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JPH0356911B2 - - Google Patents
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JPH0356911B2 - - Google Patents

Info

Publication number
JPH0356911B2
JPH0356911B2 JP28012686A JP28012686A JPH0356911B2 JP H0356911 B2 JPH0356911 B2 JP H0356911B2 JP 28012686 A JP28012686 A JP 28012686A JP 28012686 A JP28012686 A JP 28012686A JP H0356911 B2 JPH0356911 B2 JP H0356911B2
Authority
JP
Japan
Prior art keywords
metal foil
glass fiber
fiber cloth
flatness
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP28012686A
Other languages
Japanese (ja)
Other versions
JPS63132044A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP28012686A priority Critical patent/JPS63132044A/en
Publication of JPS63132044A publication Critical patent/JPS63132044A/en
Publication of JPH0356911B2 publication Critical patent/JPH0356911B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

産業上の利用分野 本発明は、金属箔の表面平滑性に優れた金属箔
張積層板に関する。 従来の技術 金属箔張積層板は、シート状の基材に熱硬化性
樹脂を含浸乾燥して得たプリプレグを、表面に金
属箔(18〜35μ厚)を載置した状態で積層成形し
一体化したものである。この積層板は、表面の金
属箔をエツチングして、配線パターンを形成した
回路板とするが、電子機器の小型軽量化に伴なつ
て配線パターンも細かくなつている。そして、細
かい配線パターンを形成するために、UV感光フ
イルムを使用したエツチングが行なわれている。 発明が解決しようとする問題点 ところで、上記金属箔張積層板において、金属
箔に接する位置の基材としてガラス繊維布が使用
されている場合、ガラス繊維布の織目の凹凸が金
属箔上に現われてしまう。その結果、UV感光フ
イルムが前記凹凸に追随できず、凹部での金属箔
と密着性が悪くなり、UV感光フイルムを露光後
エツチングした際、密着性の悪い部分にエツチン
グ液がしみ入り、細線パターンの断線が生じやす
い。 本発明は、少なくとも金属箔と接する位置にガ
ラス繊維布を基材として使用した金属箔張積層板
において、金属箔面の表面平滑性をよくして、細
線パターンの形成に対応できる金属箔張積層板を
提供することを目的とする。 問題点を解決するための手段 上記目的を達成するために、本発明は、金属箔
と接する位置にガラス繊維布を基材として使用し
た金属箔張積層板において、ガラス繊維布として
布を構成する経糸および緯糸の扁平度が0.2〜
0.13の平織ガラス繊維布を使用したものである。 作 用 通常、金属箔張積層板に基材として使用される
ガラス繊維布は平織であり、織りあつたガラス繊
維布は、経糸の扁平度が0.23〜0.25、緯糸の扁平
度が0.2〜0.21であり、経糸の扁平度が緯糸より
小さくなつている。一方、積層板の表面粗さは、
基材の縦方向が横方向より平滑であり、このこと
に着目して検討した結果、ガラス繊維布を構成す
る糸の扁平度を変えることで、表面平滑性が良好
になることを見い出した。 扁平度は、糸を解繊することにより大きくでき
る。扁平度が0.2を越えて小さくなると、表面平
滑性の改善が十分でなく、0.13を越えて大きくな
ると、解繊してガラス繊維布に織ることができ
ず、糸切れ、繊維の毛羽立ちが多くなる。 尚、扁平度とは、第1図に示すように、ガラス
繊維1を多数収束して構成した糸2の断面で、短
径(B)/長径(A)で表わされる。この値が小さいほど
扁平度は大きい。 実施例 本発明の実施例を説明する。 実施例1〜3、比較例1〜2 ビスフエノール型エポキシ樹脂(商品名Ep−
1001、油化シエル製、エポキシ当量550)100重量
部に、ジシアンジアミド4重量部、ベンジルジメ
チルアミン0.3重量部を加えてワニスを調整し、
これを第1表に示す平織ガラス繊維布に含浸乾燥
して、樹脂量40%のプリプレグを得た。このプリ
プレグを8枚重ね、その両面に18μ厚の銅箔を配
置し、成形圧力40Kg/cm2、成形温度170℃で60分
間成形を行ない、1.6mm厚の銅張積層板を得た。 その銅張積層板の表面粗さの測定値およびエツ
チングにより形成した配線パターンの断線の有無
を第1表にあわせて示す。 尚、上記実施例では、基材の全てに所定の平織
ガラス繊維布を使用したが、中心層はガラス不織
布等他の基材を使用したものであつてもよい。
INDUSTRIAL APPLICATION FIELD The present invention relates to a metal foil-clad laminate with excellent metal foil surface smoothness. Conventional technology Metal foil-clad laminates are made by laminating and molding prepreg obtained by impregnating and drying a sheet-like base material with thermosetting resin, with metal foil (18 to 35μ thick) placed on the surface. It has become. This laminated board is a circuit board with a wiring pattern formed by etching the metal foil on the surface, but as electronic devices become smaller and lighter, the wiring patterns are becoming finer. In order to form fine wiring patterns, etching is performed using UV-sensitive film. Problems to be Solved by the Invention By the way, in the metal foil-clad laminate described above, when glass fiber cloth is used as the base material in contact with the metal foil, the unevenness of the weave of the glass fiber cloth may appear on the metal foil. It will appear. As a result, the UV photosensitive film is unable to follow the unevenness, resulting in poor adhesion to the metal foil in the recessed areas.When the UV photosensitive film is etched after exposure, the etching solution seeps into the areas with poor adhesion, resulting in fine line patterns. wire breakage is likely to occur. The present invention provides a metal foil-clad laminate that uses glass fiber cloth as a base material at least in the position in contact with the metal foil, and has a metal foil-clad laminate that can improve the surface smoothness of the metal foil surface and can support the formation of fine line patterns. The purpose is to provide a board. Means for Solving the Problems In order to achieve the above object, the present invention provides a metal foil-clad laminate using glass fiber cloth as a base material at a position in contact with the metal foil, in which the cloth is configured as glass fiber cloth. The flatness of the warp and weft is 0.2~
0.13 plain weave glass fiber cloth is used. Function Usually, the glass fiber cloth used as a base material for metal foil-clad laminates is a plain weave, and the woven glass fiber cloth has a warp flatness of 0.23 to 0.25 and a weft flatness of 0.2 to 0.21. Yes, the flatness of the warp threads is smaller than that of the weft threads. On the other hand, the surface roughness of the laminate is
The vertical direction of the base material is smoother than the horizontal direction, and as a result of focusing on this fact and studying it, we found that the surface smoothness can be improved by changing the flatness of the threads that make up the glass fiber cloth. The flatness can be increased by defibrating the yarn. If the flatness is smaller than 0.2, the surface smoothness will not be improved enough, and if it is larger than 0.13, it will not be possible to defibrate and weave into glass fiber cloth, resulting in yarn breakage and fiber fuzz. . As shown in FIG. 1, the flatness is a cross section of a thread 2 formed by converging a large number of glass fibers 1, and is expressed by the short axis (B)/long axis (A). The smaller this value is, the greater the flatness is. Examples Examples of the present invention will be described. Examples 1 to 3, Comparative Examples 1 to 2 Bisphenol type epoxy resin (trade name Ep-
1001, manufactured by Yuka Shell, epoxy equivalent: 550) To 100 parts by weight, 4 parts by weight of dicyandiamide and 0.3 parts by weight of benzyldimethylamine were added to prepare a varnish,
This was impregnated into a plain-woven glass fiber cloth shown in Table 1 and dried to obtain a prepreg with a resin content of 40%. Eight sheets of this prepreg were stacked, 18 μm thick copper foil was placed on both sides, and molding was carried out at a molding pressure of 40 kg/cm 2 and a molding temperature of 170° C. for 60 minutes to obtain a 1.6 mm thick copper clad laminate. Table 1 also shows the measured values of the surface roughness of the copper-clad laminate and the presence or absence of disconnection in the wiring pattern formed by etching. In the above embodiments, a predetermined plain-woven glass fiber cloth was used for all the base materials, but the center layer may be made of other base materials such as glass non-woven cloth.

【表】 発明の効果 上述したように、本発明によれば、その構成
を、金属箔に接して使用される平織ガラス繊維布
の経糸および緯糸の扁平度を0.2〜0.13としたた
め、金属箔の表面平滑性が優れた金属箔張積層板
となる。その結果、UV感光フイルムと金属箔と
密着性が良好となり、エツチングによる細線パタ
ーン形成の断線不良率の低減を図れる点、その工
業的価値は極めて大である。
[Table] Effects of the Invention As described above, according to the present invention, the flatness of the warp and weft of the plain-woven glass fiber cloth used in contact with the metal foil is set to 0.2 to 0.13, so that the flatness of the metal foil is The result is a metal foil-clad laminate with excellent surface smoothness. As a result, the adhesion between the UV-sensitive film and the metal foil is improved, and the industrial value is extremely high in that it is possible to reduce the disconnection defect rate when forming fine line patterns by etching.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はガラス繊維布を構成する糸の断面図で
ある。 1はガラス繊維、2は糸。
FIG. 1 is a cross-sectional view of the threads constituting the glass fiber cloth. 1 is glass fiber, 2 is thread.

Claims (1)

【特許請求の範囲】[Claims] 1 シート状の基材に熱硬化性樹脂を含浸乾燥し
て得たプリプレグを、表面に金属箔を載置して積
層成形した積層板であつて、少なくとも前記金属
箔と接する位置に平織ガラス繊維布を基材として
用いた積層板において、前記平織ガラス繊維布の
経糸および緯糸の扁平度を0.2〜0.13としたこと
を特徴とする金属箔張積層板。
1 A laminate made by laminating and molding a prepreg obtained by impregnating and drying a thermosetting resin into a sheet-like base material and placing a metal foil on the surface, which has plain-woven glass fibers at least in a position in contact with the metal foil. 1. A metal foil-clad laminate using cloth as a base material, characterized in that the flatness of the warp and weft of the plain-woven glass fiber cloth is 0.2 to 0.13.
JP28012686A 1986-11-25 1986-11-25 Metallic foil-clad laminated board Granted JPS63132044A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28012686A JPS63132044A (en) 1986-11-25 1986-11-25 Metallic foil-clad laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28012686A JPS63132044A (en) 1986-11-25 1986-11-25 Metallic foil-clad laminated board

Publications (2)

Publication Number Publication Date
JPS63132044A JPS63132044A (en) 1988-06-04
JPH0356911B2 true JPH0356911B2 (en) 1991-08-29

Family

ID=17620696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28012686A Granted JPS63132044A (en) 1986-11-25 1986-11-25 Metallic foil-clad laminated board

Country Status (1)

Country Link
JP (1) JPS63132044A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03128239A (en) * 1989-10-16 1991-05-31 Sumitomo Bakelite Co Ltd Manufacture of laminate
JP2501038B2 (en) * 1990-10-15 1996-05-29 松下電工株式会社 Laminated board manufacturing method
US5435877A (en) * 1992-05-07 1995-07-25 Mitsubishi Gas Chemical Company, Inc. Process for the production of copper-clad laminate
WO1999028126A1 (en) * 1997-12-01 1999-06-10 Nitto Boseki Co., Ltd. Prepreg for multilayer printed wiring boards and process for producing the same

Also Published As

Publication number Publication date
JPS63132044A (en) 1988-06-04

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