JPH0343175B2 - - Google Patents
Info
- Publication number
- JPH0343175B2 JPH0343175B2 JP61146448A JP14644886A JPH0343175B2 JP H0343175 B2 JPH0343175 B2 JP H0343175B2 JP 61146448 A JP61146448 A JP 61146448A JP 14644886 A JP14644886 A JP 14644886A JP H0343175 B2 JPH0343175 B2 JP H0343175B2
- Authority
- JP
- Japan
- Prior art keywords
- main body
- shaft portion
- circumferential surface
- inner circumferential
- side wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Sheets, Magazines, And Separation Thereof (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Controlling Sheets Or Webs (AREA)
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、物体を無接触で吸着する装置に関
し、例えば半導体ウエハやフロツピーデイスクな
どのように傷つき易いものを吸着して搬送するの
に利用される。Detailed Description of the Invention (Industrial Application Field) The present invention relates to a device for non-contact suction of objects, and is suitable for suctioning and transporting easily damaged objects such as semiconductor wafers and floppy disks. used.
(従来技術及びその問題点)
従来より、物体を無接触で吸着する装置とし
て、特公昭51−40343号公報に記載のものが公知
である。これは、空気を吸入する吸込管の周囲に
空気を吐出する多数の吐出管を設け、平板状の物
体に作用する吸引力と噴出力との合力によつて当
該物体を無接触で保持するものである。しかし、
この従来の装置においては、真空源と圧縮空気源
との両方を必要とするため、これらの設備や配管
を要してコスト高になるとともに構成および制御
が複雑になるという問題があつた。(Prior art and its problems) Conventionally, a device described in Japanese Patent Publication No. 51-40343 has been known as a device for non-contact adsorption of objects. This is a system in which a large number of discharge pipes for discharging air are installed around a suction pipe for inhaling air, and the object is held without contact by the combined force of suction force and ejection force acting on a flat object. It is. but,
Since this conventional device requires both a vacuum source and a compressed air source, there are problems in that these facilities and piping are required, which increases costs and complicates the configuration and control.
(問題点を解決するための技術的手段)
本発明は、上述の問題に鑑み、圧縮空気源のみ
により無接触の真空吸着を行うことのできる装置
を提供するものであつて、その技術的手段は、有
底円筒状であつて内周面5下端部には内周面5か
ら滑らかに連続して半径方向外方へ拡径する側壁
面6を有し底部3又は周壁部4に空気導入口20
を有する本体2と、本体2の底部3で内外に貫通
するように設けられた軸方向に移動調整可能で軸
方向に貫通する検知穴17が設けられた軸部14
と、軸部14の内方端に設けられ本体内周面5と
の間にリング状の間隙を形成する円盤状の遮へい
板11と、軸部14の検知穴17に連続して設け
られる圧力センサとよりなるものである。(Technical Means for Solving the Problems) In view of the above-mentioned problems, the present invention provides an apparatus capable of performing non-contact vacuum suction using only a compressed air source, and provides technical means thereof. has a cylindrical shape with a bottom, and has a side wall surface 6 at the lower end of the inner circumferential surface 5 that smoothly continues from the inner circumferential surface 5 and expands in diameter outward in the radial direction. Mouth 20
and a shaft portion 14 provided with a detection hole 17 which is movable in the axial direction and is adjustable in the axial direction and is provided so as to penetrate inside and outside at the bottom portion 3 of the main body 2.
, a disk-shaped shielding plate 11 provided at the inner end of the shaft portion 14 and forming a ring-shaped gap between it and the inner circumferential surface 5 of the main body, and a pressure sensor provided continuously in the detection hole 17 of the shaft portion 14 . It consists of a sensor.
(作用)
空気導入口20から流入した空気は内周面5と
遮へい板11との間の間隙15からリング状に下
方へ噴出し、コアンダ効果により噴流が側壁面6
に付着して外方へ流れる。このときに本体2内の
遮へい板11より下方の空気が引かれて排出され
負圧となり、ワークを吸着する。ワークWが本体
2に接近しすぎると負圧が低下するので、負圧と
ワークWの重力とがつり合つた状態で本体2と無
接触で保持される。ワークWの重量、寸法、形状
により遮へい板の本体内での高さを調整する。遮
弊板とワークWの間の真空度を圧力センサでモニ
タし最適の条件を求めることができる。(Function) Air flowing in from the air inlet 20 is ejected downward in a ring shape from the gap 15 between the inner circumferential surface 5 and the shielding plate 11, and due to the Coanda effect, the jet flows toward the side wall surface 6.
It adheres to and flows outward. At this time, the air below the shielding plate 11 in the main body 2 is drawn and discharged to create a negative pressure, which attracts the workpiece. If the workpiece W gets too close to the main body 2, the negative pressure decreases, so that the workpiece W is held without contact with the main body 2 in a state where the negative pressure and the gravity of the workpiece W are balanced. The height of the shielding plate within the main body is adjusted depending on the weight, size, and shape of the workpiece W. The degree of vacuum between the shielding plate and the workpiece W can be monitored with a pressure sensor to determine the optimum conditions.
(実施例)
以下、本発明の実施例を図面に基づいて説明す
る。(Example) Hereinafter, an example of the present invention will be described based on the drawings.
第1図において、吸着装置1は、底部3および
周壁部4からなる有底円筒状の本体2を有してお
り、周壁部4の内周面下端には、内周面5から滑
らかに連続して半径方向外方へアール状に拡径す
る側壁面6が形成されており、さらに下端部には
この側壁面6から滑らかに連続する軸方向と直角
な平面部7が形成されている。本体2の底部3に
は、内方へ突出するボス部8が設けられ、ボス部
8に嵌入穴9およびねじ穴10が設けられてい
る。円板状の遮へい板11は、嵌入部12および
ねじ部13を有する軸部14の下端部に一体的に
設けられており、嵌入部12が嵌入穴9内に嵌入
して軸心の心出しが行われているとともに、ねじ
部13がねじ穴10に螺入して軸方向移動調整可
能となつている。遮へい板11は、内周面5との
間にリング状の狭い間隙15を形成するもので、
平面部7より本体2の内方へ入つた位置、すなわ
ち側壁面6の内方端の近辺において調整され、ロ
ツクナツト16により固定されている。軸部14に
は、軸方向に貫通する検知穴17、および上端部
にポート18が設けられている。ポート18には
図示しない圧力センサが接続されており、遮へい
板11の下方に形成される真空室19の負圧を検
知するようになつている。また、本体2の周壁部
4には、圧縮空気を導入するための導入口20が
設けられており、ここから導入された空気は周壁
部4とボス部8との間に形成された空気室21に
流入するようになつている。 In FIG. 1, the suction device 1 has a bottomed cylindrical main body 2 consisting of a bottom part 3 and a peripheral wall part 4, and a lower end of the inner peripheral surface of the peripheral wall part 4 is smoothly continuous from the inner peripheral surface 5. A side wall surface 6 is formed which expands in radius outward in the radius direction, and a flat portion 7 that smoothly continues from the side wall surface 6 and is perpendicular to the axial direction is formed at the lower end. The bottom portion 3 of the main body 2 is provided with a boss portion 8 that projects inward, and the boss portion 8 is provided with a fitting hole 9 and a screw hole 10. The disc-shaped shielding plate 11 is integrally provided at the lower end of the shaft portion 14 having a fitting portion 12 and a threaded portion 13, and the fitting portion 12 is fitted into the fitting hole 9 to center the shaft. At the same time, the threaded portion 13 is screwed into the threaded hole 10 so that its movement in the axial direction can be adjusted. The shielding plate 11 forms a narrow ring-shaped gap 15 with the inner circumferential surface 5.
It is adjusted at a position inward of the main body 2 from the flat part 7, that is, near the inner end of the side wall surface 6, and is fixed by a lock nut 16. The shaft portion 14 is provided with a detection hole 17 passing through it in the axial direction, and a port 18 at the upper end. A pressure sensor (not shown) is connected to the port 18 and is configured to detect negative pressure in a vacuum chamber 19 formed below the shielding plate 11. Further, the peripheral wall portion 4 of the main body 2 is provided with an introduction port 20 for introducing compressed air, and the air introduced from this port is fed into an air chamber formed between the peripheral wall portion 4 and the boss portion 8. 21.
次に、上述の吸着装置1の動作を説明する。導
入口20から導入されて空気室21へ流入した空
気は、内周面5と遮へい板11との間の間隙15
から内周面5に沿つてリング状に下方へ噴出し、
この噴流はコアンダ効果により側壁面6に付着し
て平面部7から外方へ流れる。この状態におい
て、真空室19の空気が側壁面6に付着した噴流
により引かれて排出させられ、真空室19は負圧
となり、その下方にある平板状のワークWを吸引
するのである。吸引されたワークWは、平面部7
に接近するが、その間隔Gが零に近づくと噴流の
外方への流出が妨げられ、真空室19の負圧が低
下し、または正圧になる。したがつて、真空室1
9の負圧による吸引力とワークWの重力とがつり
合つた位置において、適当な間隔Gを有した状態
でワークWは吸着、保持されるのである。 Next, the operation of the above-described suction device 1 will be explained. The air introduced from the inlet 20 and flowing into the air chamber 21 flows through the gap 15 between the inner circumferential surface 5 and the shielding plate 11.
It ejects downward in a ring shape along the inner circumferential surface 5 from
This jet adheres to the side wall surface 6 due to the Coanda effect and flows outward from the flat portion 7. In this state, the air in the vacuum chamber 19 is drawn and discharged by the jet flow attached to the side wall surface 6, and the vacuum chamber 19 becomes a negative pressure, and the flat workpiece W located below it is sucked. The suctioned workpiece W is moved to the flat part 7
However, when the distance G approaches zero, the outward flow of the jet is blocked, and the negative pressure in the vacuum chamber 19 decreases or becomes positive. Therefore, vacuum chamber 1
At a position where the suction force due to the negative pressure 9 and the gravity of the workpiece W are balanced, the workpiece W is attracted and held with an appropriate distance G between them.
上述の実施例において、圧縮空気の圧力、およ
び遮へい板11の軸方向位置を調整し、ワークW
の重さや硬さなどに応じた吸引力または間隔Gの
大きさとなるようにすればよい。遮へい板11の
周側壁部が円周面11aとなつているので、間隙
15がスリツト状となつて間隙15内において空
気流が層流となり易く、側壁面6への付着現象が
安定している。しかし、遮へい板として、第2図
に示すように、周側壁部が円錐状面22aとなつ
た遮へい板22を用いエツジ状の周縁部と内周面
5(または側壁面6)との間で間隙15を形成す
るようにしてもよい。また、内周面5を下方が拡
径するような緩いテーパ状とすることも可能であ
る。側壁面6の断面形状は種々変形することが可
能である。平面部7を外方上方へ向かつて傾斜さ
せてもよく、省略してもよい。導入口20を周壁
部4に複数個設けてもよく、また底部3に設けて
もよい。なお、ワークWの水平方向移動を防止す
るためのワーク位置決め用枠や、ワークWに設け
られた穴を塞ぐためのプラグ板などのアタツチメ
ントを適宜取付けることも可能である。 In the above embodiment, the pressure of the compressed air and the axial position of the shielding plate 11 are adjusted, and the work W
The suction force or the distance G may be adjusted according to the weight, hardness, etc. of the material. Since the circumferential side wall portion of the shielding plate 11 forms the circumferential surface 11a, the gap 15 has a slit shape, and the airflow within the gap 15 tends to become a laminar flow, so that the phenomenon of adhesion to the side wall surface 6 is stable. . However, as shown in FIG. 2, as a shielding plate, a shielding plate 22 whose circumferential side wall is a conical surface 22a is used, and between the edge-shaped circumferential edge and the inner circumferential surface 5 (or side wall surface 6). A gap 15 may also be formed. Further, it is also possible to form the inner circumferential surface 5 into a gentle taper shape such that the diameter increases at the bottom. The cross-sectional shape of the side wall surface 6 can be modified in various ways. The plane portion 7 may be inclined outwardly and upwardly, or may be omitted. A plurality of introduction ports 20 may be provided in the peripheral wall portion 4 or may be provided in the bottom portion 3. Note that attachments such as a workpiece positioning frame for preventing horizontal movement of the workpiece W and a plug plate for closing a hole provided in the workpiece W can be attached as appropriate.
(発明の効果)
本発明によると、圧縮空気源のみにより物体を
無接触で吸着することができる。また圧力センサ
により物体と遮へい板で囲まれる真空室の真空度
をモニタでき物体の重さ、硬さ形状に応じて圧縮
空気圧力、遮へい板の高さを調整し最適の条件を
求めることができる。しかも構造が簡単であり、
取扱いや保守が容易である。したがつて、半導体
ウエハやフロツピーデイスクなどのように傷つき
易いものを無接触で吸着して搬送することが可能
である。(Effects of the Invention) According to the present invention, an object can be adsorbed without contact using only a compressed air source. In addition, the pressure sensor can monitor the degree of vacuum in the vacuum chamber surrounded by the object and the shielding plate, and the compressed air pressure and height of the shielding plate can be adjusted according to the weight, hardness, and shape of the object to find the optimal conditions. . Moreover, the structure is simple,
Easy to handle and maintain. Therefore, it is possible to pick up and transport easily damaged items such as semiconductor wafers and floppy disks without contact.
図面は本発明の実施例を示し、第1図は吸着装
置の正面断面図、第2図は遮へい板の他の実施例
を示す正面断面図である。
1……吸着装置(無接触吸着装置)、2……本
体、3……底部、5……内周面、6……側壁面、
7……平面部、10……ねじ穴、11,22……
遮へい板、13……ねじ部、14……軸部、15
……間隙、20……導入口(空気導入口)、G…
…間隔、W……ワーク。
The drawings show an embodiment of the present invention, and FIG. 1 is a front sectional view of an adsorption device, and FIG. 2 is a front sectional view showing another embodiment of the shielding plate. 1... Adsorption device (non-contact adsorption device), 2... Main body, 3... Bottom, 5... Inner peripheral surface, 6... Side wall surface,
7... Flat part, 10... Screw hole, 11, 22...
Shielding plate, 13... Threaded part, 14... Shaft part, 15
...Gap, 20...Inlet port (air inlet), G...
...Interval, W...Work.
Claims (1)
面5から滑らかに連続して半径方向外方へ拡径す
る側壁面6を有し底部3又は周壁部4に空気導入
口20を有する本体2と、 本体2の底部3で内外に貫通するように設けら
れ軸方向に移動調整可能で軸方向に貫通する検知
穴17が設けらた軸部14と、 軸部14の内方端に設けられ本体内周面5との
間にリング状の間隙を形成する円盤状の遮へい板
11と、 軸部14の検知穴17に連続して設けられる圧
力センサとよりなる事を特徴とする無接触吸着装
置。 2 前記本体2の下端部には、前記側壁面6から
滑らがに連続する軸方向と直角な平面部7が形成
されてなる特許請求の範囲1項記載の無接触吸着
装置。 3 前記本体2の底部3には内外に貫通するねじ
穴10が設けられており、前記軸部14の外周に
は該ねじ穴10に螺合するねじ部13が形成され
ており軸部14を回すことにより軸部14を本体
2に対して軸方向移動調整可能にした特許請求の
範囲第1項または第2項記載の無接触吸着装置。 4 本体2の底部3から軸方向に沿い内方に向う
ボス部8を形成し、軸部14の嵌入部12をボス
部8に挿通させ、軸部14を本体2に対し2箇所
で支持するようにした特許請求の範囲第3項記載
の無接触吸着装置。[Claims] 1. It has a cylindrical shape with a bottom, and has a side wall surface 6 at the lower end of the inner circumferential surface 5 that smoothly continues from the inner circumferential surface 5 and expands in diameter outward in the radial direction. A main body 2 having an air inlet 20 in a portion 4, and a shaft portion 14 provided with a detection hole 17 which is provided so as to penetrate inside and outside at the bottom portion 3 of the main body 2 and is movable and adjustable in the axial direction. , a disk-shaped shielding plate 11 provided at the inner end of the shaft portion 14 and forming a ring-shaped gap with the inner circumferential surface 5 of the main body; and a pressure sensor provided continuously in the detection hole 17 of the shaft portion 14. A non-contact adsorption device characterized by: 2. The non-contact suction device according to claim 1, wherein the lower end portion of the main body 2 is formed with a flat portion 7 that is perpendicular to the axial direction and that extends smoothly from the side wall surface 6. 3 A screw hole 10 that penetrates inside and outside is provided in the bottom 3 of the main body 2, and a threaded portion 13 that is screwed into the screw hole 10 is formed on the outer periphery of the shaft portion 14. The non-contact suction device according to claim 1 or 2, wherein the axial movement of the shaft portion 14 relative to the main body 2 can be adjusted by turning it. 4. A boss part 8 is formed that extends inward along the axial direction from the bottom part 3 of the main body 2, and the fitting part 12 of the shaft part 14 is inserted into the boss part 8, so that the shaft part 14 is supported with respect to the main body 2 at two locations. A non-contact adsorption device according to claim 3, wherein the non-contact adsorption device is configured as follows.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61146448A JPS631647A (en) | 1986-06-23 | 1986-06-23 | Noncontact adsorbing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61146448A JPS631647A (en) | 1986-06-23 | 1986-06-23 | Noncontact adsorbing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS631647A JPS631647A (en) | 1988-01-06 |
| JPH0343175B2 true JPH0343175B2 (en) | 1991-07-01 |
Family
ID=15407867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61146448A Granted JPS631647A (en) | 1986-06-23 | 1986-06-23 | Noncontact adsorbing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS631647A (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2575580Y2 (en) * | 1993-03-27 | 1998-07-02 | 太陽誘電株式会社 | Circuit board support device |
| WO2000009975A1 (en) * | 1998-08-11 | 2000-02-24 | Siemens Aktiengesellschaft | Measuring device for contactless measurement of the properties of a moving metal strip |
| JP2006160434A (en) * | 2004-12-06 | 2006-06-22 | Nippon Dempa Kogyo Co Ltd | Non-contact transfer device |
| KR100928674B1 (en) * | 2009-04-07 | 2009-11-27 | 삼성코닝정밀유리 주식회사 | Non-contact suction gripping device and non-contact suction gripping frame |
| KR101293288B1 (en) * | 2010-04-19 | 2013-08-09 | 주식회사 에이엠에이치시스템즈 | Acute angle noncontact type vacuum pad |
| JP5995198B2 (en) * | 2010-10-29 | 2016-09-21 | 国立研究開発法人産業技術総合研究所 | Non-contact adsorption device |
| KR101600382B1 (en) * | 2014-05-12 | 2016-03-08 | 제트에스-핸들링 게엠베하 | Non-contact type device for substrate gripping |
| CN106737803B (en) * | 2017-02-15 | 2018-12-25 | 泉州市墨语贸易有限公司 | Structure improved sucker on a kind of robot sticking fixture |
| CN110182427B (en) * | 2019-05-15 | 2021-05-25 | 安徽盛烨电子有限公司 | An automatic paper padding device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5191459A (en) * | 1975-02-07 | 1976-08-11 | ||
| JPS5628140A (en) * | 1979-08-10 | 1981-03-19 | Gunze Ltd | Method of taking out pasteboard one by one |
| JPS61111251A (en) * | 1984-11-01 | 1986-05-29 | Kuresen Sangyo Kk | Holding device for flat laminar member |
| US4654356A (en) * | 1985-08-01 | 1987-03-31 | E. R. Squibb & Sons, Inc. | 7-oxabicycloheptane substituted diacid diamide prostaglandin analogs |
| JPS6292337A (en) * | 1985-10-17 | 1987-04-27 | Canon Inc | Wafer holding device |
-
1986
- 1986-06-23 JP JP61146448A patent/JPS631647A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS631647A (en) | 1988-01-06 |
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