JPH0358802B2 - - Google Patents
Info
- Publication number
- JPH0358802B2 JPH0358802B2 JP58155923A JP15592383A JPH0358802B2 JP H0358802 B2 JPH0358802 B2 JP H0358802B2 JP 58155923 A JP58155923 A JP 58155923A JP 15592383 A JP15592383 A JP 15592383A JP H0358802 B2 JPH0358802 B2 JP H0358802B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- aluminum
- foil
- thickness
- rolling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/38—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling sheets of limited length, e.g. folded sheets, superimposed sheets, pack rolling
- B21B2001/383—Cladded or coated products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
- B21B2003/001—Aluminium or its alloys
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Metal Rolling (AREA)
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】
この発明は、表面に金属の薄膜層を有するアル
ミニウム箔の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing aluminum foil having a thin metal film layer on its surface.
アルミニウム箔の表面に亜鉛や錫などの金属層
を設けるには、金属メツキをする方法や、真空蒸
着、イオンプレーテイング、スパツタリングなど
の方法が採られる。 To provide a metal layer such as zinc or tin on the surface of aluminum foil, methods such as metal plating, vacuum evaporation, ion plating, and sputtering are used.
しかしながら、アルミニウムはその表面に酸化
皮膜が生じ易い為、上記の方法によると金属粒子
がアルミニウム箔の表面に付着し難く、また結合
強度も小さいので剥離し易い欠点がある。さら
に、コイル巻きしたアルミニウム箔を巻き戻しな
がらメツキ処理等を行なう場合、厚みの小さい箔
は充分な引張強度を有しないため、破損し易く、
極めて生産性が悪い欠点がある。 However, since aluminum tends to form an oxide film on its surface, the above method has the disadvantage that metal particles are difficult to adhere to the surface of the aluminum foil, and the bond strength is low, making them easy to peel off. Furthermore, when performing plating processing while unwinding coil-wound aluminum foil, thin foil does not have sufficient tensile strength and is easily damaged.
It has the disadvantage of extremely poor productivity.
特に生産性の点で云えば、金属メツキや真空蒸
着を長尺のアルミニウム箔に施すこと自体、処理
に多大の時間を要し、非常に能率が悪く、装置も
大型化し、生産コストが必然的に高くなる。その
ほか、金属メツキや真空蒸着などの方法では、平
滑な表面が得られず金属光沢に劣る欠点がある。 Particularly in terms of productivity, applying metal plating or vacuum deposition to long lengths of aluminum foil itself takes a lot of time, is extremely inefficient, requires large equipment, and inevitably increases production costs. becomes higher. In addition, methods such as metal plating and vacuum deposition have the disadvantage that a smooth surface cannot be obtained and the metallic luster is inferior.
そこで、アルミニウム板に金属箔を重ね合せて
圧延する方法も考えられるが、厚み及び特性の異
なる金属を圧延してゆくにつれ歪みが生じ物性の
弱い金属が破損し、また相互の結合強度が小さく
簡単に剥離してしまう欠点がある。 Therefore, a method of rolling metal foil on an aluminum plate may be considered, but as metals with different thicknesses and properties are rolled, distortion occurs and metals with weak physical properties are damaged, and the bonding strength between them is small and it is easy to roll. It has the disadvantage of peeling off.
この発明は、上記の種々な欠点を解消し、アル
ミニウム箔と金属層との結合強度が非常に高く、
生産コストも大巾に削減可能な表面に金属層を有
するアルミニウム箔の製造方法を提供することが
目的である。 This invention solves the various drawbacks mentioned above, and has a very high bonding strength between the aluminum foil and the metal layer.
It is an object of the present invention to provide a method for manufacturing aluminum foil having a metal layer on its surface, which can greatly reduce production costs.
上記の目的を達成するため、この発明によれ
ば、まず、アルミニウム板に厚さ0.5〜50μの金属
メツキを施した後、これをアルミニウム箔の厚み
になる迄圧延する方法を採つたのである。このよ
うにすると、アルミニウムとその表面の金属は、
メツキによる結合に加えて圧延時の圧下による結
合が付与され極めて強固な結合状態が生まれ、ま
たメツキ処理は板体のアルミニウムに対してなさ
れる為、箔に施すのに比較して生産性は何倍も高
く、かつ圧延処理は箔の製造工程と同一でよいか
ら、全体として生産コストが低くかつ良質の金属
層を有するアルミニウム箔が得られる。 In order to achieve the above object, according to the present invention, first, an aluminum plate is plated with metal to a thickness of 0.5 to 50 μm, and then this is rolled to the thickness of aluminum foil. In this way, the aluminum and the metal on its surface are
In addition to the bonding by plating, the bonding by rolling during rolling creates an extremely strong bond, and since the plating treatment is performed on the aluminum plate, the productivity is lower than when applying it to foil. This is twice as expensive, and the rolling process can be the same as the foil manufacturing process, resulting in an aluminum foil with a low production cost and a high quality metal layer.
以下、この発明を添付図面に基いてさらに詳述
する。 Hereinafter, the present invention will be explained in further detail based on the accompanying drawings.
まず厚さ0.2mm以上、好ましくは0.3〜0.6mmのア
ルミニウム板を用意する。このアルミニウム板に
メツキを施すのであるが、予め表面の脱脂、洗浄
に行ない、酸化皮膜もアルカリ液で除去しておく
のが望ましい。 First, an aluminum plate with a thickness of 0.2 mm or more, preferably 0.3 to 0.6 mm is prepared. Before plating this aluminum plate, it is desirable to degrease and clean the surface and remove the oxide film with alkaline solution beforehand.
第１図に示すように、アルミニウム板のコイル
Ａを巻き戻しながら、槽１においてアルカリ洗浄
を行なう。次いで槽２において水洗、槽３におい
て酸による中和、さらに水洗を行なつて（槽４）、
前処理を完了する。 As shown in FIG. 1, alkaline cleaning is performed in tank 1 while unwinding the aluminum plate coil A. Next, washing with water in tank 2, neutralization with acid in tank 3, and further washing with water (tank 4),
Complete preprocessing.
上記のようにして前処理を施したアルミニウム
板に対し、続いてメツキ処理を行なう。その工程
は次の通りである。即ち、槽５ではメツキ処理、
槽６では水洗、槽７では中和、槽８では水洗をそ
れぞれ行ない、乾燥ゾーン９において乾燥し、コ
イルＢに巻き取る。 The aluminum plate pretreated as described above is then subjected to plating treatment. The process is as follows. That is, in tank 5, plating treatment,
The material is washed with water in tank 6, neutralized in tank 7, and washed with water in tank 8, dried in drying zone 9, and wound into coil B.
上記メツキ処理は、通常行なわれる湿式メツキ
であり、亜鉛、銅、錫、ニツケル、鉛、銀、金、
アルミニウム、鉄、クロムなどメツキ可能な金属
ならばいずれでもよく、またこれらの混合物でも
よい。さらに複層のメツキを施すこともできる。
特にアルミニウムに付着し難い金属の場合には、
予め密着性の良好な金属メツキ中間に介在させる
のが有効な手段である。例えば、錫メツキを希望
する場合、アルミニウムの表面を亜鉛で置換して
錫メツキを施した後、錫メツキを施すなどの方法
がある。勿論、錫メツキを直接施すことも可能で
ある。 The above plating process is a commonly performed wet plating process, and includes zinc, copper, tin, nickel, lead, silver, gold, etc.
Any metal that can be plated, such as aluminum, iron, or chromium, may be used, or a mixture thereof may be used. Furthermore, multiple layers of plating can also be applied.
Especially in the case of metals that are difficult to adhere to aluminum,
An effective means is to interpose a metal plating intermediate with good adhesion in advance. For example, if tin plating is desired, there is a method of substituting the surface of aluminum with zinc and applying tin plating, and then applying tin plating. Of course, it is also possible to apply tin plating directly.
金属メツキは、アルミニウム板の片面だけでな
く、両面に施してもよく、また後者の場合、メツ
キする金属を一方の面と他方の面とで異なるもの
としてもよい。さらに、部分的にメツキを施すこ
とも可能である。 Metal plating may be applied not only to one side of the aluminum plate but also to both sides, and in the latter case, one side and the other side may be plated with different metals. Furthermore, it is also possible to apply plating partially.
メツキ層の厚みは、次式を目安に選択すればよ
く、0.5〜50μ程度が好ましい。0.5μ以下では圧延
される際、メツキ層が切断されて欠除部が多くな
りすぎ、また50μ以上では経済性の面で問題があ
る。 The thickness of the plating layer may be selected using the following formula as a guide, and is preferably about 0.5 to 50 μm. If it is less than 0.5μ, the plating layer will be cut during rolling, resulting in too many missing parts, and if it is more than 50μ, there will be problems in terms of economic efficiency.
式：
圧延前の板厚／圧延後の箔厚×１／10
＜メツキ層の厚み＜圧延前の板厚／圧延後の箔厚×
５
上記のようにしてメツキを施したアルミニウム
板を、第２図に示すように圧延する。図中、１０
はアルミニウム板、１１はメツキ層、１２は圧延
ローラ、１０′はアルミニウム箔、１１′は圧延さ
れたメツキ層である。 Formula: Plate thickness before rolling / foil thickness after rolling x 1/10 < thickness of plating layer < plate thickness before rolling / foil thickness after rolling x
5. The aluminum plate plated as described above is rolled as shown in FIG. In the figure, 10
1 is an aluminum plate, 11 is a plating layer, 12 is a rolling roller, 10' is an aluminum foil, and 11' is a rolled plating layer.
上記圧延は、冷間、熱間のいずれで行なつても
よく、また圧延の途中で加熱処理を施してもよ
い。メツキする金属の種類によつては、加熱によ
つて拡散が生じ、アルミニウムに対する密着性を
より高めることができるからである。 The above-mentioned rolling may be performed either cold or hot, and heat treatment may be performed during the rolling. This is because, depending on the type of metal to be plated, heating may cause diffusion, which can further improve adhesion to aluminum.
圧延パス数は、１回に限らず複数回でもよく、
最終的に断面減少率が50％以上になればよい。 The number of rolling passes is not limited to one, but may be multiple.
The final reduction in area should be 50% or more.
また、アルミニウム箔の表面に形成される金属
層は、間隙のない連続膜でも、網目状、ラス状、
縞状などの間隙を有するものでもよい。 In addition, the metal layer formed on the surface of aluminum foil can be a continuous film with no gaps, or a mesh, lath, etc.
It may also have striped gaps.
この発明によれば、以上の様に、アルミニウム
板にメツキを施した後に圧延してアルミニウム箔
を得るようにしたので、アルミニウム箔にメツキ
を施すのと異なり、生産性が高くまたメツキ層は
メツキ処理によるアルミニウムとの密着に加えて
機械的にも密着性が高められるので結合強度が非
常に高く、さらに圧延により表面が平滑になるの
で、優れた金属光沢を現出することができる。こ
のように、アルミニウム箔の表面を金属で被覆す
ることによつて、種々の特性を容易かつ安価に付
与することが可能となる。例えば、色調を変えた
り、導電性を高めたり、半田付を可能にしたり、
或は防蝕性を高めるなどである。 According to this invention, as described above, the aluminum foil is obtained by plating the aluminum plate and then rolling it, so unlike plating the aluminum foil, productivity is high and the plating layer is not plated. In addition to the adhesion with aluminum, the treatment improves adhesion mechanically, resulting in extremely high bonding strength.Furthermore, the rolling process smoothes the surface, giving it an excellent metallic luster. By coating the surface of aluminum foil with metal in this way, it becomes possible to impart various properties easily and inexpensively. For example, changing the color tone, increasing conductivity, making soldering possible,
Or to improve corrosion resistance.
なお、以上の様にして得られたアルミニウム箔
を、細片に切断したり、ボールミル法などにより
粉砕して顔料に用いると、アルミニウム顔料とは
異なつた色調、特性（例えば導電性）を有するも
のが得られ、種々の用途に用いることができる。 Note that when the aluminum foil obtained as described above is cut into thin pieces or crushed by a ball mill method and used as a pigment, it has a color tone and characteristics (e.g. conductivity) different from those of the aluminum pigment. can be obtained and used for various purposes.
以下、この発明の実施例を挙げる。 Examples of this invention will be given below.
実施例 １
厚み0.5mmのアルミニウム板を超音波洗浄器を
用いてトリクレンで洗浄し、その後50℃の10％苛
性ソーダ水溶液で１分間エツチングし、水洗後、
10％硝酸液で30秒間酸洗いし、さらに水洗した。Example 1 An aluminum plate with a thickness of 0.5 mm was cleaned with Triclean using an ultrasonic cleaner, then etched with a 10% caustic soda aqueous solution at 50°C for 1 minute, and washed with water.
It was pickled with 10% nitric acid solution for 30 seconds and then washed with water.
次いで、市販の亜鉛置換液に15秒間浸漬した
後、下記の条件で銅メツキを施した。 Next, after being immersed in a commercially available zinc replacement solution for 15 seconds, copper plating was applied under the following conditions.
液組成 硫酸銅 75ｇ/
硫酸 187.5ｇ/
塩化物 50ppm
メツキ条件 温度 25℃
撹拌 エヤー撹拌
陰極電流密度 ４A/dm2
陽極 含リン銅
上記の条件で厚み10μの銅メツキを施した後、
冷間圧延機を用いて５パス圧延し、50μの厚み箔
を得た。Liquid composition Copper sulfate 75g/ Sulfuric acid 187.5g/ Chloride 50ppm Plating conditions Temperature 25℃ Stirring Air stirring Cathode current density 4A/dm 2 Anode Phosphorus-containing copper After copper plating with a thickness of 10μ was applied under the above conditions,
It was rolled using a cold rolling mill for 5 passes to obtain a foil with a thickness of 50 μm.
得られた箔の表面には、銅メツキ層が均一に展
延され、銅メツキ層とアルミニウムは強固に接合
していた。また、この表面に半田を付着させたと
ころ、銅箔と同様に密着した。 The copper plating layer was uniformly spread on the surface of the obtained foil, and the copper plating layer and aluminum were firmly bonded. Furthermore, when solder was applied to this surface, it adhered as well as copper foil.
実施例 ２
厚さ0.5mmのアルミニウム板を、実施例１と同
様に、洗浄、エツチング、水洗、酸洗い、水洗処
理し、さらに亜鉛置換した。Example 2 An aluminum plate having a thickness of 0.5 mm was washed, etched, washed with water, pickled, and washed with water in the same manner as in Example 1, and was further replaced with zinc.
これに下記の条件で銅メツキを施した。 Copper plating was applied to this under the following conditions.
液組成 硫酸銅 20ｇ/
硫酸 180ｇ/
塩化物 50mg/
メツキ条件 温度 25℃
撹拌 エヤー撹拌
陰極電流密度 ４A/dm2
陽極 含リン銅
上記条件で厚み20μの銅メツキを施した後、冷
間圧延機で８パス圧延し、20μの箔を得た。得ら
れたものは、銅メツキ層がアルミニウムの薄化と
同時に均一に展延されており、両者の結合状態も
強固であつた。Liquid composition Copper sulfate 20g/ Sulfuric acid 180g/ Chloride 50mg/ Plating conditions Temperature 25℃ Stirring Air stirring Cathode current density 4A/dm 2 Anodes Phosphorus-containing copper After copper plating with a thickness of 20μ was applied under the above conditions, it was rolled in a cold rolling mill. Rolling was carried out for 8 passes to obtain a 20μ foil. In the obtained product, the copper plating layer was spread uniformly at the same time as the aluminum was thinned, and the bonding state between the two was also strong.
この箔を細片に切断した後、ボールミルで粉砕
し、100メツシユスルーの状態まで微粉化したも
のを塗料中に80重量％添加して、テスターで導電
性を調べたところ104Ω/cmの導通があつた。 This foil was cut into thin pieces, crushed in a ball mill, and pulverized to a state of 100 mesh through. 80% by weight of the foil was added to the paint, and the conductivity was checked using a tester, and the conductivity was 10 4 Ω/cm. It was hot.
実施例 ３
厚み0.5mmmmのアルミニウム板を実施例１と同
様に表面処理し、同様の条件で厚み1μの銅メツ
キを施した。これに下記の条件でさらに錫メツキ
を施した。Example 3 An aluminum plate with a thickness of 0.5 mm was surface-treated in the same manner as in Example 1, and copper plating with a thickness of 1 μm was applied under the same conditions. This was further tin-plated under the following conditions.
液組成 硫酸第１錫 30ｇ/
硫酸 10％
メツキ条件 温度 25℃
撹拌 カソードロツク
陰極電流密度 1.5A/dm2
陽極 錫
上記条件で厚み15μの錫メツキを施した後、冷
間圧延機で５パス圧延することにより、50μの箔
を得た。得られた箔は、錫メツキ層がアルミニウ
ムの薄化と同時に均一に展延されており、密着性
も充分であつた。この表面に半田を付着したとこ
ろ、銅箔と同様に密着した。Liquid composition: 30g of tinned sulfate/10% of sulfuric acid Plating conditions: Temperature: 25℃ Stirring: Cathode current density: 1.5A/dm 2 anode: Tin After tin plating to a thickness of 15μ under the above conditions, it was rolled in a cold rolling mill for 5 passes. By doing this, a 50μ foil was obtained. In the obtained foil, the tin plating layer was spread uniformly at the same time as the aluminum was thinned, and the adhesion was sufficient. When solder was applied to this surface, it adhered as well as copper foil.
実施例 ４
厚み0.5mmのアルミニウム板に、実施例１と同
様の表面処理を施し、これを、無電解ニツケルメ
ツキ液に浸漬し、20μのニツケルメツキを施し
た。Example 4 An aluminum plate having a thickness of 0.5 mm was subjected to the same surface treatment as in Example 1, and then immersed in an electroless nickel plating solution to be plated with 20 μm of nickel.
これを冷間圧延機で５パス圧延し、厚み50μの
箔を得た。得られた箔は、ニツケルメツキ層がア
ルミニウムの薄化と共に均一に展延され、密着性
も充分であつた。 This was rolled in a cold rolling mill for 5 passes to obtain a foil with a thickness of 50 μm. In the obtained foil, the nickel plating layer was spread uniformly as the aluminum was thinned, and the adhesion was sufficient.
第１図は、この発明の製造方法のうち、アルミ
ニウム板の洗浄及びメツキの工程を示す線図、第
２図は、メツキを施したアルミニウム板の圧延工
程を示す線図である。
図中、Ａ及びＢはアルミニウム板のコイル、１
はアルカリ洗浄槽、５はメツキ槽、１０はアルミ
ニウム板、１１はメツキ層、１０′はアルミニウ
ム箔である。
FIG. 1 is a diagram showing the process of cleaning and plating an aluminum plate in the manufacturing method of the present invention, and FIG. 2 is a diagram showing the process of rolling the plated aluminum plate. In the figure, A and B are aluminum plate coils, 1
5 is an alkali cleaning tank, 5 is a plating tank, 10 is an aluminum plate, 11 is a plating layer, and 10' is an aluminum foil.
Claims (1)
メツキを施し、これを前記アルミニウム板が箔の
厚みになるまで圧延することから成る表面に金属
層を有するアルミニウム箔の製造方法。1. A method for producing an aluminum foil having a metal layer on its surface, which comprises applying metal plating to a thickness of 0.5 to 50 μm on the surface of an aluminum plate, and rolling this until the aluminum plate has the thickness of the foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15592383A JPS6046801A (en) | 1983-08-23 | 1983-08-23 | Manufacture of aluminum foil having metallic layer on its surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15592383A JPS6046801A (en) | 1983-08-23 | 1983-08-23 | Manufacture of aluminum foil having metallic layer on its surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6046801A JPS6046801A (en) | 1985-03-13 |
| JPH0358802B2 true JPH0358802B2 (en) | 1991-09-06 |
Family
ID=15616460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15592383A Granted JPS6046801A (en) | 1983-08-23 | 1983-08-23 | Manufacture of aluminum foil having metallic layer on its surface |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6046801A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100560150B1 (en) * | 2002-10-25 | 2006-03-15 | 이용철 | Manufacturing method of electrolytic nickel foil and electrolytic nickel foil |
| CN1321205C (en) * | 2005-01-13 | 2007-06-13 | 四川大学 | Method for preparing NiAl shape memory alloy film by cold rolling ultra-thin laminated alloy foil |
| CN105127197B (en) * | 2015-08-31 | 2017-01-25 | 东北大学 | Preparation method for multi-layer metal/graphene composite electrode thin strip |
| CN105880284B (en) * | 2016-04-11 | 2018-02-09 | 武汉大学 | A kind of high rigidity high-conductivity copper carbon composite and its preparation method and application |
| CN110743913B (en) * | 2019-10-21 | 2022-03-22 | 江苏中色复合材料有限公司 | Production process of copper-aluminum composite decorative material |
| CN110802892B (en) * | 2019-11-25 | 2021-12-24 | 兰州理工大学 | Method for laminating multilayer aluminum/copper composite plate with copper atoms deposited on surface |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5897404A (en) * | 1981-12-04 | 1983-06-09 | Toyo Alum Kk | Production of metallic foil laminate |
-
1983
- 1983-08-23 JP JP15592383A patent/JPS6046801A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6046801A (en) | 1985-03-13 |
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