JPH0340331B2 - - Google Patents
Info
- Publication number
- JPH0340331B2 JPH0340331B2 JP25283286A JP25283286A JPH0340331B2 JP H0340331 B2 JPH0340331 B2 JP H0340331B2 JP 25283286 A JP25283286 A JP 25283286A JP 25283286 A JP25283286 A JP 25283286A JP H0340331 B2 JPH0340331 B2 JP H0340331B2
- Authority
- JP
- Japan
- Prior art keywords
- vibration
- microphone
- sound
- chamber
- acoustic measurement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000001133 acceleration Effects 0.000 claims description 16
- 238000005192 partition Methods 0.000 claims description 16
- 238000004891 communication Methods 0.000 claims description 9
- 238000005259 measurement Methods 0.000 claims description 8
- 239000012528 membrane Substances 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 7
- 239000003566 sealing material Substances 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 239000000470 constituent Substances 0.000 claims description 2
- 230000005520 electrodynamics Effects 0.000 claims 1
- 230000005856 abnormality Effects 0.000 description 4
- 230000003068 static effect Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 210000005069 ears Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000033764 rhythmic process Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
Description
【発明の詳細な説明】
<産業上の利用分野>
この発明は運転中の機器の運転状況、故障、安
全についての判断をする振動・音響計測装置のセ
ンサーの構造に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to the structure of a sensor for a vibration/acoustic measuring device that determines the operating status, failure, and safety of equipment during operation.
<従来の技術及びその問題点>
物体が振動すると音を発する。回転体を有する
装置が円滑に運転されているときは振動も少なく
かつ発する音も定常でリズムをもつている。<Prior art and its problems> When an object vibrates, it emits sound. When a device with a rotating body is operating smoothly, there is little vibration and the sound it makes is steady and has a rhythm.
運転者は通常耳で音を聞き手を回転する装置の
外箱に触れてその正常状態を記憶し、これと異な
る音や振動があるときは異常なりとして対応する
処置をとつている。 The driver usually hears the sound with his ears and touches the outer box of the rotating device to memorize its normal state, and if there is a sound or vibration that differs from this, he considers it abnormal and takes appropriate measures.
しかし、近時センサーの進歩により、人間の感
覚よりも優れた装置の開発がされ、装置の安全予
防を数値的表示又は画面表示などをし、より正
確、精度の高い検知と安全をはかる手段が提供さ
れている。 However, due to recent advances in sensors, devices that are superior to human senses have been developed, and there are means to display equipment safety precautions numerically or on screen, and to ensure more accurate and precise detection and safety. provided.
センサーとして音の計測検知には通常マイクロ
ホンが使用され、振動の計測には振動加速度ピツ
クアツプ、変位ピツクアツプ、振動速度ピツクア
ツプ等が使用されている。 As a sensor, a microphone is usually used to measure and detect sound, and a vibration acceleration pick-up, displacement pick-up, vibration velocity pick-up, etc. are used to measure vibration.
従来機械やプラントの異常の診断や運転状態の
モニターには振動が主体であつたが近時音をモニ
ターすることが増えつつある。 Conventionally, vibrations have been the main method used to diagnose abnormalities in machinery and plants and monitor operating conditions, but recently, monitoring of sounds has been increasing.
例えばタービンやポンプのような回転機械の軸
受部や羽根車部等の異常診断を行なう場合、一点
の振動と音を計測し両者の信号の総合から異常を
診断することがある。 For example, when diagnosing an abnormality in a bearing or impeller of a rotating machine such as a turbine or a pump, vibration and sound at one point may be measured and the abnormality diagnosed based on the combined signals of both.
この場合軸受内部ベアリング部からの音や、ス
クロール(渦巻状ケーシング)内の羽根車部から
の音を直接計測すれば最も確実であるが装置構造
の点よりしてそれができないので、装置ケーシン
グにセンサーを接触させその透過音を計測してい
る。 In this case, it would be most reliable to directly measure the sound from the bearing inside the bearing or the impeller inside the scroll (spiral casing), but this is not possible due to the structure of the equipment. A sensor is placed in contact and the transmitted sound is measured.
またその音については、従来は音圧レベルで計
ることが多かつたが、近年FFT(高速フーリエ変
換器)分析器の発達に伴い音響インテンシテイ
(強度)を計測し音響パワー(出力)を計測する
ことが多くなつてきている。 In addition, in the past, the sound was often measured by the sound pressure level, but in recent years, with the development of FFT (Fast Fourier Transformer) analyzers, the sound intensity (strength) is measured and the sound power (output) is measured. There are more and more things to do.
なお音響インテンシテイの計測方法を大きく分
類すると、
(1) 2つのマイクロホンを使用する場合、
(2) 1つのマイクロホン(サーフエスインテンシ
テイ)と振動加速度ピツクアツプを併用する場
合
となる。後者の(2)の場合、従来はマイクロホンと
振動加速度ピツクアツプは別々のセンサーを使用
しているためそれらを近接位置させても同一点の
音及び振動を計測したということにならないた
め、信号の時間的遅れ位相差を生じ正しいデータ
を得る計測ができない。 The methods for measuring sound intensity can be broadly classified into: (1) when two microphones are used, and (2) when one microphone (surf intensity) is used in combination with a vibration acceleration pickup. In the latter case (2), conventionally the microphone and vibration acceleration pickup use separate sensors, so even if they are placed close to each other, it does not mean that the sound and vibration were measured at the same point. This causes a phase delay and a phase difference, making it impossible to measure to obtain correct data.
このような欠点を補うセンサーとして発明され
たものが本願センサーであり、被計測点の音及び
振動加速度が同時計測できるという特徴を有する
ものであり、またかかる装置の出現が要望されて
いたものである。 The sensor of the present application was invented as a sensor that compensates for these drawbacks, and has the feature of being able to simultaneously measure sound and vibration acceleration at the measurement point, and the appearance of such a device has been desired. be.
<発明の目的>
この発明は、被測定点の音及び振動加速度、並
びに構造物内音と構造物面の振動加速度を同時測
定できるマイクロホン、振動加速度ピツクアツプ
組合せ型のセンサー構造を提案することを目的と
する。<Purpose of the Invention> The purpose of the present invention is to propose a sensor structure that combines a microphone and a vibration acceleration pickup that can simultaneously measure sound and vibration acceleration at a point to be measured, as well as sound inside a structure and vibration acceleration on the surface of the structure. shall be.
<手段の概要>
この発明は、上部室と下部空間から構成された
装置外箱を有し、上部室には音圧を計測するため
のマイクロホンを位置させ、下部室には振動を計
測するための振動加速度ピツクアツプを位置さ
せ、かつ下部室の軸心部には、上部室へ音を伝達
させるための連通孔を位置させたものである。<Summary of Means> The present invention has an outer box of the device composed of an upper chamber and a lower space, a microphone for measuring sound pressure is located in the upper chamber, and a microphone for measuring vibration is located in the lower chamber. A vibration acceleration pickup is located in the lower chamber, and a communication hole for transmitting sound to the upper chamber is located in the axial center of the lower chamber.
上部室は音圧受圧膜で上下に仕切られた構造で
あり、上部に背極を設け、音圧受圧膜と背極によ
りコンデンサ−マイクロホンを形成させ、かつ背
極室と音圧伝播室の圧力をバランスさせるために
気圧調整孔を設け、音圧伝播室の底面中心に設け
られた音圧伝播孔と下部室の振動加速度ピツクア
ツプ中心軸部に設けた連通孔端部とが絶縁シール
材を介して密着する構造を特徴とする振動・音響
計測一体型センサーの構造を提案するものであ
る。 The upper chamber has a structure in which it is partitioned into upper and lower parts by a sound pressure receiving membrane, and a back electrode is provided at the top, and the sound pressure receiving membrane and the back electrode form a condenser microphone, and the pressure in the back electrode chamber and the sound pressure propagation chamber is A pressure adjustment hole is provided to balance the pressure, and the sound pressure propagation hole provided at the center of the bottom of the sound pressure propagation chamber and the end of the communication hole provided at the center axis of the vibration acceleration pickup in the lower chamber are connected via an insulating sealing material. This paper proposes a structure for an integrated vibration/acoustic measurement sensor that is characterized by a structure in which the two sensors are in close contact with each other.
実施例 1
第1図はこの発明の第1実施例を示す圧縮型の
装置の縦断面図である。Embodiment 1 FIG. 1 is a longitudinal sectional view of a compression type device showing a first embodiment of the present invention.
センサー1の装置外箱は内部に収容する部材の
組付けを容易にするためケーシング2a,2b,
2cの組立てにより形成されている。上室3はケ
ーシング2a,2b,2cの組付けにより形成さ
れる。上室3は振動膜4で上仕切室3a、下仕切
室3bとに仕切りされる。上仕切室3a内にはマ
イクロホン背極が振動絶縁材6a,6bを介して
保持位置される。 The device outer box of the sensor 1 has casings 2a, 2b,
It is formed by assembling 2c. The upper chamber 3 is formed by assembling the casings 2a, 2b, and 2c. The upper chamber 3 is partitioned by a vibrating membrane 4 into an upper partition chamber 3a and a lower partition chamber 3b. A microphone back electrode is held within the upper partition 3a via vibration insulators 6a and 6b.
上仕切室3aと下仕切室3bは気圧調整孔7で
圧力の均衡が確保されている。この気圧調整孔に
より被測定場の圧力と背極部の圧力との均衡が保
たれ振動膜への静圧による損傷を防止することが
できる。なお振動絶縁材6aについても同様通気
孔8を設けておく。 Pressure balance between the upper partition chamber 3a and the lower partition chamber 3b is ensured by air pressure adjustment holes 7. This air pressure adjustment hole maintains a balance between the pressure in the field to be measured and the pressure in the back electrode portion, making it possible to prevent damage to the vibrating membrane due to static pressure. Incidentally, a ventilation hole 8 is similarly provided for the vibration insulating material 6a.
下仕切室3bの床、(ケーシング2cの一部で
もある)には、そのケーシング軸心と同軸心にす
る音波伝達用通路9をもつ音波の伝達用ノズル1
0が下方に垂下位置する。 On the floor of the lower partition 3b (which is also a part of the casing 2c) is a sound wave transmission nozzle 1 having a sound wave transmission passage 9 coaxial with the casing axis.
0 is located hanging downward.
前記した各部材の組付けにより音圧計測部11
が形成される。 The sound pressure measuring section 11 is assembled by assembling each of the above-mentioned members.
is formed.
下部空間12はケーシング2cとピツクアツプ
本体15の組付けにより形成される。振動加速度
ピツクアツプ13は、軸心に音波伝達用の連通孔
14をもつピツクアツプ本体15と圧電素子16
と重錘17a,17bとよりなる。 The lower space 12 is formed by assembling the casing 2c and the pickup body 15. The vibration acceleration pickup 13 includes a pickup main body 15 having a communication hole 14 for transmitting sound waves at its axis, and a piezoelectric element 16.
and weights 17a and 17b.
ピツクアツプ本体15には連通孔14と軸心を
同じくする接続用タツプ孔19が設けられ、この
タツプ孔19のねじ部19aと螺合する中心に連
通孔と軸心を同じくし音波伝達用の通路22aを
もつプラグ22(第3図に示す)により、検査対
象物(図示せず)と接続固定される。 The pick-up body 15 is provided with a connection tap hole 19 having the same axis as the communication hole 14, and a passage for sound wave transmission having the same axis as the communication hole at the center of the tap hole 19 that is screwed into the threaded portion 19a. A plug 22 (shown in FIG. 3) having a diameter of 22a connects and fixes the test object (not shown).
センサと検査対象物との接続は音波と振動を正
しく伝えるものであれば他の手段によつてもよ
い。 The sensor and the object to be inspected may be connected by other means as long as they properly transmit sound waves and vibrations.
ピツクアツプ本体の頂部端面と音波伝達用ノズ
ル10の間には振動絶縁シール材20が位置し挾
持される。符合21は信号を伝達する電線類の引
き出し用ノズルである。なおマイクロホンに接続
する信号伝達用の電線はケーシング2aに設けた
引出し用の孔(図示せず)を挿通してすることが
できる。 A vibration insulating sealing material 20 is positioned and held between the top end surface of the pickup body and the sound wave transmission nozzle 10. Reference numeral 21 indicates a nozzle for drawing out electric wires for transmitting signals. Note that a signal transmission wire connected to the microphone can be inserted through a draw-out hole (not shown) provided in the casing 2a.
実施例 2
第1図では圧電素子16が圧縮型に設けられて
いるのに対し、第2実施例の第2図では圧電素子
16′は剪断型に設けられ、この圧電素子16′を
囲み重錘17′を設けたものである。その他の構
成部材については第1図と同じである。Embodiment 2 In FIG. 1, the piezoelectric element 16 is provided in a compression type, whereas in FIG. 2 of the second embodiment, the piezoelectric element 16' is provided in a shear type, and a heavy A weight 17' is provided. Other constituent members are the same as in FIG. 1.
<発明の効果>
振動加速度ピツクアツプ13の軸心と、音波伝
達用の連通孔と軸心とは同一であり、この連通孔
14は下仕切室3bに開口し振動膜4に音圧が伝
えられ、振動膜4と背極5間の静電容量変化によ
り音圧を電気信号に変換する部分と、振動加速度
ピツクアツプ部分から構成され、それぞれの電気
信号を信号処理し、評価することにより、音と振
動による総合評価判断が行なえる。その結果従来
振動のみで評価判断していた機械装置の異常判断
が両者により確実に行なえることとなる。<Effects of the Invention> The axial center of the vibration acceleration pickup 13 and the axial center of the communication hole for transmitting sound waves are the same, and this communication hole 14 opens into the lower partition chamber 3b so that sound pressure is transmitted to the vibrating membrane 4. , consists of a part that converts sound pressure into an electrical signal by changing the capacitance between the diaphragm 4 and the back electrode 5, and a vibration acceleration pickup part.By processing and evaluating each electrical signal, the sound and A comprehensive evaluation judgment can be made based on vibration. As a result, it becomes possible to reliably judge the abnormality of a mechanical device, which has conventionally been evaluated and judged only based on vibration, by using both of them.
なお気圧調整孔7は被測定空間の静圧が大気圧
でない場合にマイクロホン背極の前後静圧をバラ
ンスさせるために設けた孔であり、このピツクア
ツプ音圧計測部の特性に貢献することが大きい。 The air pressure adjustment hole 7 is a hole provided to balance the front and rear static pressure of the microphone back electrode when the static pressure in the space to be measured is not atmospheric pressure, and it greatly contributes to the characteristics of this pick-up sound pressure measuring section. .
第1図はこの発明の第1実施例にかかるセンサ
ーの縦断面図、第2図は第2実施例のセンサーの
縦断面図、第3図はセンサーと対象物を接続する
プラグの縦断面図である。
1……センサー、2a,2b,2c,2d……
ケーシング、3……上室、3a……上仕切室、3
b……下仕切室、4……振動膜、5……背極、6
a,6b……振動絶縁材、7……気圧調整孔、8
……通気孔、10……音波伝達用ノズル、11…
…音圧計測部、12……下部空間、13……振動
加速度ピツクアツプ、14……連通孔、15……
ピツクアツプ本体、19……接続用タツプ孔、2
0……振動絶縁シール材、22……プラグ。
FIG. 1 is a vertical cross-sectional view of a sensor according to a first embodiment of the present invention, FIG. 2 is a vertical cross-sectional view of a sensor according to a second embodiment, and FIG. 3 is a vertical cross-sectional view of a plug connecting the sensor and an object. It is. 1...Sensor, 2a, 2b, 2c, 2d...
Casing, 3...Upper chamber, 3a...Upper partition, 3
b... Lower partition, 4... Vibration membrane, 5... Back electrode, 6
a, 6b... Vibration insulating material, 7... Air pressure adjustment hole, 8
...Vent hole, 10...Sound wave transmission nozzle, 11...
...Sound pressure measurement section, 12...Lower space, 13...Vibration acceleration pickup, 14...Communication hole, 15...
Pick-up body, 19...Tap hole for connection, 2
0... Vibration insulation sealing material, 22... Plug.
Claims (1)
材で形成し、該上室を振動膜で仕切り上仕切室と
下仕切室とし、上仕切室にはマイクロホンを位置
させ、前記装置外箱には上仕切室と下仕切室を連
通する気圧調整孔を設け、該上仕切室、下仕切
室、振動膜とマイクロホンにより音圧計測部を形
成し、前記下仕切室底板中心部に設けた音波伝達
用通路の下端に絶縁シール材を介して同一軸心に
してかつその上端を接する音波伝達用の連通孔を
もつ振動加速度ピツクアツプを前記下部空間内に
設けたことを特徴とする振動・音響計測一体型セ
ンサー。 2 マイクロホンをコンデンサマイクロホンとす
ることを特徴とする特許請求の範囲第1項記載の
振動・音響計測一体型センサー。 3 マイクロホンを圧電型マイクロホンとするこ
とを特徴とする特許請求の範囲第1項記載の振
動・音響計測一体型センサー。 4 マイクロホンを動電型マイクロホンとするこ
とを特徴とする特許請求の範囲第1項記載の振
動・音響計測一体型センサー。 5 振動加速度ピツクアツプの構成部材を圧縮型
の圧電素子と重錘とすることを特徴とする特許請
求の範囲第1項記載の振動・音響計測一体型セン
サー。 6 振動加速度ピツクアツプの構成部材を剪断型
の圧電素子と重錘とすることを特徴とする特許請
求の範囲第1項記載の振動・音響計測一体型セン
サー。[Scope of Claims] 1. The outer box of the device is formed of members constituting an upper chamber and a lower space, respectively, the upper chamber is partitioned by a vibrating membrane into an upper partition chamber and a lower partition chamber, and a microphone is located in the upper partition chamber. The outer box of the device is provided with an air pressure adjustment hole that communicates the upper partition and the lower partition, the upper partition, the lower partition, a vibrating membrane, and a microphone form a sound pressure measuring section, A vibration acceleration pick-up having a communication hole for sound wave transmission that is coaxially centered with the lower end of the sound wave transmission passage provided in the center of the bottom plate through an insulating sealing material and in contact with the upper end thereof is provided in the lower space. Features an integrated vibration/acoustic measurement sensor. 2. The vibration/acoustic measurement integrated sensor according to claim 1, wherein the microphone is a condenser microphone. 3. The vibration/acoustic measurement integrated sensor according to claim 1, wherein the microphone is a piezoelectric microphone. 4. The vibration/acoustic measurement integrated sensor according to claim 1, wherein the microphone is an electrodynamic microphone. 5. The vibration/acoustic measurement integrated sensor according to claim 1, wherein the components of the vibration acceleration pickup are a compression type piezoelectric element and a weight. 6. The vibration/acoustic measurement integrated sensor according to claim 1, wherein the constituent members of the vibration acceleration pickup are a shear type piezoelectric element and a weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25283286A JPS63108235A (en) | 1986-10-25 | 1986-10-25 | Vibration and acoustic measurement integral type sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25283286A JPS63108235A (en) | 1986-10-25 | 1986-10-25 | Vibration and acoustic measurement integral type sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63108235A JPS63108235A (en) | 1988-05-13 |
| JPH0340331B2 true JPH0340331B2 (en) | 1991-06-18 |
Family
ID=17242820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25283286A Granted JPS63108235A (en) | 1986-10-25 | 1986-10-25 | Vibration and acoustic measurement integral type sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63108235A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5609613B2 (en) * | 2010-12-14 | 2014-10-22 | 株式会社村田製作所 | Shock and acoustic sensor |
| JP6396943B2 (en) * | 2016-04-27 | 2018-09-26 | 株式会社日本製鋼所 | Failure diagnosis apparatus and method by non-contact vibration measurement |
| WO2019183283A2 (en) | 2018-03-21 | 2019-09-26 | Knowles Electronics, Llc | Dielectric comb for mems device |
| CN119211820B (en) * | 2024-09-20 | 2025-12-05 | 维沃移动通信有限公司 | Microphones and electronic devices |
-
1986
- 1986-10-25 JP JP25283286A patent/JPS63108235A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63108235A (en) | 1988-05-13 |
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