JPH0365299U - - Google Patents
Info
- Publication number
- JPH0365299U JPH0365299U JP12576689U JP12576689U JPH0365299U JP H0365299 U JPH0365299 U JP H0365299U JP 12576689 U JP12576689 U JP 12576689U JP 12576689 U JP12576689 U JP 12576689U JP H0365299 U JPH0365299 U JP H0365299U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- ceramic circuit
- metal
- frame plate
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案に係るシールドパツケージ型回
路装置の展開斜視図、第２図は同装置の組立て状
態で示す部分拡大断面図、第３，４図は同装置の
枠板とシールドキヤツプとの嵌め合せ構造を示す
部分拡大断面図である。
１０……セラミツク回路基板、１１ａ，１１ｂ
……グランド金属層の導通露出部分、１２…，１
３………リードピン、１４……枠板、１４２，１
４３……切欠、１６……シールドキヤツプ。
Fig. 1 is an exploded perspective view of a shielded package type circuit device according to the present invention, Fig. 2 is a partially enlarged sectional view showing the device in an assembled state, and Figs. 3 and 4 are views of the frame plate and shield cap of the device. It is a partially enlarged sectional view showing a fitting structure. 10... Ceramic circuit board, 11a, 11b
... Conductive exposed portion of ground metal layer, 12..., 1
3...Lead pin, 14...Frame plate, 142,1
43...notch, 16...shield cap.
Claims (1)
にグランド金属層を設けると共に、このグランド
金属層と接続する導通露出部分１１ａ，１１ｂ…
をセラミツク回路基板１０に設け、その導通露出
部分１１ａ，１１ｂ…と導通固定させて縁辺回り
を取囲む金属製の枠板１４をセラミツク回路基板
１０に装着し、この枠板１４と着脱自在に嵌め合
わせてセラミツク回路基板１０の部品搭さい面を
覆う金属製のシールドキヤツプ１６を装備したこ
とを特徴とするシールドパツケージ型回路装置。 (2) 上記セラミツク回路基板１０の板厚面乃至
は部品搭さい面からリードピン１２…，１３…を
導出させ、そのリード片の導出個所と対応する枠
板１４の板面に切欠１４２，１４３…を設け、こ
の切欠１４２，１４３…を介して枠板１４からリ
ード片１２…，１３…を外部に突出させたことを
特徴とする請求項１記載のシールドパツケージ型
回路装置。[Claims for Utility Model Registration] (1) A ground metal layer is provided on the back surface or internal layer of the ceramic circuit board 10, and conductive exposed portions 11a, 11b connected to this ground metal layer...
is provided on the ceramic circuit board 10, and a metal frame plate 14 is attached to the ceramic circuit board 10, and the frame plate 14 made of metal is attached to the ceramic circuit board 10, and the metal frame plate 14 is fixed to the conductive exposed portions 11a, 11b, . This shield package type circuit device is also equipped with a metal shield cap 16 that covers the component mounting surface of the ceramic circuit board 10. (2) Lead pins 12..., 13... are led out from the board thickness surface or component mounting surface of the ceramic circuit board 10, and notches 142, 143... 2. The shielded package type circuit device according to claim 1, wherein the lead pieces 12, 13, .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12576689U JPH0365299U (en) | 1989-10-27 | 1989-10-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12576689U JPH0365299U (en) | 1989-10-27 | 1989-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0365299U true JPH0365299U (en) | 1991-06-25 |
Family
ID=31673620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12576689U Pending JPH0365299U (en) | 1989-10-27 | 1989-10-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0365299U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6881896B2 (en) | 2003-05-20 | 2005-04-19 | Nec Compound Semiconductor, Ltd. | Semiconductor device package |
-
1989
- 1989-10-27 JP JP12576689U patent/JPH0365299U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6881896B2 (en) | 2003-05-20 | 2005-04-19 | Nec Compound Semiconductor, Ltd. | Semiconductor device package |