JPH0345920B2 - - Google Patents

Description

[Detailed description of the invention]

[Summary] A wire bonding work method that includes the direction in which the wire is pulled out from the pad, the pulling angle in that case, the positioning angle of the bonding tip,
A multiprocessor unit (microcomputer, minicomputer, etc.) manages and operates information such as whether or not the wire is hooked to the route point component, whether or not to cut the wire after bonding, and what to do with the excess length. This makes it possible to respond to changing wiring systems. [Industrial Application Field] The present invention relates to a discrete wiring work method in which a multiprocessor unit manages and uses various wire connection data. [Problems to be solved by the prior art and the invention] In general, automation of discrete wiring on printed circuit boards requires a multiprocessor unit (microcomputer) to determine the coordinates of two points to be connected and the wire length between the two points. ,
This method uses a minicomputer, etc.) to process the data. There is little information about the wiring work. For this reason, it is difficult to cope with increasingly complex and diverse wiring methods, such as the recent double-sided component mounting of printed circuit boards. The present invention was created in view of these points, and an object of the present invention is to provide a wire bonding method that can handle increasingly complex and diverse wiring. [Means for Solving the Problems] Therefore, the present invention provides a method for performing discrete wiring on a printed circuit board by having a multiprocessor unit manage and operate route wiring information and line length adjustment information by detour. In the wire bonding work method, the route wiring includes lead-out point information indicating which direction to lead out the wire 3 from the component pad 2, up, down, left, or right, and a wire lead-out angle corresponding to the wire lead-out point and the lead-out direction. The drawing angle information, the bonding chip angle information indicating the positioning angle of the bonding chip 4 corresponding to the wire drawing angle, and the place where the wire 3 is stopped at the component mounting intersection (route point) to determine which direction to route the wire next. route point information indicating whether to hook the wire 3 at the route point, wire hooking information indicating whether to hook the wire 3 at the route point, and wire cutting information indicating whether to cut the wire 3 bonded to the component pad 2 or not. The above detour line length adjustment information instructs to detour around parts with different component circumferences in order to adjust the extra wire length when wiring between two specified points with a specified wire length. It is characterized by [Function] The multiprocessor unit manages wire drawing information, drawing angle information, bonding chip angle information, route point information, wire hooking information, wire cutting information, and surplus length processing information. By operating the system, it becomes possible to perform wire bonding work in response to increasingly complex and diverse wiring. [Example] Figures 1 to 6 are diagrams explaining the wire bonding work method of the present invention, in which Figure 1 shows extraction point information, Figure 2 shows extraction angle information, and Figure 3 shows bonding tip angle information. , FIG. 4 is a diagram for explaining route point information and wire hooking information, FIG. 5 is a diagram for explaining wire cutting information, and FIG. 6 is a diagram for explaining line length adjustment information due to detours. Each piece of information will be explained below. Please note that these wiring data are created by the design department and are stored on storage media (e.g. MT, magnetic disk, etc.)
Supplied by The supplied data is converted into a media format (eg, floppy disk) suitable for the manufacturing equipment (wire bonder in this case) and processed by the MPU. The extraction point information shown in Fig. 1 represents the absolute value from the board origin, and is necessary data when determining the table movement of the wire bonder and the wire extraction direction, and 4 points or more are set for each component 1. , two drawing directions of the wire 3 are allowed for each component pad 2. The drawing angle information shown in FIG. 2 is data that instructs whether to draw the bonding wire upward, downward, leftward, or rightward.The wire drawing direction is determined by the positional relationship between the bonding point and the next drawing point. The drawing angle of wire 3 is 45°, 225°, 135°,
There are six angles: 315°, 180°, and 0°, which are determined by the following wire drawing angle table depending on the board setting direction.

[Table] The bonding chip angle information shown in Figure 3 is
The angle of the tip 4 is determined in accordance with the wire drawing angle as shown in the following table. The chip angle can also be determined to support direct bonding to component leads.

[Table] The route point information shown in Figure 4 is
This is the point at which the wire is bent or hooked onto a routing guide, and here instructions are given for wiring to the next point. Compare the coordinates of the current point (route point) and the next point to determine the wiring direction as shown by the arrow in the table below.

〔Effect of the invention〕

As described above, according to the present invention, various types of information are managed and operated by a multiprocessor unit, so that it is possible to deal with all types of wiring, and is extremely useful in practice.

[Brief explanation of drawings]

1 to 7 are diagrams for explaining an embodiment of the present invention, in which FIG. 1 is drawing point information, FIG. 2 is drawing angle information, FIG. 3 is bonding tip angle information, and FIG. 5 is a diagram for explaining the route point information and the wire hooking information, FIG. 5 is the wire cutting information, FIG. 6 is the line length adjustment information by detour, and FIG. 7 is a diagram for explaining the procedure for determining the wiring information. 1 to 6, 1, 5, and 6 are components, 2 is a component pad, 3 is a wire, and 4 is a bonding chip.

Claims (1)

[Scope of Claims] 1. A wire bonding work method in which route wiring information and line length adjustment information by detours are managed and operated by a multiprocessor unit to perform discrete wiring on a printed circuit board, comprising: are: a. Pull-out point information indicating which direction to pull out the wire 3 from the component pad 2, up, down, left, or right; b. Pull-out angle information indicating the wire pull-out angle corresponding to the wire pull-out point and the pull-out direction; and c. Wire pull-out angle. Bonding chip angle information indicating the positioning angle of the bonding chip 4 corresponding to d and the component mounting intersection (route point) of the wire 3
route point information indicating where to stop in order to decide which way to wire next; e wire hooking information indicating whether to hook wire 3 at the route point or not; f bonding to component pad 2. wire cutting information indicating whether to cut the wire 3 that has been cut or not; A wire bonding work method characterized by instructing to bypass parts having different peripheral lengths in order to adjust the wire bonding process.