JPH0353995B2 - - Google Patents
Info
- Publication number
- JPH0353995B2 JPH0353995B2 JP57199485A JP19948582A JPH0353995B2 JP H0353995 B2 JPH0353995 B2 JP H0353995B2 JP 57199485 A JP57199485 A JP 57199485A JP 19948582 A JP19948582 A JP 19948582A JP H0353995 B2 JPH0353995 B2 JP H0353995B2
- Authority
- JP
- Japan
- Prior art keywords
- frequency
- circuit
- ultrasonic
- voltage
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001514 detection method Methods 0.000 claims description 23
- 238000003754 machining Methods 0.000 description 11
- 230000010355 oscillation Effects 0.000 description 11
- 230000003321 amplification Effects 0.000 description 10
- 238000003199 nucleic acid amplification method Methods 0.000 description 10
- 230000007423 decrease Effects 0.000 description 5
- 239000012530 fluid Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/56—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
- B29C65/60—Riveting or staking
- B29C65/606—Riveting or staking the rivets being integral with one of the parts to be joined, i.e. staking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
- B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
- B29C65/7805—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features
- B29C65/7814—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of inter-cooperating positioning features, e.g. tenons and mortises
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
- B29C66/21—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being formed by a single dot or dash or by several dots or dashes, i.e. spot joining or spot welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
- B29C66/472—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
- B29C66/824—Actuating mechanisms
- B29C66/8242—Pneumatic or hydraulic drives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
- B29C66/8322—Joining or pressing tools reciprocating along one axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/84—Specific machine types or machines suitable for specific applications
- B29C66/847—Drilling standard machine type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
- B29C66/924—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools
- B29C66/9261—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the displacement of the joining tools
- B29C66/92651—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the displacement of the joining tools by using stops
- B29C66/92653—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the displacement of the joining tools by using stops said stops being adjustable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/95—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94
- B29C66/951—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94 by measuring or controlling the vibration frequency and/or the vibration amplitude of vibrating joining tools, e.g. of ultrasonic welding tools
- B29C66/9511—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94 by measuring or controlling the vibration frequency and/or the vibration amplitude of vibrating joining tools, e.g. of ultrasonic welding tools by measuring their vibration frequency
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/95—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94
- B29C66/951—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94 by measuring or controlling the vibration frequency and/or the vibration amplitude of vibrating joining tools, e.g. of ultrasonic welding tools
- B29C66/9512—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94 by measuring or controlling the vibration frequency and/or the vibration amplitude of vibrating joining tools, e.g. of ultrasonic welding tools by controlling their vibration frequency
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
- B29C66/924—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools
- B29C66/9261—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the displacement of the joining tools
- B29C66/92611—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the displacement of the joining tools by controlling or regulating the gap between the joining tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Description
【発明の詳細な説明】
技術分野
この発明は、いわゆる超音波ウエルダー、超音
波溶着機等の超音波加工機のための超音波振動素
子を超音波振動させる超音波振動素子駆動装置に
関する。DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to an ultrasonic vibrating element drive device for ultrasonically vibrating an ultrasonic vibrating element for an ultrasonic processing machine such as a so-called ultrasonic welder or an ultrasonic welding machine.
従来技術
従来の超音波振動素子駆動装置においては、超
音波振動素子に設けられた加工用ホーンにひび割
れが生ずるとか、加工用ホーンが交換された時に
は、超音波振動素子が基本周波数以外の異なる周
波数にて振動されるようになり、例えば被加工物
であるプラスチツクの溶着不良を生ずる等の問題
点があつた。Prior Art In conventional ultrasonic vibrating element drive devices, if a crack occurs in the machining horn provided on the ultrasonic vibrating element, or when the machining horn is replaced, the ultrasonic vibrating element may change to a different frequency other than the fundamental frequency. This caused problems such as poor welding of the plastic workpiece.
目 的
この発明の目的は、上記問題点を解決するため
に為されたものであつて、基本周波数以外の異な
る周波数にて超音波振動素子が振動された場合、
その異なる振動周波数による超音波振動素子の振
動を防止して、基本周波数による振動に自動的に
移行するようにし、被加工物の溶着不良を防止し
得る超音波振動素子駆動装置を提供することにあ
る。Purpose The purpose of the present invention is to solve the above problems, and when an ultrasonic vibrating element is vibrated at a frequency different from the fundamental frequency,
To provide an ultrasonic vibrating element drive device that prevents vibration of an ultrasonic vibrating element due to the different vibration frequencies and automatically shifts to vibration at the fundamental frequency, thereby preventing defective welding of workpieces. be.
実施例
以下この発明の超音波加工機に具体化した一実
施例を図面に従つて説明する。Embodiment An embodiment of the ultrasonic processing machine of the present invention will be described below with reference to the drawings.
第１図に示すように、テーブル１上には支柱２
が立設され、その支柱２の上部には固定台３が固
定されている。その固定台３には流体圧シリンダ
４が固定され、その下方に延びるピストンロツド
５には可動枠体６が固定されており、その可動枠
体６には超音波振動素子７が保持されている。そ
の超音波振動素子７の下端には加工用ホーン８が
着脱可能に取り付けられ、その下端の加工面８ａ
は前記テーブル１と対向している。又、超音波振
動素子７を発振させる発振回路９が設けられてい
る。 As shown in Figure 1, there are two pillars on the table 1.
is erected, and a fixed base 3 is fixed to the upper part of the support column 2. A fluid pressure cylinder 4 is fixed to the fixed base 3, a movable frame 6 is fixed to a piston rod 5 extending below the fixed base 3, and an ultrasonic vibration element 7 is held in the movable frame 6. A machining horn 8 is removably attached to the lower end of the ultrasonic vibration element 7, and a machining surface 8a at the lower end
is opposite to the table 1. Further, an oscillation circuit 9 for causing the ultrasonic vibration element 7 to oscillate is provided.
そしてテーブル１上に型１０を載置し、その型
１０内にプラスチツクからなる２枚の被加工物１
１を重合して載置して、流体圧シリンダ４のピス
トンロツド５を下動させると、可動枠体６ととも
に加工用ホーン８が下動され、その加工面８ａが
被加工物１１の加工部１１ａを押圧する。その状
態で発振回路９により超音波振動素子７を振動さ
せ被加工物１１に加工面８ａから超音波振動を付
与すると両被加工物１１の加工部１１ａが溶着加
工される。加工終了後は流体圧シリンダ４により
加工用ホーン８が上動され、被加工物１１がテー
ブル１上から取り除かれる。 Then, a mold 10 is placed on the table 1, and two workpieces 1 made of plastic are placed inside the mold 10.
When the piston rod 5 of the fluid pressure cylinder 4 is moved down, the machining horn 8 is moved down together with the movable frame 6, and the machining surface 8a is aligned with the machining part 11a of the workpiece 11. Press. In this state, when the ultrasonic vibration element 7 is vibrated by the oscillation circuit 9 and ultrasonic vibration is applied to the workpiece 11 from the workpiece surface 8a, the workpieces 11a of both workpieces 11 are welded. After the machining is completed, the machining horn 8 is moved upward by the fluid pressure cylinder 4, and the workpiece 11 is removed from the table 1.
次にこの実施例の超音波加工機の電子回路を第
２図に従つて説明する。超音波振動素子７は駆動
用素子７ａと検出用素子７ｂとを備えており、発
振回路９により発振される。その発振回路９につ
いて説明すると、検出用素子７ｂからは超音波振
動素子７の実際の振動周波数の電気的な高周波
信号SG１が出力され、その高周波信号SG１は帰
還回路１２に入力される。その帰還回路１２は、
一端が超音波振動素子７の検出用素子７ｂに接続
され、他端が抵抗１３を介して接地されたコンデ
ンサ１４と、その抵抗１３と、その抵抗１３に一
次側端子が並列接続されたトランス１５とからな
り、トランス１５の二次側端子は帰還回路１２の
出力端子となつている。帰還回路１２の出力端子
から出力されるフイードバツク信号SG２は減衰
回路１６に入力される。その減衰回路１６、３個
の抵抗Ｒ１，Ｒ２，Ｒ３を直列接続してなり、ト
ランス１５の二次側端子に並列接続されている。
抵抗Ｒ２の両端にはアナログスイツチ１７が並列
接続され、抵抗Ｒ１とＲ２との接続点から減衰回
路１６の出力信号SG３が出力される。その出力
信号SG３は可変増幅度増幅回路１８と電力増幅
回路１９により増幅され、その電力増幅回路１９
から高周波電力が超音波振動素子７の駆動用素子
７ａに供給される。そして、減衰回路１６、可変
増幅度増幅回路１８、電力増幅回路１９により電
力供給回路２０が構成されている。 Next, the electronic circuit of the ultrasonic processing machine of this embodiment will be explained with reference to FIG. The ultrasonic vibration element 7 includes a drive element 7a and a detection element 7b, and is oscillated by an oscillation circuit 9. To explain the oscillation circuit 9, the detection element 7b outputs an electrical high frequency signal SG1 of the actual vibration frequency of the ultrasonic vibration element 7, and the high frequency signal SG1 is input to the feedback circuit 12. The feedback circuit 12 is
A capacitor 14 whose one end is connected to the detection element 7b of the ultrasonic vibration element 7 and whose other end is grounded via a resistor 13, the resistor 13, and a transformer 15 whose primary terminal is connected in parallel to the resistor 13. The secondary terminal of the transformer 15 serves as the output terminal of the feedback circuit 12. The feedback signal SG2 output from the output terminal of the feedback circuit 12 is input to the attenuation circuit 16. The attenuation circuit 16 is formed by connecting three resistors R1, R2, and R3 in series, and is connected in parallel to the secondary terminal of the transformer 15.
An analog switch 17 is connected in parallel to both ends of the resistor R2, and an output signal SG3 of the attenuation circuit 16 is output from the connection point between the resistors R1 and R2. The output signal SG3 is amplified by the variable amplification amplifier circuit 18 and the power amplifier circuit 19.
High frequency power is supplied to the driving element 7a of the ultrasonic vibration element 7 from the ultrasonic vibration element 7. A power supply circuit 20 is constituted by the attenuation circuit 16, the variable amplification circuit 18, and the power amplification circuit 19.
この発振回路９は、電圧増幅率をA〓0、電圧帰
還率をβ〓とすればA〓0・β〓＝１なる条件を満足する
とき発振する。 This oscillation circuit 9 oscillates when it satisfies the condition A〓0·β〓=1, where the voltage amplification factor is A〓0 and the voltage feedback rate is β〓.
超音波振動素子７の検出用素子７ｂからの高周
波信号SG１は検波整流回路２１へ入力され、そ
の検波整流回路２１ぱ高周波信号SG１の電圧値
に比例する直流電圧VDを可変直流電源２２に付
与する。その可変直流電源２２には電源電圧VC
が付与されており、直流電圧VDにより制御され
る出力電圧VOを可変増幅度増幅回路１８に付与
する。その出力電圧VOは、直流電圧VDが高く
なるほど低い値となり、直流電圧VDが低下する
ほど高くなる。前記可変増幅度増幅回路１８の増
幅率はその出力電圧VOに比例する。従つて、超
音波振動素子７の振動周波数ｆが低下すると高周
波信号SG１の電圧値が低くなり、直流電圧VDが
低下し出力電圧VOが高くなる。これにより可変
増幅度増幅回路１８の増幅率が高くなり、調音波
振動素子７の駆動用素子７ａには大きな高周波電
力が供給される。従つて超音波振動素子７は結果
的に一定の振動数にて振動することになり、高周
波信号SG１の電圧値も一定となる。又、反対に
超音波振動素子７の振動周波数ｆが高くなつた時
も、同様に制御されて結果的に超音波振動素子７
は一定の振動周波数ｆにて振動され、高周波信号
SG１の電圧も一定となる。 The high frequency signal SG1 from the detection element 7b of the ultrasonic vibration element 7 is input to the detection rectifier circuit 21, and the detection rectifier circuit 21 applies a DC voltage VD proportional to the voltage value of the high frequency signal SG1 to the variable DC power supply 22. . The variable DC power supply 22 has a power supply voltage VC.
is applied, and an output voltage VO controlled by the DC voltage VD is applied to the variable amplification amplifier circuit 18. The output voltage VO becomes lower as the DC voltage VD increases, and becomes higher as the DC voltage VD decreases. The amplification factor of the variable amplification amplifier circuit 18 is proportional to its output voltage VO. Therefore, when the vibration frequency f of the ultrasonic vibration element 7 decreases, the voltage value of the high frequency signal SG1 decreases, the DC voltage VD decreases, and the output voltage VO increases. As a result, the amplification factor of the variable amplification amplifier circuit 18 is increased, and a large high-frequency power is supplied to the driving element 7a of the harmonic vibration element 7. Therefore, the ultrasonic vibration element 7 will vibrate at a constant frequency, and the voltage value of the high frequency signal SG1 will also be constant. Conversely, when the vibration frequency f of the ultrasonic vibrating element 7 becomes high, the same control is performed and as a result, the ultrasonic vibrating element 7
is vibrated at a constant vibration frequency f, and a high-frequency signal
The voltage of SG1 also becomes constant.
しかしながら、超音波振動素子７は基本周波数
f0以外の周波数を含む。この基本周波数f0以外の
周波数としては、高周波、発振回路９の浮遊容量
等に起因する寄生振動によるもの等が存在する
が、超音波振動素子７の周波数に対するいわゆる
スプリアス特性が基本周波数f0に近接した周波数
でピーク値を有すると、超音波振動素子７の実際
の振動周波数ｆは基本周波数f0から外れてしまう
こととなる。このような状態となると、前述した
ような検波整流回路２１、可変直流電源２２、可
変増幅度増幅回路１８によつては、もはや超音波
振動素子７の振動周波数ｆを一定に保つことがで
きなくなつてしまう。 However, the ultrasonic vibration element 7 has a fundamental frequency
Contains frequencies other than f0. Frequencies other than the fundamental frequency f0 include high frequencies, parasitic vibrations caused by stray capacitance of the oscillation circuit 9, etc. If the frequency has a peak value, the actual vibration frequency f of the ultrasonic vibration element 7 will deviate from the fundamental frequency f0. In this state, the detection rectifier circuit 21, the variable DC power supply 22, and the variable amplification amplifier circuit 18 described above are no longer able to maintain the vibration frequency f of the ultrasonic transducer 7 constant. I get used to it.
そこでこの発明においては発振回路９に以下に
述べるような回路構成を設けている。帰還回路１
２の抵抗１３とコンデンサ１４との接続点からは
超音波振動素子７の振動周波数ｆの電気信号が出
力されている。その振動周波数ｆは周波数−電圧
変換器からなる周波数検出装置２３に入力され、
その周波数検出装置２３は振動周波数ｆに比例す
る直流電圧Vを判別手段２４に付与する。その
判別手段２４は、超音波振動素子７の基本周波数
f0より僅かに高い周波数f0＋Δfに比例する直流電
圧VHと、基本周波数f0より僅かに低い周波数f0
−Δfに比例する直流電圧VLとを出力する基準電
圧発生器２５と、直流電圧Vfと直流電圧VHとが
２個の入力端子にそれぞれ入力される比較器２６
と、直流電圧Vfと直流電圧VLとが２個の入力端
子にそれぞれ入力される比較器２７と、両比較器
２６，２７の出力端子が２個の入力端子にそれぞ
れ接続されたOR回路２８とからなる。比較器２
６は直流電圧Vfが直流電圧XHより高くなつた時、
すなわち超音波振動素子７の振動周波数ｆが基本
周波数f0よりΔfだけ高くなつた時、論理１の出
力信号を出力し、比較器２７は直流電圧Vfが直
流電圧VLより低くなつた時、すなわち超音波振
動素子７の振動周波数ｆが基本周波数f0よりΔf
だけ低くなつた時、論理１の出力信号を出力する
ようになつており、OR回路２８は、両比較器２
６，２７の出力のいずれか一方又は両方が論理１
となつた時、論理１の判別信号SG４を出力する。
その判別信号SG４は、スイツチ２９を介して、
警報表示手段３０又はアナログスイツチ駆動回路
３１に入力される。その警報表示手段３０は、警
報信号を発生する発光ダイオード、スピーカー等
の警報素子３２と、その警報素子３２を駆動する
警報表示素子駆動回路３３とからなる。超音波振
動素子７の実際の周波数ｆがf0±Δfの範囲内の
値に収まつていない場合には、判別手段２４から
論理１の判別信号SG４が警報表示素子駆動回路
３３に付与されて、警報素子３２から光、音等の
警報信号が発生される。 Therefore, in the present invention, the oscillation circuit 9 is provided with a circuit configuration as described below. Feedback circuit 1
An electric signal having a vibration frequency f of the ultrasonic vibration element 7 is output from the connection point between the resistor 13 and the capacitor 14 in FIG. The vibration frequency f is input to a frequency detection device 23 consisting of a frequency-voltage converter,
The frequency detection device 23 applies a DC voltage V proportional to the vibration frequency f to the discrimination means 24. The determining means 24 determines the fundamental frequency of the ultrasonic vibration element 7.
DC voltage VH proportional to frequency f0 + Δf slightly higher than f0 and frequency f0 slightly lower than fundamental frequency f0
A reference voltage generator 25 that outputs a DC voltage V L proportional to −Δf, and a comparator 26 that receives DC voltage Vf and DC voltage V H into two input terminals, respectively.
, a comparator 27 to which DC voltage Vf and DC voltage V L are respectively input to two input terminals, and an OR circuit 28 to which output terminals of both comparators 26 and 27 are respectively connected to two input terminals. It consists of Comparator 2
6 is when DC voltage Vf becomes higher than DC voltage XH ,
That is, when the vibration frequency f of the ultrasonic vibration element 7 becomes higher than the fundamental frequency f0 by Δf, the comparator 27 outputs a logical 1 output signal, and when the DC voltage Vf becomes lower than the DC voltage VL , that is, The vibration frequency f of the ultrasonic vibration element 7 is Δf from the fundamental frequency f0.
The OR circuit 28 outputs a logic 1 output signal when the comparator 2 becomes low.
Either or both of the outputs of 6 and 27 are logic 1.
When this happens, a logic 1 discrimination signal SG4 is output.
The discrimination signal SG4 is transmitted via the switch 29 to
The signal is input to the alarm display means 30 or the analog switch drive circuit 31. The alarm display means 30 includes an alarm element 32 such as a light emitting diode or a speaker that generates an alarm signal, and an alarm display element drive circuit 33 that drives the alarm element 32. If the actual frequency f of the ultrasonic vibration element 7 is not within the range of f0±Δf, a discrimination signal SG4 of logic 1 is applied from the discrimination means 24 to the alarm display element drive circuit 33, The alarm element 32 generates an alarm signal such as light or sound.
又、スイツチ２９がアナログスイツチ駆動回路
３１側へ倒されている時には、判別手段２４から
論理１の判別信号SG４が出力されるとアナログ
スイツチ駆動回路３１が作動し、そのアナログス
イツチ駆動回路３１は前記減衰回路１６のアナロ
グスイツチ１７をオンさせる。減衰回路１６の減
衰率は、アナログスイツチ１７がオフされている
ときにはR1／（R1＋R2＋R3）であるが、アナ
ログスイツチ１７がオンされた時にはR1／（R1
＋R3）となる。従つて、アナログスイツチ１７
がオンされた時のほうが減衰回路１６の減衰率は
大きくなり、発振回路９の全体の電圧利得は低下
する。それにより超音波振動素子７は、例え基本
周波数f0に接近した周波数てスプリアス特性のピ
ーク値を有する場合でも通常そのピーク値は基本
周波数f0のピーク値より低いため、基本周波数f0
以外の周波数では発振し難くなり、基本周波数f0
で発振するようになる。すると、周波数検出装置
２３から出力される直流電圧Vfは、基準電圧発
生器２５から出力される直流電圧VL〜VHの範囲
内に収まり、判別手段２４からは論理０の信号が
出力される。従つてアナログスイツチ駆動回路３
１は作動せず、アナログスイツチ１７がオフされ
る。すると、発振回路９の全体の電圧利得は元の
値に戻つて、そのまま基本周波数f0にて超音波振
動素子７が振動させることとなる。 Further, when the switch 29 is turned to the analog switch drive circuit 31 side, when the discrimination signal SG4 of logic 1 is output from the discrimination means 24, the analog switch drive circuit 31 is activated, and the analog switch drive circuit 31 operates as described above. Turn on the analog switch 17 of the attenuation circuit 16. The attenuation rate of the attenuation circuit 16 is R1/(R1+R2+R3) when the analog switch 17 is off, but is R1/(R1) when the analog switch 17 is on.
+R3). Therefore, analog switch 17
The attenuation rate of the attenuation circuit 16 becomes larger when the oscillation circuit 16 is turned on, and the overall voltage gain of the oscillation circuit 9 decreases. As a result, even if the ultrasonic transducer element 7 has a peak value of spurious characteristics at a frequency close to the fundamental frequency f0, the peak value is usually lower than the peak value of the fundamental frequency f0, so the fundamental frequency f0
It becomes difficult to oscillate at frequencies other than that, and the fundamental frequency f0
It starts to oscillate. Then, the DC voltage Vf output from the frequency detection device 23 falls within the range of the DC voltage V L to V H output from the reference voltage generator 25, and the determining means 24 outputs a logic 0 signal. . Therefore, analog switch drive circuit 3
1 is not activated and the analog switch 17 is turned off. Then, the overall voltage gain of the oscillation circuit 9 returns to its original value, and the ultrasonic transducer element 7 continues to vibrate at the fundamental frequency f0.
前述した検波整流回路２１、可変直流電源２２
等からなる回路は、調音波振動素子７の基本周波
数f0の値が何らかの原因によりずれた場合にその
基本周波数f0の値を一定に保つための回路であ
る。これに対して周波数検出装置２３、判別手段
２４、警報表示手段３０、アナログスイツチ駆動
回路３１、アナログスイツチ１７、減衰回路１６
等により構成される回路は、超音波振動素子７が
基本周波数f0以外の高調波成分等による周波数に
よつて発振されるのを防止する回路でありその目
的が異なる。 The aforementioned detection rectifier circuit 21 and variable DC power supply 22
The circuit consisting of the above is a circuit for keeping the value of the fundamental frequency f0 constant when the value of the fundamental frequency f0 of the harmonic vibration element 7 deviates for some reason. On the other hand, the frequency detection device 23, the discrimination means 24, the alarm display means 30, the analog switch drive circuit 31, the analog switch 17, the attenuation circuit 16
The circuit constituted by the above circuits is a circuit that prevents the ultrasonic vibration element 7 from being oscillated by frequencies caused by harmonic components other than the fundamental frequency f0, and its purpose is different.
なお、周波数検出装置２３としては、振動周波
数ｆの高周波信号SG１をその周波数ｆのパルス
信号に変換するシユミツト回路で構成し、その周
波数ｆもしくは周期を直接計測することにより判
別信号SG４を出力するように判別手段２４を構
成してもよい。 The frequency detection device 23 is constructed of a Schmitt circuit that converts a high frequency signal SG1 having a vibration frequency f into a pulse signal having a frequency f, and outputs a discrimination signal SG4 by directly measuring the frequency f or period. The determining means 24 may be configured as follows.
効 果
以上詳述したようにこの発明は、超音波振動素
子７の検出用素子７ｂから出力される高周波信号
SG１の周波数ｆに比例する電気信号Vfを検出す
る周波数検出装置２３と、その周波数検出装置２
３によつて検出された電気信号Vfが予め定めら
れた周波数f0と一致するか否かを判別する判別手
段２４と、その判別手段２４によつて前記検出さ
れた周波数ｆが前記予め定められた周波数f0と一
致しないと判別された場合、その判別結果に応答
して前記電力供給回路２０から駆動用素子７ａに
供給する高周波電力を減少させる手段とを設けた
ことにより、新しい加工用ホーンに交換した場合
等には、超音波振動素子７の基本周波数f0と異な
る周波数ｆにて超音波振動素子７が振動されよう
としても自動的に基本周波数f0にて振動されるよ
うになり、被加工物の加工不良をなくすことがで
きる。Effects As described in detail above, the present invention provides a high-frequency signal output from the detection element 7b of the ultrasonic vibration element 7.
A frequency detection device 23 that detects an electric signal Vf proportional to the frequency f of SG1, and its frequency detection device 2
determining means 24 for determining whether or not the electric signal Vf detected by No. 3 matches the predetermined frequency f0; If it is determined that the frequency does not match the frequency f0, a means for reducing the high frequency power supplied from the power supply circuit 20 to the driving element 7a in response to the determination result is provided, so that the processing horn can be replaced with a new one. In such cases, even if the ultrasonic vibrating element 7 is to be vibrated at a frequency f different from the fundamental frequency f0 of the ultrasonic vibrating element 7, it will automatically be vibrated at the fundamental frequency f0, and the workpiece It is possible to eliminate machining defects.
図面はこの発明を超音波加工機に具体化した一
実施例を示し、第１図は側面図、第２図は回路図
である。
超音波振動素子……７、加工用ホーン……８、
加工面……８ａ、発振回路……９、被加工物……
１１、帰還回路……１２、減衰回路……１６、ア
ナログスイツチ……１７、電力供給回路……２
０、周波数検出装置……２３、判別手段……２
４、警報表示手段……３０、アナログスイツチ駆
動回路……３１、振動周波数……ｆ、基本周波数
……f0、直流電圧……Vf、直流電圧……VH、直
流電圧……VL、判別信号……SG４。
The drawings show an embodiment of the present invention in an ultrasonic processing machine, with FIG. 1 being a side view and FIG. 2 being a circuit diagram. Ultrasonic vibration element...7, Processing horn...8,
Machining surface...8a, Oscillation circuit...9, Workpiece...
11, Feedback circuit...12, Attenuation circuit...16, Analog switch...17, Power supply circuit...2
0, Frequency detection device...23, Discrimination means...2
4. Alarm display means...30, Analog switch drive circuit...31, Vibration frequency...f, Fundamental frequency...f0, DC voltage...Vf, DC voltage... VH , DC voltage... VL , Discrimination Signal...SG4.
Claims (1)
超音波振動素子７と、 その超音波振動素子７の駆動用素子７ａに高周
波電力を供給するための電力供給回路２０と、 その電力供給回路２０に前記超音波振動素子７
の検出用素子７ｂから出力される高周波信号SG
１を正帰還する帰還回路１２と を含む超音波振動素子駆動装置において、 前記検出用素子７ｂから出力される高周波信号
SG１の周波数ｆに比例する電気信号Vfを検出す
る周波数検出装置２３と、 その周波数検出装置２３によつて検出された電
気信号Vfが予め定められた周波数ｆ０と一致す
るか否かを判別する判別手段２４と、 その判別手段２４によつて前記検出された周波
数ｆが前記予め定められた周波数ｆ０と一致しな
いと判別された場合、その判別結果に応答して前
記電力供給回路２０から駆動用素子７ａに供給す
る高周波電力を減少させる手段と を設けたことを特徴とする超音波振動素子駆動装
置。 ２ 前記電力供給回路２０は前記検出用素子７ｂ
から帰還された高周波信号SG１を減衰させるた
めのアナログスイツチ１７を有する減衰回路１６
を含み、前記高周波電力を減少させる手段は前記
アナログスイツチ１７を駆動するための駆動回路
３１を含むことを特徴とする特許請求の範囲第１
項に記載の超音波振動素子駆動装置。[Claims] 1. An ultrasonic vibration element 7 including a driving element 7a and a detection element 7b, and a power supply circuit 20 for supplying high-frequency power to the driving element 7a of the ultrasonic vibration element 7. , the ultrasonic vibration element 7 is provided in the power supply circuit 20.
The high frequency signal SG output from the detection element 7b of
1, and a feedback circuit 12 that provides positive feedback of a high frequency signal output from the detection element 7b.
A frequency detection device 23 that detects an electrical signal Vf proportional to the frequency f of SG1, and a determination that determines whether the electrical signal Vf detected by the frequency detection device 23 matches a predetermined frequency f0. means 24, and when the determining means 24 determines that the detected frequency f does not match the predetermined frequency f0, the drive element is removed from the power supply circuit 20 in response to the determination result. 7a. An ultrasonic vibrating element driving device characterized by comprising: means for reducing high frequency power supplied to 7a. 2 The power supply circuit 20 is connected to the detection element 7b.
an attenuation circuit 16 having an analog switch 17 for attenuating the high frequency signal SG1 fed back from the
and the means for reducing the high frequency power includes a drive circuit 31 for driving the analog switch 17.
The ultrasonic vibrating element drive device described in 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57199485A JPS5990672A (en) | 1982-11-13 | 1982-11-13 | Ultrasonic vibrating element drive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57199485A JPS5990672A (en) | 1982-11-13 | 1982-11-13 | Ultrasonic vibrating element drive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5990672A JPS5990672A (en) | 1984-05-25 |
| JPH0353995B2 true JPH0353995B2 (en) | 1991-08-16 |
Family
ID=16408586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57199485A Granted JPS5990672A (en) | 1982-11-13 | 1982-11-13 | Ultrasonic vibrating element drive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5990672A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2672797B2 (en) * | 1995-06-16 | 1997-11-05 | オリンパス光学工業株式会社 | Ultrasonic transducer drive circuit |
| JP6267050B2 (en) * | 2014-05-01 | 2018-01-24 | 株式会社イシダ | Ultrasonic packaging machine |
-
1982
- 1982-11-13 JP JP57199485A patent/JPS5990672A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5990672A (en) | 1984-05-25 |
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