JPH0359591B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to hybrid integrated circuits, and particularly to improvements in hybrid integrated circuits suitable for high-density integration.

(b) Prior Art As shown in FIG. 1, a conventional hybrid integrated circuit has a thin insulating layer provided on one main surface of a metal substrate 1 to provide a desired conductive path 2, and a semiconductor integrated circuit and a chip on the conductive path 2. Circuit elements such as resistors or chip capacitors 3
was fixed, and the whole was molded with resin 5, leaving only the external leads 4 as shown in FIG.

Since such a hybrid integrated circuit is formed on one main surface of the metal substrate 1, a certain height is required to ensure a certain degree of integration, which has been a difficulty in designing thinner electronic devices. This is mainly due to the fact that the fixing pad 6 of the external lead 4 requires a considerable area.

In order to eliminate the above-mentioned drawbacks, the inventor of the present invention devised a hybrid integrated circuit shown in FIGS. 3 and 4. This hybrid integrated circuit includes two metal substrates 11 and 12, an insulating film 13 connecting the substrates 11 and 12, a conductive path 14 provided on the film 13, and a conductive path 14 provided on the film 13.
A printed circuit board 1 is provided with a plurality of circuit elements 15 such as a semiconductor integrated circuit, a chip resistor, or a chip capacitor fixed thereon, and the insulating film 13 is bent at the space between the boards 11 and 12, as shown in FIG.
Implemented in 6. This structure has the advantage that a hybrid integrated circuit having the same degree of integration as the conventional one can be reduced in height to about half.

However, since the bent portion is the flexible insulating film 13, the bending angle and other shapes cannot be standardized, making automatic insertion impossible, and there is also a risk that the insulating film 13 may break.

(c) Object of the Invention The present invention has been made in view of the above-mentioned drawbacks, and an object of the present invention is to provide a hybrid integrated circuit which can be easily mass-produced and which largely eliminates such drawbacks.

(d) Structure of the Invention As shown in FIG. 5, the hybrid integrated circuit according to the present invention includes a metal substrate 21, a notch hole 22 and a connecting body 23 provided in the bent portion of the substrate 21, and a metal substrate 21 on one principal surface of the substrate 21. It is characterized by comprising an attached insulating film 24, a conductive path 25 provided on the insulating film 24, and a plurality of circuit elements 26 fixed on the conductive path 25, and the insulating film 24 is cut out at the connecting body 23 part. It is said that

(E) Embodiment The metal substrate 21 is made of aluminum with good thermal conductivity and has a thickness of 0.5 to 1.0 mm, and its surface may be coated with an aluminum oxide film. At the center of the metal substrate 21, which is the bent portion 20, there are provided an elongated notch hole 22 formed by press punching and a plurality of connecting bodies 23 in which the metal substrate 21 remains as it is. The connecting body 23 has the function of integrally supporting the metal substrate 21 and maintaining its regular shape even when bent. The insulating film 24 is made of polyimide or the like, and is attached to substantially the entire surface of one principal surface of the metal substrate 21 with an adhesive such as epoxy resin. A copper foil serving as a conductive path 25 is adhered to one main surface of the insulating film 24, and this copper foil is selectively etched to form the conductive path 25 in a desired shape. Conductive path 25
As is clear from FIG. 5, the pads 27 to be soldered to the electrodes of the printed circuit board to be mounted are arranged at both ends, and the conductive path 25 is connected to the insulating film 2 from the pads 27.
4.Extend on top. The portion of the conductive path 25 to which the circuit element 26 is fixed is designed to be located over the entire substrate 21, and the conductive path 25, excluding the bent portion of the substrate 21, is designed to conduct electricity between multiple circuit elements such as a semiconductor integrated circuit, a chip resistor, or a chip capacitor. It sticks to the road 25.

The feature of the present invention is that the insulating film 24 is attached to the metal substrate 2.
1 is cut out at the connecting body 23. That is, the insulating film 24 is present only over the cutout hole 22 at the bent portion. As a result, the metal substrate 21
Even if the connecting body 2 is bent at the bending part, as shown in Fig. 6,
3 is simply bent, the insulation film 2
4, the presence of the cutout hole 22 prevents the insulating film 24 from being stretched.
1 can be bent.

(C) Effects of the Invention According to the present invention, a hybrid integrated circuit having the same degree of integration as a conventional hybrid integrated circuit can be reduced in height to about half, and the flexible insulating film 24 allows the board to be easily bent. have

Furthermore, the substrate 21 is
This bending can be done by the connecting body 23, and the possibility that the insulating film 24 will be stretched unnecessarily can be completely prevented.
The bent shape of the board 21 is arbitrary and can be standardized, which is extremely advantageous in terms of mounting.

[Brief explanation of drawings]

Fig. 1 is a plan view illustrating a conventional hybrid integrated circuit, Fig. 2 is a side sectional view thereof, Fig. 3 is a plan view illustrating a conventional improved hybrid integrated circuit, and Fig. 4 is a hybrid of Fig. 3. FIG. 5 is a side cross-sectional view of the integrated circuit mounted thereon; FIG. 5 is a plan view illustrating the hybrid integrated circuit of the present invention;
6 and 7 are side sectional views of the hybrid integrated circuit of the present invention. Explanation of main figure numbers: 21 is a metal substrate, 22 is a notch hole, 23 is a connecting body, 24 is an insulating film, 25 is a conductive path, and 26 is a circuit element.

Claims (1)

[Scope of Claims] 1. A metal substrate, an elongated notch hole provided in a bent portion of the metal substrate, a connecting body provided at both ends of the notch hole of the substrate, and an insulating film attached to a surface of the substrate. , comprising a desired conductive path provided on the film and a plurality of circuit elements fixed on the conductive path, the insulating film is notched at the connecting body portion,
A hybrid integrated circuit characterized in that the metal exposed surfaces of the substrates separated by the notch holes are held facing each other by being bent and arranged using the connecting body.