JPH0345918B2 - - Google Patents

Description

[Detailed description of the invention] [Table of contents] ●Overview ●Field of industrial application (Figure 7) ●Prior art ●Problems to be solved by the invention ●Means for solving the problems ●Operations ●Example (Figures 1, 2, 3, 4, 5, 6) - Effects of the invention [Summary] Pressing member 4 for pressing the insertion surface in advance to align it with the reference surface when inserting the leaded electronic component 10
4-16, 44-17, gripping claws 44-10, 44-11 that can grip the electronic component 10 via leads and move close to the insertion surface, and grip the electronic component 10 held against the insertion surface. By providing the hand 44 with a pushing member 44-26 for pressing the electronic component 10, it is possible to insert the electronic component 10 reliably and smoothly with a simple structure.

[Industrial application field]

The present invention relates to an electronic component insertion device for inserting a large number of electronic components of the same type onto a printed circuit board in order to perform heating tests on leaded electronic components such as ICs (integrated circuit components), and particularly relates to an electronic component insertion device for inserting a large number of electronic components of the same type onto a printed board. The present invention relates to an electronic component insertion mechanism.

For example, an IC is an example of an electronic component with leads.
It has a lead 11 as shown by the reference numeral 10 in FIG. 7, and is formed with the ambient temperature set at a maximum of about 60 to 70°C as its function guarantee temperature, but of course there is a certain degree of actual resistance to this temperature. It is formed with a safety factor (margin). However, among a large number of ICs, there may be a mixture of defective products or near-defective products that have some kind of defect or low reliability. Therefore, before ICs are actually mounted on printed circuit boards, they are often subjected to high-temperature heating tests (commonly known as burn-in tests) to ensure the quality of the ICs. This high-temperature heating test is conducted under adverse conditions by housing a large number of the same type of IC in a constant temperature chamber. That is, a large number (for example, 100
) ICs are inserted, and the printed boards are housed in a box-shaped shelf in multiple stages (for example, 10 boards), and these shelves (usually multiple) are stacked and housed in a thermostatic oven. Then, after fitting and connecting the connector of each printed board to the connector provided in the thermostatic oven, the temperature inside the thermostatic oven is raised to a predetermined high temperature (for example,
120℃) and apply the same voltage (e.g. 5V) to each IC as in actual use to cause the IC itself to generate heat, and maintain this state for a predetermined period of time (e.g. 72 hours, 48 hours). A high temperature heating test is carried out. As a result of this high-temperature heating test, ICs with some defects are broken or damaged and become defective products. After this heating test, each IC is functionally tested by a tester to determine whether it is good or bad, and only good products are mounted on the printed board.

[Conventional technology]

Conventionally, when conducting high-temperature heating tests on a large number of leaded electronic components such as ICs of the same type, in most cases workers wear a grounding band to connect to the ground and connect the printed circuit board for testing. ICs were inserted manually, either directly or one by one into multiple sockets mounted on a printed circuit board.

[Problem that the invention seeks to solve]

In the above conventional technology, the test printed board
Since the ICs are inserted manually one by one, a lot of time is required for insertion, which is very inefficient. The present invention was created in view of these problems, and is an electronic component that can efficiently and reliably insert leaded electronic components with a simple structure and that can contribute to smooth automatic insertion of electronic components. It is an object of the present invention to provide an electronic component insertion mechanism for a hand part in a component insertion device.

[Means for solving problems]

In order to solve the above problems, the present invention includes an inclined part 30 and a hand for grasping the leaded electronic component 10 positioned on the inclined surface of the inclined part 30 and inserting it onto a horizontal insertion surface. 44, the hand 44 includes an insertion surface pressing member 44 for pressing the insertion surface in advance and aligning it with the reference surface when inserting the electronic component 10. -16,44-1
6, and a gripping claw 44-1 that can grip the electronic component 10 via its lead 11 and move close to the insertion surface.
0,44-11 and the gripping claws 44-10,44-
Provided is an electronic component insertion mechanism of a hand portion in an electronic component insertion device, characterized in that the electronic component insertion mechanism includes a pushing member 44-26 for press-inserting the electronic component 10 gripped by the electronic component 11 onto the insertion surface.

[Effect]

When inserting the electronic component 10 with leads onto the printed circuit board 15, the holding members 44-16 and 44-17 contact the insertion surface in advance to align the insertion surface with the reference surface, and the electronic component 10 is inserted through the leads 11. The gripping claws 44-10 and 44-11 that gripped the electronic component 1 move close to the insertion surface, and then the pushing member 44-26
0 into the insertion surface, the electronic component 10 can be inserted easily and reliably.

〔Example〕

1 to 6 are diagrams for explaining an embodiment of the present invention. FIG. 1 is a side view A and a front view B of a hand 44 according to an embodiment of the present invention, and FIG. 3 is a schematic side view of an electronic component insertion device equipped with an embodiment of the invention, FIG. 4 is an external perspective view of the electronic component insertion device of FIG. 3,
FIG. 5 is a plan view of the test printed board 15, and FIG. 6 is a side view (a) and a cross-sectional view (b) of a stake 22 for accommodating a leaded IC 10 as a leaded electronic component. When looking at Figure 3, the left hand side is called the rear side of the device and each part, the right hand side is called the front side (front side), and when looking from the front side to the rear side, the left hand side is called the left side, and the right hand side is called the right side. The same applies to other figures as well.

First, let us explain the overall structure and operation of this insertion device in the third section.
This will be briefly explained with reference to FIG. This device basically consists of a stake stock section 20 provided at the rear of the device, an inclined section 30 for feeding IC (electronic components) provided at the front side of this stock section 20,
A hand part 40 provided on the lower end side (front side) of this inclined part 30, and an XY table part 50 provided from the lower part of this hand part 40 to the front side.
, an elevator section 60 provided on the front side of this XY table 50, and a printed board operating section 70 provided on the front side of this elevator section 60.

The stake stock section 20 includes a plurality of stake cassettes 21 (four in this example) arranged in parallel with their front ends tilted downward at a predetermined angle (α=35° in this example), and the cassettes 21. Multiple (for example, 10) stakes 2 that are stacked and stored in the
2. Stake 22 is the 6th
As shown in the figure, an inverted U is made from transparent plastic.
Long length (e.g. 300~600mm) with hollow cross section
It is formed to have a length of about 20 to 30 cm, and accommodates a plurality of ICs 10 (for example, about 20 to 30 ICs) in series. In FIGS. 3 and 4, reference numeral 211 is a stake front end receiving member provided on the lower surface of the cassette 21 and movable in the front-rear direction, 212 is a stay rear end receiving member, and 213 is a stake provided between the receiving members 211 and 212. 214 is a gate opening/closing plate provided at the lower part of the front end surface of the cassette 21 and is movable up and down, 23 is a receiving box for the empty stake 22, and 24 and 25 are cassette support frames. are shown respectively. The IC housed in the cassette 21 together with the stake 22 slides downward due to its own weight through an opening at the front end of the cassette and is delivered to an inclined section 30, which will be described later. Then, the empty stake 22 falls into the receiving box 23 and is stored therein.

Similarly to the cassette 21, the inclined portion 30 has an inclination angle α
(in this case, α=35°), and has a plurality of (four in this case) guide rails 31 provided corresponding to each of the above-mentioned cassettes 21, and the upper end of this guide rail 31 An IC guide member 32, a stake stabbing member 33, and a receiving member actuating piece 34 are provided at the top, a pair of cylinders 351 and 352 are provided at the intermediate portion as an IC intermittent feeding mechanism 35, and a guide plate 361 is provided at the lower end as an IC positioning mechanism 36.
and a positioning piece 362 are provided. Note that 37 is a vibration cylinder for applying impact vibration to the guide rail 31, and 38 is a guide rail support frame.

The hand portion 40 includes a rotating plate 42 rotatably supported by a pair of left and right side plates 41 via a support shaft 411.
, a hand support plate 43 supported by the rotary plate 42 so as to be movable up and down, and a hand support plate 43 arranged in parallel corresponding to each guide rail 31 of the inclined portion 30 .
A plurality of (four in this case) hands 4 fixedly attached to the
4, and a hand support plate 4 fixedly installed on the rotating plate 42 side.
3 and a cylinder 45 for moving the hand 44 up and down, and a cylinder 46 for rotating the hand 44 in the front and back directions about the support shaft 411, which is connected to a rod 461 and a rotating plate 42. The hand 44 is formed with an IC gripping mechanism and an IC insertion mechanism, and is located on the inclined center line _C2 at an inclined angle β (in this case, β=35°) with respect to the vertical center line _C1 . The IC 10 is held at the first rotational position P ₁ and the IC 10 is inserted onto the printed circuit board 15 (in this case, onto the socket 18) at the second rotational position on the vertical center line C ₁ .

The XY table section 50 has an XY table 51 on which a printed board 15 is placed and fixed.
It moves in the XY directions and positions the printed board 15 in correspondence with the IC 10 that is held by the hand 44 and is to be inserted. As shown in FIG. 5, the printed board 15 is formed as a test printed board, and has a connector 16 at one end, a pull-back hole 17 at the other end, and a socket 18 on the top surface. A total of 100 pieces are mounted in an 8-row configuration with 13 pieces arranged in every other row and 12 pieces arranged, and a reinforcing frame 19 with an L-shaped cross section is fixed on the outer periphery.

The elevator section 60 includes a pair of left and right endless chains 61 (see FIG. 4) that can be raised and lowered, and this chain 61 pulls in a shelf (not shown) that accommodates a plurality of stages (for example, 10 stages) of printed boards 15. The shelf is placed on the chain 61, and the shelf is moved up and down in accordance with the aforementioned XY table 51 as necessary. Note that 62 indicates an operation panel.

The printed board actuator 70 is disposed on a base 71 so as to be slidable in the left-right direction (in the direction of arrow B in FIG. are arranged correspondingly. The actuating part 70 has a shelf 72
When placed on top, as shown in FIG. 4, the shelf is moved to the side (to the right in this case), and after being accommodated in the elevator section 60 from the pedestal 72, it is moved to the center in the left-right direction. The printed board 15 in the shelf is pushed out onto the XY table 51 by an operating rod (not shown) installed in the actuating part 70,
And the pull-back hole 17 of the printed board 15 after inserting the IC.
(FIG. 5) and pull the printed board 15 back into the shelf.

Now, this embodiment will be explained with reference to FIGS. 1 and 2. This embodiment is characterized by the insertion mechanism for the leaded IC (leadded electronic component) 10 at the second rotational position _P2 of the hand 44 shown in FIG. 3 described above. This embodiment basically consists of a pair of left and right socket pressing members (insertion surface pressing members) 44-16, 44- which are provided on the hand 44 and can move up and down elastically.
17, a pair of left and right gripping claws 44-10, 44-11 that grip the IC 10 via its lead 11 and are movable close to the insertion surface, and a gripping claw 44-10,
A pushing plate (pushing member) 44 for pushing and inserting the IC10 held by 44-11 into the insertion surface.
-26.

First, the hand 44 will be explained with reference to FIG. The hand 44 is constructed as shown in FIG. 1 in a side view (partially sectional) A and a front view (partially sectional) B. That is, a frame-shaped outer frame 44-1 serving as a hand body is fixed to the lower surface of the hand support plate 43. As shown in FIG.
b, 44-1b and 44-2b, 44-2b are slidably connected to each other in the vertical direction via a spherical roller 44-3. Upper member 44-2 of inner frame 44-2
As shown in figure B, a pair of left and right pins 44 are shown in FIG.
-4 extends through the center line parallel to the center line _C3 and is slidably disposed. The upper end of the pin 44-4 is the outer frame 4
It passes through the upper member 44-1a of 4-1, contacts the lower part of the hand support plate 43, and is fixed upward. A spring receiver 44-4a is provided on the upper part of the pin 44-4, and this spring receiver 44-4a and the inner frame 44
A compression spring 44-5 is wound around the pin 44-4 and disposed between the upper surface of the upper member 44-2a and the upper member 44-2a.
A total of two springs 44-5 are installed with a preload of a predetermined pressure (in the case of this example, two springs 44-5 are installed).
The total preload of 5 is 4Kg). Therefore,
Due to this spring 44-5, when the inner frame 44-2 is in a free state, the lower end surface of the side member 44-2b is applied to the upper surface of the lower member 44-1c of the outer frame 44-1 by a total of 4 kg.
It is constantly pressed with the pressure of A pair of left and right support shafts 44-6 and 44-7 are disposed to penetrate through the side member 44-2b of the inner frame 44-2 (see FIG. 2). Support shaft 44
-6, 44-7, gripping arms 44-9, 44-8 are rotatably supported as a left and right pair.
The lower sides of -8 and 44-9 are arranged so that they can be opened and closed in the left-right direction, that is, in the direction of arrow D shown in FIG. The gripping arm 44-8 has a side shape approximately L-shaped as shown in Figure A, and a front shape approximately inverted L-shape as shown in Figure B. The upper portion 44-8
As described above, the end portion of a is rotatably supported on the support shaft 44-7, and a gripping claw 44-10 is fixed to the lower portion 44-8b. Gripping arm 44-9
is the upper portion 4 of the gripping arm 44-8.
4-9a is rotated left and right as shown in figure B,
The lower portion 44-9b is formed oppositely in the front and back as shown in Figure A, and the upper portion 44-9a
As described above, the end portion of the is rotatably supported on the support shaft 44-6, and the lower portion 44-9b is provided with the gripping claw 4.
4-11 is fixedly installed. Gripping arm 44-8, 4
Operating holes 44-8c and 44-9c of the same shape are formed through and aligned in the center of the upper portions 44-8a and 44-9a, respectively. An operating ring 44- is inserted into these operating holes 44-8c and 44-9c.
12, 44-13 are loosely fitted, respectively. The operating rings 44-12, 44-13 are the support pins 44
-14 (see figure B) is rotatably supported. The support pin 44-14 is connected to the gripping arm upper portion 44-8a, 4
The actuating plates 44-15 are respectively protruded and fixed on the front and rear surfaces of the actuating plates 44-15, which are arranged to be vertically movable between the actuating plates 4-9a. The actuating plate 44-15 is connected to a piston rod 44-31 of a cylinder 44-31 fixed to the upper surface of the upper member 44-2a of the inner frame 44-2 along the center line _C3 .
It is connected and fixed to the tip of a (see figure 2). Therefore,
Due to the vertical movement of the piston rod 44-31a, the gripping arms 44-8, 44-9 are moved against the support shaft 44-31a.
7 and 44-6, respectively, and the actuating plate 4
4-15, the lower portions 44-8b and 44-9b side open and close in the left and right direction (in the direction of arrow D in Figure B) through the operating rings 44-12 and 44-13 and the operating holes 44-8c and 44-9c. Being exercised. The gripping claws 44-10, 44-11 are the gripping arms 44-8, 4.
It is opened and closed together with 4-9. This opening/closing movement causes the gripping claws 44-10, 44-11 to
grasp or dissolve. As shown in Figure A, the inner frame 4
A frame-shaped socket holding member 44- is placed inside of 4-2.
16, 44-17 are arranged, and these pressing members 4
4-16, 44-17 are connected to the inner frame 44-2 via spherical rollers 44-18 so as to be slidable in the vertical direction. And presser members 44-16, 44-
17 are arranged as a left and right pair, as shown in FIG. As shown in FIG. 1, two supporting pins 44-19, a total of four supporting pins 44-19, are fixed on the upper surfaces of the holding members 44-16 and 44-17, parallel to the center line _C3 . Each of these pins 44-19 has its upper end slidably passing through the upper member 44-2a of the inner frame 44-2, and is supported by the upper member 44-20 by a receiving ring 44-20 provided at its upper end. 2a in a hanging manner. A compression spring 44-21 is wound around each pin 44-19 and disposed between the lower surface of the upper member 44-2a of the inner frame 44-2 and the upper surface of the holding members 44-16 and 44-17. Therefore, the spring 44
-21 are installed in total, and are installed with a predetermined preload for the total of the four (in the case of this example, 4
Set to a preload of approximately 1.5Kg in total). As a result, the socket holding members 44-16 and 44-17 are suspended from the inner frame 44-2 via the support pins 44-19, and the compression springs 44-21 are suspended in the free state.
Approximately 1.5Kg in total (0.75Kg per holding member)
It is constantly pressed downward with the pressure of As shown in the figure, the lower member 44-1c of the outer frame 44-1 has
A pair of front and rear support pins 44 centered on the center line _C3
-22 (only the front pin shown) is the lower member 44-1
c. These pins 44-22 are secured to the upper surface of the lower member 44-1c by a receiving ring 44-23 provided at an intermediate portion thereof. As shown in Figure A, a spring receiving plate 44-24 having an inverted L-shaped cross section is fixed on the inner surface of the lower member 44-1c, and is slidably attached to the upper end of the pin 44-22. It is placed through. A compression spring 44-25 is arranged between the spring receiving plate 44-24 and the receiving ring 44-23 so as to be wound around each pin 44-22. This spring 44-2
5 are disposed in total, and are disposed with a predetermined preload for the total of the two pieces (in this example, the preload for the two pieces in total is set to about 2 kg). Therefore, pin 44-2
2 is pressed onto the upper surface of the lower outer frame member 44-1c via the receiving ring 44-23 by the spring 44-25 with a total pressure of about 2 kg (1 kg per pin) in the free state. And these bearing pins 44-
A pushing plate 44-26 for pushing the IC 10 is fixedly provided at the lower end of the IC 22. The push-in plate 44-26 is disposed with a slight gap between the lower surface of the outer frame lower member 44-1c and the lower surface of the outer frame lower member 44-1c. Push plate 44-26
As shown _in FIG. . The holding member 44-27 has a head 44-27a for pressing the IC10 at its lower end, and is locked to the upper surface of the pushing plate 44-26 by a receiving ring 44-28 fixed to its upper end. . The lower surface of the pushing member 44-26 and the pressing member 44-27
A compression spring 44-29 is connected between the head 44-27a of the
is arranged so as to be wound around the presser member 44-27. This spring 44-29 has a predetermined preload (in this example, approximately
(preload set at 0.05Kg). Therefore, in the free state, the presser member 44-27 is constantly pressed downward by the spring 44-29 with a pressure of about 0.05 kg, and its head 44-27a is pressed against the presser plate 44.
It protrudes downward from the bottom surface of -26. In addition, in FIG.
A micro switch fixed in the recess 4-1c is shown. This micro switch 44-30
is actuated by the pushing plate 44-26 and plays the role of sending out an abnormal signal when an abnormal situation such as incorrect insertion of the IC 10 occurs. Also,
The distance g ₁ between the lower surface of the inner frame upper member 44-2a shown in Fig. A and the top surface (in the free state) of the holding members 44-16 and 44-17, and the gripping claw 44 shown in Fig. B
-10, 44-11 (when the IC10 is gripped) and the lowermost surfaces of the holding members 44-16, 44-17 (when in the free state) are set to have substantially the same distance _g2 . In this example, both g ₁ and g ₂ are set to approximately 3.5 mm.

This hand 44 is constructed as described above, and as will be described later, the holding members 44-16, 44
-17 presses the insertion surface of the IC 10 (in this example, the top surface of the socket 18 on the printed board 15) in advance to align it with the reference surface (in this case, the horizontal surface), and then the gripping claw 44-1 that grips the IC 10 ,44-
11 approaches the insertion surface and guides the lead of IC 10 onto the insertion surface, and then the push plate 44-2
6 inserts the IC 10 by pushing it. The holding member 44-17 (44-16) and the gripping claw 44-11 (44-10) shown by two-dot chain lines in the figure (however, only the right side is shown) are the holding member 44-1.
7 presses the socket 18, the gripping claw 44-1
1 has moved close to the socket 18.

Next, the operation of this embodiment will be explained based on FIG. 2.

First, as shown in FIG.
The lower end surface (lowest surface) of socket 17 abuts on the upper surface (insertion surface) of socket 18 . Note that this downward movement of the hand 44 is performed by the cylinder 45 shown in FIG. 3, as described above. After that, the hand 44 further descends, and the holding members 44-16, 44-
17 is pushed inside the outer frame 44-1 (see Figure 1), and springs 44-21 (see Figure 1, 4 in total)
is compressed and deflects. Due to the spring force of the springs 44-21, the holding members 44-16 and 44-17 press against the upper surface of the socket 18, and the upper surface of the socket 18 is caused by the warping of the printed circuit board 15, etc. is tilted with respect to the horizontal plane), then
This upper surface (insertion surface) is aligned with the reference surface. still,
At this time, the gripping claws 44-10, 44-11 move relative to the holding members 44-16, 44-17, descend, and approach the socket 18.

Next, as shown in FIG. the lead 11 of the IC 10 into the socket 18.
Align it with the insertion hole 18a (see figure A).

Next, as shown in FIG. Insert and push member 44-
The lowermost end surface of the IC 10 comes into contact with the upper surface of the IC 10, and the IC 10 is continuously pressed to push the lead 11 into the insertion hole 18a of the socket 18 (see Figure 1).
In this case, since the insertion pressure of the IC 10 is set to about 1 kg, the compression springs 44-25 do not bend.
Note that when the lead 11 is inserted, the gripping claw 44-
10, 44-11, and is inserted by sliding the gripping claws 44-10, 44-11. With the above steps, the insertion operation of the IC 10 is completed.

Although this embodiment shows the case where the IC 10 is inserted into the socket 18 mounted on the printed board 15, the present invention is not limited to this, and the IC 10 may be inserted directly onto the printed board 15. Of course, it can also be applied to any case.

〔Effect of the invention〕

As explained above, according to the present invention, the holding members 44-16 and 44-17 come into contact with the insertion surface in advance to align the insertion surface with the reference surface, and then the leaded electronic component 10 is inserted into the lead 11. The grip claws 44-10 and 44-11 move close to the insertion surface to align the lead 11 with the insertion hole of the insertion surface, and then the pushing member 44-26 presses the electronic component 10. Therefore, the electronic component 10 can be inserted easily and reliably, so that automatic insertion of the leaded electronic component 10 can be performed more accurately and smoothly with a simple structure.

[Brief explanation of drawings]

1 is a side view A and a front view B of a hand 44 according to the present invention, FIG. 2 is an explanatory diagram of the operation of an embodiment of the present invention, and FIG. 3 is a schematic diagram of an electronic component insertion device according to the present invention. A side view, FIG. 4 is a perspective view of the external appearance of the electronic component insertion device shown in FIG. 3, FIG. 5 is a plan view of the test printed board 15, and FIG. 7 is a diagram showing a side view A and an end view B of the leaded IC (lead-equipped electronic component) 10. FIG. In Figures 1 to 6, 10 is an IC with leads (electronic component with leads), 11 is a lead, 15 is a printed board (for testing), 18 is a socket, 18a is an insertion hole,
20 is a stake stock part, 30 is an inclined part, 3
1 is an inclined guide rail, 40 is a hand portion, 44 is a hand, 44-1 is an outer frame, 44-2 is an inner frame, 44
-5, 44-21, 44-25, 44-29 are compression springs, 44-6, 44-7 are support shafts, 44-8,
44-9 is a gripping arm, 44-10, 4-11 are gripping claws, 44-16, 44-17 are socket pressing members (insertion surface pressing members), 44-26 is a pushing plate (pushing member), 44-27 44-31 is an IC holding member (electronic component holding member), 44-31 is a gripping arm 44-8, 44-
9 and gripping claws 44-10 and 44-11 respectively show cylinders for opening and closing, and 43-31a shows a piston rod.

Claims (1)

[Scope of Claims] 1. A device for inserting a large number of leaded electronic components of the same type onto a printed board, which are arranged at a predetermined inclination angle, and the leaded electronic components 10 are lowered by their own weight on the inclined surface. an inclined part 30 for sliding; a positioning mechanism 36 provided at the lower part of the inclined part 30 for stopping and positioning the electronic component 10 on the inclined surface; and a positioning mechanism 36 for stopping and positioning the electronic component 10 on the inclined surface; The electronic component 10 is rotatably disposed toward the bottom, and grips the electronic component 10 positioned on the inclined portion 30 at its first rotational position _P1 , and at its second rotational position P2 _.
a hand portion 4 for inserting the gripped electronic component 10 onto a printed board 15 placed horizontally;
0, and the hand 44 includes insertion surface pressing members 44-16 and 44-1 for pressing the insertion surface in advance and aligning it with the reference surface when inserting the electronic component 10.
7, and a gripping claw 44-1 that grips the electronic component 10 via its lead 11 and is movable close to the insertion surface.
0,44-11 and the gripping claws 44-10,44-
1. An electronic component insertion mechanism in an electronic component insertion apparatus, comprising a pushing member 14-26 for press-inserting the electronic component 10 held by the electronic component 11 onto an insertion surface.