JPH0340944B2 - - Google Patents
Info
- Publication number
- JPH0340944B2 JPH0340944B2 JP59014870A JP1487084A JPH0340944B2 JP H0340944 B2 JPH0340944 B2 JP H0340944B2 JP 59014870 A JP59014870 A JP 59014870A JP 1487084 A JP1487084 A JP 1487084A JP H0340944 B2 JPH0340944 B2 JP H0340944B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- tip
- shoulder
- fiber sensor
- detected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
【発明の詳細な説明】
この発明は集積回路素子のリード曲りの検査方
法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for inspecting lead bends in integrated circuit devices.
従来この検査は目視検査で行ない人の判断によ
りリード曲りを検査していた。 Conventionally, this inspection was performed visually and the bending of the lead was determined by human judgment.
これには人的工数が多大にかかり、個人差によ
る判断のばらつきが大きく、見逃しも多かつた。 This required a large amount of human effort, the judgments varied widely due to individual differences, and there were many oversights.
この発明の目的は従来の問題を解決する為、リ
ードの肩と先端をフアイバーセンサーで検出する
ことにより、リード曲りを自動的に検査すること
にある。 The purpose of this invention is to automatically inspect lead bending by detecting the shoulder and tip of the lead with a fiber sensor, in order to solve the conventional problems.
この発明はＸ方向へ移動する集積回路素子と直
交するＹ−Ｚ平面上のリードの肩および先端を検
出する位置に各々個別のフアイバーセンサを配置
している。 In this invention, individual fiber sensors are arranged at positions for detecting the shoulders and tips of the leads on the Y-Z plane perpendicular to the integrated circuit element moving in the X direction.
Ｘ方向へ移動する集積回路素子のリードの先端
がリードの肩幅外へＸ方向に曲つている場合、リ
ードの肩をリードの肩検出用フアイバーセンサー
で検出していない間にもリードの先端がリードの
先端検出用フアイバーセンサーで検出される。 If the tip of the lead of an integrated circuit device moving in the X direction is bent in the X direction outside the shoulder width of the lead, the tip of the lead will continue to move even when the shoulder of the lead is not detected by the fiber sensor for detecting the shoulder of the lead. It is detected by the fiber sensor for detecting the tip.
リード先端がリードの先端検出用フアイバーセ
ンサーのＹ方向検出領域外にＹ方向へ曲つている
場合、リードの肩をリードの肩検出用フアイバー
センサーで検出している間にもリードの先端がリ
ードの先端検出用フアイバーセンサーで検出され
ない。 If the lead tip is bent in the Y direction outside the Y direction detection area of the fiber sensor for detecting the tip of the lead, the tip of the lead may be Not detected by the fiber sensor for tip detection.
よつてフアイバーセンサーの信号を処理するこ
とによりリードの曲りの有無を判定できる。 Therefore, by processing the signal from the fiber sensor, it is possible to determine whether or not the lead is bent.
次にこの発明を実施例にそつて説明する。第１
図はこの発明の一実施例を示す。第１図に示すよ
うに、ガイド１をＸ方向に滑走する集積回路素子
２の一方のリードの肩をフアイバーセンサー３で
検出し、リードの先端をフアイバーセンサー４で
検出している。集積回路素子２の多方のリードの
肩はフアイバーセンサー５で検出し、リードの先
端はフアイバーセンサー６で検出している。 Next, the present invention will be explained with reference to examples. 1st
The figure shows one embodiment of the invention. As shown in FIG. 1, a fiber sensor 3 detects the shoulder of one lead of an integrated circuit element 2 sliding in the X direction on a guide 1, and a fiber sensor 4 detects the tip of the lead. The shoulders of the many leads of the integrated circuit element 2 are detected by a fiber sensor 5, and the tips of the leads are detected by a fiber sensor 6.
フアイバーセンサー３，４および５，６の信号
は判定回路７へ転送されている。判定回路７では
信号を処理してリード曲りの有無を判定してい
る。 The signals from the fiber sensors 3, 4 and 5, 6 are transferred to the determination circuit 7. The determination circuit 7 processes the signal to determine the presence or absence of lead bending.
第１図は本発明の一実施例を示す説明図であ
る。
尚、図において、１……ガイド、２……集積回
路素子、３……フアイバーセンサー、４……フア
イバーセンサー、５……フアイバーセンサー、６
……フアイバーセンサー、７……判定回路であ
る。
FIG. 1 is an explanatory diagram showing one embodiment of the present invention. In the figure, 1... Guide, 2... Integrated circuit element, 3... Fiber sensor, 4... Fiber sensor, 5... Fiber sensor, 6
. . . Fiber sensor, 7 . . . Judgment circuit.
Claims (1)
積回路素子が移動する方向であるＸ方向と直交す
るＹ−Ｚ平面上の１本のリードの肩および先端を
検出する位置に各々個別のフアイバーセンサーを
配置し、該肩および先端に投射した反射光を該フ
アイバーセンサーで各々検出し、これによる信号
を判定回路へ転送し、該肩を該肩検出用フアイバ
ーセンサーで検出していないときに該先端を該先
端検出用フアイバーセンサーで検出したときはそ
のリードは肩幅外へＸ方向に曲つていると判定
し、該肩を該肩検出用フアイバーセンサーで検出
しているときに該先端を該先端検出用フアイバー
センサーで検出されないときはそのリードはＹ方
向検出領域外にＹ方向に曲つていると判定し、こ
のようにして該判定回路で該信号を処理してリー
ド曲りの有無を判定していることを特徴とするリ
ード曲り検出方法。1. In the lead bending test for integrated circuit devices, individual fiber sensors are placed at positions that detect the shoulder and tip of one lead on the Y-Z plane perpendicular to the X direction, which is the direction in which the integrated circuit device moves. The fiber sensor detects the reflected light projected onto the shoulder and the tip, and the resulting signals are transferred to a determination circuit, and when the shoulder is not detected by the shoulder detection fiber sensor, the tip is detected. When detected by the fiber sensor for detecting the tip, it is determined that the lead is bent in the X direction outside the shoulder width, and when the shoulder is detected by the fiber sensor for detecting the shoulder, the tip is bent by the fiber for detecting the tip. When the sensor does not detect it, it is determined that the lead is bent in the Y direction outside the Y direction detection area, and in this way, the determination circuit processes the signal and determines whether or not the lead is bent. Features lead bend detection method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59014870A JPS60160137A (en) | 1984-01-30 | 1984-01-30 | Bent lead detection process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59014870A JPS60160137A (en) | 1984-01-30 | 1984-01-30 | Bent lead detection process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60160137A JPS60160137A (en) | 1985-08-21 |
| JPH0340944B2 true JPH0340944B2 (en) | 1991-06-20 |
Family
ID=11873050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59014870A Granted JPS60160137A (en) | 1984-01-30 | 1984-01-30 | Bent lead detection process |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60160137A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6214449A (en) * | 1985-07-11 | 1987-01-23 | Nec Kyushu Ltd | Bend detecting method for semiconductor element lead |
| JP6829946B2 (en) * | 2016-04-28 | 2021-02-17 | 川崎重工業株式会社 | Parts inspection equipment and methods |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5663275A (en) * | 1979-10-30 | 1981-05-29 | Nec Kyushu Ltd | Lead testing device for semiconductor device |
-
1984
- 1984-01-30 JP JP59014870A patent/JPS60160137A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60160137A (en) | 1985-08-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |