the reflected light with a television camera 14 to observe the uneven state of the processing surface 7. When measuring even large irregularities, it is necessary to bring the observation system (that is, the television camera 14) sufficiently close to the machined surface 7 of the workpiece 1. In other words, when the irregularities are large, the intensity of the reflected light changes greatly depending on the direction, so the necessary reflected light cannot be made to enter the observation system unless the observation system is brought sufficiently close to the processed surface 7. . However, when the television camera 14, which is an observation system, is placed close to the workpiece 1 in this way, the scattered cutting oil may be exposed to the television camera 14.
There was a problem that the cutting chips adhered to the lens, making it impossible to make accurate measurements.Additionally, the cutting chips could get caught in the observation system, posing a danger to the work.
［発明の目的］
本発明は上述したような従来の問題を解消する
ために為されたものであり、非接触型の表面粗さ
の観測系と被加工材との距離を十分に離して配置
しても十分に高い測定精度を得ることができるよ
うにした回転体の表面粗さ測定装置を提供するこ
とを目的とするものである。[Purpose of the Invention] The present invention was made to solve the conventional problems as described above, and it is arranged with a sufficient distance between the non-contact surface roughness observation system and the workpiece. It is an object of the present invention to provide a surface roughness measuring device for a rotating body that can obtain sufficiently high measurement accuracy even when the surface roughness of a rotating body is measured.
［発明の開示］
（構成）
本発明に係る回転体の表面粗さ測定装置は、被
加工材１を回転させる回転駆動手段２と、被加工
材１の表面である回転面３に当接して被加工材１
の表面を切削加工する工具４と、工具４を回転軸
方向に移動させる軸方向移動手段５と、被加工材
１の加工表面に光ビームを回転軸に対して交差す
る方向から入射する光ビーム入射装置８と、加工
表面で反射された反射光ビームの振れの大きさを
測定する光入射位置検出装置９と、被加工材１が
少なくとも１回転する間は測定点を固定しその後
工具送りピツチに相当する距離だけ測定点を移動
させる動作を間欠的に繰り返す測定点移動手段と
を設け、光入射位置検出装置９の出力を時間につ
いて積分するとともにその積分結果と工具送り速
度とを乗算する演算回路１０を設け、演算回路１
０の出力の最大値と最小値との差から加工表面に
おける凹凸の高さを検出するピーク幅検出回路１
１を設けて成るものであり、被加工材１が少なく
とも１回転する間の反射光の振れ幅に基づいて１
ピツチ分の加工表面７の凹凸の高さを検出し、か
つ、工具の送りピツチに合わせて測定点を間欠的
に移動させることにより、被加工材１の全長に亘
る情報を得るようにしたものである。[Disclosure of the Invention] (Structure) The surface roughness measuring device for a rotating body according to the present invention includes: a rotation drive means 2 for rotating a workpiece 1; Work material 1
a tool 4 for cutting the surface of the workpiece, an axial moving means 5 for moving the tool 4 in the direction of the rotation axis, and a light beam that enters the processing surface of the workpiece 1 from a direction intersecting the rotation axis. An input device 8, a light incidence position detection device 9 that measures the magnitude of deflection of the reflected light beam reflected on the processing surface, and a measurement point fixed while the workpiece 1 rotates at least once, and then a tool feed pitch. is provided with a measurement point moving means that intermittently repeats the operation of moving the measurement point by a distance corresponding to A circuit 10 is provided, and an arithmetic circuit 1
Peak width detection circuit 1 detects the height of unevenness on the machined surface from the difference between the maximum and minimum output values of 0
1 based on the amplitude of the reflected light during at least one rotation of the workpiece 1.
Information over the entire length of the workpiece 1 is obtained by detecting the height of the unevenness on the machined surface 7 corresponding to the pitch and moving the measurement point intermittently in accordance with the feed pitch of the tool. It is.
（実施例）
第３図は本発明の原理を示すものであり、レー
ザビームのように細く絞られた光ビームを光ビー
ム入射装置８から被加工材１の半径方向に対して
入射角αで入射させている。ここに、加工表面７
が平坦であれば、入射光線は反射角αで反射され
ることになるのであり、このときの反射光ビーム
が光入射位置検出装置９の中央部に入射するよう
に設定される。一方、加工表面７が平坦ではな
く、回転軸方向に対して微小角度θだけ傾いてい
るとすると、反射光線は角度2θだけ中央位置から
偏位する。光入射位置検出装置９はこの偏位量を
検出するものであり、光入射位置検出装置９上に
おける入射スポツトの偏位量をｘ、加工表面７に
おける光反射点と光入射位置検出装置９との間の
距離をｌとすると、光入射位置検出装置９の出力
ｘは次式で与えられる。(Example) Fig. 3 shows the principle of the present invention, in which a narrowly focused light beam like a laser beam is emitted from the light beam incidence device 8 at an incident angle α with respect to the radial direction of the workpiece 1. It is incident. Here, processing surface 7
If is flat, the incident light beam will be reflected at the reflection angle α, and the setting is such that the reflected light beam at this time is incident on the center of the light incidence position detection device 9. On the other hand, if the processed surface 7 is not flat but is inclined by a small angle θ with respect to the direction of the rotation axis, the reflected light beam will be deviated from the central position by an angle 2θ. The light incidence position detection device 9 detects this amount of deviation, and calculates the amount of deviation of the incident spot on the light incidence position detection device 9 by x, and the light reflection point on the processing surface 7 and the light incidence position detection device 9. Assuming that the distance between them is l, the output x of the light incident position detection device 9 is given by the following equation.
ｘ＝ｌ・tan2θ
角度θは十分に微小であるから、tan2θ≒2θと
なり、結局、
ｘ＝2lθ
と考えることができる。ところで、被加工材１を
一定の回転数で回転させながら工具を被加工材１
の軸方向に一定速度で移動させて加工すると、被
加工材１の加工表面７には螺旋状のロール目が形
成される。ここで、光ビーム入射装置８からの入
射光線は被加工材１の軸方向に対して一定角度を
なすようにして入射しているから、螺旋状のロー
ル目が隙間なく密に形成されているとすれば、被
加工材１が１回転するときに入射光線の反射点は
螺旋の山と谷とを必ず通ることになる。つまり、
光ビーム入射装置８からの入射光線を固定しなが
らも、被加工材１を回転させることにより、加工
表面７の凹凸形状における最大変位幅を検出する
ことが可能になるのである。第７図に示すよう
に、反射点が微小距離dsだけ移動したとすると、
被加工材１の半径方向（ｙ方向）の変位量dyは
上記角度θを用いれば、dy＝θ・dsであるから、
半径方向の変位量ｙは、次式で表わすことができ
る。 x=l・tan2θ Since the angle θ is sufficiently small, tan2θ≒2θ, and in the end, it can be considered that x=2lθ. By the way, while rotating the workpiece 1 at a constant rotation speed, the tool
When the workpiece 1 is moved at a constant speed in the axial direction, a spiral roll pattern is formed on the workpiece surface 7 of the workpiece 1. Here, since the incident light beam from the light beam incidence device 8 is incident at a constant angle with respect to the axial direction of the workpiece 1, the spiral roll mesh is formed densely without any gaps. Then, when the workpiece 1 rotates once, the reflection point of the incident light beam will necessarily pass through the peaks and valleys of the spiral. In other words,
By rotating the workpiece 1 while fixing the incident light beam from the light beam incidence device 8, it becomes possible to detect the maximum displacement width in the uneven shape of the processing surface 7. As shown in Figure 7, if the reflection point moves by a minute distance ds, then
Since the displacement dy of the workpiece 1 in the radial direction (y direction) is dy = θ・ds using the above angle θ,
The displacement amount y in the radial direction can be expressed by the following equation.
ｙ＝∫dy＝∫θ・ds
ここで、被加工材１の回転数をｎ［rps］、工具
４の送りピツチ（すなわち、被加工材１への筋の
形成ピツチ）をｐ［mm］とすると、時間dtにおけ
る反射点の変位量dsは、dt／ds＝１／npとなり、
工具４の送り速度ｖ［mm／sec］は、ｖ＝npで表
わされるから、ds＝ｖ・dtとなり、半径方向の変
位量ｙは、次式で表わされるのである。 y=∫dy=∫θ・ds Here, the rotation speed of the workpiece 1 is n [rps], and the feed pitch of the tool 4 (that is, the pitch at which streaks are formed on the workpiece 1) is p [mm]. Then, the displacement ds of the reflection point at time dt is dt/ds=1/np,
Since the feed rate v [mm/sec] of the tool 4 is expressed by v=np, ds=v·dt, and the radial displacement amount y is expressed by the following equation.
ｙ＝∫θv・dt＝（ｖ／2l）∫x・dt
したがつて、加工表面７の半径方向の位置を表
わす変数ｙは、光入射位置検出装置９と光反射点
との間の距離ｌが一定であるとすれば、光入射位
置検出装置９の出力ｘを時間について積分して、
軸方向移動手段５の移動速度ｖを乗算すれば容易
に得ることができるのである。 y=∫θv・dt=(v/2l)∫x・dt Therefore, the variable y representing the radial position of the processing surface 7 is the distance l between the light incident position detection device 9 and the light reflection point. is constant, the output x of the light incident position detection device 9 is integrated over time,
It can be easily obtained by multiplying by the moving speed v of the axial moving means 5.
第４図は上述の演算を行なう演算回路１０を示
すものであり、積分回路１２と乗算回路１３とに
より構成されている。両回路はオペレーシヨナル
アンプ等を用いて構成されるものである。上述し
たように、軸方向移動手段５により移動する工具
４の送り速度ｖは、被加工材１の回転速度ｎと工
具送りピツチｐとの積により求められるから、乗
算回路１３においてこの演算を行なうことによ
り、送り速度ｖを求めている。第６図ａは光入射
位置検出装置９の出力ｘの波形図を示すものであ
り、同図ｂの波形を見ればわかるように、演算回
路１０の出力波形は被加工材１の表面形状と相似
的な形状となつている。したがつて、ピーク幅検
出回路１１により、演算回路１０の出力波形ｙの
最大値ymaxと最小値yminとの差ｈを求めれば、
被加工材１の加工表面７に形成された凹凸形状の
高さｈを容易に求めることができるのである。 FIG. 4 shows an arithmetic circuit 10 that performs the above-mentioned arithmetic operations, and is composed of an integrating circuit 12 and a multiplication circuit 13. Both circuits are constructed using operational amplifiers and the like. As mentioned above, the feed speed v of the tool 4 moved by the axial movement means 5 is determined by the product of the rotational speed n of the workpiece 1 and the tool feed pitch p, so this calculation is performed in the multiplier circuit 13. By doing so, the feed rate v is determined. FIG. 6a shows a waveform diagram of the output x of the light incident position detection device 9, and as can be seen from the waveform in FIG. They have similar shapes. Therefore, if the peak width detection circuit 11 calculates the difference h between the maximum value ymax and the minimum value ymin of the output waveform y of the arithmetic circuit 10, then
The height h of the uneven shape formed on the processed surface 7 of the workpiece 1 can be easily determined.
ところで、光ビームの入射点が静止していると
加工表面７に形成された筋目の１ピツチ分につい
ての凹凸の高さｈを調べているだけであり、加工
表面７の全体についての情報を得ることはできな
い。そこで、第５図ａに示すように、測定点Piを
P1，P2，P3，P4…のように順次移動させて加工
表面７のすべての領域を走査できるように測定点
移動手段を設ける。このような測定点の移動は、
被加工材１の１回転毎に１回ずつ間欠的に行なう
ようにし、その移動量は加工表面に形成されるロ
ール目の１ピツチ分に相当する量とすれば、被加
工材１の加工表面７の粗さの測定を全く連続的に
（すなわち、被加工材１の全長に亘つてすべての
箇所で）行なうことができるのである。すなわ
ち、測定点は被加工材１が少なくとも１回転する
間は固定しておき、その後、工具４の送りピツチ
の１ピツチ分に相当する距離だけ回転軸方向に移
動させ、この動作を繰り返すことにより、最終的
に被加工材１の全長に亘る情報を得ることができ
るのである。 By the way, if the incident point of the light beam is stationary, only the height h of the unevenness for one pitch of the streaks formed on the processed surface 7 is checked, and information about the entire processed surface 7 is obtained. It is not possible. Therefore, as shown in Figure 5a, the measurement point Pi is
Measurement point moving means is provided so that the measuring point can be moved sequentially like P 1 , P 2 , P 3 , P 4 . . . to scan all areas of the processing surface 7. This kind of movement of the measurement point is
If the movement is performed intermittently once per rotation of the workpiece 1, and the amount of movement is equivalent to one pitch of the roll stitches formed on the workpiece surface, then the workpiece surface of the workpiece 1 7 can be carried out completely continuously (that is, at all locations along the entire length of the workpiece 1). In other words, the measurement point is fixed while the workpiece 1 rotates at least once, and then moved in the direction of the rotation axis by a distance equivalent to one pitch of the feed pitch of the tool 4, and by repeating this operation. , information over the entire length of the workpiece 1 can finally be obtained.
［発明の効果］
本発明は上述のように、被加工材を回転させる
回転駆動手段と、被加工材の表面である回転面に
当接して被加工材の表面を切削加工する工具と、
工具を回転軸方向に移動させる軸方向移動手段
と、被加工材の加工表面に光ビームを回転軸に対
して交差する方向から入射する光ビーム入射装置
と、加工表面で反射された反射光ビームの振れの
大きさを測定する光入射位置検出装置と、被加工
材が少なくとも１回転する間は測定点を固定しそ
の後工具送りピツチに相当する距離だけ測定点を
移動させる動作を間欠的に繰り返す測定点移動手
段とを設け、光入射位置検出装置の出力を時間に
ついて積分するとともにその積分結果と工具送り
速度とを乗算する演算回路を設け、演算回路の出
力の最大値と最小値との差から加工表面における
凹凸の高さを検出するピーク幅検出回路を設けて
成るものであり、被加工材が少なくとも１回転す
る間は測定点を固定して反射光の振れ幅に基づい
て加工表面の凹凸の高さを検出するので、被加工
材の加工中に被加工材の表面に形成されるロール
目（100μｍ程度以上の高さ）等の１ピツチ分に
関する凹凸を検出することができるのである。こ
のように、測定点を固定していることにより、イ
ンプロセス測定において加工表面の周速等を考慮
する必要がなく、切削により形成された溝の１ピ
ツチ分について凹凸の高さを簡単な計算のみで測
定することができるのである。また、被加工材が
少なくとも１回転してから工具送りピツチに相当
する距離だけ測定点を間欠的に移動させるので、
被加工材の表面のすべてのロール目に関して凹凸
の高さを求めることができるのであり、結局、被
加工材の全長に亘る情報を得ることができるので
ある。以上のように、少なくとも被加工材が少な
くとも１回転する間は測定点を固定し、１つのロ
ール目に関する凹凸形状を得るのであり、１つの
ロール目に対する凹凸形状に関する情報を得た後
には、工具の送りピツチの１ピツチ分だけ被加工
材の軸方向に測定点をずらして次の測定を行なう
ことにより、最終的に被加工材の全長に亘る凹凸
形状の測定を達成することができるのである。さ
らに、光入射位置検出装置は、被加工材の表面か
ら遠く離して配設するほど加工表面の凹凸形状を
精度よく検出することができる構成であるから、
従来のようにテレビカメラ等の観測系を被測定物
に近接させる必要がなく、切削油等が飛散してテ
レビカメラのレンズに付着したり、切削くずが観
測系に引掛つて故障の原因となることが防止でき
るのである。[Effects of the Invention] As described above, the present invention includes a rotational drive means for rotating a workpiece, a tool that cuts the surface of the workpiece by coming into contact with a rotating surface that is the surface of the workpiece,
An axial moving means for moving the tool in the direction of the rotation axis, a light beam incidence device for making a light beam incident on the machined surface of the workpiece from a direction intersecting the rotation axis, and a reflected light beam reflected from the machined surface. A light incident position detection device measures the amount of runout, and the operation of fixing the measurement point while the workpiece rotates at least once and then moving the measurement point by a distance equivalent to the tool feed pitch is repeated intermittently. A calculation circuit is provided which integrates the output of the light incident position detection device with respect to time and multiplies the result of the integration by the tool feed rate, and calculates the difference between the maximum value and minimum value of the output of the calculation circuit. This system is equipped with a peak width detection circuit that detects the height of the unevenness on the machined surface.The measurement point is fixed while the workpiece rotates at least once, and the peak width detection circuit detects the height of the unevenness on the machined surface based on the amplitude of the reflected light. Since the height of the unevenness is detected, it is possible to detect unevenness related to one pitch such as roll marks (height of about 100 μm or more) formed on the surface of the workpiece during processing. . In this way, by fixing the measurement point, there is no need to consider the circumferential speed of the machined surface during in-process measurement, and the height of the unevenness can be easily calculated for one pitch of the groove formed by cutting. It can be measured only by In addition, since the measurement point is intermittently moved by a distance corresponding to the tool feed pitch after the workpiece has rotated at least once,
The height of the unevenness can be determined for all rolls on the surface of the workpiece, and in the end, information over the entire length of the workpiece can be obtained. As described above, the measurement point is fixed at least while the workpiece rotates at least once, and the uneven shape for one roll is obtained. After obtaining information about the uneven shape for one roll, the tool By shifting the measurement point in the axial direction of the workpiece by one feed pitch and performing the next measurement, it is possible to finally measure the uneven shape over the entire length of the workpiece. . Furthermore, since the light incidence position detection device is configured to be able to detect the uneven shape of the processed surface with higher precision as it is disposed farther away from the surface of the workpiece,
Unlike conventional methods, there is no need to place the observation system such as a TV camera close to the object to be measured, which can cause cutting oil etc. to scatter and adhere to the TV camera lens, or cutting chips to get caught in the observation system, causing malfunctions. This can be prevented.
第１図は従来例を示す斜視図、第２図は同上の
要部拡大斜視図、第３図は本発明の一実施例を示
す側面図、第４図は同上のブロツク図、第５図ａ
は同上に用いる加工装置の側面図、第５図ｂは同
上の全体構成を示す斜視図、第６図ａは光入射位
置検出装置の出力ｘの波形図、第６図ｂは演算回
路の出力の波形図、第７図は本発明の原理を示す
説明図である。
１は被加工材、２は回転駆動手段、３は回転
面、４は工具、５は軸方向移動手段、６は加工装
置、７は加工表面、８は光ビーム入射装置、９は
光入射位置検出装置、１０は演算回路、１１はピ
ーク幅検出回路である。
Fig. 1 is a perspective view showing a conventional example, Fig. 2 is an enlarged perspective view of essential parts of the same as above, Fig. 3 is a side view showing an embodiment of the present invention, Fig. 4 is a block diagram of the same as above, and Fig. 5 a
5 is a side view of the processing device used in the above, FIG. 5 b is a perspective view showing the overall configuration of the above, FIG. 6 a is a waveform diagram of the output x of the light incident position detection device, and FIG. 6 b is the output of the arithmetic circuit. FIG. 7 is an explanatory diagram showing the principle of the present invention. 1 is a workpiece, 2 is a rotation drive means, 3 is a rotating surface, 4 is a tool, 5 is an axial movement means, 6 is a processing device, 7 is a processing surface, 8 is a light beam incidence device, 9 is a light incidence position In the detection device, 10 is an arithmetic circuit, and 11 is a peak width detection circuit.
Claims (1)
工材の表面である回転面に当接して被加工材の表
面を切削加工する工具と、工具を回転軸方向に移
動させる軸方向移動手段と、被加工材の加工表面
に光ビームを回転軸に対して交差する方向から入
射する光ビーム入射装置と、加工表面で反射され
た反射光ビームの振れの大きさを測定する光入射
位置検出装置と、被加工材が少なくとも１回転す
る間は測定点を固定しその後工具送りピツチに相
当する距離だけ測定点を移動させる動作を間欠的
に繰り返す測定点移動手段とを設け、光入射位置
検出装置の出力を時間について積分するとともに
その積分結果と工具送り速度とを乗算する演算回
路を設け、演算回路の出力の最大値と最小値との
差から加工表面における凹凸の高さを検出するピ
ーク幅検出回路を設けて成ることを特徴とする回
転体の表面粗さ測定装置。1. A rotation drive means for rotating a workpiece, a tool for cutting the surface of the workpiece by contacting a rotating surface that is the surface of the workpiece, and an axial movement means for moving the tool in the direction of the rotation axis. , a light beam incidence device that makes a light beam enter the processing surface of the workpiece from a direction intersecting the rotation axis, and a light incidence position detection device that measures the magnitude of the deflection of the reflected light beam reflected on the processing surface. and a measuring point moving means that intermittently repeats an operation of fixing the measuring point while the workpiece rotates at least once and then moving the measuring point by a distance corresponding to the tool feed pitch, and a light incident position detecting device. A calculation circuit is provided that integrates the output over time and multiplies the integration result by the tool feed rate, and the peak width is used to detect the height of the unevenness on the machined surface from the difference between the maximum and minimum values of the output of the calculation circuit. A surface roughness measuring device for a rotating body, comprising a detection circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18856980A JPS57113310A (en) | 1980-12-29 | 1980-12-29 | Measuring device for surface coarseness of rotary object |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18856980A JPS57113310A (en) | 1980-12-29 | 1980-12-29 | Measuring device for surface coarseness of rotary object |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57113310A JPS57113310A (en) | 1982-07-14 |
| JPH0337125B2 true JPH0337125B2 (en) | 1991-06-04 |
Family
ID=16225976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18856980A Granted JPS57113310A (en) | 1980-12-29 | 1980-12-29 | Measuring device for surface coarseness of rotary object |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57113310A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6262205A (en) * | 1985-09-13 | 1987-03-18 | Toray Ind Inc | Surface irregularity inspection for object |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5065254A (en) * | 1973-10-09 | 1975-06-02 |
-
1980
- 1980-12-29 JP JP18856980A patent/JPS57113310A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57113310A (en) | 1982-07-14 |
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