JPH0358539B2 - - Google Patents
Info
- Publication number
- JPH0358539B2 JPH0358539B2 JP59150040A JP15004084A JPH0358539B2 JP H0358539 B2 JPH0358539 B2 JP H0358539B2 JP 59150040 A JP59150040 A JP 59150040A JP 15004084 A JP15004084 A JP 15004084A JP H0358539 B2 JPH0358539 B2 JP H0358539B2
- Authority
- JP
- Japan
- Prior art keywords
- coating layer
- electrode
- wiring board
- conductive paste
- active passive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
- H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、多数個の電極を有する能受動素子を
外部回路に接続する微細結線部を有する半導体装
置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a semiconductor device having a fine connection portion for connecting an active passive element having a large number of electrodes to an external circuit.
従来例の構成とその問題点
従来、能受動素子と外部回路とを接続する場
合、ワイヤーボンデイング、フイルムキヤリヤビ
ームリード方式等が行なわれていたが、リード部
の断線、短絡が発生し、信頼性に欠けていた。Conventional configurations and their problems In the past, wire bonding, film carrier beam lead methods, etc. were used to connect active passive elements to external circuits, but wire bonding and film carrier beam lead methods were used, but disconnections and short circuits occurred in the leads, making them unreliable. It lacked sex.
そこで本発明者らは、以前に能受動素子と外部
回路の電極接続部に、フオトレジスト膜による窓
を形成し、その窓部に、導電性ペーストを形成す
る事により、信頼性ある接続方法を提案した。 Therefore, the present inventors previously formed a window using a photoresist film at the electrode connection between the active passive element and the external circuit, and then formed a conductive paste on the window to create a reliable connection method. Proposed.
第１図に、その具体的構造を示す。 FIG. 1 shows its specific structure.
１は能受動素子、２はセラミツク配線基板、３
は能受動素子１とセラミツク配線基板２の電極部
４及び５を接続する導電性ペーストであり、能受
動素子１とセラミツク配線基板２とは、接着材７
を介して基板６に固定されている。 1 is an active passive element, 2 is a ceramic wiring board, 3
is a conductive paste that connects the active passive element 1 and the electrode parts 4 and 5 of the ceramic wiring board 2;
It is fixed to the substrate 6 via.
本構成では、導電性ペースト３を介して、能受
動素子１の電極部４とセラミツク配線基板２の電
極部５とを、直接接続するので、断線や短絡がな
くなる。 In this configuration, the electrode section 4 of the active passive element 1 and the electrode section 5 of the ceramic wiring board 2 are directly connected via the conductive paste 3, thereby eliminating disconnections and short circuits.
しかし、高湿度中の運転では、導電ペースト３
にマイグレーシヨンが発生し、隣接する電極間で
短絡が起きたり、運転時の発熱や気温の変化によ
る熱ストレスの発生により結線部の導電ペースト
３の断線が起ることがある。 However, when operating in high humidity, conductive paste 3
Migration may occur, short-circuiting may occur between adjacent electrodes, or disconnection of the conductive paste 3 at the connection portion may occur due to heat stress generated during operation or due to changes in temperature.
発明の目的
本発明は、上記欠点を解消するもので、マイグ
レーシヨンと熱ストレスから電極部を保護するこ
とを目的とする。OBJECTS OF THE INVENTION The present invention solves the above-mentioned drawbacks and aims to protect the electrode portion from migration and thermal stress.
発明の構成
本発明は、上記目的を達成するもので、表面に
複数の電極を有する能受動素子と、表面に複数の
電極導体を有する配線基板と、前記能受動素子と
配線基板の端面を当接し、対応する前記電極と電
極導体との接続部上に設けられた導電性物質と、
前記導電性物質を覆つて設けられたコーテイング
層とを備え、前記コーテイング層が、マイグレー
シヨンを防止するコーテイング層と、熱ストレス
に対して強度を補強するコーテイング層とから少
なくともなることを特徴とする半導体装置を提供
するものである。Structure of the Invention The present invention achieves the above object, and includes an active passive element having a plurality of electrodes on its surface, a wiring board having a plurality of electrode conductors on its surface, and an end face of the active passive element and the wiring board. a conductive substance provided on a connection portion between the electrode and the electrode conductor in contact with each other;
a coating layer provided to cover the conductive substance, the coating layer comprising at least a coating layer for preventing migration and a coating layer for reinforcing strength against thermal stress. The present invention provides a semiconductor device.
実施例の説明
以下、本発明の実施例を、図を用いて説明す
る。第２図ａは、本発明の一実施例である、
LEDアレイ素子と外部回路基板とを接続部によ
り接続した半導体装置の斜視図、同図ｂはａの
部分の拡大図である。DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 2a is an embodiment of the present invention,
FIG. 2 is a perspective view of a semiconductor device in which an LED array element and an external circuit board are connected by a connecting portion, and FIG.
同図において１１はLED素子、１２はセラミ
ツク配線基板であり、これらは基板１６上に接着
材１７を介して互いに当接して設けられている。
また１４はLED素子１１の電極部で、１５はセ
ラミツク配線基板１２上に設けられた電極部であ
る。かかる電極部１４及び１５は第２図ｂに詳細
に示すように導電性ペースト１３により接続され
ている。さらに本実施例ではこの導電性ペースト
１３を覆つて防湿効果の高いフエノール変性エポ
キシの第１コーテイング層１８を塗布、硬化さ
せ、次の第１のコーテイング層１８を覆つて補強
効果の高いビイスフエノール系の第２のコーテイ
ング層１９を塗布、硬化する構成になつている。
かかる構成にすることにより、導電性ペースト１
３は、高湿度中での運転においても第１コーテイ
ング層１８によりマイグレーシヨンから保護さ
れ、また第２のコーテイング層１９により熱スト
レスによる破壊から護られることになる。 In the figure, 11 is an LED element, and 12 is a ceramic wiring board, which are provided on a board 16 in contact with each other via an adhesive 17.
Further, 14 is an electrode portion of the LED element 11, and 15 is an electrode portion provided on the ceramic wiring board 12. The electrode parts 14 and 15 are connected by a conductive paste 13, as shown in detail in FIG. 2b. Furthermore, in this embodiment, a first coating layer 18 of phenol-modified epoxy with a high moisture-proofing effect is applied and cured to cover the conductive paste 13, and the next first coating layer 18 is covered with bisphenol which has a high reinforcing effect. The second coating layer 19 of the system is applied and cured.
By having such a configuration, the conductive paste 1
3 is protected from migration by the first coating layer 18 even when operating in high humidity, and is protected from destruction by thermal stress by the second coating layer 19.
なお本発明の他の実施例として、導電性ペース
ト上にまず熱ストレスに強いコーテイング層を形
成し、さらにその上に防湿効果の高いコーテイン
グを行なつても前記実施例の同等の効果を有する
ことが確かめられた。 As another embodiment of the present invention, a coating layer resistant to heat stress is first formed on the conductive paste, and then a coating with a high moisture-proofing effect is further applied on top of the coating layer, and the same effect as in the above embodiment can be obtained. was confirmed.
また本発明はLED素子に限らず表面に複数の
電極を有する他の能受動素子を同じく表面に複数
の電極導体を有する配線基板と接続する場合につ
いて適用できることはもちろんである。 Further, the present invention is of course applicable not only to LED elements but also to cases in which other passive elements having a plurality of electrodes on the surface are connected to a wiring board having a plurality of electrode conductors on the surface.
さらに前記実施例ではLED素子とセラミツク
配線基板の電極同士を接続する複数の導電性ペー
ストをすべて覆つてコーテイング層を設けた例を
示したが、各導電性ペーストごとにコーテイング
層を設けても良いことはもちろんである。 Further, in the above embodiment, a coating layer was provided covering all of the plurality of conductive pastes that connect the electrodes of the LED element and the ceramic wiring board, but a coating layer may be provided for each conductive paste. Of course.
発明の効果
以上、要するに本発明は、導電ペーストのマイ
グレーシヨンを防止する第１コーテイング層と熱
ストレスに対して強度を補強する第２コーテイン
グ層とを重ねた多層コーテイング層を、能受動素
子と配線基板を接続する電極部上に設けた導電性
物質を覆つて設けた半導体装置を提供するもの
で、導電性物質を使つた微細結線部でのマイグレ
ーシヨンによる短絡や、温度変化によるストレス
で生じる断線を防ぎ、結線部の信頼性を向上させ
る利点がある。Effects of the Invention In summary, the present invention provides a multilayer coating layer in which a first coating layer for preventing conductive paste migration and a second coating layer for reinforcing strength against thermal stress is applied to active passive elements and wiring. This product provides a semiconductor device that covers a conductive material provided on an electrode part that connects a substrate, and prevents short circuits due to migration at minute interconnections using conductive materials and disconnections caused by stress due to temperature changes. This has the advantage of preventing this and improving the reliability of the connection section.
第１図は本出願人が以前に提案した導電性ペー
ストによる結線を施した半導体装置の斜視図を示
す図、第２図ａは本発明の一実施例における半導
体装置の斜視図、同図ｂは同図ａのの部分の拡
大図である。
１１……LED素子、１２……セラミツク配線
基板、１３……導電性ペースト、１４……能受動
素子電極、１５……セラミツク配線基板電極、１
６……基板、１７……接着材、１８……第１コー
テイング層、１９……第２コーテイング層。
FIG. 1 is a perspective view of a semiconductor device with connections using conductive paste, which was previously proposed by the applicant, FIG. 2a is a perspective view of a semiconductor device according to an embodiment of the present invention, and FIG. 2 is an enlarged view of the portion a in the same figure. 11... LED element, 12... Ceramic wiring board, 13... Conductive paste, 14... Active passive element electrode, 15... Ceramic wiring board electrode, 1
6... Substrate, 17... Adhesive, 18... First coating layer, 19... Second coating layer.
Claims (1)
面に複数の電極導体を有する配線基板と、前記能
受動素子と配線基板の端面を当接し、対応する前
記電極と電極導体との接続部上に設けられた導電
性物質と、前記導電性物質を覆つて設けられたコ
ーテイング層とを備え、前記コーテイング層が、
マイグレーシヨンを防止する第１のコーテイング
層と、熱ストレスに対して強度を補強する第２の
コーテイング層とから少なくともなることを特徴
とする半導体装置。1. An active passive element having a plurality of electrodes on the surface, a wiring board having a plurality of electrode conductors on the surface, and an end face of the active passive element and the wiring board are brought into contact with each other, and on the connection portion between the corresponding electrode and the electrode conductor. and a coating layer provided to cover the conductive material, the coating layer comprising:
A semiconductor device comprising at least a first coating layer for preventing migration and a second coating layer for reinforcing strength against thermal stress.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15004084A JPS6129144A (en) | 1984-07-19 | 1984-07-19 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15004084A JPS6129144A (en) | 1984-07-19 | 1984-07-19 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6129144A JPS6129144A (en) | 1986-02-10 |
| JPH0358539B2 true JPH0358539B2 (en) | 1991-09-05 |
Family
ID=15488185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15004084A Granted JPS6129144A (en) | 1984-07-19 | 1984-07-19 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6129144A (en) |
-
1984
- 1984-07-19 JP JP15004084A patent/JPS6129144A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6129144A (en) | 1986-02-10 |
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