JPH0355222B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a soldering device for soldering workpieces with a soldering iron in an automated line.

Prior Art The soldering process is one of the few remaining processes on a manufacturing line that has not been fully automated, and the demand for automation has been increasing in recent years. When automating soldering, the key points to improve yield are:
Improved iron positioning accuracy and temperature stability. However, these two points have contradictory characteristics. Since the iron moves during soldering, it must have a guide mechanism. In order to improve the positional accuracy of the iron, the contact area of the guide mechanism must be increased, but this increases the amount of heat that escapes from the iron through the guide mechanism, making the temperature of the iron unstable. Therefore, there is a need for a thermally stable soldering device with high iron positioning accuracy.

An example of a conventional soldering device will be described below with reference to the drawings.

FIG. 6 is a schematic diagram of a soldering iron up-and-down mechanism of a conventional soldering device. In FIG. 6, 1 is a soldering iron, 2 is a soldering iron holder, and has a constricted part 3. 4 is a shaft, 5 is a linear bearing, and 6 is a bearing holder. The constricted portion 3 of the iron holder 2 serves to slightly reduce the heat escaping from the iron 1 through the iron holder 2 to the shaft 4 through the iron holder 2.

The linear bearing 5 is in contact with the shaft 4 over its entire axial length to reduce backlash.

Problems to be Solved by the Invention However, in the above configuration, although the iron holder 2 has the constricted portion 3, the iron holder 2 is of an integral structure, so that a large amount of heat escapes from the iron 1 to the shaft 4 through the iron holder 2. Since the linear bearing 5 is in contact with the shaft 4 over its entire axial length, the heat transferred to the shaft 4 is transferred through the linear bearing 5 to the bearing holder 6 and other parts of the device.
Therefore, the temperature of the iron 1 is unstable, and the positioning accuracy of the iron 1 is also poor due to expansion and deformation of the device due to heat.

In view of the above-mentioned problems, the present invention provides a soldering device that has high iron positioning accuracy and is thermally stable.

Means for Solving the Problems In order to solve the above problems, the soldering device of the present invention holds each of a pair of shafts in the soldering iron guide mechanism, and makes point contact along the shafts. In each of the plurality of pairs of rollers that roll while rotating, the mounting pin of at least one of the rollers is eccentric to the center of rotation of the roller.

Effects The present invention has the above-mentioned configuration, and since the sliding portion is in point contact, heat conduction from the soldering iron can be suppressed, and since the mounting pin on at least one of the rollers is eccentric to the rotation center of the roller, By changing the installation and fixing position of this mounting pin in the rotational direction, the distance between the center of rotation of the roller and the center of the shaft can be changed, making it possible to absorb the gap between the shaft and the roller. Since a preload is applied to the contact portion of the iron, the positional accuracy of the iron can be maintained even if the member expands or deforms due to heat.

Embodiment A soldering apparatus according to a first embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a schematic diagram of a soldering iron guide mechanism of a soldering apparatus according to a first embodiment of the present invention.
In Fig. 1, 7 is a soldering iron, 8 is a soldering iron holder, and 9 is a soldering iron.
1 is a holder bracket, 10 is a drum-shaped first roller, 11 is a second roller, 12 is an air cylinder that moves the holder bracket up and down, 13 is a shaft, 1
4 is a shaft holder. The iron 7 is inserted and fixed into the iron holder 8. The iron holder 8 is fixed to a holder bracket 9, and a first roller 10 and a second roller 11 are attached to the holder bracket 9. Air cylinder 12 is attached to shaft holder 14 and moves holder bracket 9 up and down. The first roller 10 and the second roller 11 are supported across the shaft 13, and the iron 7, iron holder 8, and holder bracket 9 are moved up and down along the shaft 13 via the first roller 10 and the second roller 11 by an air cylinder 12. move.

Regarding the soldering device configured as above,
The operation will be explained below using FIGS. 1 to 4.

FIG. 2 shows a cross-sectional view of A and A in FIG.
1 is attached, the first roller 10 and the second roller
The rollers 11 sandwich and support the shaft 13, and the iron 7, iron holder, and holder bracket 8 are moved up and down along the shaft 13 by an air cylinder 12 via the first roller 10 and the second roller 11.
The first roller 10 is connected to the holder bracket 9,
It is connected to the rotation center of the first roller 10 by an eccentric pin 15 located at an eccentric position, and as shown in FIG. The interaxial distance between the center and the center of the shaft 13 is made variable, allowing the shaft 13 to absorb the gap at the contact portion of the first roller 15, and applying preload between the shaft 13 and the first roller 15. I can do it.

FIG. 4 is a cross-sectional view taken along line B and B in FIG.
14 is a shaft holder, 1
2 is an air cylinder fixed to the shaft holder;
A bracket 16 connects the tip of the air cylinder 12 to a holder bracket (not shown) to move the iron up and down.

As described above, according to this embodiment, since the sliding surfaces on the upper and lower sides of the soldering iron are in point contact with the conical surface and the cylindrical surface, and between orthogonal cylindrical surfaces, the heat escaping from the iron through the sliding surfaces is small. Furthermore, since the support pin of the roller that slides along the shaft is eccentric and preload is applied to the shaft, the positional accuracy of the iron can be maintained regardless of expansion and deformation due to heat.

In addition, in FIG. 4, four sets of the first roller 10 and the second roller 11 are provided and supported, but three sets may also be used, and one set is the roller (2) 11.
A combination of the two may also be used.

FIG. 5 is a schematic diagram of a soldering iron guide mechanism of a soldering apparatus showing a second embodiment of the present invention. The difference from the configuration shown in FIG. 1 is that the shaft 17 is attached to a holder bracket 18, the first roller 19 and the second roller 20 are fixed, and the shaft 17 is moved up and down.

Effects of the Invention As described above, in the present invention, each of the pair of shafts of the guide section that guides the movement of the iron is held between two or more pairs of rollers from both sides, and the rollers make point contact along the shaft. As it rolls, the mounting pin of at least one of each pair of rollers is eccentric to the center of rotation of the roller, so the distance between the center of the shaft and the center of rotation is variable, which reduces heat from the iron. In addition to reducing run-off, the roller can be pressed against the shaft with preload without any gaps, improving the positioning accuracy of the iron.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram of a soldering iron guide mechanism of a soldering device according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view of A and A in FIG. 1, and FIG. 3 is a schematic diagram of shaft support by rollers. FIG. 4 is a sectional view of B and B in FIG. 2, FIG. 5 is a schematic diagram of a soldering iron guide mechanism of a soldering device according to a second embodiment of the present invention, and FIG. 6 is a soldering iron guide of a conventional soldering device. FIG. 2 is a schematic diagram of the mechanism. 7... Soldering iron, 8... Soldering iron holder, 9... Holder bracket, 10... First roller, 11... Second
Laura, 13...shaft.

Claims (1)

[Claims] 1. A soldering iron that comes into contact with a soldering position and heats it, and a guide part that guides the soldering iron so that it comes into contact with a soldering position, and the guide part has a pair of shafts and each of the pair of shafts. , is held between both sides within the plane formed by the pair of shafts, and rolls along the shaft with the shaft as the center while making point contact, and at least one of the shafts is rotated in the axial direction with respect to the shaft. Consists of multiple pairs of rollers with recesses to prevent relative movement.
A soldering device characterized in that in each of the plurality of pairs of rollers, a mounting pin of at least one of the rollers is eccentric to the center of rotation of the roller.