JPH0346316B2 - - Google Patents
Info
- Publication number
- JPH0346316B2 JPH0346316B2 JP58130440A JP13044083A JPH0346316B2 JP H0346316 B2 JPH0346316 B2 JP H0346316B2 JP 58130440 A JP58130440 A JP 58130440A JP 13044083 A JP13044083 A JP 13044083A JP H0346316 B2 JPH0346316 B2 JP H0346316B2
- Authority
- JP
- Japan
- Prior art keywords
- aluminum
- acid
- ppm
- amount
- sulfuric acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 54
- 238000007639 printing Methods 0.000 claims description 46
- 229910052782 aluminium Inorganic materials 0.000 claims description 43
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 29
- 238000007788 roughening Methods 0.000 claims description 29
- 230000005611 electricity Effects 0.000 claims description 25
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 24
- 229910017604 nitric acid Inorganic materials 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 239000008151 electrolyte solution Substances 0.000 claims description 6
- 239000012535 impurity Substances 0.000 claims description 5
- 238000007743 anodising Methods 0.000 claims description 4
- 239000007864 aqueous solution Substances 0.000 description 18
- 239000003792 electrolyte Substances 0.000 description 16
- -1 nitrate radicals Chemical class 0.000 description 15
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 14
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 12
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 239000002253 acid Substances 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 11
- 238000005530 etching Methods 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000000654 additive Substances 0.000 description 7
- 239000003513 alkali Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 6
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 230000003746 surface roughness Effects 0.000 description 5
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 235000011121 sodium hydroxide Nutrition 0.000 description 4
- 238000010186 staining Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000003082 abrasive agent Substances 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000000635 electron micrograph Methods 0.000 description 3
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000010731 rolling oil Substances 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- 229920000084 Gum arabic Polymers 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- 229910002651 NO3 Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 241000978776 Senegalia senegal Species 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- 239000000205 acacia gum Substances 0.000 description 2
- 235000010489 acacia gum Nutrition 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 239000010407 anodic oxide Substances 0.000 description 2
- 239000007900 aqueous suspension Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229940114081 cinnamate Drugs 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-M phthalate(1-) Chemical compound OC(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-M 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- 239000008262 pumice Substances 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- WBYWAXJHAXSJNI-VOTSOKGWSA-M trans-cinnamate Chemical compound [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 2
- BNGXYYYYKUGPPF-UHFFFAOYSA-M (3-methylphenyl)methyl-triphenylphosphanium;chloride Chemical compound [Cl-].CC1=CC=CC(C[P+](C=2C=CC=CC=2)(C=2C=CC=CC=2)C=2C=CC=CC=2)=C1 BNGXYYYYKUGPPF-UHFFFAOYSA-M 0.000 description 1
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N 1,5-Pentadiol Natural products OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- ANBBXQWFNXMHLD-UHFFFAOYSA-N aluminum;sodium;oxygen(2-) Chemical compound [O-2].[O-2].[Na+].[Al+3] ANBBXQWFNXMHLD-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000003934 aromatic aldehydes Chemical class 0.000 description 1
- 150000008365 aromatic ketones Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000001540 azides Chemical class 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- 235000019445 benzyl alcohol Nutrition 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- PIPBVABVQJZSAB-UHFFFAOYSA-N bis(ethenyl) benzene-1,2-dicarboxylate Chemical compound C=COC(=O)C1=CC=CC=C1C(=O)OC=C PIPBVABVQJZSAB-UHFFFAOYSA-N 0.000 description 1
- FLHKEWQKOHJIMH-UHFFFAOYSA-N bis(ethenyl) benzene-1,3-disulfonate Chemical compound C=COS(=O)(=O)C1=CC=CC(S(=O)(=O)OC=C)=C1 FLHKEWQKOHJIMH-UHFFFAOYSA-N 0.000 description 1
- IHXBXGHGYCSRAP-UHFFFAOYSA-N bis(ethenyl) benzene-1,4-dicarboxylate Chemical compound C=COC(=O)C1=CC=C(C(=O)OC=C)C=C1 IHXBXGHGYCSRAP-UHFFFAOYSA-N 0.000 description 1
- AJCHRUXIDGEWDK-UHFFFAOYSA-N bis(ethenyl) butanedioate Chemical compound C=COC(=O)CCC(=O)OC=C AJCHRUXIDGEWDK-UHFFFAOYSA-N 0.000 description 1
- JZQAAQZDDMEFGZ-UHFFFAOYSA-N bis(ethenyl) hexanedioate Chemical compound C=COC(=O)CCCCC(=O)OC=C JZQAAQZDDMEFGZ-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- PMMYEEVYMWASQN-IMJSIDKUSA-N cis-4-Hydroxy-L-proline Chemical compound O[C@@H]1CN[C@H](C(O)=O)C1 PMMYEEVYMWASQN-IMJSIDKUSA-N 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 150000008049 diazo compounds Chemical class 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011067 equilibration Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229960004337 hydroquinone Drugs 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 229920005610 lignin Polymers 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- XZSZONUJSGDIFI-UHFFFAOYSA-N n-(4-hydroxyphenyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NC1=CC=C(O)C=C1 XZSZONUJSGDIFI-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- HWGNBUXHKFFFIH-UHFFFAOYSA-I pentasodium;[oxido(phosphonatooxy)phosphoryl] phosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])(=O)OP([O-])([O-])=O HWGNBUXHKFFFIH-UHFFFAOYSA-I 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920002338 polyhydroxyethylmethacrylate Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
- 235000011118 potassium hydroxide Nutrition 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910001388 sodium aluminate Inorganic materials 0.000 description 1
- 235000012247 sodium ferrocyanide Nutrition 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulphite Substances [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- 235000019832 sodium triphosphate Nutrition 0.000 description 1
- FGDMJJQHQDFUCP-UHFFFAOYSA-M sodium;2-propan-2-ylnaphthalene-1-sulfonate Chemical compound [Na+].C1=CC=CC2=C(S([O-])(=O)=O)C(C(C)C)=CC=C21 FGDMJJQHQDFUCP-UHFFFAOYSA-M 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- ROVRRJSRRSGUOL-UHFFFAOYSA-N victoria blue bo Chemical compound [Cl-].C12=CC=CC=C2C(NCC)=CC=C1C(C=1C=CC(=CC=1)N(CC)CC)=C1C=CC(=[N+](CC)CC)C=C1 ROVRRJSRRSGUOL-UHFFFAOYSA-N 0.000 description 1
- 235000020681 well water Nutrition 0.000 description 1
- 239000002349 well water Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N3/00—Preparing for use and conserving printing surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N3/00—Preparing for use and conserving printing surfaces
- B41N3/03—Chemical or electrical pretreatment
- B41N3/034—Chemical or electrical pretreatment characterised by the electrochemical treatment of the aluminum support, e.g. anodisation, electro-graining; Sealing of the anodised layer; Treatment of the anodic layer with inorganic compounds; Colouring of the anodic layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/04—Etching of light metals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
- Y10S205/921—Electrolytic coating of printing member, other than selected area coating
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Printing Plates And Materials Therefor (AREA)
Description
本発明は平版印刷用支持体及びその製造方法、
特に平版印刷用アルミニウム組面版及びその製造
方法に関するものである。
従来より、平版印刷用支持体としてアルミニウ
ム板が広く使用されているが、その上に設けられ
る感光層との密着性を良好にし、且つこれを用い
て作成される平版印刷版の非画像部(印刷時に使
用される湿し水を受容し油性インクを反撥する領
域で支持体の表面が露出している領域)の保水性
を改善することを目的としてアルミニウム板の表
面は粗面化されているのが通例である。この粗面
化処理は所謂砂目立と称され平版印刷版用支持体
の調製においては不可欠の工程である。この砂目
立は、ボールグレイン、ワイヤーグレイン、ブラ
シグレイン、ブラストグレイン等の機械的な粗面
化方法と、酸又は中性の水溶液中で電気化学的に
エツチングを行う電解粗面化方法、特殊なアルミ
ニウム合金材料を用いて酸またはアルカリにより
化学的にエツチングを行う化学粗面化法が知られ
ている。印刷時報社刊「平版制版印刷の基礎」
(著者杉山憲一、1965年12月1日発行)第35−37
頁には、砂目立方法について一般的な解説がなさ
れており、特に研磨剤スリラーを併用して機械的
粗面化を行う方法について具体的に記述されてい
る。印刷雑誌、1963年7月号第2−4頁「アルマ
イト平版概説」(著書:佐野迪)には塩酸あるい
は硝酸を用いて交流により電解粗面化を行つたの
ち陽極酸の処理する平版印刷板の製造方法が記載
されている。特公昭54−42284号公報にはマンガ
ンを1.6−2.5%含むアルミニウム板をアルカリで
化学的粗面化を行う平版用印刷板の製造方法が記
載されている。
他方、これら公知の粗面化方法を適宜組合せた
複合砂目立方法も又良く知られている。例えば、
米国特許第2344510号明細書には機械的粗面化を
行つたのち塩酸等を用いて電気学的粗面化を八重
畳的(Superimpose)に複合した砂目を表面に形
成させたのち、陽極酸化処理を行う平版印刷版用
支持体の製造方法が記載されている。更に特公昭
57−16918号公報には機械的粗面化を行つたのち、
酸又はアルカリにより化学的にエツチングししか
るのち電気化学的に粗面化し、次いで陽極酸化処
理を行う平版印刷版用支持体の製造方法が記載さ
れている。更にまた特開昭56−28893号公報には、
順に機械的粗面化、化学的エツチング及び酸性電
解液中で交番波形電流による電気化学的粗面化を
行なうことによりアルミニウム表面にプラトーと
ピツトよりなる砂目構造をもつ平版印刷版用支持
体の製造方法が記載されている。
本発明者等は粗面化されたアルミニウム支持体
の表面を2000〜5000倍に拡大した場合に観察され
る微小な凹凸の形状が平版印刷用支持体として下
記の如き極めて大きな影響を印刷性能に及ぼすも
のであることを見い出した。
(1) 画像層と支持体界面の密着を強固にし耐刷を
向上する。
(2) 上記(1)と同様にして1〜5%程度の微小網点
画像の現像過程から印刷過程を通じての支持体
への密着を強固にし、調子再現性を向上させ
る。
(3) 非画像部への親水性コーテイング層(例;ア
ラビアガム)の密着を強固にし親水性を向上さ
せる。
(4) 非画像部の保水性を向上させる。
本発明者等は、この微小な凹凸構造に着目し観
察と実験を重ねた結果、下記の考察と結論をうる
に至つた。
(a) 一般的に、砂目立された粗面は大きな粗さ構
造(一次構造)と小さな粗さ構造(二次構造)
を有し、前出の効果を有する微小な凹凸は、二
次構造を由来すること。
(b) 機械的粗面化な際しては、使用する研磨剤の
粒度を選択し、注意深く加工条件を設定するこ
とにより二次構造を増減することが可能であ
る。この考え方は特公昭54−42282号及び特公
昭54−42283号の各公報中に、湿式ブラスト法
により2種類の粒度の異なる研磨剤により機械
的に粗面化を行うオフセツト印刷用アルミニウ
ム版材の製造法として開示されている。
しかし通常、機械的粗面化された表面には研
磨剤、アルミニウムの研削屑等が残留するた
め、特に陽極酸化を施して印刷板とした場合に
はこれら残留成分に起因する外観の黒色化、印
刷時の汚れの発生等の問題があること。
(c) 上記の問題を解決するために、特公昭51−
33444号公報に記載される様に、酸又はアルカ
リによる化学的エツチングあるいは特公昭56−
19279号公報に記載されるりん酸中での電気化
学的エツチングを施してのち陽極酸化する方法
が有効である。しかし乍ら該エツチングの過程
では二次構造が消失するために、せつかく砂目
立により付与された表面特性を悪化させ、保水
性や耐刷性を低下させるという新たな問題を生
ずる。
(d) 電気化学的粗面化においても同様に、二重構
造の形成が認められる。例えば住友軽金属技報
Vol.15、No.2、April 1974“The Process for
the Production of Electrolytically Etched
and Anodised Stvip”にこれを裏付ける報告
を見い出す事ができる。本発明者等の実験に依
れば、通常市販されているPS版
(Preseusitized Plateの略称)のもつ平均的な
表面粗さ(Ra=0.6μ)を塩酸を主体とする電
解液を用い商用交流を用い砂目立するためには
1000−1500クーロン/dm2の電気量を必要とし
た。電解を終えた直後の表面はスマツト
(smut)と呼ばれる不溶解残渣に一面おおわれ
ており通常の水洗あるいはブラツシング洗浄に
より取り除く事は困難なので、特公昭48−
28123号公報に記載される如くアルカリを用い
て表面をエツチングする必要があつた。その結
果、注意深く軽度のエツチングを行つた粗面は
該二次構造が存在したが僅かにエツチング量を
上回ると該二次構造が消失してしまう事、その
結果として(c)と同様に保水性と親水性が低下す
るという問題があつた。
(e) 塩酸剤に対して、種々の添加剤を加えて一次
構造の粗大化を抑制し微密な二次構造の生成を
促す試みが数多く提案されている。硝酸、クロ
ム酸、フツ酸を添加剤とするもの(特公昭48−
28123号)、アミン類、アルデヒド類、非イオン
界面活性剤を添加剤とするもの(特公昭51−
7081号)、ホウ酸を添加剤とするもの(仏国特
許第2110257号)、リン酸を添加剤とするもの
(米国特許第3887447号)、等の添加物がこれ迄
に知られている。
特に米国特許第3887447号明細書においては、
微細なピツトの均一生成を阻害する因子として
電解液中に存在する微量不純物としての硫酸イ
オンの影響に言及し10−15ppm程度の硫酸イオ
ンが存在すると均一な粗大ピツトが出来ると
し、これを改良する手段としてリン酸の添加を
提案している事は興味深い。
(f) 本発明者等は微細な二次構造に着目しこれを
均一かつ効率的に表面に形成させる上で硝酸を
主体とする電解液が塩酸に比較して有利である
との確信を持つに至つた。その理由は硝酸を主
体とする電解液を用いて電解粗面化した表面は
表面残存物(スマツト)が塩酸に比較して少
く、このため比較的温和な後処理によつて残渣
を除去できるためである。これにより電解粗面
化して得られた砂目を破壊する事が少ないとい
う利点がある。
しかし乍ら、商用交流を用いた硝酸単独電解
液で得られる粗面構造は巨大ピツトを含む不規
則、不均一な配置をするため印刷版として必要
な所定の表面アラサを有する均一な表面構造が
得られないという問題があつた。
(g) また、特公昭40−764号公報にはリグニンを
基礎とする保護コロイド、芳香族アルデヒド、
芳香族ケトンを硝酸に添加することにより微細
な粗面構造を得る方法が記載されている。
しかしながら、本発明者の追試した結果に依
れば、いずれもその効果を本発明者が目的とす
るところには及ばぬ不充分なものであつた。そ
こで本発明者等は鋭意研究の結果、硝酸を主体
とする電解液に対して極めて限定的な範囲の硝
酸根を、共存させた場合に首記課題が達成され
る事を見出した。このような事実は、米国特許
第3887447号明細書に硫酸イオンが共存するこ
とによつて悪影響を受けるという記載があるこ
とを考えると、極めて驚くべきことといわなけ
ればならない。
本発明によれば、以下に詳細に説明するごと
く、形状的に特徴を有するピツト構造が得られ、
この形状的特徴の故に印刷性能(耐刷、汚れにく
さ)上極めて好ましい効果が発揮される。
(1) 本方式によつて得られるピツトは円形でかつ
個々の独立した構造をもち、0.3〜8ミクロン
の開口径を有する。
(2) 本方式により交番波形電流を用い陽極時電気
量に対する陰極時電気量の比を0.4〜1.25の範
囲で電気化学的粗面化を行うと、巨大ピツトの
偏在しない均一な粗面をえることができ、電気
量2000クーロン/dm2において表面アラサ0.8
ミクロンを有する均一な砂目立を行う事が出来
た。ちなみに硝酸単独の場合は、500クーロ
ン/dm2付近から巨大ピツトが偏在する不規則
な粗面が生成し、表面アラサにして0.5ミクロ
ン以上の均一な粗面構造を作る事は困難であつ
た。
(3) 本方式により交番波形電流を用い陽極時電気
量が2000クーロンを越えない範囲でかつその電
圧を5〜50V、電流密度を10〜100A/dm2の
範囲とし、陰極時電気量/陽極時電気量=0.4
〜1.25の範囲で予め機械的および/または化学
的に所定の表面アラサに粗面化処理された粗面
上に、二次構造として上記(1)に述べたビツト構
造を重畳的に分布させた二次構造の粗面は、印
刷適性に最もすぐれた結果を発揮した。その詳
細については後記の実施例にて説明する。
(4) 上記(3)における特筆すべきもう1つの効果
は、添加された硝酸根の濃度によりピツト構造
の重畳密度が制御できるという事であつて、こ
の事実は予測しえない極めて驚くべき事であ
る。第1図は硝酸単独電解液(硝酸濃度:7
g/)を用い交番波形電流(陰極時電気量/
陽極時電気量:0.8)により電解粗面化を行な
つた結果を示したものである。図中横軸は投入
電気量(陽極時電気量クーロン/dm2)を示
し、縦軸は得られた粗面化アルミニウム表面の
反射濃度を示す。第5A図、第5B図、第5C
図は各々第1図中のA点、B点、C点の試料の
各々の表面を1500倍に拡大してみた走査型電子
顕微鏡写真(以下、SEMと称す。)である。第
1図、第5A図、第5B図および第5C図か
ら、電気量に比例して0.3〜8ミクロンの開口
径を有するピツトの密度が増大し、それにつれ
て粗面を反射濃度が増加することが理解され
る。第2図は、一例としてある特定の電気量下
において、硝酸の硫酸を添加した場合における
硫酸の添加量と反射濃度の関係を示したグラフ
であり、横軸は硫酸の添加量(単位:ppm)を
示し、縦軸はえられた粗面化アルミニウム表面
の反射濃度を示す。このときの電気化学的粗面
化の条件は、硝酸濃度:7g/、陽極時電気
量:175クーロン/dm2、陰極時電気量:145ク
ーロン/dm2、陰極時電気量/陽極時電気量:
0.8であつた。第6A図、第6B図、第6C図、
第6D図は各々硫酸濃度οppm、100ppm、
1000ppm、5000ppmに対応する、それぞれの粗
面化表面のSEMである。これにより同一の投
入電気量にもかかわらず特定範囲の硫酸濃度に
より微小ピツト密度が増加していくことがわか
る。同様な結果は投入電気量を任意に変えた場
合にも得ることができる。有用な硫酸根の濃度
は硝酸の濃度、交番波形電流密度および共存す
る硝酸アルミニウムの量によつて変化しうるが
50〜4000ppmの範囲である。5000ppmを越える
と不働態皮膜の生成のためエツチング反応が阻
害される。又通常井水中に存在する硫酸イオン
濃度は2〜25ppmであるため25ppm以下は制御
が困難である。上記硫酸根の源としては、硫酸
のほかそのカリウム塩、ナトリウム塩等が使用
できる。この中で硫酸が好ましい。硝酸濃度は
1000〜40000ppmの範囲で用いることが出来る、
又共存する不可避の成分としてはAL、CO3 -2、
Na、Fe、Siがあるが、このうちアルミニウム
に関しては硝酸アルミニウムにして1000〜
20000ppmの範囲で使用することができる。
(5) 第2図に例示した如く硝酸に硫酸を添加した
場合の挙動は大きく3つに区分される。まず、
0〜800ppmは添加量の増加につれてピツト密
度が増加する領域であり、次に800〜3000ppm
は添加量に鈍感に一定したピツト密度を保つ領
域であり、そして3000ppm〜4000ppmは添加に
したがつて衡次効果が減少していく領域に相当
する。したがつて、第一の領域においては硫酸
根の濃度を制御して投入電気量をセーブするこ
とが可能である。又、硫酸根の濃度に鈍感な第
二の領域においては広い変容度をもつ製造条件
の下で、上記(1)〜(3)で述べた特徴を有する表面
形状により優れた印刷性能をもつ印刷版の製造
が可能となる。
本発明に使用されるアルミニウム板には純アル
ミニウム及びアルミニウム合金板が含まれる。ア
ルミニウム合金としては種々のものが使用でき、
例えばけい素、銅、マンガン、マグネシウム、ク
ロム、亜鉛、鉛、ビスマス、ニツケルなどの金属
とアルミニウムの合金が用いられる。具体的なア
ルミニウム合金の例を下表に示す。表中の数字の
単位は重量%であり、残余がアルミニウムであ
る。
The present invention relates to a lithographic printing support and a method for producing the same;
In particular, the present invention relates to an aluminum type plate for lithographic printing and a method for manufacturing the same. Conventionally, aluminum plates have been widely used as supports for lithographic printing.Aluminum plates have been used to improve adhesion with the photosensitive layer provided thereon, and also to improve the non-image area ( The surface of the aluminum plate is roughened for the purpose of improving water retention in the exposed area of the support (the area that receives dampening water and repels oil-based ink used during printing). It is customary. This surface roughening treatment is called graining and is an essential step in the preparation of supports for lithographic printing plates. This graining can be achieved by mechanical surface roughening methods such as ball grain, wire grain, brush grain, and blast grain, electrolytic surface roughening method that electrochemically etches in acid or neutral aqueous solution, and special surface roughening methods. A chemical surface roughening method is known in which aluminum alloy material is chemically etched with acid or alkali. “Basics of Lithographic Printing” published by Printing Jihosha
(Author Kenichi Sugiyama, published December 1, 1965) No. 35-37
The page provides a general explanation of the graining method, and specifically describes a method of mechanically roughening the surface using an abrasive thriller. Printed Magazine, July 1963 issue, pages 2-4, ``Overview of Alumite Lithography'' (Author: Michi Sano) describes a lithographic printing plate that is electrolytically roughened by alternating current using hydrochloric acid or nitric acid, and then treated with anodic acid. The manufacturing method is described. Japanese Patent Publication No. 54-42284 describes a method for producing a lithographic printing plate in which an aluminum plate containing 1.6-2.5% manganese is chemically roughened with an alkali. On the other hand, a composite graining method in which these known surface roughening methods are appropriately combined is also well known. for example,
U.S. Patent No. 2,344,510 discloses that after mechanical roughening, electrical roughening is performed using hydrochloric acid etc. to form grains on the surface in a superimpose manner, and then the anode A method for producing a support for a lithographic printing plate that is subjected to an oxidation treatment is described. In addition, Tokko Akira
57-16918, after mechanical roughening,
A method for producing a support for a lithographic printing plate is described, which comprises chemically etching with an acid or alkali, followed by electrochemical roughening, and then anodizing. Furthermore, in Japanese Patent Application Laid-open No. 56-28893,
By sequentially performing mechanical roughening, chemical etching, and electrochemical roughening using an alternating waveform current in an acidic electrolyte, a lithographic printing plate support having a grain structure consisting of plateaus and pits on the aluminum surface was prepared. The manufacturing method is described. The present inventors have discovered that the shape of minute irregularities observed when the surface of a roughened aluminum support is magnified 2000 to 5000 times has an extremely large effect on printing performance as a lithographic printing support, as described below. It was discovered that (1) Strengthen the adhesion between the image layer and the support to improve printing durability. (2) In the same manner as in (1) above, the adhesion of the fine halftone dot image of about 1 to 5% to the support from the development process to the printing process is strengthened, and the tone reproducibility is improved. (3) Strengthen the adhesion of the hydrophilic coating layer (eg, gum arabic) to the non-image area and improve hydrophilicity. (4) Improve water retention in non-image areas. The inventors of the present invention focused on this fine uneven structure and conducted repeated observations and experiments, and as a result, they came to the following considerations and conclusions. (a) Generally, a grained rough surface has a large roughness structure (primary structure) and a small roughness structure (secondary structure).
The minute irregularities having the above-mentioned effect originate from a secondary structure. (b) When mechanically roughening the surface, it is possible to increase or decrease the secondary structure by selecting the particle size of the abrasive used and carefully setting the processing conditions. This idea was introduced in Japanese Patent Publications No. 54-42282 and No. 54-42283, in which aluminum plates for offset printing are mechanically roughened using two types of abrasives with different particle sizes using a wet blasting method. It is disclosed as a manufacturing method. However, since abrasives, aluminum grinding chips, etc. usually remain on the mechanically roughened surface, blackening of the appearance due to these residual components, especially when printing plates are made by anodizing, Problems such as stains occurring during printing. (c) In order to solve the above problem,
As described in Publication No. 33444, chemical etching with acid or alkali or
The method described in Japanese Patent No. 19279, in which electrochemical etching in phosphoric acid is performed followed by anodic oxidation, is effective. However, since the secondary structure disappears in the etching process, new problems arise in that the surface properties imparted by the grainy grains are deteriorated and water retention and printing durability are reduced. (d) Similarly, formation of a double structure is observed in electrochemical roughening. For example, Sumitomo Light Metal Technical Report
Vol.15, No.2, April 1974 “The Process for
the Production of Electrolytically Etched
According to the experiments of the present inventors, the average surface roughness (Ra = 0.6μ) using an electrolyte mainly composed of hydrochloric acid and a commercial alternating current.
It required an amount of electricity of 1000-1500 coulombs/dm 2 . Immediately after electrolysis, the surface is completely covered with an insoluble residue called smut, which is difficult to remove with normal washing with water or brushing.
As described in Japanese Patent No. 28123, it was necessary to etch the surface using an alkali. As a result, the secondary structure existed on the rough surface that was carefully and lightly etched, but when the etching amount was slightly exceeded, the secondary structure disappeared, and as a result, as in (c), the water retention There was a problem that hydrophilicity decreased. (e) Many attempts have been proposed to add various additives to the hydrochloric acid agent to suppress coarsening of the primary structure and promote the formation of fine secondary structures. Products containing nitric acid, chromic acid, and hydrofluoric acid as additives (Special Publication Act 1977-
28123), those containing amines, aldehydes, and nonionic surfactants as additives (Special Publication No. 1973-
Additives such as those using boric acid as an additive (No. 7081), those using boric acid as an additive (French Patent No. 2110257), and those using phosphoric acid as an additive (US Pat. No. 3,887,447) are known so far. In particular, in U.S. Pat. No. 3,887,447,
The authors mention the influence of sulfate ions as a trace impurity present in the electrolyte as a factor that inhibits the uniform formation of fine pits, and state that the presence of about 10-15 ppm of sulfate ions will result in uniform coarse pits, and will improve this. It is interesting that the addition of phosphoric acid is proposed as a means. (f) The inventors are confident that an electrolytic solution mainly composed of nitric acid is advantageous compared to hydrochloric acid in terms of focusing on fine secondary structures and forming them uniformly and efficiently on the surface. It came to this. The reason for this is that surfaces electrolytically roughened using an electrolyte mainly composed of nitric acid have less surface residue (smut) compared to hydrochloric acid, and therefore the residue can be removed by a relatively mild post-treatment. It is. This has the advantage that the grains obtained by electrolytic surface roughening are less likely to be destroyed. However, the rough surface structure obtained with a nitric acid-only electrolyte using commercial alternating current has an irregular and non-uniform arrangement including giant pits, so a uniform surface structure with a predetermined surface roughness necessary for a printing plate cannot be obtained. I had a problem with not being able to get it. (g) In addition, Japanese Patent Publication No. 1976-764 also describes protective colloids based on lignin, aromatic aldehydes,
A method for obtaining a fine rough surface structure by adding aromatic ketones to nitric acid is described. However, according to the results of additional tests conducted by the present inventor, the effects of these methods did not reach the desired effect of the present inventor and were insufficient. As a result of intensive research, the inventors of the present invention have found that the above problem can be achieved when a very limited range of nitrate radicals is allowed to coexist with an electrolytic solution mainly composed of nitric acid. This fact is extremely surprising considering that US Pat. No. 3,887,447 states that the coexistence of sulfate ions has an adverse effect. According to the present invention, as will be explained in detail below, a pit structure having a characteristic shape can be obtained,
Because of this shape characteristic, extremely favorable effects are exhibited in terms of printing performance (printing durability, resistance to staining). (1) The pits obtained by this method are circular and have individual independent structures, and have an opening diameter of 0.3 to 8 microns. (2) When electrochemical surface roughening is performed using this method using an alternating waveform current and the ratio of the amount of electricity at the cathode to the amount of electricity at the anode is in the range of 0.4 to 1.25, a uniformly roughened surface with no uneven distribution of giant pits can be obtained. surface roughness of 0.8 at 2000 coulombs/ dm2
It was possible to create a uniform grain with micron diameter. Incidentally, in the case of using nitric acid alone, an irregular rough surface with unevenly distributed giant pits was formed from around 500 coulombs/dm 2 , and it was difficult to roughen the surface and create a uniform rough surface structure of 0.5 microns or more. (3) Using this method, an alternating waveform current is used, the amount of electricity at the anode does not exceed 2000 coulombs, the voltage is 5 to 50 V, the current density is in the range of 10 to 100 A/ dm2 , and the amount of electricity at the cathode is divided by the amount of electricity at the anode. Hourly electricity amount = 0.4
The bit structure described in (1) above was distributed in a superimposed manner as a secondary structure on a roughened surface that had been mechanically and/or chemically roughened to a predetermined surface roughness in the range of ~1.25. The rough surface with secondary structure showed the best results in printability. The details will be explained in Examples below. (4) Another noteworthy effect in (3) above is that the density of the pit structure can be controlled by the concentration of added nitrate radicals, and this fact is unexpected and extremely surprising. It is. Figure 1 shows nitric acid alone electrolyte (nitric acid concentration: 7
g/) and the alternating waveform current (cathode electricity quantity/
This figure shows the results of electrolytic surface roughening using anode electricity amount: 0.8). In the figure, the horizontal axis shows the amount of electricity applied (coulomb/dm 2 of electricity at the time of anode), and the vertical axis shows the reflection density of the obtained roughened aluminum surface. Figure 5A, Figure 5B, Figure 5C
The figures are scanning electron micrographs (hereinafter referred to as SEM) of the surfaces of the samples at points A, B, and C in Figure 1, respectively, magnified 1500 times. From Figures 1, 5A, 5B, and 5C, the density of pits with an opening diameter of 0.3 to 8 microns increases in proportion to the amount of electricity, and the density of reflection on the rough surface increases accordingly. is understood. Figure 2 is a graph showing, as an example, the relationship between the amount of sulfuric acid added and the reflection density when sulfuric acid is added to nitric acid under a certain amount of electricity, and the horizontal axis is the amount of sulfuric acid added (unit: ppm ), and the vertical axis shows the reflection density of the roughened aluminum surface obtained. The conditions for electrochemical surface roughening at this time were: nitric acid concentration: 7 g/, quantity of electricity at anode: 175 coulombs/dm 2 , quantity of electricity at cathode: 145 coulombs/dm 2 , quantity of electricity at cathode/quantity of electricity at anode. :
It was 0.8. Figure 6A, Figure 6B, Figure 6C,
Figure 6D shows the sulfuric acid concentration οppm, 100ppm,
These are SEM images of roughened surfaces corresponding to 1000ppm and 5000ppm. It can be seen from this that the micro pit density increases with a specific range of sulfuric acid concentration despite the same amount of input electricity. Similar results can be obtained by arbitrarily changing the amount of electricity applied. The concentration of useful sulfate radicals can vary depending on the concentration of nitric acid, the alternating waveform current density, and the amount of coexisting aluminum nitrate.
It ranges from 50 to 4000 ppm. If it exceeds 5000 ppm, the etching reaction will be inhibited due to the formation of a passive film. Furthermore, since the concentration of sulfate ions normally present in well water is 2 to 25 ppm, it is difficult to control the concentration below 25 ppm. As the source of the sulfuric acid radical, in addition to sulfuric acid, its potassium salt, sodium salt, etc. can be used. Among these, sulfuric acid is preferred. Nitric acid concentration is
Can be used in the range of 1000 to 40000ppm,
Also, the unavoidable components that coexist are AL, CO 3 -2 ,
There are Na, Fe, and Si, but among these, aluminum has a 1000~
Can be used in the range of 20000ppm. (5) As illustrated in Figure 2, the behavior when sulfuric acid is added to nitric acid can be broadly classified into three types. first,
0~800ppm is the area where the pit density increases as the amount added, then 800~3000ppm
is a region where a constant pit density is maintained insensitively to the amount added, and 3000 ppm to 4000 ppm corresponds to a region where the equilibration effect decreases as the amount of addition increases. Therefore, in the first region, it is possible to save the input electricity amount by controlling the concentration of sulfate radicals. In addition, in the second region, which is insensitive to the concentration of sulfate radicals, under manufacturing conditions with a wide variation degree, printing with excellent printing performance due to the surface shape having the characteristics described in (1) to (3) above is possible. It becomes possible to manufacture plates. The aluminum plate used in the present invention includes pure aluminum and aluminum alloy plate. Various aluminum alloys can be used,
For example, alloys of aluminum and metals such as silicon, copper, manganese, magnesium, chromium, zinc, lead, bismuth, and nickel are used. Specific examples of aluminum alloys are shown in the table below. The units of numbers in the table are % by weight, with the remainder being aluminum.
【表】
これらの組成物は、いくらかの鉄およびチタン
に加えて、その他掲示しなかつた無視し得る程度
の量の不純物をも含むものである。
本発明の好ましい態様においては、アルミニウ
ム板は、先づ機械的に粗面化されるが、これに先
立つて、アルミニウム表面の圧延油を除去するこ
と及び清浄なアルミニウム表面を現出させるため
に前処理を行うことが一般に行われている。圧延
油の除去のためには、トリクレン等の溶剤、界面
活性剤等による処理が用いられている。又清浄な
表面とするためには水酸化ナトリウム、水酸化カ
リウム等のアルカリ水溶液でエツチングする方法
が広く用いられている。
しかし本発明によれば、特に圧延油がはなはだ
しく多く付着する場合を除いて、機械的な粗面化
に先立つ前処理は省略することができる。
本発明の方法では、先に記したいずえの機械的
な粗面化方法を用いてもよい。
このような機械的に砂目立てされたアルミニウ
ム板は、次いで化学的にエツチング処理される。
この処理は、機械的砂目立ての際に食い込んだ研
磨剤、アルミニウム屑等を除き、その後に施され
る電気化学的粗面化を効果的に行なう為に行なわ
れるものであり、一般に酸又はアルカリ水溶液に
アルミニウム板を浸漬処理することにより行なわ
れる。
上記酸又はアルカリ水溶液の具体例としては例
えば弗酸、弗化ジルコン酸、りん酸、硫酸、塩
酸、硝酸などの酸及び水酸化ナトリウム、水酸化
カリウム、第三燐酸ナトリウム、アルミン酸ナト
リウム、けい酸ナトリウム、炭酸ナトリウムなど
のアルカリ水溶液が用いられる。これらの酸又は
アルカリ水溶液は夫々一種又は二種以上を混合し
て使用することができる。
本発明における該エツチング処理は好ましくは
2〜12g/m2の範囲でアルミニウムのエツチング
が行われるような条件でアルミニウム板を処理す
ることが望ましい。ブラシグレインされたアルミ
ニウム板の表面を上記の範囲内でエツチングを行
う事により本発明の目的とする平均粗さが大きく
かつ均一なミクロ形状の砂目を作成出来る。
アルカリの水溶液によりアルミニウム表面の化
学処理を行つた場合にはその表面に不溶解残渣即
ちスマツトが生成する。
このスマツトはりん酸、硝酸、クロム酸又はこ
れらの混合物により除去することができる。
本発明において、電気化学的に処理されるアル
ミニウム表面はスマツトのない清浄な面であるこ
とが望ましいが、たとえば電解液が酸でありデス
マツト作用をもつ場合等はこれを省くこともでき
る。
このように処理されたアルミニウム板には、引
続き前述の如く電気化学的な粗面化が行われる。
かくして得られたアルミニウム支持体の表面に
陽極酸化被膜を形成させることが好ましい。電解
液としては、硫酸以外に例えばりん酸、クロム
酸、蓚酸、スルフアミン酸、ベンゼンスルホン酸
等あるいはこれらの二種類以上を組み合せた水溶
液又は非水溶液中でアルミニウムを陽極として電
流を流すと、アルミニウム支持体表面に陽極酸化
被膜を形成させることができる。
陽極酸化の処理条件は使用される電解液によつ
て種々変化するので一概に決定され得ないが一般
的には電解液の濃度が1〜80重量%、液温5〜70
℃、電流密度0.5〜60アンペア/dm2、電圧1〜
100V、電解時間30秒〜50分の範囲が適当である。
さらに具体的には、下表の如き陽極酸化処理条件
が好ましい。In addition to some iron and titanium, these compositions also contain negligible amounts of other unlisted impurities. In a preferred embodiment of the present invention, the aluminum plate is first mechanically roughened, but prior to this, the aluminum plate is first roughened to remove rolling oil from the aluminum surface and to reveal a clean aluminum surface. It is common practice to carry out processing. In order to remove rolling oil, treatment with a solvent such as triclene, a surfactant, etc. is used. In order to obtain a clean surface, etching with an alkaline aqueous solution such as sodium hydroxide or potassium hydroxide is widely used. However, according to the present invention, pretreatment prior to mechanical surface roughening can be omitted, except in cases where a particularly large amount of rolling oil is attached. Any of the mechanical surface roughening methods described above may be used in the method of the present invention. Such mechanically grained aluminum plates are then chemically etched.
This treatment is performed to remove abrasives, aluminum chips, etc. that have become ingrained during mechanical graining, and to effectively perform the electrochemical roughening that is applied afterwards. This is done by immersing an aluminum plate in an aqueous solution. Specific examples of the acid or alkaline aqueous solution include acids such as hydrofluoric acid, fluorozirconic acid, phosphoric acid, sulfuric acid, hydrochloric acid, nitric acid, and sodium hydroxide, potassium hydroxide, sodium triphosphate, sodium aluminate, and silicic acid. An alkaline aqueous solution such as sodium or sodium carbonate is used. These acid or alkali aqueous solutions can be used alone or in combination of two or more. In the etching process of the present invention, it is preferable to process the aluminum plate under conditions such that aluminum is etched preferably in the range of 2 to 12 g/m 2 . By etching the surface of a brush-grained aluminum plate within the above-mentioned range, it is possible to create uniform microscopic grains with a large average roughness, which is the object of the present invention. When an aluminum surface is chemically treated with an aqueous alkali solution, an insoluble residue, ie, smut, is formed on the surface. This smut can be removed with phosphoric acid, nitric acid, chromic acid or mixtures thereof. In the present invention, it is desirable that the aluminum surface to be electrochemically treated be a clean surface without smut, but this may be omitted if, for example, the electrolyte is an acid and has a desmut action. The aluminum plate thus treated is subsequently subjected to electrochemical roughening as described above. It is preferable to form an anodic oxide film on the surface of the aluminum support thus obtained. As an electrolyte, in addition to sulfuric acid, for example, phosphoric acid, chromic acid, oxalic acid, sulfamic acid, benzenesulfonic acid, etc., or a combination of two or more of these acids can be used in an aqueous or non-aqueous solution, and when an electric current is passed using aluminum as an anode, aluminum supports An anodic oxide film can be formed on the body surface. The processing conditions for anodic oxidation vary depending on the electrolyte used, so they cannot be determined unconditionally, but in general, the concentration of the electrolyte is 1 to 80% by weight, and the temperature of the solution is 5 to 70%.
°C, current density 0.5~60 ampere/ dm2 , voltage 1~
A range of 100V and electrolysis time of 30 seconds to 50 minutes is appropriate.
More specifically, the anodizing treatment conditions as shown in the table below are preferable.
【表】
このようにして得られた支持体上に感光性物質
を塗布することによつて感光性平版印刷版を得る
ことができる。感光性物質は、露光の前後で現像
液に対する溶解性又は膨潤性が変化するものなら
ば使用できる。
好ましいものとしてはジアゾ化合物、例えばジ
アゾ樹脂とシエラツクとからなる感光性組成物
(特開昭47−34404号)、ポリ(ヒドロキシエチル
メタクリレート)とジアゾ樹脂からなる感光性組
成物、ジアゾ樹脂と可溶性ポリアマイド樹脂(米
国特許第3751257号)からなる感光性組成物など
と、アジド感光物とエポキシ樹脂からなる感光性
組成物(米国特許2852379号)、ポリビニールシン
ナメートで代表されるように分子中に不飽和二重
結合を有し、活性光線の照射により二重化反応を
起して不溶化する感光性樹脂、例えば英国特許第
843545号、同966297号、米国特許第2725372号の
各明細書等に記載されているポリビニルシンナメ
ートの誘導体、カナダ国特許第696997号明細書に
記載されているようなビスフエノールAとジバニ
ラールシクロヘキサノン、p−フエニレンジエト
キシアクリレートと1,4−ジ−β−ヒドロキシ
エトキシシクロヘキサノンとの縮合で形成された
感光性ポリエステル、米国特許第3462267号に記
載されているようなジアリルフタレートのプレポ
リマー等及び分子中に少なくとも2つの不飽和2
重結合を有し、活性光線の照射により重合反応を
引起すようなエチレン系不飽和化合物、例えば特
公昭35−8495号公報に記載されているようなポリ
オールの不飽和エステル例えばエチレンジ(メ
タ)アクリレート、ジエチレングリコールジ(メ
タ)アクリレート、グリセロールジ(メタ)アク
リレート、グリセロートリ(メタ)アクリレー
ト、エチレンジメタクリレート、1,3−プロピ
レンジ(メタ)アクリレート、1,4−シクロ−
ヘキサンジオール(メタ)アクリレート、1,4
−ベンゼンジオールジ(メタ)アクリレート、ペ
ンタエリスリトールテトラ(メタ)アクリレー
ト、1,3−プロピレングリコールジ(メタ)ア
クリレート、1,5−ペンタジオールジ(メタ)
アクリレート、ペンタエリストールトリ(メタ)
アクリレート、分子量50〜500のポリエチレング
リコールのビスアクリレート及びメタクリレー
ト、不飽和アミド特に、α−メチレンカルボン酸
のアミド及び特にα,ω−ジアミン及び酸素が中
間に存在するω−ジアミンのもの例えばメチレン
ビス(メタ)アクリルアミド及びジエチレントリ
アミントリ(メタ)アクリルアミド、ジビニルサ
クシネート、ジビニルアジペート、ジビニルフタ
レート、ジビニルテレフタレート、ジビニルベン
ゼン−1,3−ジスルホネート等の適当なバイン
ダー例えばポリビニルアルコール又はセルローズ
の誘導体で側鎖にカルボキシ基を含有するような
化合物例えばポリビニル水素フタレート、カルボ
キシメチルセルローズ、又はメチルメタクリレー
トとメタクリル酸の共重合体から成る感光性組成
物等が活性光線の作用により不溶性と成りネガテ
イブワーキング型の感光性組成物として有用であ
る。米国特許第3635709号、同3061430号、同
3061120号に記載されているようなものo−ジア
ゾオキサイド系の感光物、ジアゾ樹脂のリンタン
グステン酸塩(特公昭39−7663号)、ジアゾ樹脂
の黄血塩(米国特許第3113023号)及びジアゾ樹
脂とポリビニル水素フタレート(特公昭43−
23684号)等から成る感光性組成物がポジテイブ
ワーキング型の感光物として有用である。また米
国特許第3081168号、同3486903号、同3512971号、
同3615629号などの各明細書に記されているよう
な線状ポリアミド及び付加重合性不飽和結合を有
する単量体を含む感光性組成物も有用である。
必要に応じて塗布の前にアルミニウム板表面の
親水性を増加させるためシリケート類による表面
処理を行うこのが行なわれる。
好ましいシリケート類としては米国特許第
2714066号明細書に記載されたものから適宜選択
したものが用いられる。
以下に本発明による平版印刷版用支持体の製造
方法を実施例に基づいて更に詳細に説明する。な
お%は重量%を示すものとする。
実施例 1
純度99.5%のアルミニウムシートをパミストン
ー水懸濁液と回転するナイロンブラシローラーを
用いて、表面アラサRa=0.6ミクロンとなる様に
砂目立したのち、苛性ソーダ20%水溶液を用いて
アルミニウムの溶解量が8g/m2となるようにエ
ツチングした。流水で充分洗つたのち25%硝酸水
溶液で酸洗し、水洗した基板を用意した。この基
板を第3図に示す矩形波を用いた交番波形電流に
より下記第1表に示した条件で電解粗面化した。
引続き15%硫酸の50℃水溶液中に3分間浸漬して
表面を清浄化したのち20%硫酸水溶液中で直流に
より陽極酸化処理を行い2.4g/m2の酸化皮膜を
設けてサンプルA、B、C及びD作成した。この
ように作製したサンプルに下記の感光層を乾燥後
の塗布量が2.5g/m2となるように設けた。
ナフトキノン−1,2−ジアジド−5−スルホ
ニルクロライドとピロガロールアセント樹脂と
のエステル化合物(米国特許3635709号実施例
1に記載されているもの) 0.79g
クレゾールノボラツク樹脂 2.00g
オイルブルー#603(オリエント化学製) 0.04g
エチレンジクロライド 16g
2−メトキシエチルアセテート 12g
かくして得られた感光性平版印刷版を3kWの
メタルハライドランプ1mの距離から60秒間画像
露光し、SiO2/Na2Oのモル比が1.2でSiO2の含量
が1.5%の珪酸ナトリウム水溶液で現像した。こ
のようにして得られた平版印刷版を用いて常法の
手順に従つて印刷したところ下記第2表に示すよ
うに結果が得られた。この結果から、本発明の範
囲内で硫酸を添加した電解液を用いて製造した平
版印刷版は、硫酸無添加の場合および本発明の範
囲を超て硫酸を添加した場合に比べて、耐刷、汚
れにくさ共に優れた性能を有することが分る。[Table] A photosensitive lithographic printing plate can be obtained by coating a photosensitive substance on the support thus obtained. Any photosensitive substance can be used as long as its solubility or swelling ability in a developer changes before and after exposure. Preferred examples include diazo compounds, such as photosensitive compositions consisting of diazo resin and silica (Japanese Patent Application Laid-Open No. 47-34404), photosensitive compositions consisting of poly(hydroxyethyl methacrylate) and diazo resin, and diazo resin and soluble polyamide. Photosensitive compositions consisting of resin (US Pat. No. 3,751,257), photosensitive compositions consisting of azide photosensitive material and epoxy resin (US Pat. No. 2,852,379), and polyvinyl cinnamate, which contain inorganic compounds in the molecule. Photosensitive resins that have saturated double bonds and become insolubilized by a doubling reaction upon irradiation with actinic rays, such as British Patent No.
Derivatives of polyvinyl cinnamate described in specifications such as No. 843545, No. 966297, and U.S. Patent No. 2,725,372, bisphenol A and divanyl, as described in Canadian Patent No. 696,997. cyclohexanone, photosensitive polyesters formed by condensation of p-phenylene diethoxy acrylate and 1,4-di-β-hydroxyethoxycyclohexanone, prepolymers of diallyl phthalate as described in U.S. Pat. No. 3,462,267, etc. and at least two unsaturations in the molecule
Ethylenically unsaturated compounds that have a double bond and cause a polymerization reaction when irradiated with actinic rays, such as unsaturated esters of polyols such as those described in Japanese Patent Publication No. 35-8495, such as ethylene di(meth)acrylate , diethylene glycol di(meth)acrylate, glycerol di(meth)acrylate, glycerol tri(meth)acrylate, ethylene dimethacrylate, 1,3-propylene di(meth)acrylate, 1,4-cyclo-
Hexanediol (meth)acrylate, 1,4
-Benzenediol di(meth)acrylate, pentaerythritol tetra(meth)acrylate, 1,3-propylene glycol di(meth)acrylate, 1,5-pentadiol di(meth)acrylate
Acrylate, pentaerythritol tri(meth)
Acrylates, bisacrylates and methacrylates of polyethylene glycols with molecular weights from 50 to 500, unsaturated amides, especially amides of α-methylenecarboxylic acids and especially α,ω-diamines and ω-diamines with oxygen present in the middle, such as methylene bis(meth) ) acrylamide and diethylenetriamine tri(meth)acrylamide, divinyl succinate, divinyl adipate, divinyl phthalate, divinyl terephthalate, divinylbenzene-1,3-disulfonate, etc. with a suitable binder such as polyvinyl alcohol or a derivative of cellulose with a carboxy group in the side chain. For example, a photosensitive composition containing polyvinyl hydrogen phthalate, carboxymethyl cellulose, or a copolymer of methyl methacrylate and methacrylic acid becomes insoluble by the action of actinic rays and is used as a negative working type photosensitive composition. Useful. U.S. Patent No. 3635709, U.S. Patent No. 3061430, U.S. Pat.
3061120, o-diazooxide-based photosensitive materials, phosphotungstates of diazo resins (Japanese Patent Publication No. 39-7663), yellow blood salts of diazo resins (US Pat. No. 3,113,023), and diazo resins. Resin and polyvinyl hydrogen phthalate
No. 23684) and the like are useful as positive working type photosensitive materials. Also, U.S. Patent No. 3081168, U.S. Patent No. 3486903, U.S. Patent No. 3512971,
Also useful are photosensitive compositions containing a linear polyamide and a monomer having an addition polymerizable unsaturated bond, as described in various specifications such as No. 3,615,629. If necessary, a surface treatment with a silicate is carried out before coating to increase the hydrophilicity of the surface of the aluminum plate. Preferred silicates include those described in U.S. Patent No.
Those appropriately selected from those described in the specification of No. 2714066 are used. The method for producing a lithographic printing plate support according to the present invention will be explained in more detail below based on Examples. Note that % indicates weight %. Example 1 An aluminum sheet with a purity of 99.5% was grained using a pumice stone-water suspension and a rotating nylon brush roller so that the surface roughness Ra = 0.6 microns, and then the aluminum was grained using a 20% aqueous solution of caustic soda. Etching was performed so that the dissolved amount was 8 g/m 2 . After thoroughly washing with running water, the substrate was pickled with a 25% nitric acid aqueous solution, and a water-washed board was prepared. The surface of this substrate was electrolytically roughened using an alternating current waveform using a rectangular wave as shown in FIG. 3 under the conditions shown in Table 1 below.
Subsequently, the surface was cleaned by immersion in a 15% sulfuric acid aqueous solution at 50°C for 3 minutes, and then anodized by direct current in a 20% sulfuric acid aqueous solution to form an oxide film of 2.4 g/ m2 . C and D were created. The following photosensitive layer was provided on the sample prepared in this way so that the coating amount after drying was 2.5 g/m 2 . Ester compound of naphthoquinone-1,2-diazido-5-sulfonyl chloride and pyrogallol ascent resin (described in Example 1 of US Pat. No. 3,635,709) 0.79 g Cresol novolac resin 2.00 g Oil Blue #603 (Orient Chemical ) 0.04 g Ethylene dichloride 16 g 2-methoxyethyl acetate 12 g The photosensitive lithographic printing plate thus obtained was exposed imagewise for 60 seconds from a 3 kW metal halide lamp at a distance of 1 m, and the SiO 2 /Na 2 O molar ratio was 1.2. 2 was developed with an aqueous sodium silicate solution containing 1.5%. When the lithographic printing plate thus obtained was used for printing according to a conventional procedure, the results shown in Table 2 below were obtained. From these results, it was found that lithographic printing plates produced using an electrolyte to which sulfuric acid was added within the scope of the present invention had a longer printing life than those without sulfuric acid and when sulfuric acid was added beyond the scope of the present invention. It can be seen that it has excellent performance in terms of resistance to staining.
【表】【table】
【表】
実施例 2
JISA1050アルミニウムシートに平均粒径100ミ
クロンのパミストン−水懸濁液を50Kg/cm2の圧力
でノズルから吐出している水に合流させアルミニ
ウム表面へ衡突させて粗面化を行いアルミニウム
板の表面全体にわたつてRa=0.5ミクロンの砂目
を作製した。この表面をエツチング量が5g/m2
となるように苛性ソーダ20%水溶液を用いてエツ
チングした。水溶液を用いてエツチングした。水
洗後20%硝酸水溶液中で酸洗し、水洗した基板を
用意した。この基板を第3図及び第4図に各々示
した矩形波交番波形電流及び正弦波交番波形電流
により下記第3表に示した条件で電解粗面化し
た。水洗ののち、15%硫酸の50℃水溶液中に浸漬
して表面を清浄化した。しかるのち20%硫酸水溶
液中で直流により陽極酸化処理を行い1.8g/m2
の酸化皮膜を設けた。次いで1%の珪酸ナトリウ
ム水溶液に70℃で1分浸漬し、水洗乾燥した。こ
のようにして電解粗面化の条件のみが異なつて調
製されたサンプルE、F、G及びHを作成した。
サンプルE、Fの粗面化表面のSEMを各々第7
A図、第7B図に示す。このように作製したサン
プルに下記組成の感光液を乾燥時の重量が2.0
g/m2となるように塗布を行つた。
感光液
N−(4−ヒドロシキフエニル)メタクリルア
ミド/2−ヒドロキシエチルメタクリレート/
アクリロニトリル/メチルメタクリレート/メ
タクリル酸(=15:10:30:38:7モル比)共
重合体(平均分子量60000) 5.0g
4−ジアゾジフエニルアミンとホルムアルデヒ
ドの縮合物の六弗化燐酸塩 0.5g
亜リン酸 0.05g
ビクトリアピユアーブルーBOH(保土ケ谷化学
(株)社製) 0.1g
2−メトキシエタノール 100g
このようにして作られた感光性平版印刷版を、
真空焼枠中で透明ネガテイブフイルムを通して、
1mの距離から富士フイルムPSライト(東芝メ
タルハライドランプ、MU2000−2−DL型3kW
の光源を有し、富士写真フイルム(株)より販売され
ているもの)により50秒間露光を行なつたのち、
下記組成の現像液で現像し、アラビアガム水溶液
でガム引きして平版印刷版とした。
現像液
亜硫酸ナトリウム 5g
ベンジルアルコール 30g
炭酸ナトリウム 5g
イソプロピルナフタレンスルホン酸ナトリウム
12g
純 水 1000g
このようにして得られた平版印刷を用いて常法
の手順に従つて印刷したところ下記第4表に示す
ように結果がえられた。
この結果から、本発明の範囲内で硫酸を添加し
た電解液を用いて製造した平版印刷版は、本発明
の範囲外の電解液を用いた場合に比べて、耐刷、
汚れにくさ共に良好な性能を有すること、特に矩
形波交番波形電流を用いた場合に優れた印刷性能
が得られることが分る。[Table] Example 2 A pumice stone-water suspension with an average particle size of 100 microns was mixed with water being discharged from a nozzle at a pressure of 50 kg/cm 2 on a JISA1050 aluminum sheet, and the surface was roughened by colliding with the aluminum surface. A grain of Ra = 0.5 micron was created over the entire surface of the aluminum plate. The amount of etching on this surface is 5g/m 2
It was etched using a 20% aqueous solution of caustic soda so that Etching was performed using an aqueous solution. After washing with water, the substrate was pickled in a 20% nitric acid aqueous solution and washed with water to prepare a substrate. The surface of this substrate was electrolytically roughened using a rectangular alternating waveform current and a sinusoidal alternating waveform current shown in FIGS. 3 and 4, respectively, under the conditions shown in Table 3 below. After washing with water, the surface was cleaned by immersing it in an aqueous solution of 15% sulfuric acid at 50°C. Afterwards, it was anodized by direct current in a 20% sulfuric acid aqueous solution to give a yield of 1.8 g/ m2.
An oxide film was provided. Next, it was immersed in a 1% aqueous sodium silicate solution at 70°C for 1 minute, washed with water, and dried. In this way, samples E, F, G, and H were prepared with only the electrolytic surface roughening conditions different.
SEM images of the roughened surfaces of Samples E and F were
This is shown in Figure A and Figure 7B. A photosensitive solution with the following composition was applied to the sample prepared in this way so that the dry weight was 2.0.
The coating was carried out so that the amount was 1.2 g/m 2 . Photosensitive liquid N-(4-hydroxyphenyl)methacrylamide/2-hydroxyethyl methacrylate/
Acrylonitrile/methyl methacrylate/methacrylic acid (=15:10:30:38:7 molar ratio) copolymer (average molecular weight 60,000) 5.0g Hexafluorophosphate of condensate of 4-diazodiphenylamine and formaldehyde 0.5g Phosphorous acid 0.05g Victoria Pure Blue BOH (Hodogaya Chemical
Co., Ltd.) 0.1g 2-methoxyethanol 100g The photosensitive lithographic printing plate made in this way,
Pass a transparent negative film through a vacuum printing frame,
Fujifilm PS light (Toshiba metal halide lamp, MU2000-2-DL type 3kW) from a distance of 1m
After exposure for 50 seconds using a light source (available from Fuji Photo Film Co., Ltd.),
It was developed with a developer having the composition shown below, and gummed with an aqueous gum arabic solution to prepare a lithographic printing plate. Developer Sodium sulfite 5g Benzyl alcohol 30g Sodium carbonate 5g Sodium isopropylnaphthalene sulfonate
12 g Pure water 1000 g When the lithographic printing thus obtained was used for printing according to a conventional procedure, the results shown in Table 4 below were obtained. From this result, it can be seen that the lithographic printing plate manufactured using the electrolyte to which sulfuric acid is added within the scope of the present invention has a longer printing life than the plate manufactured using the electrolyte that is outside the scope of the present invention.
It can be seen that it has good performance in terms of resistance to staining, and in particular, excellent printing performance can be obtained when a rectangular alternating waveform current is used.
【表】【table】
【表】
実施例 3
第1図のA点に対応する電解条件で硫酸を
10ppmまたは500ppm添加し、あらかじめ実施例
1に記載した如き前処理を施した純度99.5%のア
ルミニウムシートを矩形波を用いた交番波形電流
により下記第5表に示した条件で電解粗面化し
た。引続き15%硫酸の50℃水溶液中に3分間浸漬
して表面を清浄化したのち20%硫酸水溶液中で直
流により陽極酸化処理を行い1.8g/m2の酸化皮
膜を設けてサンプルI及びJを作成した。このよ
うに作製したサンプルに実施例1に記載した如く
感光層を設け、露光、現像を行なつた。このよう
にして得られら平版印刷版を用いて常法の手順に
従がつて印刷したところ下記第6表に示す結果が
得られた。
この結果から、本発明の範囲中で硫酸を添加し
た電解液を用いて製造した平版印刷版は、本発明
の範囲外の電解液を用いた場合に比べて、耐刷、
汚れにくさ共に良好な性能を有することが分る。[Table] Example 3 Sulfuric acid was added under the electrolytic conditions corresponding to point A in Figure 1.
A 99.5% pure aluminum sheet containing 10 ppm or 500 ppm and pre-treated as described in Example 1 was electrolytically roughened using an alternating waveform current using a square wave under the conditions shown in Table 5 below. Subsequently, the surfaces were cleaned by immersion in a 15% sulfuric acid aqueous solution at 50°C for 3 minutes, and then anodized by direct current in a 20% sulfuric acid aqueous solution to form an oxide film of 1.8 g/m 2 . Created. A photosensitive layer was provided on the sample thus prepared as described in Example 1, and the sample was exposed and developed. When the thus obtained lithographic printing plates were used for printing according to conventional procedures, the results shown in Table 6 below were obtained. From these results, it can be seen that the lithographic printing plate manufactured using the electrolyte to which sulfuric acid is added within the scope of the present invention has a longer printing life than the case where the electrolyte solution outside the scope of the present invention is used.
It can be seen that it has good performance in terms of resistance to staining.
【表】【table】
第1図は硝酸電解液における電気量と反射濃度
の関係を示した図である。第2図は電気量を一定
にして硫酸添加量を変化させた場合の反射濃度の
変化を示した図である。第3図は非対称交番波形
電流として得られる電流の電圧波形図である。第
4図は正弦波交番波形電流として得られる電流の
電圧波形図である。第5A図、第5B図、第5C
図は硝酸電解液を用い電気量を変化させて得られ
たサンプルの電子顕微鏡写真である。第6A図、
第6B図、第6C図、第6D図は硫酸の添加量を
変化させて得られたサンプルの電子顕微鏡写真で
ある。第7A図、第7B図、第8A図は電解粗面
化の条件を変化させて得られた別のサンプルの電
子顕微鏡写真である。
FIG. 1 is a diagram showing the relationship between the amount of electricity and the reflection concentration in a nitric acid electrolyte. FIG. 2 is a diagram showing changes in reflection density when the amount of electricity is kept constant and the amount of sulfuric acid added is varied. FIG. 3 is a voltage waveform diagram of a current obtained as an asymmetrical alternating waveform current. FIG. 4 is a voltage waveform diagram of a current obtained as a sinusoidal alternating waveform current. Figure 5A, Figure 5B, Figure 5C
The figure is an electron micrograph of a sample obtained by varying the amount of electricity using a nitric acid electrolyte. Figure 6A,
Figures 6B, 6C, and 6D are electron micrographs of samples obtained by varying the amount of sulfuric acid added. FIGS. 7A, 7B, and 8A are electron micrographs of other samples obtained by changing the electrolytic roughening conditions.
Claims (1)
硝酸、50〜4000ppmの硫酸根およびその他不可避
の不純物を含有する電解液により電気化学的に粗
面化することを特徴とする平版印刷版用支持体の
製造方法。 2 該電解粗面化を非対称交番波形電流を用いて
陽極時電気量に対する陰極時電気量の比が0.4〜
1.25となる範囲で行なう事を特徴とする特許請求
の範囲第1項記載の平版印刷版用支持体の製造方
法。 3 アルミニウム板の表面を1000〜40000ppmの
硝酸、50〜4000ppmの硫酸根およびその他の不可
避な不純物を含有する電解液により電気化学的に
粗面化したのち、陽極酸化することを特徴とする
平版印刷版用支持体の製造方法。 4 アルミニウム板の表面を、順に機械的に粗面
化し、アルミニウムの溶解量が2〜12g/m2の範
囲で化学的にエツチングし、かつ1000〜
40000ppmの硝酸、50〜4000ppmの硫酸根および
その他不可避の不純物を含有する電解液により電
気化学的に粗面化することを特徴とする平版印刷
用支持体の製造方法。[Claims] 1. Lithographic printing characterized by electrochemically roughening the surface of an aluminum plate with an electrolytic solution containing 1,000 to 40,000 ppm of nitric acid, 50 to 4,000 ppm of sulfuric acid, and other unavoidable impurities. Method for manufacturing plate support. 2 The electrolytic surface roughening is performed using an asymmetrical alternating waveform current until the ratio of the amount of electricity at the cathode to the amount of electricity at the anode is 0.4 to 0.4.
1.25. 1.25. 3 Lithographic printing characterized by electrochemically roughening the surface of an aluminum plate with an electrolytic solution containing 1000 to 40000 ppm nitric acid, 50 to 4000 ppm sulfuric acid, and other unavoidable impurities, and then anodizing the surface. Method for manufacturing plate support. 4. The surface of the aluminum plate is sequentially mechanically roughened, chemically etched so that the dissolved amount of aluminum is in the range of 2 to 12 g/ m2 , and
A method for producing a lithographic printing support, which comprises electrochemically roughening the surface using an electrolytic solution containing 40,000 ppm of nitric acid, 50 to 4,000 ppm of sulfuric acid radicals, and other unavoidable impurities.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58130440A JPS6021298A (en) | 1983-07-18 | 1983-07-18 | Preparation of support for planographic printing plate |
| US06/632,148 US4545866A (en) | 1983-07-18 | 1984-07-18 | Process for producing support for planographic printing |
| DE8484108505T DE3460768D1 (en) | 1983-07-18 | 1984-07-18 | Process for producing support for planographic printing |
| EP84108505A EP0132787B1 (en) | 1983-07-18 | 1984-07-18 | Process for producing support for planographic printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58130440A JPS6021298A (en) | 1983-07-18 | 1983-07-18 | Preparation of support for planographic printing plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6021298A JPS6021298A (en) | 1985-02-02 |
| JPH0346316B2 true JPH0346316B2 (en) | 1991-07-15 |
Family
ID=15034290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58130440A Granted JPS6021298A (en) | 1983-07-18 | 1983-07-18 | Preparation of support for planographic printing plate |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4545866A (en) |
| EP (1) | EP0132787B1 (en) |
| JP (1) | JPS6021298A (en) |
| DE (1) | DE3460768D1 (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3717654A1 (en) * | 1987-05-26 | 1988-12-08 | Hoechst Ag | METHOD FOR ELECTROCHEMICALLY Roughening ALUMINUM FOR PRINTING PLATE CARRIERS |
| JPH0729507B2 (en) * | 1987-10-30 | 1995-04-05 | 富士写真フイルム株式会社 | Method for producing aluminum support for printing plate |
| JP3342776B2 (en) * | 1994-08-30 | 2002-11-11 | 富士写真フイルム株式会社 | Aluminum support for lithographic printing plate, method for producing the same, and method for roughening aluminum support |
| US6344131B1 (en) | 1994-08-30 | 2002-02-05 | Fuji Photo Film Co., Ltd. | Method of producing aluminum support for planographic printing plate |
| GB0500407D0 (en) * | 2005-01-10 | 2005-02-16 | Short Brothers Plc | Anodising aluminium alloy |
| JP2007090442A (en) * | 2005-09-26 | 2007-04-12 | Fujifilm Corp | Cutting blade |
| DE602006003856D1 (en) * | 2006-02-28 | 2009-01-08 | Agfa Graphics Nv | Method for producing a lithographic printing plate support |
| BRPI0709691A2 (en) * | 2006-03-31 | 2011-07-19 | Alcoa Inc | lithographic sheet |
| US20110114502A1 (en) * | 2009-12-21 | 2011-05-19 | Emily Barton Cole | Reducing carbon dioxide to products |
| US8845877B2 (en) | 2010-03-19 | 2014-09-30 | Liquid Light, Inc. | Heterocycle catalyzed electrochemical process |
| US8721866B2 (en) | 2010-03-19 | 2014-05-13 | Liquid Light, Inc. | Electrochemical production of synthesis gas from carbon dioxide |
| US8568581B2 (en) | 2010-11-30 | 2013-10-29 | Liquid Light, Inc. | Heterocycle catalyzed carbonylation and hydroformylation with carbon dioxide |
| US10329676B2 (en) | 2012-07-26 | 2019-06-25 | Avantium Knowledge Centre B.V. | Method and system for electrochemical reduction of carbon dioxide employing a gas diffusion electrode |
| US8858777B2 (en) | 2012-07-26 | 2014-10-14 | Liquid Light, Inc. | Process and high surface area electrodes for the electrochemical reduction of carbon dioxide |
| US9873951B2 (en) | 2012-09-14 | 2018-01-23 | Avantium Knowledge Centre B.V. | High pressure electrochemical cell and process for the electrochemical reduction of carbon dioxide |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1376366A (en) * | 1917-12-24 | 1921-04-26 | Gotthold E Wertheimer | Solution or bath for use in electrically preparing stencil-plates, die-plates, and the like |
| US3935080A (en) * | 1974-10-02 | 1976-01-27 | Polychrome Corporation | Method of producing an aluminum base sheet for a printing plate |
| DE2811396A1 (en) * | 1978-03-16 | 1979-09-27 | Hoechst Ag | PROCESS FOR THE ANODIC OXIDATION OF ALUMINUM AND ITS USE AS PRINTING PLATE SUPPORT MATERIAL |
| US4242417A (en) * | 1979-08-24 | 1980-12-30 | Polychrome Corporation | Lithographic substrates |
| US4427506A (en) * | 1982-09-24 | 1984-01-24 | Sprague Electric Company | AC Etching of aluminum capacitor foil |
-
1983
- 1983-07-18 JP JP58130440A patent/JPS6021298A/en active Granted
-
1984
- 1984-07-18 US US06/632,148 patent/US4545866A/en not_active Expired - Lifetime
- 1984-07-18 EP EP84108505A patent/EP0132787B1/en not_active Expired
- 1984-07-18 DE DE8484108505T patent/DE3460768D1/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE3460768D1 (en) | 1986-10-23 |
| US4545866A (en) | 1985-10-08 |
| EP0132787B1 (en) | 1986-09-17 |
| EP0132787A1 (en) | 1985-02-13 |
| JPS6021298A (en) | 1985-02-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0565360B2 (en) | ||
| US4824757A (en) | Process for preparing positive-acting photosensitive lithographic aluminum printing plate precursor using nitric acid electrokyte for graining | |
| JPH0346316B2 (en) | ||
| US4576686A (en) | Process for producing aluminum support for lithographic printing plates | |
| JPH01306288A (en) | Support for planographic plate | |
| JPH0147544B2 (en) | ||
| US4833065A (en) | Process for producing support for presensitized lithographic printing plate using alkaline electrolyte | |
| JPH028918B2 (en) | ||
| JPS6330294A (en) | Aluminum alloy support for planographic printing plate and its preparation | |
| JPH0472719B2 (en) | ||
| JPH03104694A (en) | Manufacture of support for photosensitive lithography | |
| JPH01178496A (en) | Production of plate base for lithography | |
| JP3068309B2 (en) | Method for producing aluminum support for lithographic printing plate | |
| JPS608091A (en) | Manufacture of negative type photosensitive sheet printing plate | |
| JPS6387288A (en) | Production of base for planographic plate | |
| US4678551A (en) | Process for producing an aluminum support for a lithographic printing plate | |
| JPS6151396A (en) | Preparation of support for planographic printing plate | |
| JPH0565359B2 (en) | ||
| JP3867420B2 (en) | Lithographic printing plate support and method for producing the same | |
| JPH01237197A (en) | Production of planographic support | |
| JPH08132749A (en) | Photosensitive lithographic printing plate | |
| JPS6228293A (en) | Manufacture of base for planographic plate | |
| JPH0347194B2 (en) | ||
| JPH0467517B2 (en) | ||
| JPH0347195B2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |