JPH0337466B2 - - Google Patents
Info
- Publication number
- JPH0337466B2 JPH0337466B2 JP58002857A JP285783A JPH0337466B2 JP H0337466 B2 JPH0337466 B2 JP H0337466B2 JP 58002857 A JP58002857 A JP 58002857A JP 285783 A JP285783 A JP 285783A JP H0337466 B2 JPH0337466 B2 JP H0337466B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- leadless
- positioning
- leadless component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】
（発明の分野）
本発明はリードレス部品を印刷配線板上の所定
位置に半田接合する場合の位置決め治具に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION (Field of the Invention) The present invention relates to a positioning jig for soldering leadless components to predetermined positions on a printed wiring board.
（従来技術）
従来、リードレス部品の位置決めは作業者の目
視による位置決め、あるいは印刷配線板の基準穴
を用い、リードレス部品位置決め用穴を設けた治
具を印刷配線板上へ基準ピンにて位置合わせし、
リードレス部品の位置決めを行つていた。しかし
ながら目視による位置合わせではリードレス部品
が小型で複数の電極を有していることから位置決
めが難しく、部品の電極が所定のパターンに半田
付け接合されなかつたり、所定外のパターンと接
合されたりすることになる。(Prior art) Conventionally, the positioning of leadless components has been done by visual inspection by an operator, or by using reference holes on a printed wiring board, and using a jig with holes for positioning leadless components onto the printed wiring board using reference pins. Align and
I was positioning leadless parts. However, positioning by visual inspection is difficult because leadless components are small and have multiple electrodes, and the electrodes of the component may not be soldered to the specified pattern or may be connected to a pattern other than the specified pattern. It turns out.
第１図に従来実施例によるリードレス部品の位
置決め方法ならびに位置決め治具を示す。第１図
ａはリードレス部品の外観であり（１辺約１〜20
mm）、１４はリードレス部品６の側面に設けられ
た接続部である。第１図ｂはリードレス部品位置
決め用の治具４を示し、３は治具４に明けられた
リードレス部品位置決め用穴、５は基準ピンであ
る。第１図ｃは印刷配線基板１を示し、２は前記
治具４の基準ピンと挿嵌される基準穴である。 FIG. 1 shows a conventional method for positioning leadless components and a positioning jig. Figure 1a shows the external appearance of a leadless component (approximately 1 to 20 mm per side).
mm), 14 is a connection portion provided on the side surface of the leadless component 6. FIG. 1b shows a jig 4 for positioning a leadless component, 3 designating a hole for positioning a leadless component made in the jig 4, and 5 a reference pin. FIG. 1c shows a printed wiring board 1, and 2 is a reference hole into which a reference pin of the jig 4 is inserted.
第１図において、治具４はその対角線上の２隈
に設けられた基準ピン５を印刷配線板１の基準穴
２に挿嵌して位置合わせされ、リードレス部品は
印刷配線板及びリードレス部品の両方又は一方に
あらかじめ半田を供給しておいた状態でリードレ
ス部品位置決め用穴３にはめられて位置決めさ
れ、全体を雰囲気炉、蒸気半田付装置、赤外線リ
フロー装置、オイルデツプ等のリフロー装置によ
り全体を加熱し、半田を溶融せしめ、リードレス
部品と印刷配線板のパターンとが接合されるもの
である。 In FIG. 1, the jig 4 is aligned by inserting the reference pins 5 provided in two diagonal corners into the reference holes 2 of the printed wiring board 1. With solder supplied to both or one of the parts in advance, they are fitted into the leadless part positioning hole 3 and positioned, and the whole is soldered using a reflow device such as an atmospheric furnace, a steam soldering device, an infrared reflow device, or an oil dip. The whole is heated to melt the solder, and the leadless component and the pattern of the printed wiring board are joined.
第２図はリードレス部品６が印刷配線板１へ半
田接合される前の状態を示す断面図であり、７は
半田を示し、他の記号は第１図と同じものを示
す。第３図は第２図の状態にてリフロー装置を用
いてリードレス部品６の半田接合を行つた状態を
示し、第４図はリフロー半田付け後治具４を取り
外した状態を示す。第４図にて明らかなように、
半田フイレツトが接合部に形成されず、ほぼ均一
の厚みにて半田接合がなされることから、半田接
合強度の低下を招く欠点がある。又第１図に示し
た治具４を用いる場合、印刷配線板１の基準穴２
に治具４の基準ピン５が挿入されているだけであ
り、取扱い時において治具４が容易に外れたり、
治具４の熱が印刷配線板ならびにリードレス部品
に影響を与えるという欠点がある。（その目的上、
治具４は変形、繰返し使用に耐え得るように一般
には金属で作られる。従つて全体を加熱した場
合、治具の方が熱容量が大きく冷却時に印刷配線
板と温度差を生じることに起因するものである。）
（発明の目的）
本発明の目的は、上記欠点を解決する為、印刷
配線板を固定する固定板とリードレス部品位置決
め板から成る治具を用いてリードレス部品を取り
つけるものであり、以下詳細に説明する。 FIG. 2 is a cross-sectional view showing the state before the leadless component 6 is soldered to the printed wiring board 1, where 7 indicates solder and other symbols are the same as in FIG. 1. 3 shows a state in which the leadless component 6 is soldered using a reflow apparatus in the state shown in FIG. 2, and FIG. 4 shows a state in which the jig 4 is removed after reflow soldering. As is clear from Figure 4,
Since no solder fillet is formed at the joint and the solder joint is made with a substantially uniform thickness, there is a drawback that the strength of the solder joint is reduced. Also, when using the jig 4 shown in FIG. 1, the reference hole 2 of the printed wiring board 1
Since only the reference pin 5 of the jig 4 is inserted into the holder, the jig 4 may easily come off during handling.
There is a drawback that the heat of the jig 4 affects the printed wiring board and leadless components. (For that purpose,
The jig 4 is generally made of metal so that it can withstand deformation and repeated use. Therefore, when the whole is heated, the jig has a larger heat capacity and a temperature difference occurs with the printed wiring board during cooling. ) (Object of the Invention) In order to solve the above-mentioned drawbacks, the object of the present invention is to mount leadless components using a jig consisting of a fixing plate for fixing a printed wiring board and a leadless component positioning plate. Explain in detail.
（発明の構成）
本発明は、印刷配線板上の所定位置にリードレ
ス部品を半田接合するリードレス部品の位置決め
治具であつて、複数の点支持にてリードレス部品
を位置決め固定する複数のリードレス部品位置決
め穴を有するリードレス部品位置決め板と、印刷
配線板を挟んで前記リードレス部品位置決め板を
載せ前記印刷配線板上下各々に間隙をおいて前記
印刷配線板ならびに前記リードレス部品位置決め
板を点支持かつ係合固定する複数の突部を有する
印刷配線板固定板とから構成される。(Structure of the Invention) The present invention is a leadless component positioning jig for soldering the leadless component to a predetermined position on a printed wiring board, and includes a plurality of positioning jig for positioning and fixing the leadless component by supporting at a plurality of points. A leadless component positioning board having a leadless component positioning hole, and a printed wiring board on which the leadless component positioning board is placed with a gap above and below the printed wiring board, respectively, and the printed wiring board and the leadless component positioning board. and a printed wiring board fixing plate having a plurality of protrusions that point support and engage and fix the printed wiring board.
（第１の実施例）
第５図は本発明の第１の実施例を説明するもの
であり、１０は印刷配線板固定板、１１はガイド
ピン、１２は印刷配線板支持ピン、１３はリード
レス部品位置決め板支持ピン、１は印刷配線板、
２は基準穴、３０はリードレス部品位置決め板、
３１はガイド穴、３はリードレス部品位置決め穴
である。第５図において、印刷配線板１は２カ所
の基準穴２を基準ピン５に各々挿入して印刷配線
板固定板１０上の複数個の印刷配設板支持ピン１
２にて支持される。この印刷配線板支持ピン１２
により、印刷配線板１と印刷配線板固定板１０と
の間に間隙が形成される。(First Embodiment) FIG. 5 explains the first embodiment of the present invention, in which 10 is a printed wiring board fixing plate, 11 is a guide pin, 12 is a printed wiring board support pin, and 13 is a lead. Less parts positioning plate support pin, 1 is printed wiring board,
2 is a reference hole, 30 is a leadless component positioning plate,
31 is a guide hole, and 3 is a leadless component positioning hole. In FIG. 5, the printed wiring board 1 has two reference holes 2 inserted into the reference pins 5, and a plurality of printed wiring board support pins 1 on the printed wiring board fixing plate 10.
2 is supported. This printed wiring board support pin 12
As a result, a gap is formed between the printed wiring board 1 and the printed wiring board fixing plate 10.
印刷配線板固定板１０はまた、ガイドピン１１
と位置決め板支持ピン１３とを有しておりガイド
ピン１１をリードレス部品位置決め板３０に設け
られたガイド穴３１に挿入して位置決めを行う。
即ち印刷配線板固定板１０に設けられた基準ピン
およびガイドピンとで印刷配線板１およびリード
レス部品位置決め板３０とを位置決め固定してい
る。また、印刷配線板固定板１０に設けられた印
刷配線板支持ピン１２で、印刷配線板１と印刷配
線板１０との間に間隙を形成している。このよう
な状態で第１図ａに示すリードレス部品６をリー
ドレス部品位置決め板３０のリードレス部品位置
決め穴３に嵌められ、リフロー半田付けされる。
この場合、リードレス部品位置決め穴３は第５図
に示すように４隈が突状態となつており、リード
レス部品６が４隈でのみ位置決めされ、穴の側面
とは接触しない構造となつている。 The printed wiring board fixing plate 10 also has guide pins 11
and a positioning plate support pin 13, and positioning is performed by inserting the guide pin 11 into a guide hole 31 provided in the leadless component positioning plate 30.
That is, the printed wiring board 1 and the leadless component positioning plate 30 are positioned and fixed by the reference pins and guide pins provided on the printed wiring board fixing plate 10. Further, a gap is formed between the printed wiring board 1 and the printed wiring board 10 by the printed wiring board support pin 12 provided on the printed wiring board fixing plate 10. In this state, the leadless component 6 shown in FIG. 1a is fitted into the leadless component positioning hole 3 of the leadless component positioning plate 30 and reflow soldered.
In this case, the leadless component positioning hole 3 has four corners protruding as shown in FIG. 5, and the leadless component 6 is positioned only in the fourth corner and does not come into contact with the side surface of the hole. There is.
第６図はリードレス部品６とリードレス部品位
置決め板３０ならびに印刷配線板１との関係を示
す断面図である。リードレス部品６は上述したよ
うにリードレス部品位置決め板３０とはリードレ
ス部品位置決め穴３の４隈にて位置決め固定され
ている為、リードレス部品位置決め穴３の側面と
間隙をおいた状態となつている。したがつてリー
ドレス部品６は印刷配線板１上に半田フイレツト
１５を形成して半田接合されることになり、接合
部の強度を強くすることができる。又、リードレ
ス部品位置決め板３０ならびに印刷配線板固定板
１０は治具という性格から印刷配線板１の材質よ
りも比較的強度の強い材料（金属等）で作られて
いる為、高温の雰囲気中でリフロー半田した場
合、リードレス部品位置決め板３０ならびに印刷
配線板固定板１０の方が冷却時に温度勾配を持ち
高温となる。そして本実施例の場合、印刷配線板
１がリードレス部品位置決め部３０ならびに印刷
配線板固定板１０のいずれとも直接接触していな
い為、基板に与える温度影響が少い。 FIG. 6 is a sectional view showing the relationship between the leadless component 6, the leadless component positioning plate 30, and the printed wiring board 1. As mentioned above, the leadless component 6 is positioned and fixed to the leadless component positioning plate 30 at the four corners of the leadless component positioning hole 3, so it is in a state where there is a gap between the side surface of the leadless component positioning hole 3 and the leadless component positioning plate 30. It's summery. Therefore, the leadless component 6 is soldered to the printed wiring board 1 by forming a solder fillet 15 thereon, thereby increasing the strength of the joint. In addition, since the leadless component positioning plate 30 and the printed wiring board fixing plate 10 are made of a material (metal, etc.) that is relatively stronger than the material of the printed wiring board 1 due to their nature as jigs, they cannot be used in high-temperature atmospheres. When reflow soldering is performed, the leadless component positioning plate 30 and the printed wiring board fixing plate 10 have a temperature gradient and reach a high temperature during cooling. In the case of this embodiment, since the printed wiring board 1 is not in direct contact with either the leadless component positioning section 30 or the printed wiring board fixing plate 10, the influence of temperature on the board is small.
以上説明したように、第１の実施例では印刷配
線板１を強度の強い印刷配線板固定板１０とリー
ドレス部品位置決め板３０により点接触状態で挟
み込み、リードレス部品６をリードレス部品位置
決め板３０のリードレス部品位置決め穴３内に点
接触で位置決めする構造となつている為、リード
レス部品をリフロー半田付け装置に装着する際に
治具が容易に外れることなく、又高温雰囲気中で
リフロー半田付けを行つた場合に治具（リードレ
ス部品位置決め板３０と印刷配線板固定板１０）
の熱による印刷配線板への影響を少なくすること
ができる。更にリードレス部品６と印刷配線板１
とは容易に半田フイレツトを形成でき、強固に半
田接合することが出来る利点を有する。 As explained above, in the first embodiment, the printed wiring board 1 is sandwiched between the strong printed wiring board fixing plate 10 and the leadless component positioning plate 30 in a point contact state, and the leadless component 6 is held between the leadless component positioning plate 30 and the printed wiring board fixing plate 10, which has strong strength. 30 leadless component positioning holes 3 with point contact, the jig does not easily come off when attaching leadless components to reflow soldering equipment, and reflow soldering in high temperature atmosphere is possible. Jig (leadless component positioning plate 30 and printed wiring board fixing plate 10) when soldering
The influence of heat on the printed wiring board can be reduced. Furthermore, leadless parts 6 and printed wiring board 1
This has the advantage that a solder fillet can be easily formed and a strong solder joint can be achieved.
（第２の実施例）
第１の実施例では、リードレス部品６をリード
レス部品位置決め穴３の４隈にて位置決めを行
い、リードレス部品６とリードレス部品位置決め
板３０の穴側面間に間隙を設けるようにした場合
を示したが、第７図の断面図にて示すようにリー
ドレス部品位置決め板３２の厚さａ、半田フイレ
ツト１５の高さｂ、リードレス部品６の厚みをｃ
とし、ａ＋ｂ≦ｃが成立するようにしても第１の
実施例の場合と同様の効果を提供できる。この場
合は、印刷配線板１とリードレス部品位置決め板
３０との間に間隙を形成し前記の関係を満たすた
めに、リードレス部品位置決め板支持ピン１３の
高さを設定する。すなわち、リードレス部品位置
決め板の下面より印刷配線板のパターンまでの距
離を半田フイレツトが十分形成しうる長さとする
ことによつても、リードレス部品の位置決めなら
びに強固な半田接合が可能となる。又本実施例の
場合、リードレス部品６を第１の実施例と同様に
リードレス部品位置決め板の位置決め穴部の４隈
において点支持する場合あるいはリードレス部品
６が直接位置決め穴の側面と接触するようにした
場合においても半田フイレツトは容易に形成され
る（但し後者の場合は治具の熱による影響が大き
くなる）。(Second Embodiment) In the first embodiment, the leadless component 6 is positioned at four corners of the leadless component positioning hole 3, and the leadless component 6 is positioned between the leadless component 6 and the hole side of the leadless component positioning plate 30. Although the case where a gap is provided is shown, as shown in the cross-sectional view of FIG. 7, the thickness a of the leadless component positioning plate 32, the height b of the solder fillet 15, and the thickness of the leadless component 6 are
Even if a+b≦c is established, the same effect as in the first embodiment can be provided. In this case, the height of the leadless component positioning plate support pin 13 is set in order to form a gap between the printed wiring board 1 and the leadless component positioning plate 30 and satisfy the above relationship. That is, by setting the distance from the lower surface of the leadless component positioning plate to the pattern on the printed wiring board to a length that is sufficient to form a solder fillet, positioning of the leadless component and strong solder bonding are also possible. Further, in the case of this embodiment, when the leadless component 6 is point-supported at the four corners of the positioning hole of the leadless component positioning plate as in the first embodiment, or when the leadless component 6 directly contacts the side surface of the positioning hole. Solder fillets can also be easily formed in this case (however, in the latter case, the influence of heat from the jig becomes greater).
（発明の効果）
本発明は印刷配線板を印刷配線板固定板とリー
ドレス部品位置決め板によつて点接触状態で挟み
込み、リードレス部品をリードレス部品位置決め
板の位置決め穴にて点接触で位置決めするもので
あり、リードレス部品の位置決めが確実に行える
と共に、操作性が良く、熱による影響を少なくす
ることができる。特に多ピンのリードレス部品の
組立い於いて品質性、作業性を向上させることが
できる。(Effects of the Invention) The present invention sandwiches a printed wiring board between a printed wiring board fixing plate and a leadless component positioning plate in a point contact state, and positions the leadless component in point contact using the positioning hole of the leadless component positioning plate. This makes it possible to reliably position leadless components, provide good operability, and reduce the effects of heat. Particularly in assembling multi-pin leadless parts, quality and workability can be improved.
第１図は従来のリードレス部品の位置決め方法
ならびに位置決め治具を示す説明図、第２図は従
来実施例においてリードレス部品６が印刷配線板
１へ半田接合される前の状態を示す断面図、第３
図は第２図の状態から半田接合を行つた後の状態
を示す断面図、第４図は半田接合後治具４を取り
外した状態を示す断面図、第５図は本発明の第１
の実施例を示す説明図、第６図は第１の実施例に
おけるリードレス部品６の印刷配線板１への半田
接合状態を示す断面図、第７図は第２の実施例に
おけるリードレス部品６の印刷配線板１への半田
接合状態を示す断面図である。
１……印刷配線板、２……基準穴、３……リー
ドレス部品位置決め穴、５……基準ピン、６……
リードレス部品、１０……印刷配線板固定板、１
１……ガイドピン、１２……印刷配線板支持ピ
ン、１３……リードレス部品位置決め板支持ピ
ン、１５……半田フイレツト、３０，３２……リ
ードレス部品位置決め板。
FIG. 1 is an explanatory diagram showing a conventional positioning method and positioning jig for leadless components, and FIG. 2 is a cross-sectional view showing a state before leadless component 6 is soldered to printed wiring board 1 in the conventional embodiment. , 3rd
The figure is a cross-sectional view showing the state after soldering from the state shown in FIG. 2, FIG. 4 is a cross-sectional view showing the state with the jig 4 removed after soldering, and FIG.
FIG. 6 is a sectional view showing the state of soldering of the leadless component 6 to the printed wiring board 1 in the first embodiment, and FIG. 7 is the leadless component in the second embodiment. 6 is a cross-sectional view showing a state of solder bonding to the printed wiring board 1 of No. 6. FIG. 1... Printed wiring board, 2... Reference hole, 3... Leadless component positioning hole, 5... Reference pin, 6...
Leadless parts, 10...Printed wiring board fixing plate, 1
1...Guide pin, 12...Printed wiring board support pin, 13...Leadless component positioning plate support pin, 15...Solder fillet, 30, 32...Leadless component positioning plate.
Claims (1)
半田接合するリードレス部品の位置決め治具であ
つて、 複数の点支持にてリードレス部品を位置決め固
定する複数のリードレス部品位置決め穴を有する
リードレス部品位置決め板と、 このリードレス部品位置決め板と対となつて前
記印刷配線板を挾持する印刷配線固定板とから構
成され、 前記印刷配線板固定板は、この固定板と前記印
刷配線板との間に間隙を形成する複数の印刷配線
板支持ピンと、 前記位置決め板を支持する複数の位置決め板支
持ピンとを有し、 前記印刷配線板固定板はさらに前記印刷配線板
に形成された基準穴を位置決めする基準ピンと、
前記位置決め板に形成されたガイド穴を位置決め
するガイドピンとを有することを特徴とする、 リードレス部品の位置決め治具。[Scope of Claims] 1. A positioning jig for leadless components that solder joins leadless components to predetermined positions on a printed wiring board, the jig comprising: a plurality of leadless components that position and fix leadless components with support at multiple points; It is composed of a leadless component positioning plate having component positioning holes, and a printed wiring fixing plate that pairs with the leadless component positioning plate and clamps the printed wiring board, and the printed wiring board fixing plate is composed of the fixing plate. a plurality of printed wiring board support pins forming a gap between the printed wiring board and the printed wiring board, and a plurality of positioning plate support pins that support the positioning plate, and the printed wiring board fixing plate is further attached to the printed wiring board. a reference pin for positioning the formed reference hole;
A positioning jig for leadless components, comprising a guide pin for positioning a guide hole formed in the positioning plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58002857A JPS59127968A (en) | 1983-01-13 | 1983-01-13 | Positioning jig for leadless parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58002857A JPS59127968A (en) | 1983-01-13 | 1983-01-13 | Positioning jig for leadless parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59127968A JPS59127968A (en) | 1984-07-23 |
| JPH0337466B2 true JPH0337466B2 (en) | 1991-06-05 |
Family
ID=11541050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58002857A Granted JPS59127968A (en) | 1983-01-13 | 1983-01-13 | Positioning jig for leadless parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59127968A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0647091A1 (en) * | 1993-10-05 | 1995-04-05 | AT&T Corp. | Passive alignment of components with micromachined tool |
| JP4770503B2 (en) * | 2006-02-15 | 2011-09-14 | トヨタ自動車株式会社 | Brazed joint structure and joining method thereof |
| JP5274489B2 (en) * | 2010-01-13 | 2013-08-28 | Ｃｋｄ株式会社 | Soldering apparatus and lamp manufacturing method using the same |
| CN102935537A (en) * | 2012-07-27 | 2013-02-20 | 西安永电电气有限责任公司 | Welding fixture structure and welding method for n-shaped electrode based on insulated gate bipolar translator (IGBT) |
-
1983
- 1983-01-13 JP JP58002857A patent/JPS59127968A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59127968A (en) | 1984-07-23 |
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