JPH0337682B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a device for detecting the alignment of leads on an object, and more particularly to an electro-optical device for detecting lead spacing on an object.

Product quality control is of paramount importance to both manufacturers and end users. This quality control is performed at an intermediate stage of manufacturing or assembly of the product, and final quality control is performed on the finished product. For these quality controls, various control techniques are adopted depending on the different products being produced.

It may generally be referred to as an object having at least one extended lead of a certain type of product. One particular example of such products are those known as integrated circuit packages made by semiconductor companies. Typically, each side of the package has a plurality of leads extending from the package body. The leads on each side of the completed package must be substantially aligned or aligned with each other. Otherwise, defects such as lead misalignment may cause premature electrical or mechanical failure during end use of the package.

Despite strict quality control during package assembly, a significant number of finished packages have one or more misaligned, bent leads. For example, one or more leads may be bent toward each other along a line parallel to the long axis of the package, or may be bent away from each other along a line orthogonal to the parallel line; Alternatively, there are also curves that are a combination of curve components along parallel lines and perpendicular lines. Therefore, it is necessary to test all completed packages and exclude packages with bent leads.

Furthermore, many types of packaging bodies may include a base and a cover for the base, supporting the leads between the cover and the base. This quality control also involves producing a finished package that is approximately, if not precisely, aligned edge-to-edge with the cover on the base. However, the disadvantage is that in many completed packages, the edge of the cover is substantially offset from the edge of the base. Therefore, packages with this shift or offset must be excluded.

An object of the present invention is to provide a novel quality control device.

Another object of the present invention is to provide an apparatus for inspecting manufactured products for defects.

Still another object of the present invention is to provide a quality control device that accurately inspects products for defects even when the production speed of an assembly line is at its maximum.

According to the gist of the present invention, in order to achieve these objects, "bending along a first line extending from an axial object and parallel to the axis, or bending along a second line orthogonal to the first line" Alternatively, in an apparatus for inspecting the alignment state of at least one lead having a combination of a bend component along the first line and a bend component along the second line, the light beam passes through the first optical path along the second line. a first light beam generating means for producing a first light beam that intersects the lead; a first detection means for detecting the first light beam; and forming an angle with the first line and the second line. and a second light beam generating means for generating a second light beam that passes through a second light path and intersects the lead, and a second detection means for detecting the second light beam. do".

In the first aspect of the present invention, the optical data obtained by the first light beam generating means and the first detecting means has first information representing the bending of the lead along the first line. The optical data obtained by the second light beam generating means and the second detecting means includes second information representative of the combined bending of the lead along the first line and the second line. By subtracting the first information about the bend along the parallel line from the combined second information about the bend, information about the bend component along the second line can be obtained.

In another aspect of the invention, an apparatus for inspecting the alignment of a plurality of leads spaced apart from each other on an object includes an optical means for generating data having information on the spacing between the leads; and data processor means for determining the spacing between the leads. The results obtained by this other feature indicate whether the leads are curved or in a straight line at intervals.

The present invention will be explained below with reference to the drawings.

FIG. 1 is a diagram showing an example of a product 10, which is an object at a predetermined production stage. The product 10 includes a main body 12, which includes a front end 14 and a rear end 1.
6. It has a left side 18 and a right side 20. The plurality of leads 22 are respectively 22-1, 22-2,...2
2-n, these leads extend from the left side 18 of the body 12. 24-1, 24 respectively
Multiple leads 2 represented by -2,...24-n
4 extends from the right side 20 of the main body 12. The main body 12 has a base 26 and a cover 28, and the leads 22 and 24 are connected between the base 26 and the cover 28.
support. Note that this product 10 has a virtual vertical axis Y as a coordinate reference, which will become clear from the explanation below.
It is possible to consider a virtual horizontal axis X that is orthogonal to this. By way of example, the product 10 may be a finished product known in the semiconductor industry as an n-lead, dual-in-line integrated circuit (IC) package.

The high-quality finished product 10 in FIG. 2 is shown by solid lines, and its leads 22-1 to 22-n and 24-
1 to 24-n are aligned. That is, these leads extend parallel to each other when viewed from the side shown in the figure. If one or more of these leads 22-1 to 22-n or leads 24-1 to 24-n is substantially bent from a parallel position along an imaginary line _l1 parallel to the imaginary vertical axis Y, In such a case, the quality of the product 10 cannot be said to be satisfactory. This condition is shown as an example for lead 22-4, in which case the lead bends rearward along line _l1 as shown by the dashed line, and forward as shown by the dashed line. The song may be out of tune. This type of bend along the parallel line l ₁ is called a "parallel bend". Lead 22-
1,...22-n are all aligned, these leads are separated from each other by a predetermined distance _d1 , but if there is a bent lead such as lead 22-4, the spacing is not the predetermined distance. First, the lead approaches or moves away from an adjacent lead by more than a predetermined distance. It is necessary to exclude packages 10 in which the distance d ₁ between adjacent leads exceeds a predetermined tolerance.

FIG. 3 shows a high-quality finished product 10 in which the leads 22-1 to 22-n and the leads 24-1 to 24-n are inclined and parallel to each other and are aligned as can be seen from this end view. This is a diagram shown in . If one or more leads 22-1 to 22 to n or leads 24-1 to 24-n are aligned along an arbitrary imaginary line _l2 that is orthogonal to line _l1 and parallel to the imaginary horizontal axis If the product 10 is substantially bent from its slanted parallel position, the quality of the product 10 is not satisfactory. This state is shown for the lead 22-2 as an example. In this case, the lead 22-2 is bent outward in the direction along the line _l2 as shown by the broken line, or bent inward as shown by the dashed line. It may be curved. This type of bending in the direction along the orthogonal line _l2 is referred to as "upward bending". If a bent lead, such as lead 22-2, is bent a distance d ₂ that exceeds a predetermined tolerance, the package 10 may fail to meet quality control specifications.

Next, a third type of bend called "combination bend" will be explained in detail. A lead having this "combined bend" has both "parallel bend" and "upward bend" components.

FIG. 4 is a diagram showing these three types of bends, where the lead 22-4 is a "parallel bend" lead with a distance _d1 shorter than the predetermined distance;
The lead 22-2 has a distance d ₂ greater than the predetermined distance.
The lead 24-3 has a "parallel bend" component of distance d ₁ and a distance of "parallel bend".
Since it has an "upward bending" component of d ₂ ,
This is the lead of "combination bending".

FIG. 5 is a diagram illustrating another defect that may be associated with the finished product 10. In the case of a high-quality product 10, the cover 28 will be attached to the base 26 even if it is not accurate.
The edges are almost aligned on the top. The defective product 10 shown in FIG. 5 has a cover 28 offset from the base 26 by a distance d ₃ .

6 and 7 are diagrams showing an optical system 30 for generating data containing information for detecting the alignment state of one or more leads 22 or 24, particularly the presence or absence of "parallel bending". It is. The relative movement between the optical system 30 and the product 10 is indicated by an arrow.
This optical system 30 has a light source 32 on the right side 20 of the product 10.
, and this light source has a line l ₂ as shown in FIG.
A light beam is generated which passes through an optical path 34 in a direction along the line l ₁ and thus perpendicular to the line l 1 . This light source 32
The light beam passing through the optical path 34 is detected by the sensor 36 on the left side 18. As shown in FIG. 7, the light source 32 is positioned slightly elevated relative to the product 10, and the optical path 34 is slightly inclined so that the optical path intersects only with the leads 22 and does not intersect with the leads 24. In this case, the optical path 34 still lies along the line _l2 , which is slightly raised but still perpendicular to the line _l1 . Therefore, as will be described below, sensor 36 produces output data with information about the "parallel bend" of only lead 22. As previously mentioned, one reason to raise the light source 32 slightly is to prevent the optical path 34 from intersecting the lead 24. If the package 10 does not have leads 24, the light source 3
2 Therefore, it is not necessary to raise the optical path 34 as shown in FIG. In any case, the optical path 34 can be considered to extend along line _l2 and perpendicular to line _l1 .

If product 10 has only leads 22 and no leads 24, optical system 30 need only include light source 32 and sensor 36 for "parallel bend" testing. When the lead 24 is also included, the optical system 30 generates a light beam passing through an optical path 40 along the line _l2 and perpendicular to the line _l1 , as shown in FIG. A light source 38 is included on the left side 18. A sensor 42 is provided on the right side 20 to detect the light beam passing through the optical path 40 from the light source 38. As is clear from FIG. 7, for the same reason as the light source 32, the light source 38 is positioned at a level relative to the product 10 so that the light beam passing through the optical path 40 intersects only the lead 24 extending from the right side 20. Eggplant. Therefore, the sensor 42 is connected to this lead 24.
It is clear that only output data with "parallel bend" information is produced.

Leads 22 and 24 of product 10 are "parallel bent"
In the case where only the light sources 32 and 38 described above are provided,
and sensors 36, 42 are required for quality control. However, as described above, since these leads 22 and 24 are subjected to "upward bending" or "combined bending", the optical system 30 is provided with an optical system that provides data having information on "combined bending". Add and set the ingredients,
From this, it is possible to derive information on "upward curvature".

In particular, as shown in FIGS. 8 and 9, in addition to the optical components shown in FIGS. 6 and 7, the optical system 3
On the right side 20 of the product 10 at 0 there is a light source 44 producing a light beam passing through an optical path 46 and on the right side 18 this optical path 4.
A sensor 48 for detecting the light of 6 is provided. As can be seen in FIG. 8, the optical path 46 is at an angle with respect to line l ₁ or the "parallel bend" and also at an angle with respect to line l ₂ or the "cave bend". As an example, the optimum value of each angle can be set to 45°. As can be seen in FIG. 9, the light source 44 is raised slightly relative to the product 10 so that the light path 46 intersects only the leads 22 extending from the left side 18. In this way, the sensor 48 will provide output data having information on the "combined bends" of the leads 22, as will be described below.

Since the product 10 also has a lead 24,
On the left side 18 there is provided a light source 50 which produces a light beam passing through the optical path 52, and on the right side 20 there is provided a sensor 54 for detecting the light beam of this optical path 52. As is clear from FIG. 8, the optical path 52 has a "parallel bend" or an angle with the line _l1 , and a "cave bend" or an angle with the line _l2 . As can be seen in FIG. 9, the position of the light source 50 is slightly raised relative to the product 10 so that the optical path 52 intersects only the lead 24 extending from the right side 20. For the same reason as before, the positions of light sources 44 and 50 are raised slightly.

In accordance with the principles of the present invention, various optical techniques may be used to determine data for testing the alignment of the leads 22 or 24, and in particular for detecting the gap distance between the leads. Optical system 30 is one example of this, and is based in part on the need to optically inspect only a small area or point on each lead to obtain sufficient data for these purposes. be. This embodiment is the example shown in FIGS. 6 to 9, and in these embodiments, the optical paths 34, 40, 46, 52 are connected to the leads 2.
2 and 24 at the respective micropoints P ₁ , P ₂ , P ₃ , and P ₄ . Preferably, the points P ₁ -P ₄ are located at about 1/8 to 1/4 of the distance from the upper end to the lower end of the arranged leads 22, 24. Since only such points P ₁ - P ₄ are inspected, each light source 3
2, 38, 44, 50 may be, for example, a point light source generating infrared light, and each sensor 36, 42, 48, 5
4 can be a single photodetector such as a phototransistor that detects this infrared light.

Although not shown, in other embodiments of the optical system, instead of using each point light source 32, 38, 44, 50, a light source that can control the light to intersect the entire leads 22, 24, for example, may be used. Yes, a linear photodiode array can be used instead of each single photodetector. Such a light source can be a laser. Product 10 can be moved relative to this other optical system so that the linear photodiode array can output data corresponding to each lead as a whole.

In other embodiments of the optical system, the product 10 may remain stationary and the optical system may include a light source that illuminates the entire array of leads, such as leads 22. In this optical system, the sensor may be a TV camera that electronically scans the "image" of all leads.

It should be noted that in all the optical systems described above, optical data of at least points P ₁ -P ₄ of each lead are obtained. One advantage of obtaining optical data for only points P ₁ -P ₄ for each lead is that the amount of electronically processed data can be minimized, as will be discussed below. Additionally, infrared point sources and single phototransistors are less expensive than detectors such as lasers, linear photodiode arrays, and TV cameras.

FIG. 10 is a diagram showing an example of the positional relationship between the optical components of the optical system 30 described above. An optical system 30 is used to detect the lead alignment state.
Additionally, there is provided a light source 56 that produces a light beam passing through a light path 58 that extends only across and intersects the body 12, and a sensor 60 that detects the light beam that passes through this light path 58. Additionally, there is provided another light source 62 for producing a light beam passing through a light path 64 across and intersecting the body 12, and a sensor 66 for detecting this light beam.

As is clear from FIG. 10, this optical path 58
are the optical paths 34, 40, 4 when viewed in the direction of movement of the product 10.
6, 52, in other words, in front of the optical path 6.
4 is behind, or behind, these optical paths 34, 40, 46, 52. The light sources 56 and 62 are separated by a predetermined distance D, for example, 5.08 cm (=2 inches), and the front end portion 14 is directed to the optical path 58, 6 by the sensors 60, 66.
4 is detected. As described later, using the output data of the sensors 60 and 66,
By considering the average velocity of the product 10, the reference point or front end 14 of each lead 22, 24 is determined.
Find the interval for.

FIG. 11 shows a self-contained module 68 for optical system 30. The module 68 has a housing 70 and a cable connector 74, the housing having a channel that allows movement of the product 10 in the direction of the arrow. As shown in FIGS. 11 and 12, a circuit board, such as a printed wiring board 78, is mounted on the left side 76 of the channel 72 of the housing 70, and a fixing pin 82 is inserted into the hole 80.
through them and fix them to the upper and lower brackets 84 respectively. A glass plate 86 is provided extending above the printed wiring board. Similar components are provided on the right side 76' of channel 72 of housing 70 (not shown).

FIG. 13 shows a portion of the optical system 30 integrated into the printed wiring board 78. The phantom line shows the product 10 moving along the channel 72 in the direction of the arrow. As shown in FIG. 10, this board includes a sensor 60, a sensor 36, a light source 38, and a light source 5.
0, sensor 48 and sensor 66 in sequence. On the right side of the channel 72 of this substrate, a light source 56, a light source 32, a sensor 42, a light source 44, a sensor 54, and a light source 62 are sequentially provided as shown in FIG. 10, although not shown.

Still another sensor 88 is shown in FIG.
This is provided below the sensor 60. cover 28
5 and 1 using a combination of the sensor 60 aligned with the base 26 and the sensor 88 aligned with the base 26.
Data related to the offset as shown in Figure 3 is extracted. Although not shown, another light source and optical path are provided immediately below the light source 56 and optical path 58 shown in FIG. As shown in FIG. 13, the cover 28 is offset from the base 26 so that when the product 10 passes the module 68, the time at which the cover traverses the optical path 58 shown in FIG. 58 is different from the time when the light path, not shown, is crossed. Therefore, the output data from one of the sensors 60, 88 is delayed with respect to the output data from the other, and this delay time represents the amount of offset.

side portions 76 each holding a printed wiring board;
and 76' will vary from module to module 68. This space depends on the width of a given package 10. The reason for this is to ensure that each optical path intersects the same point P ₁ -P ₄ of the leads for any width of the package. As the package width becomes wider,
The space width will also be wider. By varying the width of this space for the modules, the same printed wiring board can be used for all modules.

Figure 14 shows lead 22 and lead 2 of product 10.
FIG. 4 is a diagram illustrating an electron optical system 90 for detecting the inner spacing of the leads and thus the alignment of the leads.
Although this system 90 will be explained using the optical system 30, data for detecting this inner distance can be obtained using the other optical systems mentioned above.

As shown in the block diagram, the electron optical system 90 includes seven light sources 92 corresponding to the light sources 32, 38, 44, 50, 56, 62 and a light source below the light source 56 (not shown), and an optical path 34. ,40,4
6, 52, 58, 64 and a light path (not shown) below the light path 58, seven light paths 94, and sensors 36, 42, 48, 54, 60,
7 sensors 96 corresponding to 66 and 88 respectively
including. output data of the sensor 96 is generated as a pulse waveform signal on each of seven output lines 98;
Limit values of these pulse waveform signals are detected by respective limit value detectors 100. Each pulse waveform signal appearing on the output line 98 is detected by the limit value detector 100.
When the limit value set in is exceeded, seven rectangular pulse waveform signals as shown in FIG. 15 are generated.

The pulse waveform signal W ₆₀ shown in FIG.
Corresponds to output data from 0. pulse waveform signal
W ₈₈ corresponds to the output data of sensor 88, W ₃₆ corresponds to the output data from sensor 36, W ₄₂ corresponds to the output data from sensor 42, and W ₄₈ corresponds to the output data from sensor 48. , W ₅₄ correspond to the output data from the sensor 54, and W ₆₆ correspond to the output data from the sensor 66, respectively. All pulse waveforms shown in solid lines in FIG.
4 are aligned and the cover 28 and base 26 are accurately aligned. The broken lines in the figure are lines for explaining the bending of the leads 22 and 24 and the offset between the cover 28 and the base 26.

Leading edge E ₁ of signal W ₆₀ occurs when front end 14 of cover 28 traverses and interrupts optical path 58 . Also, leading edge E ₂ of signal W ₈₈ occurs when leading edge 14 of base 26 cuts across the lower optical path 58 .
A leading edge E' ₂ shown by a broken line in the signal W ₈₈ with respect to the leading edge E ₁ is information indicating that the cover 28 is offset with respect to the base 26 . The aligned leading edges E ₁ and E ₂ shown in solid lines are information indicating that the cover 28 and base 26 are not offset.

Leading edge E ₃ of signal W ₆₆ occurs when leading edge 14 traverses optical path 64 . As described below, the leading edge E ₁ and
The time interval between occurrences of E ₃ is used to detect the velocity or velocity of product 10 through optical system 30. Unless otherwise specified, the product 10 is assumed to be moving at a constant speed. Since the leading edge E ₁ corresponds to the leading end 14, the leading edge E ₁ is used as a reference to detect the inner distance between each of the leads 22 or 24.

Signal W ₃₆ has leading edges e ₁ to _{e o} corresponding to leads 22-1 to 22-n, respectively. These leading edges
e ₁ to _{e o} occur when each lead 22-1 to 22-n crosses and interrupts the optical path 34, and if the mutual time distances of these leading edges e ₁ to e _o are equal, this means that one Information is provided that "parallel bending" has not occurred in any of the above leads 22. As shown by the broken line in the figure, when the leading edge _e4 ' corresponding to the lead 22-4 is close to the leading edge _e3 , the lead 22-4
4 gives information that a "parallel bend" is occurring in the front.

The signal W ₄₂ has a plurality of leading edges e ₁ to e _o corresponding to the leads 24-1 to 24-n, respectively. Each leading edge e ₁ to _{e o} of this signal W ₄₂ corresponds to each lead 2
4-1 to 24-n cross and block the optical path 40. Since these leading edges e ₁ -e _o are equally spaced from each other, they provide information that no "parallel bends" have occurred in any of the leads 24.

Furthermore, the signal W ₄₈ is connected to leads 22-1 to 22-n.
It has a plurality of leading edges e ₁ to e o respectively corresponding to the leading edges e 1 to e _o . Each of these leading edges e ₁ to e _o has a respective lead 2
2-1 to 22-n cross the optical path 46. These leading edges e ₁ to e _o are equally spaced from each other,
Provides information that "combination bending" has not occurred. The dashed leading edge e' ₄ of this waveform signal is close to the leading edge e ₃ and thus provides information that lead 22-4 may be experiencing a "combination bend."

As described above, the optical path 46 has a certain angle, so the information on this "combined bend" alone cannot represent the amount and component of the "parallel bend" and the amount and component of the "upward bend." However, the distance between leading edges e' ₄ and e ₃ of signal W ₃₆ provides information about the "parallel bend" component. By subtracting this "parallel bending" component from the distance between the leading edges e' ₄ and _e3 of this signal W ₄₈ , the "upward bending" component can be detected. If the difference is 0, only "parallel bending" exists. If the difference is a number larger than 0, there is a component of "upward curvature" corresponding to this number. As another example, the leading edge where signal W ₃₆ is shown as a solid line
Corresponding to e ₄ , there is no "parallel bend" to lead 22-4, and the leading edge of signal W ₄₈ is indicated by a dashed line.
If e' ₄ indicates that there is a "combined bend", then the above subtraction indicates that there is only a "cave bend".

The signal W ₅₄ has a plurality of leading edges e ₁ to e _o corresponding to the leads 24-1 to 24-n, respectively.
Each leading edge e ₁ -e _o of this signal W ₅₄ occurs when a respective lead 24-1 - 24-n crosses and interrupts the optical path 52. These leading edges e ₁ -e _o are equally spaced, giving information that the lead 24 is free of "combinatory bends."

Electron optical system 90 includes a data processor, generally designated 102. The digital signal preprocessor 104 receives seven pulse waveform signals W ₆₀ , W ₈₈ , W ₃₆ , W ₄₂ , W ₄₈ ,
W ₅₄ and W ₆₆ are received and combined to extract five output pulse waveform signals W ₁ to W ₅ as shown in FIG. 16 onto five lines 108.

The signal W ₁ is a combination waveform signal of the signals W ₆₀ and W ₈₈ , and when this waveform signal W ₁ has no pulses at all as shown by the solid line, the leading edge E ₁ of the signal W ₆₀ and Signal W ₈₈ indicates coincidence with leading edge E ₂ and therefore that cover 28 and base 26 are correctly aligned. If this is not the case, a pulse P occurs, as indicated by the dashed line, of which one edge corresponds, for example, to the leading edge E ₁ and the other edge corresponds, for example, to the leading edge E ₂ ', and which connects the cover 28 and the base 26. This shows that there is an offset between

Signal W ₂ is a combination of signals W ₆₀ and W ₃₆ but inverted. The reference symbol of this signal W ₂ represents the leading edge of the signals W ₆₀ and W ₃₆ . other signals
The same applies to W ₃ , W ₄ , W ₅ and W ₆ . Signal W ₃ is a combination of signals W ₆₀ and W ₄₂ .
Also, signal W ₄ is a combination of signals W ₆₀ and W ₄₈ , W ₅ is a combination of W ₆₀ and W ₅₄ , and W ₆ is a combination of W ₆₀ and W ₆₆
It is a combination of These six signals W ₁ -W ₆ are generated by performing logical operations on various logic gates (not shown) of the preprocessor 104.

The data processor 102 has six retriggerable timers 110 each receiving a signal W ₁ -
Receive one of W ₆ . These timers 110 are clocked by a common clock 112. As an example, with respect to signal _W2 , when leading edge _E1 occurs, one of the timers 110 begins counting clock pulses coming from clock 112, starting from a count of zero. Since each leading edge e ₁ ~ _{e o} occurs,
One timer 110 corresponds to leading edge E _{1 ~}
e Outputs a 16-bit number corresponding to the cumulative time when _o occurred. Product 10 is then prepared as described below.
It is assumed that the speed of each lead 22 is known, and this timing information given as a number of 16 bits is used as the distance between the leading edges e ₁ to _{e o} and the leading edge E ₁ , or in other words, the distance between the corresponding lead 22 and the reference front end 14 . Convert to data representing the distance between. The difference between these 16 bit numbers is the internal spacing between leads 22. Other timers 110 respond to the signal and produce similar 16-bit numbers. If the signal W ₁ has no pulses as shown by the solid line, then 0
from one of the timers 110, representing that there is no offset between the cover 28 and the base 26, but corresponding to the width of this pulse P, if there is a pulse P on the signal _W1 . do
A 16-bit number is generated to indicate that there is an offset. A timer 110 is installed on each of the six lines 114.
A 16-bit number is output.

A microprocessor 116 and an arithmetic processor 118 process the 16 bit data received on line 114 under the control of software to be described below.
From this data, calculations are made of the inner distance between leads 22 and 24, and the results indicate that one or more leads have undergone a "parallel bend" or "upward bend" greater than a predetermined tolerance stored in memory. If this is found, a decision is made to exclude this product 10, and a control signal representing this is generated on the output line. Otherwise, it is determined that all leads of product 10 are aligned and another control signal is generated on line 120 representing this. A similar determination can be made in response to signal _W1 when determining whether product 10 should be excluded based on an offset above an acceptable range.

FIG. 17 is a diagram illustrating an automatic package handling device that may be used with a self-contained module 68;
This device 122 was manufactured by Trigon Industries in California, USA.
It may be one of several models, such as models T-2010 through 2080 manufactured by the Company, with slight modifications to accommodate module 68. This package handling device 122 has a processing gutter-like section 12.
4. A center holder 130 is rotatably mounted on a bracket 132 via a rail 126 and an arm 134 that define the channel 128. Module 68 is supported in trough 124 such that channel 72 is aligned with channel 128. The flexible output device 142 has three fixed channels 144, 146, 148, which are arranged in the channel 14 depending on the rotational position of the sorting mechanism 136.
Aligned with 0.

The package handling device 122 is a gravity applying device, and as shown in FIG. 18, it is inclined at an angle θ with respect to the horizontal direction. The package 10 is fed into the channel 128 with its leads 22, 24 facing upwardly and the center retainer 130 on the cover 28, after which the package passes by gravity through the module 68 and into the channel 140 of the sorting mechanism 136. I feel depressed. Next, based on the determination made by the electron optical system 90, the sorting mechanism 136 is rotated to select one of the channels 144, 146, 148.
Send out the package 10. The package handling device 122 is a "singulator".
, a system (not shown) by means of which a plurality of packages 10 can be delivered or held in the upper part of the channel, but only one package 10 can be processed through module 68 at a time. It can be done. This process will be described later with reference to FIG. 22.

FIG. 19 is a diagram showing the package 10 within the channel 128. Rail 126 of 150
Shape the part shown with any specific base 2
It is possible to follow the outline of 6. This shape prevents the package 10 from vibrating in the direction indicated by the arrows as it is fed through the module 68, thereby reducing noise in the optical data. Figure 20 shows module 68 and rail 1
26 is a diagram showing the relationship with 26 in detail.

To calculate the internal spacing between leads 22 or 24, timing data shown in FIG. 16 from timer 110 is collected by microprocessor 116. Next, for reasons to be described later, the timing data is linearized for the acceleration effect when the product 10 freely falls through the optical system 30,
Then, it is converted into a distance value according to the following formula.

Xn=T _SUM [V _R −A (T _R −T _SUM )] (1) Here, V _R =X _R /T _R ;A=g(sinθ)/2; T _SUM =t ₁ +t ₂ +… +t _o θ=angle of inclination shown in FIG. 18 in which the direction in which the product 10 falls with respect to the horizontal direction g=gravitational acceleration X _R =predetermined reference distance shown in FIG. 10 between optical paths 58 and 64 T _R =product 10 For example, the time V _R represented by the pulse P ₁ of the waveform signal W ₆ for the front end 14 to fall the reference distance X _R = average speed _to of the product 10 = incremental time shown in FIG. time) X _o = distance of each lead from the front end ₁₄ determined from the elapsed time to
Equation (1) is solved for each time event shown in FIG. 16 according to the procedure shown in the flowchart of the figure. First, a constant A is calculated in the process shown in block 152. Subsequently, the average speed V _R is calculated in the process shown in block 154, and then the register holding time T _SUM is set to 0 in the process shown in block 156.

Next, time is determined by the process shown in block 158.
A distance _{X o is} calculated by adding to to the time T _SUM and performing the process shown in block 160. Then this distance
X _o is stored or saved in the results array for later use by the process indicated by block 162. If there is no data as determined by block 164, that is, if all the leads have passed through the optical system 30, the program exits. Otherwise, a processing loop is formed through line 166 to another lead.
The calculation and storage of X _o is performed.

Once X _o has been calculated and stored for each lead, the microprocessor 116 sends sufficient data through other subroutines under software control to detect "parallel bends,""cavebends," etc. Determine whether it exists. Therefore, for example, in order to detect whether there is a "parallel bend" of the lead 22 that exceeds a predetermined tolerance, the distance X _o with respect to one lead 22 is
The subtraction is obtained from the distance X _o to 2. In that case, the distances of these X _o are calculated from the signal W ₂ . In that case, as described above, the difference obtained can be compared with predetermined data representing stored tolerance ranges.

As shown in FIGS. 17 to 20, the optical system 30
In particular, it passes through module 68 and falls due to gravity. This effect of gravity therefore causes the article 10 to undergo a constant acceleration such that the velocity of the reed near the rear end 16 is greater than the velocity of the reed near the front end 14. In this case, it goes without saying that the intervals between the leads are the same. Therefore, it is preferable that the software linearizes the data by taking this acceleration into account.

Furthermore, the principle of the present invention is that when the angle θ is 0, for example, when the product 10 is
It is also applicable to move the module 68 at a known constant speed by means of a conveyor belt (not shown) rather than by means of a conveyor belt (not shown). In this case, equation (1) becomes simple when A=0, and data of a known constant speed can be recorded in advance in the memory.

Although the digital signal preprocessor 104, the signals W ₁ to _{W 5} in FIG. 16, and the algorithm in FIG. 21 have been described, the waveform signal shown in FIG. Contains all data. Therefore,
Other preprocessors and other algorithms may be used to determine these distances.

Referring again to FIGS. 17 to 20, especially FIG.
A procedure for processing and storing products in an amount of about 10,000/hour will be explained. As an example, the center channel 146 of the output device 142 may receive good quality product, the side channel 148 may receive poor quality repairable product, and the side channel 144 may receive non-repairable bad product 10. You can do it like this.

Typically, a plurality of products are fed into the channel 128 and held by a "singulator" solenoid deactivation means near the top of the channel 128. This stopping means is shown in Fig. 17 as 16.
Indicated by 8. Also, as shown at 170 in FIG.
Another solenoid deactivation means is provided in the lower part. Immediately before releasing the next product 10 from this stop means 168, the previous product 10 falls by gravity through the module 68 and stops at the stop means 170.
When the previous product 10 is of good quality, the sorting mechanism 136 remains in the position shown in FIG. 17 and sends this product to channel 146. Therefore, the next product 10 is released by the stop means 170 towards the channel 146.
stop means 16 for processing in module 68
It can be done at the same time as being released from 8. because,
This is because it does not take time to move the sorting mechanism from the central position. If the quality of the previous product is not good, the sorting mechanism 136 is moved to the left or right to sort the previous product and then release the next product by the stop means 168. Time should be allowed to anticipate reception and return to central position.

FIG. 22 shows the above procedure in detail. A number of rows of products 10 are sent into channel 128 and the process indicated by block 172 causes the next product in the row to be held by stop means 168 while the previous product has been processed by module 68. Suppose that This next product is waiting to be "singulated" by the process shown in block 174. If the previous product in the stop means 170 is of good quality as determined by block 176, the next product is released by the stop means 170 (block 178) and the previous product is sorted (block 178). 180). If the determination in block 176 determines that the previous product is not of good quality, and if the determination in block 182 determines whether the previous product is repairable or not, the sorting mechanism 13
6 to the right channel 148 by the process shown in block 184 or to the left channel 144 by the process shown in block 186;
Then, the process shown in block 188 returns it to the center position. Then block 190 of the next product
It is released from the stop means 168 and sent to the module 68 by the process shown in block 192, and the data is obtained by the process shown in block 194.
The process shown in block 196 calculates the lead spacing, and then the process shown in block 196 compares these determined distances with stored tolerance ranges. Thereafter, the program is repeated via line 198 to "singulate" another product at stop means 168 by the process shown in block 174.

It is clear that the invention is not limited only to the embodiments described above, but that many modifications and variations can be made within the scope of the invention.

[Brief explanation of drawings]

Figure 1 is a perspective view showing an example of a completed package;
Figure 2 is a side view taken along line 2-2 in Figure 1, Figure 3 is an end view taken along line 3-3 in Figure 2, and Figure 4 shows the completed package in Figure 1. 5 is a side view similar to FIG. 2 showing another example of a completed package, and FIG. 6 is a top view schematically showing a part of the optical system of the present invention together with the package shown in FIG. 1. 7 is an end view taken along line 7-7 in FIG. 6, FIG. 8 is a schematic top view showing the package shown in FIG. 1 and other parts of the optical system of the present invention, and FIG. FIG. 8 is an end view taken along line 9-9 in FIG. 8, FIG. 10 is a top view showing the entire optical system of the present invention together with the package shown in FIG. 1, and FIG. 11 is a perspective view showing a completely independent module of the present invention. , FIG. 12 is a sectional view taken along line 12-12 in FIG. 11, FIG. 13 is a sectional view taken along line 13-13 in FIG. A block diagram showing the electron optical system of the invention, FIG. 15 is a diagram showing seven pulse waveforms used to explain the invention, and FIG. 16 shows five pulse waveforms used to explain the invention. 17 is a top view showing the package holder of the present invention, FIG. 18 is an end view taken along line 18-18 in FIG. 17, and FIG. 19 is a view taken along line 19-19 in FIG. 17. The taken sectional view, Figure 20, is the 17th
FIG. 21 is a flowchart for explaining the algorithm of the present invention, and FIG. 22 is a front view for explaining the other algorithm of the present invention. This is another flowchart. 10...product (or package), 12...object, 14...front end, 16...rear end, 18...
Left side, 20...Right side, 22, 22-1 to 22
-n, 24, 24-1 to 24-n...Lead, 2
6...Base, 28...Cover, 30...Optical system, 32, 38, 44, 50, 56, 62, 92
...light source (or light beam generating means or light source means),
34, 40, 46, 52, 64, 94... light path,
36, 42, 48, 54, 60, 66, 88, 9
6...Sensor (or detection means), 68...Module, 70...Housing, 72, 128, 14
4,146,148... Channel, 74... Cable connector, 76... Left side, 76'...
Right side, 78... Circuit board (or printed wiring board), 80... Hole, 82... Pin, 84... Bracket, 86... Glass plate, 90... Electron optical system, 98... Output line, 100...Limit value detector,
102...Data processor, 104...Preprocessor, 106, 108, 114...Line, 1
10...Timer, 112...Clock, 116...
... Microprocessor, 118 ... Arithmetic processor, 120 ... Output line, 122 ... Automatic package handling device, 124 ... Gutter-shaped portion, 126, 13
8... Rail, 130... Holding section, 132... Bracket, 134... Arm, 136... Sorting mechanism, 142... Flexible output device, 168, 170...
...stopping means.

Claims (1)

[Claims] 1 A bend along a first line extending from an axial object and parallel to the axis, a bend along a second line perpendicular to the first line, or a bend component along the first line. In an apparatus for testing the alignment of at least one particular lead which may have a bend in combination with a bend component along a second line: (a) for producing a first beam of light directed in a first direction; (b) first detection means for detecting the first light beam; (c) forming a predetermined angle with the first direction; and
a second light beam generating means for generating a second light beam forming a predetermined angle with a specific direction orthogonal to the first direction; (d) a second detection means for detecting the second light beam; and (e) the particular lead intersects both the first light beam and the second light beam, and when the particular lead intersects the first light beam, the first light beam of the axial object a second line is on the first direction, and a first line of the axial object is on the specific direction when the specific lead intersects the second light beam. . A lead alignment state inspection device comprising a moving means for moving the shafted object relative to the device along a movement path. 2. The lead alignment state inspection apparatus according to claim 1, wherein the first light beam generating means includes a first light source. 3. The lead alignment state inspection device according to claim 2, wherein the second light beam generating means includes a second light source. 4. Claim 3, wherein the first and second detection means each include a photodetector.
The lead alignment state inspection device described in section 2. 5. The lead alignment state inspection device according to claim 1, wherein the predetermined angle is set to 45° with respect to the first direction and the specific direction as an optimum condition. 6 A plurality of first and second portions extend from an axial object, the first portion being located on a first side of the object, and the second portion being located on a second side of the object. , a bend along a first line parallel to the axis, a bend along a second line perpendicular to the first line, or a combination of a bend component along the first line and a bend component along the second line. In an apparatus for inspecting the alignment of one or more of the first and second parts: (a) moving means for moving the object along the movement path; (b) moving the object along the movement path; a first light beam directed in a first direction so as to intersect only the first portion; when the first light beam intersects the first portion, the first direction is directed toward the object; (c) first detection means for detecting said first light beam; (d) said object is along said travel path; a second light beam directed in a second direction so as to intersect only the second portion when moving along the second portion; a second light beam generating means for producing a second light beam whose direction is parallel to the second line of the object; (e) a second detection means for detecting the second light beam; (f) said a third light beam directed in a first direction and a third direction forming an angle with a specific direction orthogonal to the first direction; a third light for producing a third light beam in which the three light beams intersect only the first part, and the specific direction is parallel to the first line of the object when the first light beam intersects the first part; (g) a third detection means for detecting the third light beam; (h) a fourth light beam directed in a fourth direction forming an angle with the second direction and the specific direction; fourth light beam generating means for producing a fourth light beam, the fourth light beam intersecting only the second portion when the object moves along the movement path; and (i) A lead alignment state inspection device comprising a fourth detection means for detecting the fourth light beam. 7. The moving means includes: (a) a housing having a first side defining a channel through which the object can move; and a second side spaced apart from the first side; (b) generating lead alignment data; , the first light beam generating means for producing the first light beam; the first detection means for detecting the first light beam; and the second light beam producing the second light beam. (c) a first circuit board and a second circuit board having optical means comprising generating means and said second detection means for detecting said second light beam; first support means for supporting a first circuit board; and (d) second support means for supporting said second circuit board on said second side of said housing. A lead alignment state inspection device according to claim 6. 8. The first and second circuit boards each include a plurality of alignment holes, and the first and second support means each include a plurality of alignment pins that receive the alignment holes. The lead alignment state inspection device according to item 7. 9 the first circuit board supported by the first support means on a first side of the housing; and the second circuit board supported by the second support means on a second side of the housing. 8. The lead alignment state inspection device according to claim 7, wherein an interval between the two is predetermined based on the size of the object. 10 A plurality of first and second leads extend from a shafted object having a front end, the first lead being located on a first side of the object, and the second lead being located on a second side of the object. A bend along a first line parallel to the axis, a bend along a second line perpendicular to the first line, or a combination of a bend component along the first line and a bend component along the second line. one or more first leads that may have a bend; a bend along a third line parallel to the axis; a bend along a fourth line perpendicular to the third line; or a bend component along the third line; In an apparatus for inspecting the alignment of one or more second leads which may have a bend in combination with a bend component along a line: (a) a second lead for producing a first light beam directed in a first direction; (b) first detection means for detecting the first light beam; (c) forming a predetermined angle with the first direction; and
a second light beam generating means for generating a second light beam forming a predetermined angle with a specific direction orthogonal to the first direction; (d) a second detection means for detecting the second light beam; and (e) third light beam generating means for producing a third light beam directed in a third direction; (f) third detection means for detecting said third light beam; (g) said first and fourth light beam generating means for generating a fourth light beam directed in a fourth direction forming a predetermined angle with a specific direction; (h) fourth detection means for detecting the fourth light beam; (i) intersects both the first light beam and the second light beam of the first lead, and when the first lead intersects the first light beam, the first light beam of the axial object; a second line is on the first direction, and a first line of the axial object is on the specific direction when the first lead intersects the second light beam; , the second lead intersects both the third light beam and the fourth light beam, and when the second lead intersects the third light beam, the fourth light beam of the axial object line is on the third direction and a third line of the axial object is on the specific direction when the second lead intersects the fourth light beam; the axial object so that the leads do not intersect the third light beam or the fourth light beam, and the second leads do not intersect the first light beam or the second light beam; (j) moving means for moving relative to the device along the movement path; (j) when an axial object moves along the movement path in front of the first to fourth light beams; (k) fifth detection means for detecting said fifth light beam; (l) said first to fourth light beams; (m) means for generating a sixth light beam at a predetermined distance from said fifth rear light beam and capable of intersecting said front end; and (m) for detecting said sixth light beam. A lead alignment state inspection device comprising a sixth detection means. 11. A plurality of first and second leads extend from a shafted object, the first lead is located on a first side of the object, and the second lead is located on a second side of the object, The first lead bends along a first line parallel to the axis, bends along a second line perpendicular to the first line, or combines a bending component along the first line and a bending component along the second line. and the second lead may have a bend along a third line parallel to the axis, or a bend along a fourth line perpendicular to the third line, or a bend component along the third line and a fourth line. The shafted object may have a bend that is a combination of a bend component along a line, and the shafted object further includes a cover and a base that support the first lead and the second lead therebetween, and the cover and the base. In an apparatus for inspecting the relative positional deviation between the leads and the alignment state of the leads: (a) first light beam generating means for generating a first light beam directed in a first direction; (b) said a first detection means for detecting a first light beam; (c) forming a predetermined angle with the first direction; and
a second light beam generating means for generating a second light beam forming a predetermined angle with a specific direction orthogonal to the first direction; (d) a second detection means for detecting the second light beam; and (e) third light beam generating means for producing a third light beam directed in a third direction; (f) third detection means for detecting said third light beam; (g) said first and fourth light beam generating means for generating a fourth light beam directed in a fourth direction forming a predetermined angle with a specific direction; (h) fourth detection means for detecting the fourth light beam; (i) intersects both the first light beam and the second light beam of the first lead, and when the first lead intersects the first light beam, the first light beam of the axial object; a second line is on the first direction, and a first line of the axial object is on the specific direction when the first lead intersects the second light beam; , the second lead intersects both the third light beam and the fourth light beam, and when the second lead intersects the third light beam, the fourth light beam of the axial object line is on the third direction and a third line of the axial object is on the specific direction when the second lead intersects the fourth light beam; the axial object so that the leads do not intersect the third light beam or the fourth light beam, and the second leads do not intersect the first light beam or the second light beam; (j) a fifth light beam for producing a fifth light beam capable of intersecting the cover when the axial object moves along the travel path; beam generating means; (k) fifth detection means for detecting the fifth light beam; (l) producing a sixth light beam capable of intersecting the base when the axial object moves along the travel path; (m) A lead alignment state inspection device comprising: a sixth light beam generating means for detecting the sixth light beam; (m) a sixth detecting means for detecting the sixth light beam. 12 A bend along a first line parallel to the axis, a bend along a second line orthogonal to the first line, on an axial object and spaced apart from each other;
Alternatively, in a lead alignment state inspection device for inspecting the alignment state of a plurality of leads that may have a bend that is a combination of a bend component along the first line and a bend component along the second line, (a) the axial a moving means for moving an object along a moving path; (b)() a first light beam generating means for producing a first light beam capable of intersecting the lead when the axial object moves along the moving path; () first detection means for detecting the first light beam and producing first output data having information on the spacing between the leads in a direction along the first line; a second light beam generating means for producing a second light beam capable of intersecting the lead when moving along the travel path; () detecting the second light beam so that the axial object moves along the travel path; detecting the second light beam directed to obtain second output data having combined information of spacing between the leads in a direction along the first and second lines when moving along the first and second lines; second detection means for producing data; and optical means for producing data having information regarding the spacing between the leads; (c)() detecting the first line in response to the first output data; a first determining means for determining the distance between the leads in the direction along the second line; and () a second determining means for determining the distance between the leads in the direction along the second line according to the first output data and the second output data. 1. A lead alignment state inspection device comprising: determining means; and data processing means. 13. The lead alignment state inspection device according to claim 12, wherein the second determining means includes subtracting means for subtracting the information on the first output data from the information on the second output data. . 14. The lead alignment state inspection device according to claim 12, wherein the moving means includes gravity applying means for directing the object in a direction across the optical means. 15. The lead alignment state inspection device according to claim 12, wherein the moving means includes a rail for guiding the object, and the rail has a shape that matches the shape of the object.