JPH0342348B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a method for plating fiber bundles,
In particular, it relates to a method for continuously and efficiently forming fiber bundles using a complicated plating tank.

Conventionally, various proposals have been made for electroplating or electroless plating of fiber bundles made of conductive materials such as carbon or non-conductive materials such as silicon and alumina.

As a promising method, proposed by the applicant, the fiber bundles are continuously introduced into the plating tank and the fiber bundles are intermittently taken out from the plating tank. There is a method of creating intermittent tension-free conditions in the bundle to open the fiber bundle and plating it continuously. (Special application 1984-4404)
However, in the conventional plating method, the fiber wire is plated in one plating tank, so there is a limit to the plating thickness.

On the other hand, copper-plated carbon fiber composite materials, for example, can have any thermal expansion coefficient by changing the ratio of carbon fiber and copper, so their use in the semiconductor field and other fields has become active in recent years. There is. but,
In the conventional plating method carried out in one plating tank, in order to obtain products with the required component ratio, the only way to obtain the desired component ratio was to increase the immersion time in the plating solution, which resulted in a problem of lowering the production rate. Further, in the case of carbon fiber, since its electrical resistance is relatively high, there are restrictions on the plating current in order to prevent disconnection due to heat generation in the electrode portion, and there is a problem in that it is difficult to perform plating at a certain current or higher. There is a multi-stage plating method as a method to solve these problems, but until now there has been no multi-stage plating method in which a tension-free slack is intermittently formed in multiple plating tanks, and plating is performed by opening the fibers. Ta.

The object of the present invention is to solve the problems of the prior art as described above, and to provide a novel fiber bundle plating system that efficiently performs continuous plating of fiber bundles by forming tension-free slack in each of a plurality of plating tanks. The purpose is to provide a method.

That is, the gist of the present invention is to continuously introduce the fiber bundle into the plating tank and to intermittently take out the fiber bundle from the plating tank, so that the fiber bundle can be removed intermittently in the plating tank. In a fiber bundle plating method in which the fiber bundle is opened in a tension-free state, and the fiber bundle is continuously plated, the fiber bundle is passed through a plurality of plating tanks, and the fiber bundle is slackened in a tension-free state in each plating tank. The method of plating a fiber bundle is characterized in that the plating is performed by holding the fiber bundle in an open state while forming the fiber bundles sequentially or simultaneously.

In general, when opening a fiber bundle in a plating solution, opening is easier under no tension or close to it than under tension, and there are fewer breakages of single fibers. That is, if fiber opening is performed with tension applied, a fiber opening means with a force greater than the tension is required, and as a matter of course, breakage of single fibers is likely to occur. Therefore, when plating the fiber bundle continuously while opening it, the fiber bundle must always be maintained in a tension-free state in the plating tank, that is, the tension-free state of the fiber bundle must be continuous. is desirable, and it has been proposed in the prior art to provide drive rollers at the inlet and outlet of the plating tank, and to continuously bring the fiber bundle into a tension-free state by adjusting the rotational speed of both rollers ( Tokuko Showa 52
-Refer to Publication No. 43770). However, since the cross-sectional area of the fiber bundle is different before and after plating, it is necessary to precisely control the rotational speed of both rollers in order to achieve a continuous tension-free state.
Requires large-scale detection system.

In contrast, the present invention makes it possible to intermittently create a tension-free state in the fiber bundle by simply providing a stopper at the exit of the plating tank and stopping the delivery of the fiber bundle for a certain period of time. Precise control of the rotational speed is no longer necessary.

Hereinafter, one embodiment of the present invention will be described based on the accompanying drawings.

FIG. 1 is an explanatory diagram illustrating an outline of a two-layer plating method according to the present invention, and FIG. 2 is an explanatory diagram illustrating an outline of an operating circuit for processing a fiber bundle according to the present invention.

The fiber bundle 1 to be plated is a first plating tank 2;
After being plated through the second plating tank 3, it is processed in a cleaning tank 4 and a drying oven 5, and then wound onto a take-up reel 7 via a traverser 6. A fiber bundle delivery device 8 consisting of a roll is provided between the first plating tank 2 and the second plating tank 3. Each plating tank 2, 3
Stoppers 9, 9 are arranged in order to form a tension-free slack in the fiber bundle.

The fiber bundle 1 that is continuously introduced at a constant speed is
The fibers are opened by a parallel plating liquid flow ejected from the nozzle 10 of the plating tank 2, and plating is performed. The parallel flow can be well defined by the current plates 11 provided on both sides. For electrolytic plating, an anode 12 is provided on the side of the fiber bundle 1, in which case the fiber bundle 1 is treated as a cathode. Opening and plating are similarly performed in the second plating tank 3 as well.

In this way, the present invention performs plating by holding the fiber bundle in an open state while forming slack in the fiber bundle without tension in the first and second plating tanks 2 and 3. However, the procedure will be explained based on the schematic diagram of the operation processing circuit illustrated in FIG. First of all
(1) After the start, the second cylinder 14 of the stopper 9 installed at the end of the second plating tank 3 is turned on, and the holder 15 connected to the cylinder 14 descends to remove the plated fiber bundle 1. Press it on the pedestal 16. Next, the delivery device 8 is turned on, and its roll rotates in the direction of the arrow for several seconds at a preset speed, causing the fiber bundle 1 to form a slack in a tension-free state. Then, the sending device 8 is turned off,
At almost the same time, the first cylinder 13 of the first plating tank 2 descends and presses down the fiber bundle 1, and the second
It forms slack in the same way as the plating tank. next,
The first cylinder 13 and the second cylinder 14 are turned off at the same time, and the take-up reel 7 rotates to take up the fiber bundle 1. Then return to the second cylinder ON,
After that, repeat the above operation. In addition, by appropriately selecting the speed setting of the delivery device 8, the first plating tank 2
Even if the stopper 9 is omitted, it is possible to obtain a good fiber opening state.

All of these operations are electrically controlled, allowing continuous plating work to be performed automatically.

The roll of the delivery device 8 is such that the slack of the fiber bundle 1' formed in the second plating tank 3 is transferred to the first plating tank 2.
This roll was installed to avoid constant fluctuation due to the effects of contact friction, etc. when passing through the fiber after exiting the fiber.By installing this roll, the slack in the non-tensioned state becomes constant and maintains a stable opened state. be able to.

As described above, according to the present invention, it is possible to efficiently perform the continuous plating method of fiber bundles by continuous introduction of fiber bundles and intermittent extraction method using a plurality of plating tanks, and to achieve a uniform and desired thickness. The matted fiber bundle can be easily obtained continuously.

Further, by using a plurality of plating tanks, composite plating etc. can be performed, which has the effect of greatly expanding the range of applications.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram illustrating an outline of a plating method according to the present invention. FIG. 2 is an explanatory diagram illustrating an overview of the operation processing circuit of the method according to the present invention. 1, 1': Fiber bundle, 2: First plating tank, 3: Second plating tank, 4: Washing tank, 5: Drying oven, 6: Traverser, 7: Take-up reel, 8: Delivery device, 9: Stopper , 10: nozzle, 11: rectifier plate, 12:
Anode, 13: first cylinder, 14: second cylinder, 15: holder, 16: pedestal.

Claims (1)

[Claims] 1. By continuously introducing the fiber bundle into the plating tank and intermittently taking out the fiber bundle from the plating tank, an intermittent tension-free state of the fiber bundle is created in the plating tank, and the fiber bundle is Spread the fibers,
In a continuous method of plating fiber bundles, the fiber bundles are passed through a plurality of plating tanks, and in each plating tank, the fiber bundles are held in an open state while forming slack in a tension-free state sequentially or simultaneously. A method for plating fiber bundles, the method comprising plating fiber bundles.