JPH0354862B2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a molding apparatus for semiconductor devices,
More specifically, the present invention relates to a simple device for packaging semiconductor devices without using a conventional large molding press.

[Conventional technology]

In general, packaging of semiconductor devices and the like uses a molding method called transfer molding, in which resin is plasticized in a pot, passed through a runner at high temperature and pressure, and then press-fitted into the cavity of a mold.

[Problem to be solved by the invention]

When using this method, the terminals of semiconductor devices, etc. that come out outside must be firmly held down with a mold to prevent the resin from leaking out, and the resin is forced in with tens of tons of high pressure. A mold with extremely high precision is required. Moreover, in order to be profitable, a large number of semiconductor devices and the like are simultaneously molded, so the mold must be large and expensive. Therefore, this method is not suitable for anything other than high-volume production of a small number of products. However, recently, the number of semiconductor devices used for certain limited purposes has increased, and it is sufficient to manufacture small quantities for trial production, but it is difficult to adopt the transfer molding method for such purposes. is unsuitable, and there has been a strong desire for an alternative molding apparatus for simple semiconductor devices, etc. for high-mix, low-volume production.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a simple molding apparatus for semiconductor devices, etc., which is suitable for high-mix, low-volume production.

Another object of the present invention is to provide a molding apparatus for semiconductor devices and the like that can perform packaging operations for semiconductor devices and the like at low cost without using large and expensive molds.

[Means for solving problems]

The present invention includes a lead frame supply section that pushes out lead frames stored vertically in a magazine to a loader section for one sheet, a loader section that conveys the lead frames to a mold section, and a loader section that is connected to the loader section. After adsorbing the supplied tablet
A mold section with mold heads that rotate 90 degrees to face each other and package closely from both sides of the lead frame, and a large number of thermosetting resin tablets equivalent to one molding process are stacked and stored. A pair of left and right tablet storage units that are raised and delivered, a tablet supply unit that absorbs tablets from the tablet storage unit and supplies them to the mold head of the mold unit, and an unloader that collects the packaged lead frame into the magazine. This is a molding apparatus for semiconductor devices, etc., and the drawings show an embodiment thereof. FIG. 1 is a plan view showing an example of the overall configuration of the device incorporating a preheating section, and FIG. 2 is a side view thereof. , a preheat section 15, mold heads 16 and 17, a hold section 18, an unloader section 19, and a lead frame storage section 20 are shown. The apparatus is installed on a pedestal A and placed in a nitrogen atmosphere sealed with a cover B covering the pedestal 1. Next, the configuration of each part will be explained in detail.

The structure of the lead frame supply section 11 is shown in FIGS. 3 and 4. Lead frame supply section 1
1 is a movable base 2 installed on a base plate 21
2, and a pusher mechanism 25 for pushing out the lead frame 24 inside the magazine 23. A female screw block 26 is fixed to the back side of the movable base 22, and a screw shaft 27 is screwed into it. This screw shaft 27 has bearings 2 at both ends.
8 and 29 on the base plate 21, and is rotationally driven by a motor 31 fixed to the back side of the base plate 21 via a chain 30. Further, a slide plate 32 is fixed to the back side of the movable base 22, and slides on a rail 33 laid on the base plate 21. A pusher mechanism 25 is also installed on the base plate 21. That is, the cylinder 35 is fixed via the bracket 34,
A pusher 36 is attached to the cylinder rod. Pusher 36 is retracted by cylinder 35. The movement of the pusher 36 is supported by a guide rail 37 having a C-shaped cross section and erected on the base plate 21. A spring 38 for moving the pusher 36 forward is stretched between the rear end of the pusher 36 and the guide rail 37. Furthermore, on the movable base 22, there is a roller roller 3 for positioning the magazine 23.
9 and rollers 40 are attached. The roller 40 is eccentrically mounted and presses the magazine 23 by rotating the pin handle 41.
Furthermore, a sensor 42 for detecting the movement of the movable base 22 and a sensor 43 for detecting the rotation of the screw shaft 27 are installed on the base plate 21.

Next, as shown in FIGS. 5 to 8, the loader section 1
The second configuration will be explained. A groove 4 in which the upper and lower edges of the lead frame 24 fit into the upper part of the vertical plate 44
A lead frame guide 47 with 5, 46 is installed. Motors 48 and 49 are fixed to two locations on the back side of the vertical plate 44, and these motors 48 and 49
As a result, the pulleys 50 and 51 are rotationally driven.
The rotation of the pulleys 50 and 51 is transmitted to the upper pulleys 54 and 55 via shafts 52 and 53, respectively, and the rotation of the pulley 55 is further transmitted to the belt 5.
6 to pulleys 58 and 59.
The shafts 52 and 53 are rotatably supported by an L-shaped shaft holder 60 attached to the vertical plate 44, and the shafts of the pulleys 58 and 59 are supported by a shaft holder 61 extending laterally from the vertical plate 44. It is rotatably supported.
A window 62 is provided in the pulley 50, 51, 54, 55 installation part of the vertical plate 44, and the pulley 50, 5
1, 54, and 55 fit within it. In addition, the window 62
A horizontal hole 63 is provided in the horizontal direction, and a belt 56 connecting the pulleys 55 and 58 is disposed therein.
For each pulley 50, 51, 54, 55,
A driven roller 64 is provided which rotates freely by abutting against them. Each driven roller 64
is pivotally supported by a rotating plate 65 rotatably attached to the lead frame guide 47, and is constantly pulled so as to be in contact with the opposing pulley by a spring 66 whose one end is fixed to the lead frame guide 47. . Among the driven rollers 64, those that come into contact with the pulleys 50, 54 are pushed by a cylinder 67 installed on the upper lead frame guide 47.
move away from A cylinder base 68 is installed at the upper end of the vertical plate 44, and a cylinder 69 is attached to the cylinder base 68.
is fixed. The cylinder rod of the cylinder 69 is fixed to an LM plate 71 having LM balls 70 on the left and right sides. The above LM ball 70 has
A guide shaft 72 having one end fixed to the cylinder base 68 is slidably inserted therethrough. A cylinder 74 is installed below the LM plate 71 via a bracket 73, and a pusher plate 75 is attached to the cylinder rod.

Next, as shown in FIG.
To explain the structure, an upper plate 82 is fixed on a plurality of studs 81 which are set up on a base plate 80. A motor fixing plate 83 is provided above the stud 81, and a linear head motor 84 is attached to the back surface thereof. The motor fixing plate 83 includes an LM ball 85, into which a push-up bar 86 is slidably inserted. The lower end of this push-up bar 86 and the linear head of a linear head motor 84 are connected by a sensor holder 87. A stopper 88 is attached to the push-up bar 86, and when this comes into contact with the lower end of the LM ball 85, the rising end of the push-up bar 86 is restricted. A push-up plate 89 is fixed to the upper end of the push-up bar 86, and the push-up plate 89 exits onto the upper plate 82 through a through hole 90 provided in the upper plate 82. Atsupah plate 82
A tablet holder 91 is installed above so as to surround the through hole 90, and a large number of tablets 92 are stacked inside the tablet holder 91. The push-up plate 89 is
It functions as the bottom of the tablet holder 91.

Next, as shown in FIGS. 10 to 13, the tablet in the uppermost stage is sucked from the tablet conveyance section 14, that is, the tablet holder 91 of the tablet storage section, and transferred to the preheating section 15, where it is formed into a boat shape. After that, mold head 16,
17 will be explained. The tablet conveying section 14 includes a head 93 that rotates left and right by 90 degrees. The cylinder 9 is in the head 93.
4 is attached to the rod of the cylinder 94, and a knuckle pin 97 that engages with the oblong hole 96 of the pendulum 95 is attached to the rod of the cylinder 94. Rotation axis 98 of pendulum 95
A pinion gear 99 is installed at the tip of the pinion gear 99, and racks 100 and 101 that mesh with the pinion gear 99 are provided on both sides of the pinion gear 99. A part fixing plate 102 is fixed to the rack 100, and a pair of vacuum parts 103 are fixed to the rack 100.
can be installed. A presser 105 is installed on the other rack 101 with a plate 104 interposed therebetween. The presser 105 is a vacuum pad 10.
It is placed between 3. The arm 106 of the head 93 is
It is fixed to a lifting block 108 that moves up and down along a guide post 107. Guide post 107
is erected at the center of the rotating plate 109. A mini-cylinder 110 is further installed on the rotary plate 109 to move the lifting block 108 up and down. The rotating plate 109 is fixed on a rotating plate 112 which is supported by a bearing block 111, and the rotating shaft 112 is rotationally driven by a servo motor 113.

The configuration of the preheat section 15 is shown in FIG.
As shown in Figure 5, the fixed lower die and
It consists of an upper mold that moves up and down. The lower mold is formed by laminating a base 115, a geta block 116, a space liner 117, a heat insulating plate 118, and a heater block 119 on a geta block 114 in order from the bottom. A mold plate 120 having a female mold is embedded in the upper surface of the heater block 119. The geta block 116 has a hollow in the center, and a push-up plate 121 is housed therein. Above the push-up plate 121, the space liner 1
17, the ejector bar 12 passes through the heat insulating plate 118, heater block 119 and mold plate 120.
2 is extended. Also, from the getter block 114 to the base 115, the push-up plate 121
A cylinder 123 for pushing up is installed. The upper die is attached to an elevating plate 125 that moves up and down along two guide shafts 124 erected on the base 115. That is, a heater block 127 is attached to the lower side of the lifting plate 125 via a heat insulating plate 126, and a mold plate 128 having a male mold corresponding to the female mold of the mold plate 120 is embedded in the heater block 127. An upper plate 129 is fixed to the upper end of the guide shaft 124, and a cylinder 130 is installed thereon. The rod of the cylinder 130 extends below the upper plate 129 and is fixed to the lifting plate 125. Between the upper and lower molds, in order to improve molding conditions, a mold plate 120,
A hot blower for blowing hot air to 128 is installed. That is, the LM ball 132 and the cylinder 133 are installed above the angle member 131 fixed on the base 115.
The tip of the LM ball 132 is attached to a pipe support plate 134.
A guide bar 135 fixed to is slidably inserted. Further, the rod of the cylinder 133 is also fixed to the pipe support plate 134. L-shaped pipes 136 and 137 through which hot air flows are inserted and fixed at the top and bottom of the pipe support plate 134. A large number of air outlets are opened at the bent ends of the L-shaped pipes 136 and 137. In this configuration, when the cylinder 133 moves forward, the pipe support plate 134 is supported by the guide bar 135.
moves forward, and the air outlets of the L-shaped pipes 136, 137 come to oppose the male and female molds of the mold plates 120, 128.

The mold section consists of a holding section 18 that holds the lead frame 24, and mold heads 16 and 17 arranged on both sides of the holding section 18. The holding portion 18 includes side plates 139 and 140 that are opened and closed by a cylinder 138. Through holes 141 and 142 into which the mold heads 16 and 17 enter are arranged in parallel at the center of the side plates 139 and 140. Side plate 139
is fixed on a bridge 145 installed on a moving base 143 via a heat insulating plate 144. Side plate 1
Guide bars 146 are attached to the four corners of 39. The other side plate 140 is slidable on these four guide bars 146. An opening/closing cylinder 148 is attached to the lower side of the side plate 140 via a bracket 147, and its rod tip is fixed to a horizontal plate 149 passed between two guide bars 146 on the lower side. A lead frame 24 is provided on the upper and lower surfaces of the through hole 142 of the side plate 140.
A pin 150 is installed that fits into a pin hole formed on the side of the lead frame 24 to position the lead frame 24. In addition, the side plates 139 and 140 are provided with a
Hot jet pipe 15 that blows out hot air
1,152 are arranged one above the other. The mechanism of the holding section 18 described above is placed on the movable base 143, and the movable base 143 is moved forward by a cam mechanism described below. On the back side of the movable base 143, the base 1
A slide guide 155 that straddles a rail 154 laid on 53 is fixed. A cam motor 156 is installed on the base 153, and a pair of rollers 15 that function as cam followers are attached to the rotation axis of the cam motor 156.
A rotating plate 158 with 7 is attached. A cam plate 159 that engages with this roller 157 is installed at the end of the movable base 143. A large number of deep grooves 159a are formed in the cam plate 159, with which the rollers 157 engage.

The mold heads 16, 17 slidably straddle a rail 161 laid on a base 160. A synchro belt 163 is fixed to the mold heads 16, 17 and is driven in circulation by a motor 162 installed at the end of the base 160. The fixing positions of the silk belt 163 are reversed left and right between the mold head 16 and the mold head 17 when viewed from the motor 162 side. A rotating head 166 is rotatably supported between upper side plates 164 and 165 of the mold heads 16 and 17.
The rotating head 166 has two sets of miter gears 167,
168, the motor 169 attached to the side plate 164 drives the motor 169 to rotate 90 degrees in the opposite direction. Next, as shown in FIGS. 18 and 19, the rotary head 1
66 (in the figure, the rotary head 166 has been rotated 90 degrees and is in a horizontal state).The upper surface of the rotary head 166 is provided with a concave portion 166a for storing a boat. and two ejector pipes 170, 171 are slidably fitted therein. Each ejector pipe 170, 17
Inside 1 is a vacuum pipe 17 whose upper surface is closed.
2,173 is slidably inserted therethrough. The ejector pipes 170 and 171 are the ejector plate 1
74 connects its lower part. The ejector plate 174 is constantly pressed down by a spring 175, and is moved against the spring 175 by air pressure supplied from an air supply port 176. Below the vacuum pipes 172 and 173, a spring 177 is installed at the lower end of the ejector pipes 170 and 171, and
In addition, they are connected by an ejector plate 178.
This ejector plate 178 is also constantly pressed down by the spring 177, and is raised when air is supplied from the air supply port 179. A circumferential groove 180 is formed on the upper (left side in FIG. 18) inner surface of the ejector pipes 170, 171. Also, Bakyum pipe 172, 17
Above 3, there is an air inlet 18 that penetrates the pipe wall.
1 is provided. The air inlet 181 has upper ends of the vacuum pipes 172 and 173 connected to the circumferential groove 1.
By lowering it to the 80 position, it communicates with the outside. An air inlet 182 is formed in a portion protruding from the ejector pipes 170, 172 below the vacuum pipes 172, 173. Air outlet 18
2 communicates with the air vent passage 183. An air inlet passage 184 is provided above the rotary head 166 and communicates with an air vent passage 185.

Note that the configuration of the mold section described above is for molding one semiconductor device or the like, but it may be configured to be able to mold a plurality of devices at the same time by arranging a plurality of concave portions 166a in parallel. .

The mechanisms of the unloader section 19 and the lead frame storage section 20 are roughly the same as those of the loader section 12 and the lead frame supply section 11, respectively.

In addition, as shown in FIG.
Dispensers 186 may be provided on both sides of boat 9 to apply adhesive to the mating surfaces of the boat. The configuration of the dispenser 186 is shown in FIGS. 21 and 2.
This is shown in Figure 2. Dispenser 186 is 2
It is equipped with two linear head motors 187 and 188, which are arranged so that their operating directions are perpendicular to each other. A linear head motor 188 is mounted on a base 189 that is reciprocated by a linear head motor 187. A nozzle 190 for applying adhesive to the four sides of the boat is attached to the tip of the head of the linear head motor 188. This nozzle 190 is connected to the cylinder 19
It is moved up and down by 1. The above configuration is further fixed to the third linear head motor 193 body via a fixing plate 192. The linear head motor 193 is installed by fixing its head to an upper plate 195 provided on a column 194.

[Action of the invention]

The operation of the present invention will be explained. First, the overall flow will be explained with reference to FIGS. 1 and 2. The lead frame 24 is sent out from the lead frame supply section 11 in an upright state in the sheet width direction. The sent-out lead frame 24 is transferred to the loader section 12
The data is then sent to the hold section 18 through. During this time, the tablet conveyance section 14 operates, picks up the tablet from the tablet storage section 13, lifts it up, turns it 90 degrees, and carries it onto the preheating section 15. There, the tablet is heated and formed into a boat shape. Thereafter, the tablet conveying section 14 picks up the boat again, turns it 90 degrees, and conveys it to the mold heads 16 and 17. Then, after applying adhesive to the mating surfaces of the boat as necessary, the pair of mold heads 16 and 17 are rotated 90 degrees while adsorbing the boat, and after facing each other with the holding part 18 in between, Move close to. Then, the lead frame 24 is clamped from both sides and the boats are joined together to seal the semiconductor device and the like. After sealing is completed, each mold head 16, 17 is separated and retracted in opposite directions. At the same time, the lead frame 24 moves forward one pitch, and the above steps are repeated to seal the second semiconductor device from the front. Thereafter, when all the semiconductor devices etc. are sealed in the same manner, the lead frame 24 is moved to the unloader section 18.
and stored in an empty magazine.

Next, we will discuss the function of each part. In the lead frame supply unit 11 shown in FIGS. 3 and 4, a magazine 2 is provided with a large number of lead frames 24 stored in a widthwise upright state on a movable base 22.
Set 3. At this time, the pin handle 41 is operated to press the magazine 23 with the roller 40 so that each corner is pressed against the lock roller 39. When the cylinder 35 becomes inactive, the pusher 36 is pulled by the spring 38 and moves forward along the guide rail 37, enters the magazine 23, and holds the outermost lead frame 24 in a predetermined position, that is, with its tip end Push it out until it reaches the pulleys 50, 54 closest to you in the loader section 12.
When the cylinder 67 moves backward and releases the pressure on the rotating plate 65, the rotating plate 65 is pulled by the spring 66 and rotates, and the driven roller 64 leads between the inner pulleys 50 and 54. The leading end of the frame 24 is held. When the motors 48 and 49 are started in this state, the lead frame 24 is first conveyed by the pulleys 50 and 54 and the driven roller 64 for them, and the leading end thereof is between the pulleys 51 and 55 and the driven roller 64 for them. Get into it. At that time, the pulleys 51, 55 and the driven roller 64
are rotationally driven by the motor 49, so the lead frame 24 smoothly enters between them. And the lead frame 24 is
The lead frame 24 advances further and reaches the pulleys 58, 59, but since the pulleys 58, 59 and the driven rollers 64 for them are also rotationally driven via the belts 56, 57, the lead frame 24 is sent further forward. It enters into the lead frame guide of the holding part 18. Lead frame 24
is advanced until its distal end passes pulleys 58,59. When the lead frame 24 reaches this point, the cylinder 69 operates to pull the pusher plate 75, and the lead frame 24
is located behind the Next, cylinder 74
When the lead frame 24 moves forward, the lead frame 24 is pushed by the pusher plate 75 and stops at a fixed position in the holding section 18. When the outermost lead frame 24 is completely pulled out from the magazine 23 by the action of the loader section 12 described above, the state returns to FIGS. 3 and 4, and the motor 31 is started to rotate the screw shaft 27 at a constant angle. let Then, the movable base 22 moves one pitch in the axial direction of the screw shaft 27 via the female thread block 26 that is engaged with the screw shaft 27, that is, the magazine 23
Move the lead frame by the distance within the lead frame. Thus, the second lead frame from the outside arrives on the path of the pusher 36 and is pushed out of the magazine 23 in the same manner as described above.

Next, the functions of the tablet storage section 13 (FIG. 9) and the tablet conveyance section 14 (FIGS. 10 to 13) will be described. In the tablet storage section 13,
From the state shown in FIG. 9, the linear head motor 84
When started, the push-up bar 86 is raised via the sensor holder 87, and the tablets 92 stacked on the push-up plate 89 are moved one pitch at a time, that is,
Tablet holder 91 for the thickness of the tablet
Raise outward. A vacuum pad 103 is waiting on the tablet 92, and when the tablet group rises one pitch, the mini cylinder 110 is activated to lower the lifting block 108. Then, the head 93 is also lowered via the arm 106, but at this time, the rack 101 is in the lowered state, and the presser 105 is lower than the vacuum pad 103 via the plate 104 (as shown in FIGS. 12 and 13). state). Therefore, when the head 93 descends, the presser 105 first comes into contact with the tablet 92 and presses it, thereby positioning the vacuum pad 103. When the cylinder 94 moves forward from this state, the knuckle pin 97 moves along the oblong hole 96, the pendulum 95 rotates about the rotating shaft 98 as a fulcrum, and the pinion gear 99 rotates. Accordingly, the rack 101 is raised and the rack 100 is lowered. As a result, the presser 105 separates from the tablet 92 and rises, and the vacuum pad 103 descends to come into contact with the tablet 92 and attract it. After that, the mini cylinder 110 moves upward,
Only the top tablet 92 is attracted and floats up. Next, when the servo motor 113 is started and the rotary plate 109 rotates 90 degrees, the head 93 also rotates 90 degrees, moves from the tablet storage section 13 onto the preheat section 15, and stops on the mold plate 120. Then, after descending again, the tablet 92 is released from the suction, and the tablet 92 is attached to the mold plate 1.
Fits within 20 female molds. The head 93 immediately rises and pivots out of the plate portion 15. There, the cylinder 130 operates, and the lifting plate 125
Then, the mold plate 128 is lowered through the heat insulating plate 126 and the heater block 127, and is joined to the mold plate 120 of the lower mold. As a result, tablet 9
2 is heated and formed into a boat. In this boat, after the upper mold is raised by the action of the cylinder 130, the push-up plate 1 is raised by the action of the cylinder 123.
21 and the ejector bar 122 fixed thereto.
The mold is released by rising. After the boat molding is completed, the head 93 arrives again, sucks the boat with the vacuum pad 103, and rotates another 90 degrees to move the boat into the concave portions 166a of the mold heads 16 and 17.
drop it inside. Thereafter, the head 93 swings again onto the tablet storage section 13 and repeats the above operation. In the preheating section 15, the cylinder 133 moves forward every time the boat is formed, and directs the air outlets of the L-shaped pipes 136, 137 toward the male and female molds of the mold plates 120, 128 to blow out hot air. By doing so, the mold can be cleaned and heated to improve molding conditions.

When the lead frame 24 is sent from the loader section 12 to the holding section 18, the side plate 140 is separated from the side plate 139. That is, opening/closing cylinder 1
When the rod 48 is retracted, since the tip of the rod is fixed to the horizontal plate 149 between the guide bars 146, the opening/closing cylinder 148 itself moves in the direction of the horizontal plate 149 (to the right in FIG. 17). Along with the movement, the side plate 140 to which the opening/closing cylinder 148 is fixed via the bracket 147
also moves together and leaves the side plate 139. When the lead frame 24 is fed to the fixed position in this state, the opening/closing cylinder 148 is extended, and the side plate 1
40 is brought into contact with the side plate 139. At that time pin 15
0 enters the pin hole on the side edge of the lead frame,
The lead frame 24 is thus positioned.
Once the lead frame 24 is set in place in this manner, it is heated to a temperature close to the tablet forming temperature.
Hot air at 180° C. is blown out from the upper and lower hot jet pipes 151, 152 toward the lead frame 24, thereby heating the lead frame 24.

Adhesive is applied to the boats housed in the recessed portions 166a of the mold heads 16, 17 with the dispenser 186 facing upward (the state of the mold heads 16 in FIG. 17) as required. That is, when the linear head motor 193 is operated, since the head is fixed, the main body moves, and the nozzle 190 is positioned above one corner of the boat that is being sucked into the concave portion 166a of the rotating head 166. . So cylinder 19
1 is activated to lower the nozzle 190, and then the linear head motors 187 and 188 are activated alternately while dripping adhesive from the nozzle 190.
The nozzle 190 traces a rectangular trajectory and applies adhesive to the four sides of the boat. And cylinder 19
After the nozzle 190 is raised by the action of step 1, the linear head motor 193 operates in the opposite direction to retract the nozzle 190.

When the boat is housed in the concave portion 166a, no air is supplied from the air supply port 176, and the ejector plate 174 is pressed down by the spring 175. As a result, ejector pipe 170,1
The upper end of 71 coincides with the bottom surface of recessed portion 166a. On the other hand, there is no air supply from the air supply port 179, and the ejector plate 178
7. As a result, the upper ends of the vacuum pipes 172, 173 are lowered into the circumferential groove 180, and the upper ends of the ejector pipes 170, 171, the circumferential groove 180, the air inlet 181, the inside of the vacuum pipes 172, 173, the air outlet 182, and the air vent passage. 183 is connected. When air is removed from the air removal passage 183 in this manner, the boat is sucked and firmly adsorbed within the recessed portion 166a. When the motor 162 is started in this state, the rotary head 166 rotates 90 degrees through the two sets of miter gears 167 and 168, and faces each other with the holding portion 18 in between. At that time, the boat becomes vertical, but because it is attracted as described above, it does not fall out of the recessed portion 166a. Next, the motor 162 is started and the synchro belt 163 is circulated, and the mold head 1 fixed thereto is rotated.
6 and 17 move toward each other, and the rotary head 166 closes the through hole 14 of the side plate 139 and 140, respectively.
1,142. Then, the device of the lead frame 24 is sandwiched between boats from both sides, and the boats are joined together to complete packaging. The boats may be joined together by gluing and/or welding. When the rotary head 166 enters the through holes 141 and 142, the air inside is pressed and escapes from the air inlet passage 184 to the air bleed passage 185. In this way, the generation of bubbles can be prevented. When air is supplied from the air supply port 179 after the joining is completed, the ejector plate 178 rises against the spring 177, causing the vacuum pipes 172 and 173 to rise. As a result, the circumferential groove 180 is closed and suction to the boat is released. In addition, air supply port 17
Air is also supplied from 6, and ejector plate 1
74 is pushed up against the spring 175,
Accordingly, the upper ends of the ejector pipes 170, 171 protrude into the recessed portion 166a, and the boat is released from the mold. When the motor 162 rotates in the opposite direction, the rotary head 166 comes out of the holes 141 and 142, moves back to its original position by the opposite action described above, and turns 90 degrees to face upward, allowing the next boat to be supplied. wait until Meanwhile, hold part 1
8, when the cam motor 156 starts and rotates the rotary plate 158, a pair of rollers 157 attached to the rotary plate 158 performs a circular motion of 180 degrees. The roller 157 is located in the deep groove 1 of the cam plate.
59a, so during its circular movement,
It slides while rotating in the deep groove 159a. As a result, the cam plate 159 is advanced by one pitch, that is, the distance between the deep grooves 159a. This deep groove 15
The spacing 9a is equal to the device spacing in the lead frame 24. In this way, cam plate 1
When the holding part 59 moves, the holding part 18 fixed thereon also moves together with the holding part 18 supported by the slide guide 155 extending over the rail 154. Thus, the second device of lead frame 24 is
It is located on the packaging line formed by mold heads 16 and 17. Thereafter, each time the rotating plate 158 rotates 180 degrees, the holding portion 18 moves forward by one pitch. Each time, packaging is performed by the action of the mold heads 16 and 17 described above.
When packaging of all devices is completed in this way, the lead frame 24 is pulled out and conveyed by the unloader section 18 adjacent to the holding section 18, and placed in the lead frame storage section 20.
It is stored in the magazine at .

In the present invention, the above-described operations are performed in series and continuously.

〔Effect of the invention〕

Since the present invention is as described above, packaging work for semiconductor devices, etc. can be performed automatically and efficiently on one line, and large molds are not required, so it is especially suitable for high-mix, low-volume production. It is suitable and very useful.

[Brief explanation of drawings]

Fig. 1 is a diagram showing the layout of the entire device according to the present invention, Fig. 2 is a side view thereof, Fig. 3 is a plan view of the lead frame supply section, Fig. 4 is a side view thereof, and Fig. 5 is a loader section. , FIG. 6 and FIG. 7 are side longitudinal cross-sectional views, FIG. 8 is a plan view, FIG. 9 is a configuration diagram of the tablet storage section, FIG. 10 is a plan view of the tablet supply section, and FIG. 12 and 13 are configuration diagrams of the vacuum part, FIG. 14 is a plan view of the preheat section, FIG. 15 is a side view thereof, and FIG. 16 is a plan view of the mold section.
FIG. 17 is a front view thereof, FIGS. 18 and 19 are views showing the structure of the ejector pipe and vacuum pipe in the mold head, FIG. 20 is a side view of the mold section, and FIG. 21 is a plan view of the dispenser. FIG. 22 is a side view thereof.

Claims (1)

[Scope of Claims] 1. A lead frame supply section that pushes out lead frames stored vertically in a magazine to a loader section for each sheet, a loader section that conveys the lead frames to a mold section, and a lead frame supply section that is connected to the loader section. The mold part has a mold head that absorbs the supplied tablet, rotates 90 degrees to face it, and packs it close to both sides of the lead frame. A pair of left and right tablet storage sections that stack and store a large number of resin tablets and lift them up to dispense them; a tablet supply section that sucks tablets from the tablet storage sections and supplies them to the mold head of the mold section; an unloader section that transports the lead frame to the lead frame storage section;
A semiconductor device molding device comprising a lead frame storage section that stores a lead frame. 2. A molding apparatus for semiconductor devices and the like according to claim 1, wherein a preheating section is provided between the tablet storage section and the molding section, and the tablet is preheated before being supplied to the molding section. 3. The molding apparatus for semiconductor devices and the like according to claim 2, wherein the preheating section has a preheating and preforming function. 4. The molding apparatus for semiconductor devices and the like according to claim 1, wherein dispensers are provided on both sides of the unloader section to apply adhesive to the bonding surface of the boat. 5. The molding apparatus for semiconductor devices and the like according to claim 1, wherein the mold section molds a plurality of semiconductor devices and the like at the same time.