JPH0349866B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a film carrier conveying and holding device for conveying and fixedly holding a film carrier in a film carrier bonding apparatus.

2. Description of the Related Art A conventional method for transporting a film carrier and holding the film carrier at a working position in a film carrier bonding apparatus has a specific structure as shown in FIGS. 4 and 5. 1 is a film carrier, and 2 is a supply reel that winds up the supplied film carrier 1. Reference numeral 3 denotes a take-up reel for winding up the film carrier 1 after bonding. Reference numeral 4 denotes a feed sprocket that engages with perforation holes 5 provided at a constant pitch on both edges of the film carrier 1 so as to intermittently feed the film carrier 1 in the direction of arrow A by a predetermined pitch. A motor 6 is connected to the feed sprocket 4 and rotates the feed sprocket 4 by a predetermined angle in the direction of arrow B. 7 is a tension sprocket that engages with the perforation holes 5 on both edges of the film carrier 1; 8 is a torque motor that always applies a constant tension to the film carrier 1 in the direction opposite to the feeding direction of arrow A; It is connected to the tension sprocket 7 and generates rotational force in the direction of arrow C. 9 and 10 are idler rollers.

A guide 11 supports the film carrier 1 in a working position between the feed sprocket 4 and the tension sprocket 7. A positioning pawl 12 is biased by an elastic body 13, has a wedge-shaped tip 14, and circumscribes the perforation hole 5a to position the film carrier 1 after intermittent feeding. During intermittent feeding of the film carrier 1, the inclined surface 15 of the wedge-shaped tip 14 allows the positioning claw 1 to
2 runs away in the direction of arrow D. Reference numeral 16 denotes a heat tool, which moves up and down in the direction of arrow E to perform a bonding operation. 17 is a semiconductor element, and arrow F of 18
It is held on a stage that moves up and down in the direction.

However, in the above configuration, as shown in FIG. 6, since the holding force of the film carrier 1 is small at the time when the fingers 20 of the film carrier 1 are bonded, the fingers 20 and the bumps 19 on the top of the semiconductor element 17 are However, there is a high possibility that the finger 20 will also come into contact with the bump 19a of the adjacent semiconductor element 17a. Further, as shown in FIG. 7, there is a drawback that bonding may be performed with the finger 20 in contact with the edge portion 21 of the semiconductor element 17.

In view of the above-mentioned drawbacks, a film carrier conveying and holding device was proposed in 1983, which fixedly holds the film carriers at the front and rear of the working position after the film carrier is fed with a constant tension applied to the film carrier. Publication No. 132856 (Special application 1982-
240239).

This film carrier transport and holding device consists of a sprocket for transporting the film carrier, its drive motor,
It consists of a sprocket that applies tension to the film carrier, a drive motor thereof, a positioning pawl that positions the film carrier, a guide part that supports the film carrier before and after the working position, and a fixture that holds the film carrier fixedly.

An example thereof will be described below based on the drawings of FIGS. 8 to 10.

In the figure, 1 is a film carrier, and 2 is a supply reel that winds up the supplied film carrier 1. Reference numeral 3 denotes a take-up reel for winding up the film carrier 1 after bonding.
4 moves the film carrier 1 at a predetermined pitch by arrow A.
Film carrier 1 is moved intermittently in the
This is a feed sprocket that engages with perforation holes 5 provided at a constant pitch on both edges of the feed sprocket.
A motor 6 is connected to the feed sprocket 4 and rotates the feed sprocket 4 by a predetermined angle in the direction of arrow B. 7 is a tension sprocket that engages with perforation holes 5 on both edges of the film carrier 1, and 8 is a torque motor that always applies a constant tension to the film carrier 1 in the opposite direction to the feeding direction A. , tension sprocket 7
is connected to generate rotational force in the direction of arrow C.

9 and 10 are idler rollers. 11 is feed sprocket 4 and tension sprocket 7
This is a guide that supports the film carrier 1 in the working position between. 12 is biased by an elastic body 13 and has a wedge-shaped tip and a perforation hole 5.
This is a positioning claw that positions the film carrier 1 after intermittent feeding by circumscribing the film carrier 1. 16
is a heat tool, which moves up and down in the direction of arrow E to perform bonding operations. 17 is a semiconductor element, which is held on a stage 18 that moves up and down in the direction of arrow F. 22 and 22a are cylinder bodies, and 23 and 23a are film carriers 1.
It is a fixture that holds the

The operation of the film carrier conveying and holding device constructed as described above will be explained below.

The film carrier 1, to which a constant tension is applied in the direction of arrow C via the tension sprocket 7, is fed at a constant pitch in the direction of arrow A by the feed sprocket 4, and the film carrier 1 is applied with a constant tension using the positioning pawl 12 as a reference. is positioned. Thereafter, the cylinders 22, 22a simultaneously move in the direction of arrow G, and the film carrier 1 is sandwiched and fixed between the guide 11 and the bottom surfaces 24, 24a of the fixtures 23, 23a. Heat tool 16 in fixed state
descends and performs the bonding operation. After the bonding is completed, the fixtures 23, 23a return in the direction of arrow H, the fixation of the film carrier 1 is released, and the next feeding operation of the film carrier 1 is performed.

According to this device, since the film carrier 1 is fixed by the fixtures 23 and 23a, there is little deflection during bonding, and the heat tool 16
When the finger 20 is lowered, the finger 20 is automatically formed by a forming amount such that it does not come into contact with the bump 19a on the upper surface of the adjacent semiconductor element 17a or the edge portion 21.

Problems to be Solved by the Invention However, in the device shown in FIG.
Since the position where the film carrier 1 is sandwiched and fixed by 3 and 23a is far away from the bonding position, and because both edges of the film carrier 1 are fixed, the film carrier 1 may bend more than necessary during bonding. Problems arise in that the finger 20 comes into contact with the edge portion 21, or in worse cases, the finger 20 comes into contact with the bump 19a of the adjacent semiconductor element 17a.

In view of the above-mentioned problems, the present invention provides a vacuum suction hole in the guide part that guides the film carrier at the bonding work position, so that the front and back of the film carrier where the bonding work is being performed are sucked and lifted upward. To provide a film carrier conveying and holding device in which fingers do not come into contact with edge portions or the like.

Means for Solving the Problems The film carrier conveying and holding device according to the present invention comprises a sprocket for feeding the film carrier and its drive motor, a sprocket for applying tension to the film carrier and its drive motor, and a positioning pawl for positioning the film carrier. and a guide part for supporting the film carrier before and after the working position, vacuum suction holes are provided in the guide part, and both the front and rear of the bonding position of the film carrier where the bonding work is performed are suctioned and held by the vacuum suction hole. That is.

Effects According to the apparatus of the present invention, the front and rear of the film carrier on which bonding work is performed are sucked by the vacuum suction holes and lifted upward, so that the film carrier is not affected by the pressure of the heat tool during bonding. Not only is the position of the film carrier maintained, but also the fingers are molded simultaneously during bonding, which eliminates contact of the fingers with anything other than the bonding bumps, greatly improving the reliability of bonding.

Embodiment An embodiment of the present invention will be described below with reference to FIGS. 1 to 3. In FIG. 1, a film carrier 1, a supply reel 2, a take-up reel 3, a feed sprocket 4, a motor 6, a tension sprocket 7, a torque motor 8, and idle rollers 9 and 1 are shown.
0, positioning claw 12, elastic body 13, heat tool 16, stage 18, cylinder body 22, 22
a, the fixtures 23, 23a are the same as in FIG. Here, guide 11, heat tool 1
Vacuum suction holes 24, 24a are provided on both sides of the hole 25 through which the vacuum suction holes 24, 24a pass. Vacuum suction hole 24,
One end of the film carrier 24a is opened at a position close to the hole 25, and is located at a position approximately at the center of the film carrier 1 in the width direction, before and after the position where the semiconductor element 17 of the film carrier 1 shown in FIG. 2 is bonded. It is designed to adsorb A and A'. The opening at the other end of the vacuum suction hole 24, 24a is a joint portion 26, 2 to which a hose (not shown) is detachably connected.
It is set as 6a. A vacuum suction source is connected to the other end of the hose.

The operation of the film carrier conveying and holding device constructed as described above will be explained below.

The film carrier 1, to which a constant tension is applied in the direction of arrow C via the tension sprocket 7, is fed at a constant pitch in the direction of arrow A by the feed sprocket 4, and the film carrier 1 is applied with a constant tension using the positioning pawl 12 as a reference. is positioned. Thereafter, the cylinders 22, 22a simultaneously move in the direction of arrow G, and the bottom surfaces 24, 24a of the fixtures 23, 23a
The film carrier 1 is sandwiched and fixed by the guides 11 and 11. At the same time, the vacuum suction source operates to suction and hold positions A and A' of the film carrier 1 before and after the bonding position of the semiconductor element 17 through the hose and the vacuum suction holes 24 and 24a in this order.

With the film carrier 1 fixed in this manner, the heat tool 16 descends to perform the bonding operation. After bonding is completed, fixing tool 2
3 and 23a return in the direction of arrow H, the vacuum suction is also released, and the fixation of the film carrier 1 is released.
Then, the next feeding operation of the film carrier 1 is performed.

FIG. 3 shows the state during bonding using the apparatus of the present invention. Since the film carrier 1 is fixed by fixtures 23 and 23a and vacuum suctioned, there is little deflection during bonding. When the heat tool 16 is lowered, the finger 20 is automatically formed by a forming amount Z. Therefore, adjacent semiconductor elements 17a
There is also no contact between the finger 20 and the bump 19a on the top surface. Furthermore, contact between the edge portion 21 and the finger 20 during bonding cannot occur.

Further, vacuum suction holes 24 and 2 are provided in the guide portion 11.
4a, even if it is formed near the hole 25, it will not interfere with the installation location and operation of the heat tool 16 and other members. In addition, in the above embodiment, the fixtures 23, 23
A and vacuum suction were used together, but the fixtures 23, 23a
is not necessarily necessary.

Effects of the Invention As described above, the present invention positions the film carrier for transport while applying a constant tension, and then holds the film carrier at the front and back of the bonding position where the bonding operation is performed by vacuum suction. Not only is the position of the film carrier maintained unaffected by the pressure of the heat tool during bonding, but the fingers are simultaneously molded during bonding, eliminating contact between the fingers and areas other than the bonding bumps, increasing the reliability of bonding. This will produce significant practical effects such as significant improvements.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram of a film carrier conveying and holding device according to an embodiment of the present invention, FIG. 2 is a plan view of the film carrier, FIG. 3 is a sectional view of the bonding part in the present invention, and FIG. 4 is a conventional An explanatory diagram of the film carrier conveying and holding device, No. 5 is a sectional view of the positioning claw portion, FIGS. 6 and 7 are sectional views for explaining the problems of the conventional position, and FIG. 8 is the device of FIG. 4. An explanatory view of a film carrier conveying and holding device proposed prior to the present invention in order to solve the problems, FIGS. FIG. 2 is a front sectional view and a side sectional view of the fixing device in a fixed state. 1... Film carrier, 2... Feed sprocket, 7... Tension sprocket, 11...
Guide, 12... Positioning claw, 16... Heat tool, 24, 24a... Vacuum suction hole.

Claims (1)

[Scope of Claims] 1. A feed sprocket that engages with perforation holes provided at a constant pitch on both edges of the film carrier, a motor connected to the feed sprocket and rotated by a predetermined angle, and a working position as described above. a tension sprocket located on the opposite side of the feed sprocket and engaged with the perforation hole; a motor connected to the tension sprocket and applying a constant tension in a direction opposite to the direction in which the film carrier is fed; A positioning pawl located between the tension sprockets and circumscribing the perforation hole of the film carrier by being biased by an elastic body, and a guide portion for guiding the film carrier at the working position, A film carrier conveying and holding device is provided with a vacuum suction hole, and the film carrier is suctioned and held at both the front and rear of the working position by the vacuum suction hole. 2. The film carrier conveying and holding device according to claim 1, wherein the vacuum suction hole is arranged to suction and hold the film carrier by applying the vacuum suction hole to a substantially central portion of the film carrier in a direction perpendicular to the feeding direction.