JPH0337299B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a resin injection device for semiconductor packages.

(Prior technology) Dual in-line package (hereinafter referred to as DIP)
Oki Electric Research and Development 118, 49 [3 volumes] Oki Electric Industry Co., Ltd.
There was something described on pages 40-46. The configuration will be explained below using figures.

Figure 2 shows a high-voltage optical coupling type for button telephone equipment.
FIG. 2 is a longitudinal sectional view showing an example of the structure of a DIP housing a PNPN switch (hereinafter referred to as an optical switch).

In Fig. 2, 1 is a ceramic DIP, and this DIP 1 has a DIP main body having a semicircular concave index portion 2 with a radius of approximately 2.6 mm on the side surface, and a lid that seals the top opening of this DIP main body 3. It consists of body 4. Inside the DIP main body 3, a large-diameter recess 5 is provided at an upper position thereof, and four small-diameter holes 6 for accommodating semiconductor chips are provided at a lower position of the recess 5. The bottom of each hole 6 has a first
Semiconductor chips, for example, light emitting diode chips (hereinafter referred to as LED chips) 7 each consisting of one element, are die-boarded (bonded), and each
The bottom of the recess 5 on the LED chip has four second
semiconductor chips, for example, first, second, third and fourth photothyristor chips (hereinafter referred to as SCR chips) in which 4PNPN elements are integrated into one chip.
8-1 to 8-4 are die-bonded at intervals of about 1.5 mm, respectively. Between each LED chip 7 and SCR chips 8-1 to 8-4,
A transparent resin 9 such as silicon is injected in order to improve the light transmission efficiency and dielectric strength of the LED.

Such an optical switch is connected to each SCR chip 8-
1 to 8-1 are composed of four PNPN elements,
4 PNPNs using the rectifying action of PNPN elements
Connect the elements in a bridge type, and connect the connections using DIP1.
This is done by internal wiring. Therefore, it has the functions of a diode bridge and a switch. Also, from the point of view of economy, one cross point should be replaced by one cross point.
Since it is desirable to drive the chip with an LED, the light-receiving parts of the four PNPN elements in one SCR chip are arranged so as to closely match the light emission output distribution of the LED.
4PNPN elements are effectively driven by 1LED.

This type of optical switch not only has functions equivalent to conventional mechanical switches, such as being able to electrically separate the drive system and communication line system, but also has a self-holding function that allows easy design of the drive system. It has advantages such as:

FIG. 3 is a perspective view of essential parts showing an example of the configuration of a conventional resin injection device.

In FIG. 3, 1 is the DIP before resin injection, and a gap is provided at the upper end opening of each hole 6 provided in this DIP 1 to insert SCR chips 8-1 to 8-4.
are each die-bodied. Here, the gap is a very narrow opening with a length in the longitudinal direction of, for example, about 0.8 mm.
Third and fourth injection ports 10-1, 10-2, 1
They are called 0-3 and 10-4.

The DIP 1 straddles a guide rail 20 having a U-shaped cross section and is carried to the resin injection position shown in the figure. A moving device 30 that moves in parallel and up and down along the guide rail 20 is disposed above the resin injection position. The moving device 30 includes a parallel moving member 31 that moves in the left-right X direction, and an up-down moving member 32 that moves in the up-down Y direction.

The vertically moving member 32 has a concave groove 33 on its upper surface.
is provided, and a detection rod 35 that is slidable in the Y direction is attached within the groove 33. Detection rod 35
is a small diameter portion 35 at the tip located below and having a radius of approximately 2 mm.
a, and a radius 4 located above the tip small diameter portion 35a.
It has a large-diameter portion 35b of 1.0 mm in diameter, a flange-like rotation blocking portion 35c located within the upper groove 33, and a through hole 35d provided above the rotating element portion 35c. A buffer spring 36 is provided between the large diameter portion 35b of the detection rod 35 and the lower surface of the vertically movable member 32 to bias the detection rod 35 downward. A light emitting type position detector 37 consisting of a light emitter and a light receiver is disposed near the groove 33 of the vertically moving member 32, and depending on whether the light beam between the light emitter and the receiver passes through the through hole 35d,
The vertical movement position of the detection rod 35 is detected. Further, a syringe 38 having a tip end diameter of, for example, 0.5 mm is provided to protrude downward from the vertically moving member 32, and a syringe main body 39 is connected to this syringe 38.

The operation of the resin injection device configured as described above will be explained.

First, when the DIP 1 is sent from the right direction to the left direction in FIG. 3 to the resin injection position on the guide rail 20 by a conveyance device (not shown),
descends.

At this time, when the index part 2 of DIP1 is in the normal position on the left side, the small diameter part 35a at the tip of the detection rod 35 fits into the index part 2, and the large diameter part 35a of the detection rod 35 fits into the index part 2.
The bottom end of b contacts the top surface of DIP1 and stops.
Then, the through hole 35d of the detection rod 35 is connected to the position detector 3.
7, and the position detector 37 is turned on. This detects that DIP1 has been accurately positioned at the resin injection position.

If the index portion 2 of DIP1 is on the right side due to a feeding error, etc., the small diameter portion 35a at the tip of the detection rod 35 will ride on top of DIP1, and the detection rod 35
stops at the maximum position. As a result, the position detector 37 cannot detect the through hole 35d, and is turned off due to a positioning error of DIP1. Similarly, DIP1
If not at the resin injection position, the small diameter portion 35a at the tip of the detection rod 35 descends to the lowest position and stops, so the position detector 37 is turned off.

Then, when the position detector 37 turns on,
The horizontally moving member 31 moves to just above the first injection port 10-1, the vertically moving member 32 descends, and the tip of the syringe 38 is inserted into the first injection port 10-1. Then, the transparent resin 9 (see FIG. 2) sent out from the syringe main body 39 is injected from the syringe 38 and injected into the hole 6 in a fixed amount. Thereafter, similarly, the tip of the syringe 38 moves in the X direction and the Y direction,
Second, third and fourth injection ports 10-2 to 10-
The transparent resin 9 is sequentially injected into the parts 4 and 4.

When the resin injection is completed, the DIP 1 is moved to the right side of the guide rail 20 by a transport device (not shown), and after hardening the transparent resin 9, the lid body 4 is bonded.
After drying, stamping, drying, and detection steps, manufacturing of the semiconductor device is completed.

(Problems to be solved by the invention) However, in the resin injection device having the above configuration,
DIP1 dimensional variation, SCR chip 8-1~
Due to misalignment during die bonding of 8-4, injection ports 10-1 to 10-4 were made as small as 0.8 mm in diameter.
If the arrangement pitch is not constant, the tip diameter is 0.5
There was a problem in that it became difficult to position the syringe 38, which was 3 mm wide, and injection errors occurred.

The present invention provides a resin injection apparatus for semiconductor packages that solves the problem of the prior art, which is injection errors caused when the arrangement pitch of the injection ports is different.

(Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention has an index portion on the side surface, a hole for accommodating the first semiconductor chip inside, and an upper end of the hole. A semiconductor package to which a second semiconductor chip is fixed by providing an injection port as a gap in the opening, a guide rail for moving the semiconductor package to a predetermined resin injection position, and a guide rail arranged above the resin injection position. a moving device that moves in parallel and vertically along the guide rail; a detection rod that is attached to the moving device and that determines whether the index section is properly positioned; and a detection rod that is attached to the moving device that moves the index section from the injection port of the package In a resin injection device for a semiconductor package comprising an injector for injecting resin into a hole, the moving device moves the injector near a side surface of the second semiconductor chip by moving parallelly and vertically, and After the syringe is brought into contact with the second semiconductor chip by parallel movement, the semiconductor package is moved a predetermined distance along the guide rail.

(Function) According to the present invention, since the resin injection device for semiconductor packages is configured as described above, the moving device can
The tip of the syringe is moved by a set amount to position it near the side surface of the second semiconductor chip, and then, after the tip of the syringe is brought into contact with the side surface of the second semiconductor chip, the semiconductor package is moved a certain distance. As a result, the tip of the injector can be positioned at the injection port located below the side surface of the second semiconductor chip, and resin can be injected accurately. Therefore, the above-mentioned problem can be eliminated.

(Example) FIG. 1 is a partially cutaway front view of a resin injection device showing an example of the present invention. Note that the same elements as those in FIGS. 2 and 3 are given the same reference numerals.

The difference between this resin injection device and the one shown in FIG. 3 is that the moving mechanism of the moving device 130 is different.

That is, the moving device 130 includes a first moving member 131 whose movement amount in the left and right X directions is controlled, and a first movement member 131 whose movement amount is controlled in the up and down Y directions, based on a control device (not shown) into which the movement amount is programmed in advance. A second moving member 132 is provided.

The first moving member 131 is installed on a guide rod 133 arranged parallel to the guide rail 20, and is moved in the X direction by being screwed into a feed screw 134 rotated by a motor (not shown). Further, the second moving member 132 is attached to the first moving member 131 so as to be slidable in the Y direction, and is screwed into a feed screw 135 rotated by a motor (not shown) to move in the Y direction. The second moving member 132 has a concave groove 136,
In this groove 136, as in FIG. 3, a detection rod 35 which is slidable in the Y direction is installed with rotation prevented, and the vertical position is detected by a position detector 37. Further, a syringe 38 is provided on the second moving member 132 at a position farther from the position detector 37 than the length of DIP1, and projects downward.

The operation of the resin injection device constructed as described above will be explained with reference to FIG. 1 and FIGS. 1 to 6. Note that FIGS. 1 to 6 are front views of essential parts showing the moving state of the syringe 38.

First, in FIG. 1, when DIP1 is sent to the resin injection position on the guide rail 20 by a transport device (not shown), the feed screw 135 rotates.
The second moving member 132 descends.

At this time, if the index part 2 of DIP1 is positioned at the correct position on the left side, the small diameter part 35a at the tip of the detection rod 35 will fit into the index part 2,
The lower end portion of the large diameter portion 35b comes into contact with the upper surface of the DIP1 and stops. Then, the through hole 35d of the detection rod 35 matches the detection height of the position detector 37, and the position detector 37 is turned on.

When the position detector 37 turns on, it is determined that the positioning of DIP1 is appropriate, and a control device (not shown) operates based on the detection signal of the position detector 37, and the feed screw 134 rotates to perform the first movement. Device 131 moves to the left in FIG. Syringe 38
The tips of the are the first and second SCR chips 8-1, 8-
2, the first moving member 1
31 stops, and then the second moving member 132 descends by a predetermined amount.

Then, as shown in FIG. 4, the tip of the syringe 38 touches the first and second SCR chips 8-1 and 8-2.
located in between. This position is the first and second SCR
Since the distance between the tips 8-1 and 8-2 is 1.5 mm, and the tip diameter of the syringe 38 is about 0.5 mm, the first,
It is located at a distance of about 0.5mm from the side of the second SCR chip.

Next, as shown in FIG. 4, the feed screw 134 shown in FIG. contact the SCR chip 8-1 and move DIP1 to the right. Thereafter, when the feed screw 135 rotates and the second moving member 132 descends by a predetermined amount, the syringe 38 is inserted into the first injection port 10-1 with a diameter of about 0.8 mm, and the transparent resin is 9 is injected in a certain amount to fill the hole 6.

When the resin injection is finished, as shown in FIG. Move to almost directly above the center between SCR chips 8-2 and 8-3.

Then, as shown in FIG. 4, the second moving member 132 descends, and the tip of the syringe 38 descends to between the second and third SCR chips 8-2 and 8-3. Next, the first moving member 131 moves 1 mm to the right. Then, the syringe 38 comes into contact with the second SCR chip 8-2 and moves the DIP1 to the right.
Then, as shown in FIG. 4 and FIG.
-2, and resin is injected into the hole 6.

Thereafter, in the same manner, after pitching the injector 38 between the third and fourth SCR chips 8-3 and 8-4 as shown in FIG. 4, the resin is injected into the third injection port 10-3. Next, resin is injected into the fourth injector 10-4 in the same manner. When the resin injection work is completed, the DIP 1 is transported to the right on the guide rail 20 by a transport device (not shown), and proceeds to the next work step.

According to this embodiment, the syringe 38 is
Move the injector 38 between the SCR chips 8-1 to 8-4, then move the injector 38 back to the right a little and move the DIP1 while pushing the side of the SCR chips 8-1 to 8-4 to position the injection point. I did it like this,
Inlet ports 10-1 to 10 that are narrow and have poor dimensional accuracy
Even with -4, resin injection can be performed accurately.
This can improve quality.

In the above embodiment, resin injection into DIP 1 constituting the optical switch has been described, but it goes without saying that the present invention can be applied to packages having other structures and shapes. Further, the moving members whose moving direction and amount of movement are controlled by a control device (not shown) are the first and second moving members 131 and 132.
However, by making this into an integrated structure, etc.
Various modifications other than those shown are possible.

(Effects of the Invention) As explained in detail above, according to the present invention,
After the injector is moved near the second semiconductor chip by the moving device, the injector is brought into contact with the side surface of the second semiconductor chip to move the semiconductor package itself by a certain amount, and the resin is injected using this moving point as the injection point. Since the injection is performed, the injection position can be easily and precisely determined even in a narrow place with poor dimensional accuracy.

[Brief explanation of the drawing]

Fig. 1 is a partially cutaway front view of a resin injection device showing an embodiment of the present invention, Fig. 2 is a longitudinal sectional view of a conventional DIP, and Fig. 3 is a perspective view of essential parts of a conventional resin injection device. , FIGS. 1 to 6 are front views of essential parts showing the moving state of the syringe in FIG. 1. 1... Semiconductor package (DIP), 2... Index section, 6... Hole, 7... First semiconductor chip (LED chip), 8-1 to 8-4... Second semiconductor chip (SCR chip) ), 10-1 to 10-4
... Inlet, 20 ... Guide rail, 35 ... Detection rod, 37 ... Position detector, 38 ... Injector, 1
30... Mobile device, 131... First moving device,
132...Second mobile device.

Claims (1)

[Scope of Claims] 1. A concave index portion on the side surface, a hole for accommodating the first semiconductor chip inside, and a gap provided at the upper end opening of the hole to which the second semiconductor chip is fixed. a semiconductor package, a guide rail for moving the semiconductor package to a predetermined resin injection position, a moving device arranged above the resin injection position and moving in parallel and vertically along the guide rail; In a resin injection device for a semiconductor package, the device includes a detection rod attached to a moving device to determine whether the positioning of the index section is good or not, and a syringe attached to the moving device to inject resin into the hole from a gap in the package. , the moving device moves the syringe in parallel and up and down to move the syringe near a side surface of the second semiconductor chip, and after moving the syringe in parallel and bringing the syringe into contact with the second semiconductor chip; A resin injection device for a semiconductor package, characterized in that the semiconductor package is configured to move the semiconductor package by a certain distance along the guide rail.