JPH0355292B2 - - Google Patents
Info
- Publication number
- JPH0355292B2 JPH0355292B2 JP58041038A JP4103883A JPH0355292B2 JP H0355292 B2 JPH0355292 B2 JP H0355292B2 JP 58041038 A JP58041038 A JP 58041038A JP 4103883 A JP4103883 A JP 4103883A JP H0355292 B2 JPH0355292 B2 JP H0355292B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- cylinder
- resin
- molten resin
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/92—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
- B29C2948/92009—Measured parameter
- B29C2948/92209—Temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
- B29C2948/92504—Controlled parameter
- B29C2948/92704—Temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
- B29C2948/92819—Location or phase of control
- B29C2948/92857—Extrusion unit
- B29C2948/92876—Feeding, melting, plasticising or pumping zones, e.g. the melt itself
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
- B29C2948/92819—Location or phase of control
- B29C2948/92857—Extrusion unit
- B29C2948/92876—Feeding, melting, plasticising or pumping zones, e.g. the melt itself
- B29C2948/92895—Barrel or housing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Feedback Control In General (AREA)
Description
この発明は、押出機などのプラスチツク成形機
を用いてプラスチツクを成形する際、成形機内の
樹脂温度を成形に最適な温度に制御するためのプ
ラスチツク成形機における樹脂温度制御方法に関
する。
プラスチツクの押出成形などにおいて、押出機
のシリンダ内の各ゾーンの樹脂温度を使用樹脂に
適した温度に制御することは、押出量の増加、ス
コーチの減少、エネルギーコストの低減、さらに
は電線・ケーブルの絶縁材料等としての電気的特
性等の向上などの点から非常に重要な意味を有し
ている。
従来の押出機の樹脂温度制御は、第1図に示す
ように、押出機1のシリンダ2にシリンダ2を貫
通しない複数の測温穴3……を穿設し、この測温
穴3……に測温素子4……を差し込み、シリンダ
2の各測温ゾーン、C1、C2、C3、C4の温度を測
定し、これらの温度を温度調節計5……に入力
し、シリンダ2の外側に設けられたバンドヒー
タ、埋込みヒータ等の加熱装置6……および冷却
ブロア等の冷却装置7……をこれら温度調節計5
……で制御させる方法によつて行われている。
しかし、この方法には次のような問題があるこ
とが明らかとなつた。すなわち、上記制御方法で
は測温素子4による測定温度とシリンダ2内の溶
融樹脂の温度との間には、押出機1の周囲の室
温の変化により、シリンダ2内面の温度とシリン
ダ2の温度との間には第2図に示すような温度差
(△T1)が各測温ゾーン毎(C2,C3、C4)に発生
し、また押出機1に樹脂を流したときの押出機
1のスクリユ8の回転数の変化によつて第3図に
示したような実際の樹脂温度とシリンダ2の温度
との温度差が更に△T2分だけ増加する。したが
つて、これらの影響によつてシリンダ2内の溶融
樹脂の温度は希望温度以上に加熱された状態とな
つており、無駄なエネルギーを消費していたこと
が判明した。(なお、第2図および第3図中の
C2、C3、C4はシリンダ2の測温位置を表わすも
ので第1図中の各温度調節計5……に示されてい
るC2、C3、C4の各測温ゾーンに対応している。)
さらに最近の検討によれば、シリンダ2内の溶
融樹脂温度は、前述のように室温やスクリユ回転
数だけではなく、押出機1の設定温度、スクリユ
の形状や構造、溶融樹脂の種類(同一樹脂のグレ
ードの差異にも)等によつて影響されることが判
明してきている。例えば、ポリエチレン樹脂の押
出時、温度調節計5の設定温度を120℃とし、測
温素子4による測定温度が120℃であつても、実
際の溶融樹脂温度は130〜140℃にもなつている。
したがつて、単なる測温穴3……による測温で
は、実際の溶融樹脂温度を正確に把握することは
不可能であつた。
そこで、このような従来方式の改良として、特
開昭55−121042号に示された押出機の樹脂温度制
御装置が提案されている。この温度制御装置は、
押出機のシリンダの内壁面よりやや外方の位置に
設置し、該位置の温度検出信号としてとりだす第
1の温度検出器と、前記押出機のシリンダの外壁
面よりやや内方の位置に設置し、該位置の温度検
出信号としてとりだす第2の温度検出器と、前記
第1の温度検出器が設置されている位置の目標温
度信号を設定出力とする第1の温度設定器と、前
記第2の温度検出器が設置されている位置の目標
温度信号を設定出力とする第2の温度設定器と、
前記第1の温度検出器が検出した温度信号と、前
記第1の温度設定器からの第1の目標温度信号と
を比較演算する第1の比較演算器と、前記第2の
温度検出器が検出した温度信号と、前記第1の比
較演算器出力信号により前記第2の温度設定器か
らの第2の目標温度信号の修正信号とを比較演算
する第2の比較演算器と、該第2の比較演算器出
力信号に応じて、前記加熱冷却装置の熱量を選択
的に加減する出力装置とを備えたものである。そ
して、シリンダの内表面近傍の温度が第1の温度
設定器の設定温度より低い場合、第1の比較器が
正の出力信号を送り、この信号は第2の温度設定
器からの目標温度信号に加算されて第2の比較器
に送られ、この第2の比較器からの出力信号に基
づいて加熱冷却装置が加熱作動され、シリンダの
内表面近傍の温度が高められる。逆に、シリンダ
の内表面近傍の温度がその目標温度より高い場
合、加熱冷却装置が冷却作動される。同様に、シ
リンダの外表面近傍の温度が第1の比較器の出力
信号により修正された第2の温度設定器の目標温
度より低い場合、第2の比較器を介して加熱冷却
装置が加熱作動される。逆に、シリンダの外表面
近傍の温度が前記修正された目標温度より高い場
合、加熱冷却装置が冷却作動される。しかしなが
ら、この従来の樹脂温度制御装置でもシリンダ壁
の温度を測定して単にシリンダの温度を制御して
いるだけなので、前述したように、設定温度と実
際の樹脂温度とには、種々のパラメータによつて
大きな温度差が見られるので、このような温度制
御装置でも、実際の樹脂温度を正確に制御できな
い欠点がある。
そこで、本発明者らは前記二つの従来の樹脂温
度制御方法の欠点を解消するため、シリンダ内表
面やスクリユの外表面に測温素子の感温部を直接
溶融樹脂に接触するように設け、シリンダ内の溶
融樹脂の温度を直接測定する方法を提案してきた
が、これらの方法では測温素子の感温部が直接溶
融状態の樹脂に常時接触しているので、測温素子
の感温部の摩耗や樹脂の滞留の問題があり、測温
素子をたびたび取り換えねばならず、押出機の長
期連続稼動上の問題がある。また、シリンダに貫
通孔を設けたものは長期の使用によつて貫通孔周
辺にクラツク等が生じる等の問題も判明した。
そこでさらに、成形機のスクリユ回転数や室温
による樹脂温度の変動を補正する手段を備えた温
度制御方法が、特開昭58−108119号公報(特願昭
56−191906号)として本発明者等によつて提案さ
れている。
この方法は、シリンダの温度を測定し、この温
度に室温、スクリユ回転数などの溶融樹脂温度を
変動させるパラメータから算出された温度を補正
してシリンダ内の溶融樹脂温度を予測し、この予
測樹脂温度と希望樹脂温度との偏差を求め、この
偏差に基づいてシリンダ内の溶融樹脂の温度を制
御するものであるが、この方法によつても目的と
する精度で樹脂温度を制御することは不可能であ
つた。
そこで、本発明者らはさらに検討を重ねたとこ
ろ、シリンダ2の厚み方向に、例えば第4図に示
すような温度分布があることを知見した。第4図
の横軸はシリンダ2の内表面からの距離(mm)を
示し、この場合0mmはシリンダ2の内表面、50mm
はシリンダ2の外表面を表わす。また、縦軸はシ
リンダ2の温度を表わす。そして、曲線C2,C3,
C4は、それぞれ第1図の押出機1の各測温ゾー
ンC2、C3、C4に対応する位置のシリンダ2の温
度分布を表わしたものである。そこで、このグラ
フから各曲線をシリンダ2の内表面の位置まで外
挿すればシリンダ2内表面の溶融樹脂の温度を予
測できる可能性があることを知つた。
この発明は上記事情に鑑みてなされたもので、
シリンダ内の溶融樹脂の温度を正確に予測でき、
樹脂温度を常に希望温度に保持することができ、
樹脂吐出量の増大、スコーチの減少、エネルギー
節約が計られ、しかも測温素子の摩耗がなく、押
出機などを長期連続稼動させることのできるプラ
スチツク成形機の樹脂温度制御方法を提供するこ
とを目的とし、シリンダ壁の厚さ方向にシリンダ
内表面からの距離を変えて2個以上の測温素子を
配設し、これらの測温素子によつて得られた測定
温度からシリンダ内表面の温度を求め、この温度
に溶融樹脂の温度を変動させるスクリユ回転数、
室温、設定温度、スクリユ形状および樹脂の種類
の5個のパラメータから求められた補正温度を加
算し、シリンダ内の溶融樹脂温度を予測し、この
予測温度と希望樹脂温度との偏差に基づいて溶融
樹脂温度を制御することを特徴とするものであ
る。
以下、図面を参照してこの発明を詳しく説明す
る。
まず、この発明の温度制御方法における測温素
子の配置を第5図によつて説明する。第5図は、
この発明を適用した押出機1のシリンダ2をこの
シリンダ2の軸に直交する平面で切断したシリン
ダ断面を示すもので、第1図に示したものと同一
構成部分には同一符号を付してある。また、スク
リユ8は省略してある。シリンダ2の測温ゾーン
C2に対応する位置には、3つの測温穴3a,3
b,3cが同一平面内に、例えば互いに120゜の角
度でシリンダ2の中心軸に向つて穿設されてい
る。これら3つの測温穴3a,3b,3cの内、
1番目の測温穴3aはシリンダ2内表面から約5
mmの厚みを残して穿設され、2番目の測温穴3b
はシリンダ2内表面から約8mmの厚みを残して穿
設され、3番目の測温穴3cは同じく約15mmの厚
みを残して穿設されている。これらの測温穴3
a,3b,3cの深さは、押出機1のシリンダ2
の厚みによつて変化し、上記の深さはシリンダ2
の厚みが25〜50mmの場合に好ましい値である。な
お条件にもよるが、測温穴の一番浅い位置(3
c)でもシリンダー壁厚の1/2程度までの位置
とすることが温度制御の精度の向上の点から好ま
しい。
そして、これらの測温穴3a,3b,3cの底
部には熱電対などの測温素子4a,4b,4cが
それぞれ挿入、固定されており、これら測温素子
4a,4b,4cが配設された位置のシリンダ2
の温度が測定されるようになつている。このよう
に、シリンダ2に、シリンダ2内表面からの距離
を変化させて測温素子4a,4b,4cを配設す
ることにより、第4図に示した1つの測温ゾーン
C2に対応する温度分布曲線が得られることにな
る。
そして、1番目の測温穴3aによる測温位置を
L、2番目の測温穴3bによる測温位置をM、3
番目の測温穴3cによる測温位置をNとし、それ
ぞれの測温素子4a,4b,4cによる測定温度
をTL,TM,TNとし、さらに、測温素子4a,4
b,4cからの出力信号をTL信号、TM信号、TN
信号とする。
また、押出機1の他の測温ゾーンC3、C4に対
応するシリンダ2の位置にも、同様に3つの測温
素子4a,4b,4cよりなる測温素子群が配置
され、測温ゾーンC3、C4に対応した温度分布曲
線が得られるようになつている。
そして、これらの測温素子4a,4b,4cに
よつて測定されたシリンダ2のL,M,N位置の
温度TL,TM,TNを表わすTL信号、TM信号、TN
信号は第6図に示す処理システムで演算処理され
る。第6図はこの温度制御方法の処理システムの
一例を示すもので、1つの測温ゾーンC2に対応
するもののみを示してある。まず、測温素子4
a,4b,4cより検知され、出力されたTL信
号、TM信号、TN信号は、それぞれリニアライザ
9,9,9に入力されリニアライズされたのち
A/D変換器10,10,10でデイジタル化さ
れ、マイクロプロセツサ11に入力される。ま
た、同時に溶融樹脂温度に変化を与えるスクリユ
8の回転数や室温が測定され、同様にリニアライ
ザ9、A/D変換器10を経て、マイクロプロセ
ツサ11に入力される。さらに、マイクロプロセ
ツサ11には、別にスクリユ8の形状、樹脂の種
類、設定温度に関するデータが入力される。な
お、前述のリニアライザ9、A/D変換器10
は、各検知手段にそれぞれ組み込まれている場合
には不要となる。また、リニアライザ9は、A/
D変換器10の後段に設置してもよく、必要に応
じて設置位置が決められる。
マイクロプロセツサ11は、TL信号、TM信
号、TN信号から温度分布曲線を演算する。例え
ば温度分布曲線が二次曲線で表わされるような場
合には次式を仮定し、
y=ax2+bx+c (1)
y:シリンダ2の温度
x:シリンダ2の内表面から測温位置までの距
離
この(1)式に上記L,M,Nの各位置に対応する
xL、xM、xNおよびyTL、yTM、yTNを代入し、
三元二次方程式を解くことにより(1)式のa、b、
cが求まり、温度分布曲線を表わす式が確定され
る。そして、この式にx=0(シリンダ2内表面)
を代入すれば、シリンダ2内表面の温度が求めら
れる。
ついで、このシリンダ2内表面の温度には、別
に入力されたスクリユ回転数、室温、設定温度、
スクリユ形状および樹脂の種類(同一樹脂内での
グレードの差異を含む)の溶融樹脂の温度を変動
させる5個のパラメータから予めメモリされてい
るプログラムによつて求められこれらパラメータ
によつて定まる補正温度が加算され、溶融樹脂の
予測温度が演算される。
さらに、この予測温度は、別にメモリされた希
望樹脂温度と比較され、その偏差が求められ、こ
の偏差に基づいて温度調節計5の設定温度が演算
される。この設定温度信号はD/A変換器12に
入力されてアナログ化され、温度調節計5に入力
される。温度調節計5には、別に測温素子4cか
らのTN信号が入力されており、このTNと設定温
度とを比較して、バンドヒータや埋込ヒータ等の
加熱装置6あるいは冷却ブロア等の冷却装置7を
動作させて、TNを設定温度に一致させる。なお、
この際の温度調節計5へ入力される測温信号は、
測温素子4cからのTN信号に限られることなく、
測温素子4a,4bからのTL,TM信号でもよい
が、望ましくはシリンダ2内表面から最も遠い位
置で行うのが樹脂温度のバラツキの点で好まし
い。また、同時に測温素子4a,4b,4cから
のL,M,N位置の温度変化に基づいてマイクロ
プロセツサ11が、上記設定温度の温度調節計5
への入力のタイミングを演算し、上記設定温度の
温度調節計5への入力タイミングを指示する。か
くして、TNを設定温度に一致させることにより、
予測温度が希望樹脂温度と一致するようになる。
このような温度制御方法によれば、3つの測温
素子4a,4b,4cをシリンダ2内部に、シリ
ンダ2内表面からの距離を変化させて配設し、こ
れによつてシリンダ2内部の温度分布を求め、こ
れよりシリンダ2内の溶融樹脂温度を求めている
ので、測温素子4を直接溶融樹脂に接触させなく
てよいので測温素子4が摩耗することがない。ま
た、このようにして求めた溶融樹脂温度に、スク
リユ回転数、室温、スクリユ形状、設定温度およ
び樹脂の種類の5個の溶融樹脂の温度に変化を与
えるパラメータから求めた補正温度を加算し、予
測温度を求めているので、この予測温度はスクリ
ユ回転数、室温、スクリユ形状、設定温度、樹脂
の種類が変動しても常に正確なものとなる。そし
て、この予測温度と希望樹脂温度との偏差を求
め、この偏差に基づいて温度調節計5の設定温度
を演算し、この設定温度でシリンダ2の内表面か
ら最も遠いN点の温度を制御しているので、溶融
樹脂温度は速やかに希望温度に一致するととも
に、シリンダ2を通過する熱の時間的遅延によつ
て生ずる溶融樹脂温度のサイクリング現象が少な
くなる。また、上記演算処理をマイクロプロセツ
サ11によつて行つているので、制御速度が早く
なり、短時間で溶融樹脂温度を目的の希望温度と
することができる。
なお、以上の例では測温素子4を1つの測温ゾ
ーンに3つ配設したが、押出機1の種類、押出条
件によつては、シリンダ2の温度分布がy=ax
+bあるいはy=alnx+bのような関数で表わ
されることもありこの場合には2つの測温素子4
a,4bでよい。また、3つ以上の測温素子4を
配設し、より精密に樹脂温度を予測してもよい。
さらに、3つの測温素子4a,4b,4cを放射
状に配設しているが、これに限られるものでな
く、要するにシリンダ2内表面からの距離を変化
させて配置すればよい。
なお、上記の例では押出機1の測温ゾーC2、
C3、C4について本発明に係る温度制御方法を適
用しているが、測温ゾーンC1についても同様に
温度制御方法を適用してもよい。しかし、通常の
押出作業ではC2、C3、C4の三ゾーンの温度制御
で充分である。また、シリンダ2の加熱、冷却手
段も上記例に限られることなく、例えばシリコー
ン油などの流体熱媒を用いた加熱、冷却手段を用
いてもよい。
以下、実施例を示して、具体的に説明する。
実施例 1
スクリユ径50mm、L/D=20、シリンダ肉厚25
mm、ヒーター容量C1……2.2KW、C2、C3、C4…
…0.7KW、PID温度調節計付きの押出機1を用い
て、本発明の温度制御方法を適用して架橋剤入り
低密度ポリエチレンを押出成形した。
測温素子は第5図における測温位置L,Mに対
応する4a,4bの2点とし、シリンダ2の温度
はy=ax+b……(2)で表わされるものとする。
但し、yはシリンダ2の温度(℃)、xはシリン
ダ2の内表面から測温位置までの距離(mm)とす
る。そして、(2)式において補正温度の加算を行つ
た後の温度、すなわち予測温度をYとする。
測定位置L,Mに対応する値をxL,yL,xM,
yMとすると、
a=yL−yM/xL−xM
b=yLxM−yMxL/xM−xL
よつて
y=yL−yM/xL−xMx+yLxM−yMxL/xM−xL……(2
′)
補正温度の加算項は(yL−yM)×nとし、そし
て前記n値はスクリユ回転数、室温、スクリユ形
状、設定温度、樹脂の種類(同一樹脂でのグレー
ドの差異も含む)などをパラメータとして、予じ
め測温用スクリユー等によつて実際の樹脂温度を
測定して求められるものである。
シリンダ内表面ではx=0mmであるから(2′)
は
y=yLxM−yMxL/xM−xL ……(2″)
となる。
よつて、予測温度Y(℃)は、
Y=yLxM−yMxL/xM−xL+(yL−yM)×n ……(3)
となる。
今、xM=10mm、xL=5mmとすれば、(3)式は
Y=2yL−yM+(yL−yM)×n……(3′)
で表わされる。
測温位置Mの設定温度は、
C1ゾーン……120℃固定
C2、C3、C4ゾーン……マイクロプロセツサ1
1からの指令による。
各ゾーンの希望樹脂温度E(℃)は、
C1……特に定めず
C2……126℃
C3……128℃
C4……130℃予め、マイクロプロセツサ
11にメモリしておく。
とする。
温度制御方法は、次の式によつて新しい設定温
度を演算して温度調節計5へ指令する方式とす
る。
新設定温度=現在の設定温度
−{Y−E}×0.9 ……(4)
(4)式におけるフアクタ0.9は希望樹脂温度に低
目から漸近させるようにしたもので、1でもよい
が1では希望樹脂温度をオーバすることがある。
以上の条件下において、スクリユ回転数を
30rpm、60rpm、70rpmと変化させて実際樹脂温
度Aを測定し、希望樹脂温度Eとの差を比較し
た。第1表に、押出開始後、2〜4回の設定温度
変更指令の後の各ゾーンのyL,yM,n,Y、実際
樹脂温度(A)、希望樹脂温度(E)および(A)−(E)の値を
示す。なお、実際樹脂温度(A)は、シリンダ2の各
ゾーンに貫通孔を穿設して、測温素子を溶融樹脂
に接触するまで挿入して測定した。
The present invention relates to a resin temperature control method in a plastic molding machine for controlling the resin temperature in the molding machine to an optimal temperature for molding when plastic is molded using a plastic molding machine such as an extruder. In plastic extrusion molding, etc., controlling the resin temperature in each zone in the extruder cylinder to a temperature suitable for the resin used increases extrusion volume, reduces scorch, reduces energy costs, and also reduces wires and cables. It has a very important meaning from the point of view of improving the electrical properties etc. of insulating materials etc. Conventional resin temperature control in an extruder, as shown in FIG. Insert the temperature measuring element 4... into the cylinder 2, measure the temperature of each temperature measuring zone, C 1 , C 2 , C 3 , C 4 , enter these temperatures into the temperature controller 5..., A heating device 6 such as a band heater or an embedded heater provided on the outside of the temperature controller 2 and a cooling device 7 such as a cooling blower are connected to the temperature controller 5.
This is done by controlling the... However, it has become clear that this method has the following problems. That is, in the above control method, there is a difference between the temperature measured by the temperature measuring element 4 and the temperature of the molten resin in the cylinder 2 due to changes in the room temperature around the extruder 1. During this period, a temperature difference (△T 1 ) as shown in Fig. 2 occurs in each temperature measurement zone (C 2 , C 3 , C 4 ), and when the resin is poured into the extruder 1, Due to a change in the rotational speed of the screw 8 of the machine 1, the temperature difference between the actual resin temperature and the temperature of the cylinder 2 as shown in FIG. 3 further increases by ΔT 2 . Therefore, it was found that due to these influences, the temperature of the molten resin in the cylinder 2 was heated to a temperature higher than the desired temperature, and energy was wasted. (Please note that in Figures 2 and 3
C 2 , C 3 , and C 4 represent the temperature measurement positions of the cylinder 2, and the temperature measurement zones C 2 , C 3 , and C 4 shown in each temperature controller 5 in Fig. 1. Compatible. ) Furthermore, according to recent studies, the temperature of the molten resin in the cylinder 2 is determined by not only the room temperature and screw rotation speed as mentioned above, but also the set temperature of the extruder 1, the shape and structure of the screw, and the type of molten resin (same It has become clear that this is influenced by differences in resin grades. For example, when extruding polyethylene resin, even if the set temperature of the temperature controller 5 is 120°C and the temperature measured by the temperature measuring element 4 is 120°C, the actual molten resin temperature is 130 to 140°C. . Therefore, it has been impossible to accurately determine the actual temperature of the molten resin by simply measuring the temperature using the temperature measuring holes 3. Therefore, as an improvement over the conventional system, a resin temperature control device for an extruder has been proposed in JP-A-55-121042. This temperature control device is
A first temperature sensor installed at a position slightly outward from the inner wall surface of the cylinder of the extruder and taken out as a temperature detection signal at the position; and a first temperature sensor installed at a position slightly inward from the outer wall surface of the cylinder of the extruder. , a second temperature detector that takes out the temperature detection signal at the position, a first temperature setter whose set output is a target temperature signal at the position where the first temperature detector is installed, and the second temperature sensor. a second temperature setting device whose set output is a target temperature signal at a position where the temperature sensor is installed;
a first comparison calculator that compares and calculates the temperature signal detected by the first temperature detector and a first target temperature signal from the first temperature setter; and the second temperature detector. a second comparison calculator that compares and calculates the detected temperature signal and a correction signal of the second target temperature signal from the second temperature setting device based on the output signal of the first comparison calculator; and an output device that selectively adjusts the amount of heat of the heating/cooling device according to the output signal of the comparator. Then, if the temperature near the inner surface of the cylinder is lower than the set temperature of the first temperature setter, the first comparator sends a positive output signal, which signal is the target temperature signal from the second temperature setter. The heating/cooling device is heated based on the output signal from the second comparator, and the temperature near the inner surface of the cylinder is increased. Conversely, if the temperature near the inner surface of the cylinder is higher than its target temperature, the heating/cooling device is operated for cooling. Similarly, if the temperature near the outer surface of the cylinder is lower than the target temperature of the second temperature setter corrected by the output signal of the first comparator, the heating/cooling device is activated via the second comparator. be done. Conversely, if the temperature near the outer surface of the cylinder is higher than the corrected target temperature, the heating/cooling device is operated for cooling. However, even with this conventional resin temperature control device, the temperature of the cylinder is simply controlled by measuring the temperature of the cylinder wall, so as mentioned above, the set temperature and the actual resin temperature depend on various parameters. Since a large temperature difference is observed, even such a temperature control device has the disadvantage that the actual resin temperature cannot be accurately controlled. Therefore, in order to eliminate the drawbacks of the two conventional resin temperature control methods, the present inventors installed a temperature sensing part of a temperature measuring element on the inner surface of the cylinder or the outer surface of the screw so as to directly contact the molten resin. We have proposed methods for directly measuring the temperature of the molten resin in the cylinder, but in these methods, the temperature sensing part of the temperature sensing element is in direct contact with the molten resin at all times. There are problems with wear and resin retention, the temperature measuring element must be replaced frequently, and there are problems with long-term continuous operation of the extruder. Furthermore, it has been found that cylinders with through holes have problems such as cracks occurring around the through holes due to long-term use. Therefore, a temperature control method equipped with a means for correcting fluctuations in resin temperature due to the screw rotation speed of the molding machine and room temperature has been proposed in Japanese Patent Application Laid-open No. 108119/1983 (Japanese Patent Application No.
56-191906) by the present inventors. This method measures the temperature of the cylinder, corrects the temperature calculated from parameters that fluctuate the molten resin temperature, such as room temperature and screw rotation speed, and predicts the molten resin temperature inside the cylinder. The deviation between the temperature and the desired resin temperature is determined, and the temperature of the molten resin in the cylinder is controlled based on this deviation, but even with this method, it is not possible to control the resin temperature with the desired accuracy. It was possible. The inventors of the present invention conducted further studies and found that there is a temperature distribution in the thickness direction of the cylinder 2, for example, as shown in FIG. 4. The horizontal axis in Figure 4 indicates the distance (mm) from the inner surface of cylinder 2; in this case, 0 mm is the inner surface of cylinder 2, and 50 mm is the distance from the inner surface of cylinder 2.
represents the outer surface of cylinder 2. Further, the vertical axis represents the temperature of the cylinder 2. And the curves C 2 , C 3 ,
C 4 represents the temperature distribution of the cylinder 2 at positions corresponding to the temperature measurement zones C 2 , C 3 , and C 4 of the extruder 1 in FIG. 1, respectively. Then, I learned that if each curve is extrapolated from this graph to the position of the inner surface of the cylinder 2, it is possible to predict the temperature of the molten resin on the inner surface of the cylinder 2. This invention was made in view of the above circumstances,
The temperature of the molten resin inside the cylinder can be accurately predicted,
The resin temperature can always be maintained at the desired temperature,
The purpose of the present invention is to provide a resin temperature control method for a plastic molding machine that increases the amount of resin discharged, reduces scorch, and saves energy, does not wear out the temperature measuring element, and allows extruders to operate continuously for long periods of time. Then, two or more temperature measuring elements are arranged at different distances from the inner surface of the cylinder in the thickness direction of the cylinder wall, and the temperature of the inner surface of the cylinder is calculated from the measured temperature obtained by these temperature measuring elements. Find the screw rotation speed that changes the temperature of the molten resin to this temperature,
The corrected temperature obtained from five parameters: room temperature, set temperature, screw shape, and resin type is added to predict the molten resin temperature in the cylinder, and the melting temperature is calculated based on the deviation between this predicted temperature and the desired resin temperature. This method is characterized by controlling the resin temperature. Hereinafter, the present invention will be explained in detail with reference to the drawings. First, the arrangement of temperature measuring elements in the temperature control method of the present invention will be explained with reference to FIG. Figure 5 shows
This figure shows a cross section of the cylinder 2 of the extruder 1 to which the present invention is applied, taken along a plane perpendicular to the axis of the cylinder 2, and the same components as those shown in FIG. 1 are given the same reference numerals. be. Further, the screw 8 is omitted. Cylinder 2 temperature measurement zone
There are three temperature measurement holes 3a, 3 at the position corresponding to C 2 .
b and 3c are bored in the same plane, for example, at an angle of 120° to each other toward the central axis of the cylinder 2. Of these three temperature measuring holes 3a, 3b, 3c,
The first temperature measurement hole 3a is approximately 5 mm from the inner surface of the cylinder 2.
The second temperature measurement hole 3b is drilled leaving a thickness of mm.
is bored leaving a thickness of about 8 mm from the inner surface of the cylinder 2, and the third temperature measuring hole 3c is also bored leaving a thickness of about 15 mm. These temperature holes 3
The depths of a, 3b, and 3c are the depths of cylinder 2 of extruder 1.
The above depth varies depending on the thickness of cylinder 2.
This is a preferable value when the thickness is 25 to 50 mm. Depending on the conditions, the shallowest position of the temperature measurement hole (3
In c), it is preferable to set the position up to about 1/2 of the cylinder wall thickness from the viewpoint of improving the accuracy of temperature control. Temperature measuring elements 4a, 4b, 4c such as thermocouples are inserted and fixed into the bottoms of these temperature measuring holes 3a, 3b, 3c, respectively, and these temperature measuring elements 4a, 4b, 4c are arranged. cylinder 2 in position
temperature is now being measured. In this way, by arranging the temperature measuring elements 4a, 4b, and 4c in the cylinder 2 at different distances from the inner surface of the cylinder 2, one temperature measuring zone shown in FIG.
A temperature distribution curve corresponding to C 2 will be obtained. Then, the temperature measurement position by the first temperature measurement hole 3a is L, the temperature measurement position by the second temperature measurement hole 3b is M, 3.
The temperature measurement position by the temperature measurement hole 3c is denoted as N, the temperature measured by each temperature measurement element 4a, 4b, 4c is denoted as T L , T M , T N , and the temperature measurement position of the temperature measurement element 4a, 4
The output signals from b and 4c are T L signal, T M signal, T N
Signal. In addition, a temperature measuring element group consisting of three temperature measuring elements 4a, 4b, 4c is similarly arranged at the position of the cylinder 2 corresponding to the other temperature measuring zones C3 and C4 of the extruder 1. Temperature distribution curves corresponding to zones C 3 and C 4 can be obtained. Then, the T L signal, T M signal, and T N representing the temperatures T L , T M , and T N at the L, M, and N positions of the cylinder 2 measured by these temperature measuring elements 4a, 4b, and 4c are transmitted .
The signal is processed by the processing system shown in FIG. FIG. 6 shows an example of a processing system for this temperature control method, and only one corresponding to one temperature measurement zone C2 is shown. First, temperature measuring element 4
The T L signal, T M signal, and T N signal detected and outputted from a, 4b, and 4c are respectively input to linearizers 9, 9, and 9, and then linearized to A/D converters 10, 10, and 10. The data is digitized and input to the microprocessor 11. At the same time, the rotational speed of the screw 8 and the room temperature, which change the temperature of the molten resin, are measured and similarly input to the microprocessor 11 via the linearizer 9 and A/D converter 10. Furthermore, data regarding the shape of the screw 8, the type of resin, and the set temperature are also input to the microprocessor 11. Note that the above-mentioned linearizer 9 and A/D converter 10
are not required if they are incorporated in each detection means. Moreover, the linearizer 9 has an A/
It may be installed after the D converter 10, and the installation position is determined as necessary. The microprocessor 11 calculates a temperature distribution curve from the T L signal, T M signal, and T N signal. For example, if the temperature distribution curve is expressed as a quadratic curve, assume the following equation: y=ax 2 +bx+c (1) y: Temperature of cylinder 2 x: Distance from the inner surface of cylinder 2 to the temperature measurement position This equation (1) corresponds to each position of L, M, and N above.
Substitute xL, xM, xN and yT L , yT M , yT N ,
By solving the ternary quadratic equation, a, b, in equation (1),
c is determined, and an equation representing the temperature distribution curve is determined. Then, in this equation, x = 0 (inner surface of cylinder 2)
By substituting , the temperature of the inner surface of the cylinder 2 can be found. Next, the temperature of the inner surface of the cylinder 2 is determined by the screw rotation speed, room temperature, set temperature,
A correction temperature determined by a program stored in advance from five parameters that vary the temperature of molten resin depending on the screw shape and resin type (including differences in grade within the same resin), and determined by these parameters. are added to calculate the predicted temperature of the molten resin. Further, this predicted temperature is compared with a separately stored desired resin temperature, the deviation thereof is determined, and the set temperature of the temperature controller 5 is calculated based on this deviation. This set temperature signal is input to the D/A converter 12, converted into an analog signal, and input to the temperature controller 5. A T N signal from a temperature measuring element 4c is separately inputted to the temperature controller 5, and this T N signal is compared with a set temperature, and the heating device 6 such as a band heater or an embedded heater, or a cooling blower, etc. The cooling device 7 is operated to make T N match the set temperature. In addition,
The temperature measurement signal input to the temperature controller 5 at this time is
Not limited to the T N signal from the temperature measuring element 4c,
Although the T L and T M signals from the temperature measuring elements 4a and 4b may be used, it is preferable to perform the measurement at the farthest position from the inner surface of the cylinder 2 in order to prevent variations in resin temperature. At the same time, the microprocessor 11 controls the temperature controller 5 at the set temperature based on the temperature changes at the L, M, and N positions from the temperature measuring elements 4a, 4b, and 4c.
The input timing to the temperature controller 5 is calculated, and the timing for inputting the set temperature to the temperature controller 5 is instructed. Thus, by matching T N to the set temperature,
The predicted temperature now matches the desired resin temperature. According to such a temperature control method, three temperature measuring elements 4a, 4b, 4c are arranged inside the cylinder 2 at varying distances from the inner surface of the cylinder 2, thereby controlling the temperature inside the cylinder 2. Since the temperature of the molten resin in the cylinder 2 is determined from the distribution, the temperature measuring element 4 does not have to come into direct contact with the molten resin, so the temperature measuring element 4 does not wear out. In addition, to the molten resin temperature obtained in this way, a correction temperature obtained from five parameters that change the temperature of the molten resin: screw rotation speed, room temperature, screw shape, set temperature, and resin type is added, Since the predicted temperature is calculated, this predicted temperature is always accurate even if the screw rotation speed, room temperature, screw shape, set temperature, and type of resin change. Then, the deviation between this predicted temperature and the desired resin temperature is determined, the set temperature of the temperature controller 5 is calculated based on this deviation, and the temperature at the N point furthest from the inner surface of the cylinder 2 is controlled using this set temperature. Therefore, the molten resin temperature quickly matches the desired temperature, and the cycling phenomenon of the molten resin temperature caused by the time delay of the heat passing through the cylinder 2 is reduced. Further, since the above calculation processing is performed by the microprocessor 11, the control speed is increased, and the molten resin temperature can be brought to the desired desired temperature in a short time. In the above example, three temperature measuring elements 4 were arranged in one temperature measuring zone, but depending on the type of extruder 1 and extrusion conditions, the temperature distribution of the cylinder 2 may be y = ax.
+b or y=alnx+b, and in this case, two temperature measuring elements 4
a, 4b are sufficient. Alternatively, three or more temperature measuring elements 4 may be provided to predict the resin temperature more precisely.
Further, although the three temperature measuring elements 4a, 4b, and 4c are arranged radially, the arrangement is not limited to this, and in short, they may be arranged at different distances from the inner surface of the cylinder 2. In addition, in the above example, the temperature measuring zone C 2 of the extruder 1,
Although the temperature control method according to the present invention is applied to C 3 and C 4 , the temperature control method may be similarly applied to temperature measurement zone C 1 . However, in normal extrusion operations, temperature control in three zones, C2 , C3 , and C4 , is sufficient. Further, the means for heating and cooling the cylinder 2 is not limited to the above example, and heating and cooling means using a fluid heat medium such as silicone oil may also be used. Hereinafter, a specific explanation will be given by showing examples. Example 1 Screw diameter 50mm, L/D=20, cylinder wall thickness 25
mm, heater capacity C 1 ...2.2KW, C 2 , C 3 , C 4 ...
...A low density polyethylene containing a crosslinking agent was extruded using a 0.7KW extruder 1 equipped with a PID temperature controller and applying the temperature control method of the present invention. The temperature measuring elements are assumed to be two points 4a and 4b corresponding to the temperature measuring positions L and M in FIG. 5, and the temperature of the cylinder 2 is expressed as y=ax+b (2).
However, y is the temperature of the cylinder 2 (°C), and x is the distance (mm) from the inner surface of the cylinder 2 to the temperature measurement position. Then, let Y be the temperature after addition of the corrected temperature in equation (2), that is, the predicted temperature. The values corresponding to the measurement positions L and M are xL, yL, xM,
If yM, a=y L −y M /x L −x M b=y L x M −y M x L /x M −x L , so y=y L −y M /x L −x M x+y L x M −y M x L /x M −x L ……(2
') The addition term for the correction temperature is (y L - y M ) × n, and the n value is determined by the screw rotation speed, room temperature, screw shape, set temperature, and resin type (including differences in grades of the same resin). It is determined by measuring the actual resin temperature in advance using a temperature measuring screw or the like using the following parameters. Since x=0mm on the inner surface of the cylinder (2')
is y=y L x M −y M x L /x M −x L ...(2″). Therefore, the predicted temperature Y (℃) is Y=y L x M −y M x L / x M −x L + (y L −y M )×n ...(3) Now, if x M = 10 mm and x L = 5 mm, equation (3) becomes Y = 2y L − y M It is expressed as +(y L −y M )×n...(3').The set temperature of temperature measurement position M is: C1 zone...Fixed at 120℃ C2 , C3 , C4 zone...Micropro Setusa 1
According to instructions from 1. The desired resin temperature E (°C) for each zone is C 1 ... not specified in particular C 2 ... 126 °C C 3 ... 128 °C C 4 ... 130 °C previously stored in the memory in the microprocessor 11. shall be. The temperature control method is to calculate a new set temperature using the following equation and issue a command to the temperature controller 5. New set temperature = current set temperature - {Y - E} × 0.9 ...(4) The factor 0.9 in equation (4) is designed to asymptotically approach the desired resin temperature from a low point, and it may be 1, but it is not 1. The desired resin temperature may be exceeded. Under the above conditions, the screw rotation speed is
The actual resin temperature A was measured by changing the rpm to 30 rpm, 60 rpm, and 70 rpm, and the difference from the desired resin temperature E was compared. Table 1 shows y L , y M , n, Y, actual resin temperature (A), desired resin temperature (E), and (A )−(E). The actual resin temperature (A) was measured by drilling a through hole in each zone of the cylinder 2 and inserting a temperature measuring element until it came into contact with the molten resin.
【表】
第1表から、実際樹脂温度(A)と希望樹脂温度(E)
との偏差|A−E|は最高でも約1℃であつて非
常に精密な樹脂温度制御が行われている。このよ
うな方法で長時間押出機を運転すると、成形品の
品質、生産性等が後述する従来例1、2に比べて
大幅に改善される。
実施例 2
シラン架橋用中密度ポリエチレン混和物を用い
て、実施例1と同様の押出作業を行つた。第2表
に、押出開始後、2〜4回の設定温度変更指令の
あとの各測温ゾーンのyL,yM,n,Y、実際樹脂
温度(A)、希望樹脂温度(E)および(A)−(E)の値を示
す。[Table] From Table 1, actual resin temperature (A) and desired resin temperature (E)
The deviation |A−E| is approximately 1° C. at most, and extremely precise resin temperature control is performed. When the extruder is operated for a long period of time in this manner, the quality, productivity, etc. of the molded product are significantly improved compared to Conventional Examples 1 and 2, which will be described later. Example 2 An extrusion operation similar to Example 1 was carried out using a medium density polyethylene blend for silane crosslinking. Table 2 shows yL , yM , n, Y, actual resin temperature (A), desired resin temperature (E) and Indicates the value of (A)−(E).
【表】
第2表から、偏差|A−E|は最高でも約0.6
℃であつて、極めて高精度に樹脂温度が制御され
ていることがわかる。
次に、従来の温度制御法を適用した従来例を示
す。
従来例 1
実施例1の押出機と同様の押出機を用い、C1、
C2、C3、C4の各ゾーンの測温位置Mで、測温し
かつこの温度を通常のPID式温度調節計で120℃
に制御した。この制御方法は、第1図に示した極
く一般的な押出機の温度制御方法である。使用樹
脂、実際樹脂温度の測定、希望樹脂温度、スクリ
ユ回転数は実施例1と同様である。第3表に、各
ゾーンのM点の温度、実際樹脂温度A、希望樹脂
温度E,A−Eを示す。[Table] From Table 2, the deviation |A-E| is approximately 0.6 at most.
℃, and it can be seen that the resin temperature is controlled with extremely high precision. Next, a conventional example to which a conventional temperature control method is applied will be shown. Conventional Example 1 Using an extruder similar to that of Example 1, C 1 ,
Measure the temperature at temperature measurement position M in each zone of C 2 , C 3 , and C 4 , and adjust this temperature to 120℃ using a normal PID temperature controller.
was controlled. This control method is a very common temperature control method for an extruder shown in FIG. The resin used, actual resin temperature measurement, desired resin temperature, and screw rotation speed are the same as in Example 1. Table 3 shows the temperature at point M in each zone, the actual resin temperature A, and the desired resin temperature E, A-E.
【表】
従来例 2
実施例1と同様の押出機を用い、測温位置を各
ゾーンのM点のみとし、樹脂温度予測式として、
Y=yM+△T1+△T2 ……(5)
但し、Y……予測樹脂温度
yM……M点のシリンダ温度
△T1……室温による補正温度分
△T2……スクリユ回転数による補正温度
分
を用いて、架橋剤入り低密度ポリエチレンを押出
した。この方法は、特願昭56−191906号に示され
た温度制御方法の例である。
各ゾーンの設定温度は、
C1……120℃固定
C2、C3、C4……マイクロプロセツサからの指
令による。
また、各ゾーンの希望樹脂温度Eは
C1……特に定めず
C2……126℃
C3……128℃
C4……130℃予めマイクロプロセツサ
にメモリしておく。
とする。
温度制御方法は、次式によつて新しい設定温度
を演算してM点の温度を制御する温度調節計へ指
令する方式とする。
新設定温度=現在の設定温度−{Y−E}×0.9
……(6)
その他の条件は実施施1と同様として、押出を
行つた。第4表に押出開始後、2〜4回の設定温
度変更指令の後の各ゾーンのyM,Y、実際樹脂
温度A、希望樹脂温度Eおよび、A−Eを示す。[Table] Conventional Example 2 Using the same extruder as in Example 1, measuring the temperature only at point M in each zone, the resin temperature prediction formula is as follows: Y=y M +△T 1 +△T 2 ……( 5) However, Y...Predicted resin temperature y M ...Cylinder temperature at point M △T 1 ...Temperature corrected by room temperature △ T2 ...Temperature corrected by screw rotation speed Extruded polyethylene. This method is an example of the temperature control method disclosed in Japanese Patent Application No. 191906/1982. The set temperature of each zone is: C1 ...Fixed at 120℃ C2 , C3 , C4 ...Based on commands from the microprocessor. Further, the desired resin temperature E for each zone is C1 ...not specified in particular C2 ...126°C C3 ...128°C C4 ...130°C and is stored in advance in the microprocessor. shall be. The temperature control method is to calculate a new set temperature using the following equation and issue a command to the temperature controller that controls the temperature at point M. New set temperature = Current set temperature - {Y-E} x 0.9
...(6) Extrusion was carried out under the same conditions as in Example 1. Table 4 shows y M , Y, actual resin temperature A, desired resin temperature E, and A-E of each zone after two to four set temperature change commands after the start of extrusion.
【表】
第4表より、実際樹脂温度Aと希望樹脂温度E
との偏差|A−E|は最高で約4.5℃となつて従
来例1に比べると小さくなつているが、まだ精密
な樹脂温度制御とは言えない状態である。
従来例 3
実施例1において、補正温度のn値の算出に、
スクリユ回転数と室温の二つのパラメータを採用
して行つた以外は全く同様にして押出作業を行つ
た。第5表にその結果を示す。なお、この方法は
特願昭57−31575号に示された温度制御方法の例
である。[Table] From Table 4, actual resin temperature A and desired resin temperature E
The maximum deviation |A−E| is about 4.5° C., which is smaller than that of Conventional Example 1, but this still cannot be said to be precise resin temperature control. Conventional Example 3 In Example 1, to calculate the n value of the corrected temperature,
Extrusion work was carried out in exactly the same manner except that two parameters were adopted: screw rotation speed and room temperature. Table 5 shows the results. This method is an example of the temperature control method disclosed in Japanese Patent Application No. 57-31575.
【表】
上表から実際樹脂温(A)と希望樹脂温(E)との偏差
|(A)−(E)|が最高でも約2.5℃であつて従来例1、
2に比べるとかなり精密な樹脂温度制御ができて
いるが、いまだ十分な精度とは言えない。これは
溶融樹脂温度を変動させるパラメータにスクリユ
回転数と室温の2つを採用したためである。
以上説明したように、この発明のプラスチツク
成形機の樹脂温度制御方法は、プラスチツク成形
機のシリンダ壁の厚さ方向にシリンダ内表面から
の距離を変えて2つ以上測温素子を配設し、これ
らの測温素子による測定温度と、予じめ実測され
たスクリユ回転数、スクリユ形状、室温、設定温
度および樹脂の種類の溶融樹脂の温度を変動させ
る5個のパラメータから求められた補正値とから
シリンダ内の溶融樹脂温度を予測し、この予測温
度と希望樹脂温度との偏差に基づいて溶融樹脂温
度を制御するものである。したがつて、この温度
制御方法によれば、上記パラメータが変動して
も、常に溶融樹脂温度を希望樹脂温度に維持する
ことができる。また、シリンダを通過する熱の遅
延に起因する溶融樹脂温度のサイクリング現象が
少なくなり、温度変動が小さくなる。よつて、溶
融樹脂吐出量の増大、スコーチの減少、熱エネル
ギーの節約が達成でき、高品質の成形品を低コス
トで製造できる。また、測温素子を直接溶融樹脂
に接触させる方法に比べて測温素子をほとんど取
替える必要がなくなり、さらにまたシリンダ、ス
クリユの破損というトラブルもなくなり成形機の
長期連続稼動が可能となる。[Table] From the table above, the deviation between the actual resin temperature (A) and the desired resin temperature (E) |(A)−(E)| is approximately 2.5℃ at maximum, and Conventional Example 1
Compared to 2, resin temperature control is much more precise, but it still cannot be said to be accurate enough. This is because two parameters, the screw rotation speed and the room temperature, are used to change the temperature of the molten resin. As explained above, the resin temperature control method for a plastic molding machine of the present invention includes arranging two or more temperature measuring elements at different distances from the inner surface of the cylinder in the thickness direction of the cylinder wall of the plastic molding machine. The temperature measured by these temperature measuring elements and the correction value obtained from five parameters that vary the temperature of the molten resin of the screw rotation speed, screw shape, room temperature, set temperature, and resin type measured in advance. The temperature of the molten resin in the cylinder is predicted from the temperature of the molten resin, and the temperature of the molten resin is controlled based on the deviation between the predicted temperature and the desired resin temperature. Therefore, according to this temperature control method, even if the above parameters change, the molten resin temperature can always be maintained at the desired resin temperature. Furthermore, the phenomenon of cycling of the molten resin temperature due to the delay of heat passing through the cylinder is reduced, and temperature fluctuations are reduced. Therefore, it is possible to increase the amount of molten resin discharged, reduce scorch, and save thermal energy, and high-quality molded products can be manufactured at low cost. Furthermore, compared to a method in which the temperature measuring element is brought into direct contact with the molten resin, there is almost no need to replace the temperature measuring element, and furthermore, there is no trouble such as damage to the cylinder or screw, and the molding machine can be operated continuously for a long period of time.
第1図は従来の樹脂温度制御方法を適用した押
出機を示す概略構成図、第2図は室温の変化と△
T1との関係を示すグラフ、第3図はスクリユ回
転数と△T2との関係を示すグラフ、第4図は押
出機のシリンダ内部の温度分布を示すグラフ、第
5図は、この発明の方法を適用した押出機のシリ
ンダ内部の測温素子の配設状態の一例を示す断面
図、第6図はこの発明の方法に用いられる処理シ
ステムの一例を示すブロツク図である。
1……押出機、2……シリンダ、5……温度調
節計、6……加熱装置、7……冷却装置、11…
…マイクロプロセツサ、3a……第1番目の測温
穴、3b……第2番目の測温穴、3c……第3番
目の測温穴、4a……第1番目の測温素子、4b
……第2番目の測温素子、4c……第3番目の測
温素子。
Figure 1 is a schematic configuration diagram showing an extruder using the conventional resin temperature control method, and Figure 2 shows changes in room temperature and △
FIG. 3 is a graph showing the relationship between screw rotation speed and ΔT 2. FIG. 4 is a graph showing the temperature distribution inside the cylinder of the extruder. FIG. 6 is a cross-sectional view showing an example of the arrangement of temperature measuring elements inside the cylinder of an extruder to which the method of the present invention is applied, and FIG. 6 is a block diagram showing an example of a processing system used in the method of the present invention. DESCRIPTION OF SYMBOLS 1... Extruder, 2... Cylinder, 5... Temperature controller, 6... Heating device, 7... Cooling device, 11...
...Microprocessor, 3a...First temperature measurement hole, 3b...Second temperature measurement hole, 3c...Third temperature measurement hole, 4a...First temperature measurement element, 4b
...Second temperature measuring element, 4c...Third temperature measuring element.
Claims (1)
にシリンダ内表面からの距離を変えて2個以上の
測温素子を配設し、これら測温素子によつて測定
されたシリンダの温度からシリンダ内表面の温度
を求め、この温度に、スクリユ回転数、室温、設
定温度、スクリユ形状および樹脂の種類の溶融樹
脂の温度を変動させる5個のパラメータから求め
られた補正温度を加算して、シリンダ内の溶融樹
脂の温度を予測し、この予測温度と希望樹脂温度
との偏差を求め、この偏差に基づいてシリンダ内
の溶融樹脂の温度を制御することを特徴とするプ
ラスチツク成形機の樹脂温度制御方法。1 Two or more temperature measuring elements are arranged at different distances from the inner surface of the cylinder in the thickness direction of the cylinder wall of a plastic molding machine, and the inner surface of the cylinder is determined from the temperature of the cylinder measured by these temperature measuring elements. The temperature in the cylinder is determined by adding to this temperature the correction temperature determined from five parameters that vary the temperature of the molten resin: screw rotation speed, room temperature, set temperature, screw shape, and resin type. A resin temperature control method for a plastic molding machine, which comprises predicting the temperature of a molten resin, determining the deviation between the predicted temperature and a desired resin temperature, and controlling the temperature of the molten resin in a cylinder based on this deviation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58041038A JPS59167241A (en) | 1983-03-12 | 1983-03-12 | Controlling method of temperature of resin in plastic molding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58041038A JPS59167241A (en) | 1983-03-12 | 1983-03-12 | Controlling method of temperature of resin in plastic molding machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59167241A JPS59167241A (en) | 1984-09-20 |
| JPH0355292B2 true JPH0355292B2 (en) | 1991-08-22 |
Family
ID=12597227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58041038A Granted JPS59167241A (en) | 1983-03-12 | 1983-03-12 | Controlling method of temperature of resin in plastic molding machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59167241A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6442930B2 (en) * | 2014-08-29 | 2018-12-26 | 横浜ゴム株式会社 | Rubber extruder and rubber extrusion control method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6149095A (en) * | 1984-08-17 | 1986-03-10 | 出光地熱開発株式会社 | Heat loss preventing apparatus of geothermal well |
-
1983
- 1983-03-12 JP JP58041038A patent/JPS59167241A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59167241A (en) | 1984-09-20 |
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