JPH0337759B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic package mounting structure, and more particularly to an electronic package mounting structure for mounting an electronic package constituting an electronic processing device.

In recent years, electronic package mounting structures in electronic processing devices are being replaced by planar mounting structures from three-dimensional mounting methods due to the number of connection terminals and measures against heat generation as devices become highly integrated.

However, if electronic packages with the same degree of integration can be configured with a three-dimensional mounting structure, the mounting density and the mounting wiring length will be improved compared to the planar mounting structure, and it will be easier to handle and advantageous in terms of maintenance.

However, due to the use of high-density integrated circuits, the density of device packaging and wiring length are disadvantageous due to an increase in heat generation density and an increase in the mounting distance between electronic packages due to the installation of heat sinks on high-density integrated circuits or electronic packages. becomes.

Conventional electronic package mounting structures that solve these disadvantages include the mounting structures shown in FIGS. 1 and 2.

FIG. 1 is a perspective view showing an example of a conventional electronic package mounting structure, and FIG. 2 is a front view of the conventional example shown in FIG. 1, viewed from the arrow direction A.

The conventional electronic package mounting structure shown in FIG. 1 and FIG. 4 is mounted face-to-face.

In the mounting structure of such an electronic package, the second
Motherboard 1 on the same axis B as shown in the figure.
Since the connector 5 is mounted from both sides of the motherboard 1, the motherboard 1 requires connection holes equivalent to two connectors at the same position.

However, as the number of connector pins increases as the degree of integration of high-density integrated circuits increases, it is physically extremely difficult to provide connection holes equivalent to two connectors at the same location on such a motherboard. There are also drawbacks.

Furthermore, when performing modified wiring when a logical change occurs, there is a drawback that wiring connection and wiring routing are extremely difficult.

Furthermore, there is also the drawback that it is impossible to attach a testing probe when inspecting or maintaining the device.

In other words, the conventional electronic package mounting structure is
There are disadvantages in that it is difficult to install connection holes, and it is difficult to modify wiring and attach inspection probes.

An object of the present invention is to provide an electronic package mounting structure that allows easy installation of connection holes, modification of wiring, and installation of inspection probes.

That is, an object of the present invention is to provide an electronic package mounting structure that solves the above-mentioned drawbacks by effectively utilizing the dead space C shown in FIG.

In the electronic package mounting structure of the present invention, an electronic package equipped with a high-density integrated circuit and the electronic package are mounted alternately on different axes on the front and back sides, and the connector pins connecting the electronic package are fixed by passing through the electronic package. The device is configured to include a motherboard, and a removable connector housing that guides the connector pins and secures a wiring area.

That is, in the electronic package mounting structure of the present invention, in a structure in which electronic packages mounted with high-density integrated circuits are mounted on both sides of a motherboard, the electronic packages are mounted alternately on different axes on the front and back sides. The connector housing is comprised of a motherboard fixed to the motherboard through which connector pins are passed through, and a removable connector housing that guides the connector pins and secures a wiring area.

Next, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 3 is a perspective view showing one embodiment of the present invention, and FIG. 4 is a front view of the embodiment shown in FIG. 3, as viewed from the arrow direction D.

Referring to FIGS. 3 and 4, the connector pins 6 on both the front and back sides of the motherboard 1 are arranged so that the connector pins 6 on the front side of the motherboard 1 are located in the center of the mounting pitch G of the connector pins 6 on the back side. Attach it by passing it through. Therefore, the electronic packages 2 mounted on the front surface of the motherboard 1 and the electronic packages 2 mounted on the back surface are alternately mounted at positions with different axes from each other.

A removable connector housing 9 is attached to the connector pin 6, which has an uneven shape so as to obtain a dimension E from the motherboard 1, and has a hole F for guiding the connector pin 6.

An electronic package 2 comprising a high-density integrated circuit 3, a heat sink 4 and a socket side connector 8 is inserted into the connector housing 9, and the connector pin 6
The structure is such that the socket contact of the socket side connector 8 is electrically connected to the socket contact of the socket side connector 8.

Therefore, when a logic change occurs and the wiring 10 becomes necessary, the gap having the dimension E between the connector housing 9 and the motherboard 1 can be used to perform the wrapping connection and the wiring routing.

Generally, it is necessary to be able to connect at least two signal connections to the same wrapping post, but in the embodiments shown in Figs. 2
It is possible to wrap and connect books one by one.

Furthermore, since the electronic package 2 is mounted alternately on the front and back surfaces of the motherboard 1, the problem of connection holes for the connector pins 6 as described in the prior art can be solved.

In addition, since an inspection probe for inspecting or maintaining the device can be connected to the connecting portion located on the opposite side of the connector housing 9, inspection becomes easy.

As explained above, the present invention involves mounting the electronic package alternately on the front and back sides with different axes, allowing the connector pins to be connected to penetrate through the motherboard and fixing them, and using the removable connector housing to cover the wiring area. By providing such a configuration, there is an effect that the drawbacks mentioned in the prior art can be solved.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an example of a conventional electronic package mounting structure, FIG. 2 is a front view of the conventional example shown in FIG. 1, and FIG. 3 is a perspective view showing an embodiment of the present invention.
FIG. 4 is a front view of the embodiment shown in FIG. 3. 1...motherboard, 2...electronic package,
3... High-density integrated circuit, 4... Heat sink, 5... Connector, 6... Connector pin, 8... Socket side connector, 9... Connector housing, 10...
Wiring, A...Direction of the arrow, B...Axis, C...Space, D...Direction of the arrow, E...Dimensions, F...Hole, G
...Mounting pitch, H...Connection part, I...Connection part.

Claims (1)

[Scope of Claims] 1. A motherboard having a first surface and a second surface opposite to the first surface, and a plurality of motherboards arranged protruding from the first surface and the second surface. a group of connector pins, and a plurality of holes through which the connector pins protrude, and predetermined holes are provided between the first surface or the second surface and the plurality of holes so as to secure wiring space. a plurality of connector housings that are attached to the first surface and the second surface while maintaining intervals; and a connector that fits with the connector pins that protrude from the plurality of holes of the plurality of connector housings, and is equipped with an electronic component. An electronic package mounting structure comprising a plurality of electronic packages.