JPH0356911B2 - - Google Patents
Info
- Publication number
- JPH0356911B2 JPH0356911B2 JP28012686A JP28012686A JPH0356911B2 JP H0356911 B2 JPH0356911 B2 JP H0356911B2 JP 28012686 A JP28012686 A JP 28012686A JP 28012686 A JP28012686 A JP 28012686A JP H0356911 B2 JPH0356911 B2 JP H0356911B2
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- glass fiber
- fiber cloth
- flatness
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000004744 fabric Substances 0.000 claims description 18
- 239000003365 glass fiber Substances 0.000 claims description 18
- 239000011888 foil Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 238000005530 etching Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Description
産業上の利用分野
本発明は、金属箔の表面平滑性に優れた金属箔
張積層板に関する。
従来の技術
金属箔張積層板は、シート状の基材に熱硬化性
樹脂を含浸乾燥して得たプリプレグを、表面に金
属箔(18〜35μ厚)を載置した状態で積層成形し
一体化したものである。この積層板は、表面の金
属箔をエツチングして、配線パターンを形成した
回路板とするが、電子機器の小型軽量化に伴なつ
て配線パターンも細かくなつている。そして、細
かい配線パターンを形成するために、UV感光フ
イルムを使用したエツチングが行なわれている。
発明が解決しようとする問題点
ところで、上記金属箔張積層板において、金属
箔に接する位置の基材としてガラス繊維布が使用
されている場合、ガラス繊維布の織目の凹凸が金
属箔上に現われてしまう。その結果、UV感光フ
イルムが前記凹凸に追随できず、凹部での金属箔
と密着性が悪くなり、UV感光フイルムを露光後
エツチングした際、密着性の悪い部分にエツチン
グ液がしみ入り、細線パターンの断線が生じやす
い。
本発明は、少なくとも金属箔と接する位置にガ
ラス繊維布を基材として使用した金属箔張積層板
において、金属箔面の表面平滑性をよくして、細
線パターンの形成に対応できる金属箔張積層板を
提供することを目的とする。
問題点を解決するための手段
上記目的を達成するために、本発明は、金属箔
と接する位置にガラス繊維布を基材として使用し
た金属箔張積層板において、ガラス繊維布として
布を構成する経糸および緯糸の扁平度が0.2〜
0.13の平織ガラス繊維布を使用したものである。
作 用
通常、金属箔張積層板に基材として使用される
ガラス繊維布は平織であり、織りあつたガラス繊
維布は、経糸の扁平度が0.23〜0.25、緯糸の扁平
度が0.2〜0.21であり、経糸の扁平度が緯糸より
小さくなつている。一方、積層板の表面粗さは、
基材の縦方向が横方向より平滑であり、このこと
に着目して検討した結果、ガラス繊維布を構成す
る糸の扁平度を変えることで、表面平滑性が良好
になることを見い出した。
扁平度は、糸を解繊することにより大きくでき
る。扁平度が0.2を越えて小さくなると、表面平
滑性の改善が十分でなく、0.13を越えて大きくな
ると、解繊してガラス繊維布に織ることができ
ず、糸切れ、繊維の毛羽立ちが多くなる。
尚、扁平度とは、第1図に示すように、ガラス
繊維1を多数収束して構成した糸2の断面で、短
径(B)/長径(A)で表わされる。この値が小さいほど
扁平度は大きい。
実施例
本発明の実施例を説明する。
実施例1〜3、比較例1〜2
ビスフエノール型エポキシ樹脂(商品名Ep−
1001、油化シエル製、エポキシ当量550)100重量
部に、ジシアンジアミド4重量部、ベンジルジメ
チルアミン0.3重量部を加えてワニスを調整し、
これを第1表に示す平織ガラス繊維布に含浸乾燥
して、樹脂量40%のプリプレグを得た。このプリ
プレグを8枚重ね、その両面に18μ厚の銅箔を配
置し、成形圧力40Kg/cm2、成形温度170℃で60分
間成形を行ない、1.6mm厚の銅張積層板を得た。
その銅張積層板の表面粗さの測定値およびエツ
チングにより形成した配線パターンの断線の有無
を第1表にあわせて示す。
尚、上記実施例では、基材の全てに所定の平織
ガラス繊維布を使用したが、中心層はガラス不織
布等他の基材を使用したものであつてもよい。
INDUSTRIAL APPLICATION FIELD The present invention relates to a metal foil-clad laminate with excellent metal foil surface smoothness. Conventional technology Metal foil-clad laminates are made by laminating and molding prepreg obtained by impregnating and drying a sheet-like base material with thermosetting resin, with metal foil (18 to 35μ thick) placed on the surface. It has become. This laminated board is a circuit board with a wiring pattern formed by etching the metal foil on the surface, but as electronic devices become smaller and lighter, the wiring patterns are becoming finer. In order to form fine wiring patterns, etching is performed using UV-sensitive film. Problems to be Solved by the Invention By the way, in the metal foil-clad laminate described above, when glass fiber cloth is used as the base material in contact with the metal foil, the unevenness of the weave of the glass fiber cloth may appear on the metal foil. It will appear. As a result, the UV photosensitive film is unable to follow the unevenness, resulting in poor adhesion to the metal foil in the recessed areas.When the UV photosensitive film is etched after exposure, the etching solution seeps into the areas with poor adhesion, resulting in fine line patterns. wire breakage is likely to occur. The present invention provides a metal foil-clad laminate that uses glass fiber cloth as a base material at least in the position in contact with the metal foil, and has a metal foil-clad laminate that can improve the surface smoothness of the metal foil surface and can support the formation of fine line patterns. The purpose is to provide a board. Means for Solving the Problems In order to achieve the above object, the present invention provides a metal foil-clad laminate using glass fiber cloth as a base material at a position in contact with the metal foil, in which the cloth is configured as glass fiber cloth. The flatness of the warp and weft is 0.2~
0.13 plain weave glass fiber cloth is used. Function Usually, the glass fiber cloth used as a base material for metal foil-clad laminates is a plain weave, and the woven glass fiber cloth has a warp flatness of 0.23 to 0.25 and a weft flatness of 0.2 to 0.21. Yes, the flatness of the warp threads is smaller than that of the weft threads. On the other hand, the surface roughness of the laminate is
The vertical direction of the base material is smoother than the horizontal direction, and as a result of focusing on this fact and studying it, we found that the surface smoothness can be improved by changing the flatness of the threads that make up the glass fiber cloth. The flatness can be increased by defibrating the yarn. If the flatness is smaller than 0.2, the surface smoothness will not be improved enough, and if it is larger than 0.13, it will not be possible to defibrate and weave into glass fiber cloth, resulting in yarn breakage and fiber fuzz. . As shown in FIG. 1, the flatness is a cross section of a thread 2 formed by converging a large number of glass fibers 1, and is expressed by the short axis (B)/long axis (A). The smaller this value is, the greater the flatness is. Examples Examples of the present invention will be described. Examples 1 to 3, Comparative Examples 1 to 2 Bisphenol type epoxy resin (trade name Ep-
1001, manufactured by Yuka Shell, epoxy equivalent: 550) To 100 parts by weight, 4 parts by weight of dicyandiamide and 0.3 parts by weight of benzyldimethylamine were added to prepare a varnish,
This was impregnated into a plain-woven glass fiber cloth shown in Table 1 and dried to obtain a prepreg with a resin content of 40%. Eight sheets of this prepreg were stacked, 18 μm thick copper foil was placed on both sides, and molding was carried out at a molding pressure of 40 kg/cm 2 and a molding temperature of 170° C. for 60 minutes to obtain a 1.6 mm thick copper clad laminate. Table 1 also shows the measured values of the surface roughness of the copper-clad laminate and the presence or absence of disconnection in the wiring pattern formed by etching. In the above embodiments, a predetermined plain-woven glass fiber cloth was used for all the base materials, but the center layer may be made of other base materials such as glass non-woven cloth.
【表】
発明の効果
上述したように、本発明によれば、その構成
を、金属箔に接して使用される平織ガラス繊維布
の経糸および緯糸の扁平度を0.2〜0.13としたた
め、金属箔の表面平滑性が優れた金属箔張積層板
となる。その結果、UV感光フイルムと金属箔と
密着性が良好となり、エツチングによる細線パタ
ーン形成の断線不良率の低減を図れる点、その工
業的価値は極めて大である。[Table] Effects of the Invention As described above, according to the present invention, the flatness of the warp and weft of the plain-woven glass fiber cloth used in contact with the metal foil is set to 0.2 to 0.13, so that the flatness of the metal foil is The result is a metal foil-clad laminate with excellent surface smoothness. As a result, the adhesion between the UV-sensitive film and the metal foil is improved, and the industrial value is extremely high in that it is possible to reduce the disconnection defect rate when forming fine line patterns by etching.
第1図はガラス繊維布を構成する糸の断面図で
ある。
1はガラス繊維、2は糸。
FIG. 1 is a cross-sectional view of the threads constituting the glass fiber cloth. 1 is glass fiber, 2 is thread.
Claims (1)
て得たプリプレグを、表面に金属箔を載置して積
層成形した積層板であつて、少なくとも前記金属
箔と接する位置に平織ガラス繊維布を基材として
用いた積層板において、前記平織ガラス繊維布の
経糸および緯糸の扁平度を0.2〜0.13としたこと
を特徴とする金属箔張積層板。1 A laminate made by laminating and molding a prepreg obtained by impregnating and drying a thermosetting resin into a sheet-like base material and placing a metal foil on the surface, which has plain-woven glass fibers at least in a position in contact with the metal foil. 1. A metal foil-clad laminate using cloth as a base material, characterized in that the flatness of the warp and weft of the plain-woven glass fiber cloth is 0.2 to 0.13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28012686A JPS63132044A (en) | 1986-11-25 | 1986-11-25 | Metallic foil-clad laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28012686A JPS63132044A (en) | 1986-11-25 | 1986-11-25 | Metallic foil-clad laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63132044A JPS63132044A (en) | 1988-06-04 |
| JPH0356911B2 true JPH0356911B2 (en) | 1991-08-29 |
Family
ID=17620696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28012686A Granted JPS63132044A (en) | 1986-11-25 | 1986-11-25 | Metallic foil-clad laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63132044A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03128239A (en) * | 1989-10-16 | 1991-05-31 | Sumitomo Bakelite Co Ltd | Manufacture of laminate |
| JP2501038B2 (en) * | 1990-10-15 | 1996-05-29 | 松下電工株式会社 | Laminated board manufacturing method |
| US5435877A (en) * | 1992-05-07 | 1995-07-25 | Mitsubishi Gas Chemical Company, Inc. | Process for the production of copper-clad laminate |
| WO1999028126A1 (en) * | 1997-12-01 | 1999-06-10 | Nitto Boseki Co., Ltd. | Prepreg for multilayer printed wiring boards and process for producing the same |
-
1986
- 1986-11-25 JP JP28012686A patent/JPS63132044A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63132044A (en) | 1988-06-04 |
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