JPH0366822B2 - - Google Patents
Info
- Publication number
- JPH0366822B2 JPH0366822B2 JP61042169A JP4216986A JPH0366822B2 JP H0366822 B2 JPH0366822 B2 JP H0366822B2 JP 61042169 A JP61042169 A JP 61042169A JP 4216986 A JP4216986 A JP 4216986A JP H0366822 B2 JPH0366822 B2 JP H0366822B2
- Authority
- JP
- Japan
- Prior art keywords
- internal electrodes
- piezoelectric
- laminated
- piezoelectric ceramic
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N30/057—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by stacking bulk piezoelectric or electrostrictive bodies and electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
- H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Transducers For Ultrasonic Waves (AREA)
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、圧電アクチユエータ等に用いられる
積層型圧電素子の製造方法に関し、更に詳しく
は、多数の圧電セラミツク板を接着により一体化
し、側面に設けた絶縁物を所定の位置で除去して
内部電極を露出させ内部電極間の電気的接続を行
うようにした積層型圧電素子の製造方法に関する
ものである。Detailed Description of the Invention [Industrial Application Field] The present invention relates to a method of manufacturing a laminated piezoelectric element used in a piezoelectric actuator, etc. More specifically, the present invention relates to a method of manufacturing a laminated piezoelectric element used in a piezoelectric actuator, etc. The present invention relates to a method for manufacturing a laminated piezoelectric element in which internal electrodes are exposed by removing provided insulators at predetermined positions to establish electrical connections between the internal electrodes.
[従来の技術]
微細加工を必要とする半導体など各種電子部品
の製造装置や微小位置決めを必要とする光学装置
等においては微小変位を行わせるため圧電アクチ
ユエータが用いられている。[Prior Art] Piezoelectric actuators are used to perform minute displacements in manufacturing equipment for various electronic components such as semiconductors that require microfabrication, and in optical devices that require minute positioning.
このような圧電アクチユエータに用いられる積
層型圧電素子の製造方法としては、焼結済の多数
の圧電セラミツク板を接着一体化する方法と、未
焼結シートを積層してから一体焼結する方法があ
る。 There are two methods for manufacturing the laminated piezoelectric elements used in such piezoelectric actuators: one is to bond together a large number of sintered piezoelectric ceramic plates, and the other is to laminate unsintered sheets and then sinter them together. be.
前者の積層接着法は、例えば第2図に示すよう
に、所定の外形寸法(約5〜30mmφ)の焼結圧電
セラミツク板10の表裏両面に焼付け銀等で電極
層を形成し、これとほぼ同寸法にエツチング等で
作成した金属端子板12とを1枚毎に接着剤を塗
布して金属端子12aの方向を揃えて数十〜数百
積層接着した後、対応する2組の金属端子12a
毎にそれぞれリード線14で接続し組み立てる方
法である。 The former lamination adhesion method, for example, as shown in FIG. After applying adhesive to each sheet of metal terminal plates 12 made by etching or the like to have the same dimensions, aligning the direction of the metal terminals 12a, and laminating tens to hundreds of them, the corresponding two sets of metal terminals 12a are bonded together.
This is a method of assembling the parts by connecting them with lead wires 14.
それに対して後者の一体焼結方法は、圧電セラ
ミツクの未焼結シートに内部電極を印刷し、積層
圧着して一体焼結し、所定寸法に切り出した後に
外部電極を形成する方法である。例えば第3図に
示すように、圧電セラミツク板10の間に白金の
ような内部電極16が介在し、その側面において
内部電極一層おきにガラス等の絶縁材18を塗布
して覆い、更に外部電極20を塗布する構成であ
る。 On the other hand, the latter integral sintering method is a method in which internal electrodes are printed on an unsintered sheet of piezoelectric ceramic, the sheets are laminated and pressure-bonded, integrally sintered, and external electrodes are formed after cutting to a predetermined size. For example, as shown in FIG. 3, internal electrodes 16 such as platinum are interposed between piezoelectric ceramic plates 10, and an insulating material 18 such as glass is coated on the side surfaces of every other layer of the internal electrodes, and external electrodes 20 is applied.
[発明が解決しようとする問題点]
ところが前者の積層接着による方法は、所定形
状の圧電セラミツク板と金属端子板とをその端子
方向を揃えて積層しなければならないため作業が
極めて煩瑣であり、量産性に乏しく低廉化できな
い欠点がある。[Problems to be Solved by the Invention] However, the former method using lamination and adhesion is extremely cumbersome because piezoelectric ceramic plates of a predetermined shape and metal terminal plates must be laminated with their terminal directions aligned. It has the disadvantage that it is not suitable for mass production and cannot be lowered in price.
それに対して後者の一体焼結する方法は、一度
の積層によつて多数の圧電積層体を切り出せるこ
とから積層作業の手間が省ける利点がある。とこ
ろが圧電セラミツクの焼結温度は1200〜1300℃と
高温であり、セラミツクの組成物が鉛化合物で反
応性が高いことと相俟つ内部電極は白金等のよう
な高価な貴金属に限定されており、このため電極
材料に要するコストが高くなる欠点がある。また
白金内部電極は不均一歪を避けるため層間全面に
形成する必要があり、それによつて層間のセラミ
ツク固相反応が制限され密着強度が低下する構造
的な欠陥を有している。 On the other hand, the latter method of integral sintering has the advantage that a large number of piezoelectric laminates can be cut out by one lamination, which saves the labor of lamination work. However, the sintering temperature of piezoelectric ceramics is as high as 1,200 to 1,300 degrees Celsius, and the composition of ceramics is a lead compound that is highly reactive, which means that the internal electrodes are limited to expensive precious metals such as platinum. Therefore, there is a drawback that the cost required for the electrode material increases. In addition, the platinum internal electrode must be formed over the entire surface of the interlayer to avoid non-uniform strain, and this has a structural defect that limits the ceramic solid phase reaction between the layers and reduces the adhesion strength.
本発明の目的は、上記のような従来技術の欠点
を解消し、内部電極に安価な材料を用いることが
でき、一度の積層によつて多数の圧電積層体を切
り出すことができ、外部電極の形成も含めて製造
工程が著しく簡素化され、しかも機械的強度等に
ついて十分高い信頼性を確保することができるよ
うな積層型圧電素子の製造方法を提供することに
ある。 It is an object of the present invention to eliminate the above-mentioned drawbacks of the prior art, to be able to use inexpensive materials for internal electrodes, to be able to cut out a large number of piezoelectric laminates by laminating them once, and to make it possible to cut out a large number of piezoelectric laminates by laminating them once. It is an object of the present invention to provide a method for manufacturing a laminated piezoelectric element, which greatly simplifies the manufacturing process including formation, and can ensure sufficiently high reliability in terms of mechanical strength and the like.
[問題点を解決するための手段]
上記のような目的を達成することのできる本発
明は、基本的には焼結済圧電セラミツク板を積層
接着する方法を採用し、外部電極の形成ならびに
内部電極と外部電極との接続構造に工夫を施し、
量産化に適するように改良した積層型圧電素子の
製造方法である。[Means for Solving the Problems] The present invention, which can achieve the above objects, basically adopts a method of laminating and bonding sintered piezoelectric ceramic plates, and forms external electrodes and The connection structure between the electrode and external electrode has been devised,
This is a method of manufacturing a laminated piezoelectric element that has been improved to be suitable for mass production.
即ち本発明では、表面に内部電極となる導電層
を形成した焼結済みの圧電セラミツク板を多数枚
積層して接着剤により接着一体化する。通常は大
きな圧電セラミツク板を用いて接着一体化したブ
ロツクから切り出して所定寸法の圧電積層体を得
る。 That is, in the present invention, a large number of sintered piezoelectric ceramic plates each having a conductive layer formed on the surface thereof to serve as an internal electrode are laminated and bonded together with an adhesive. Usually, a piezoelectric laminate of a predetermined size is obtained by cutting out a block that is bonded and integrated using a large piezoelectric ceramic plate.
次に得られた圧電積層体の側面を絶縁物にて覆
い、その第1の側面における内部電極対応個所の
絶縁物を一層おきに除去して内部電極の端面を露
出させ、また第2の側面において内部電極対応個
所の絶縁物を前記第1の側面とは一層分ずらせて
一層おきに除去して内部電極の端面を露出させ
る。そして第1および第2の側面にそれぞれ外部
電極を設けて両側面についてそれぞれ各内部電極
を外部電極に接続する。このようにして積層型圧
電素子が製造される。 Next, the side surfaces of the obtained piezoelectric laminate are covered with an insulating material, and the insulating material corresponding to the internal electrodes on the first side surface is removed every other layer to expose the end surfaces of the internal electrodes, and the second side surface is covered with an insulating material. In this step, the insulating material at the portion corresponding to the internal electrode is removed every other layer while being shifted one layer from the first side surface to expose the end surface of the internal electrode. External electrodes are provided on each of the first and second side surfaces, and each internal electrode is connected to the external electrode on both side surfaces. In this way, a laminated piezoelectric element is manufactured.
[作用]
本発明は基本的には焼結済み圧電セラミツク板
を積層接着する方法であるから、内部電極として
銀やニツケルのような安価な材料を使用できる。
また内部電極の引出し構造を工夫したから、金属
端子板を挟み込む必要は無く、一度の積層作業に
より得られたブロツクから所定寸法に切り出すこ
とによつて多数の圧電積層体を得ることができ
る。[Function] Since the present invention is basically a method of laminating and bonding sintered piezoelectric ceramic plates, inexpensive materials such as silver and nickel can be used for the internal electrodes.
Furthermore, since the internal electrode lead-out structure has been devised, there is no need to sandwich metal terminal plates, and a large number of piezoelectric laminates can be obtained by cutting out a block of predetermined size from a block obtained by a single lamination operation.
また内部電極と外部電極との接続も、圧電積層
体の所定の位置に絶縁物を付着させるのではな
く、圧電積層体の側面に設けた絶縁物の一部を除
去して内部電極の端面を露出させる構成であるか
ら、圧電セラミツク板の厚みが極めて薄くても、
また積層枚数が極めて多くなつても作業が容易で
あり、内部電極と外部電極との接続を簡単に行う
ことができる。 In addition, the connection between the internal electrodes and the external electrodes is achieved by removing part of the insulating material provided on the sides of the piezoelectric laminate, instead of attaching an insulating material to a predetermined position of the piezoelectric laminate. Because it is an exposed structure, even if the thickness of the piezoelectric ceramic plate is extremely thin,
Further, even if the number of laminated sheets is extremely large, the work is easy, and the connection between the internal electrodes and the external electrodes can be easily performed.
[実施例]
第1図は本発明方法の一実施例を示す工程説明
図である。まず同図Aに示すように、表面に内部
電極32となる導電層を形成した焼結済み圧電セ
ラミツク板30を多数枚積層して接着剤により接
着一体化する。圧電セラミツク板30として、長
さ50mm、幅40mm、厚さ0.2mm程度の寸法のものを
用いて試作実験を行つた。最上面および最下面に
位置する圧電セラミツク板30は片面のみに、そ
れ以外の圧電セラミツク板には表裏両面全面に導
電層を形成する。この導電層としては例えば銀を
焼付けることによつて容易に行うことができる。
この程度の寸法の圧電セラミツク板に銀電極を形
成する工程は、例えば従来圧電ブザー等の素子製
造において行われていた工程と類似しており、既
に量産技術が確立されているから安価に製作する
ことが可能である。[Example] FIG. 1 is a process explanatory diagram showing an example of the method of the present invention. First, as shown in FIG. 1A, a large number of sintered piezoelectric ceramic plates 30 each having a conductive layer formed on its surface to serve as an internal electrode 32 are laminated and bonded together with an adhesive. A prototype experiment was conducted using a piezoelectric ceramic plate 30 having dimensions of approximately 50 mm in length, 40 mm in width, and 0.2 mm in thickness. A conductive layer is formed on only one side of the piezoelectric ceramic plates 30 located on the top and bottom surfaces, and on the entire front and back surfaces of the other piezoelectric ceramic plates. This conductive layer can be easily formed by baking silver, for example.
The process of forming silver electrodes on a piezoelectric ceramic plate of this size is similar to the process conventionally used to manufacture elements such as piezoelectric buzzers, and mass production technology has already been established, so it can be manufactured at low cost. Is possible.
このような圧電セラミツク板30に例えばエポ
キシ接着剤をスクリーン印刷して数十〜数百枚積
層し、バイスで緊締し硬化させる。なお第1図に
おいては図面を簡略化するため圧電セラミツク板
は7枚しか描いていないが、実際は前記のように
多数枚積層されることになる。接着剤の印刷厚さ
や挟み込み圧力等により積層したブロツクの高さ
は一定値になる。これをダイヤモンドブレードを
用いた切断機等によつて破線で示す位置で切り出
し同図Bに示すような圧電積層体34を得る。圧
電積層体34の寸法は、例えば長さ5mm、幅4mm
程度である。各層の内部電極32は4側面で露出
されている。 For example, epoxy adhesive is screen printed on such piezoelectric ceramic plates 30, several tens to hundreds of sheets are laminated, and the piezoelectric ceramic plates 30 are tightened and cured in a vise. In order to simplify the drawing, only seven piezoelectric ceramic plates are shown in FIG. 1, but in reality, a large number of piezoelectric ceramic plates will be laminated as described above. The height of the stacked blocks becomes a constant value depending on the printing thickness of the adhesive, the sandwiching pressure, etc. This is cut out at the position indicated by the broken line using a cutter using a diamond blade or the like to obtain a piezoelectric laminate 34 as shown in FIG. The dimensions of the piezoelectric laminate 34 are, for example, 5 mm in length and 4 mm in width.
That's about it. The internal electrodes 32 of each layer are exposed on four sides.
次に同図Cに示すように、このような圧電積層
体34に対向する2側面に、絶縁物として厚さ
0.1mm程度のガラス板36をエポキシ接着剤で接
着し、残りの2面は単に同じエポキシ接着剤にて
被覆する。そして0.1mm厚のダイヤモンドブレー
ドを用いて同図Dに示すように0.4mm間隔毎にガ
ラス板36の内部電極対応個所に150μm深さの
切込み38を入れ、内部電極32の端面を露出さ
せる。この場合一方の側面(図面左側の側面)の
ガラス板36の内部電極対応個所を一層おきに切
込み38を形成して内部電極32の端面を露出さ
せ、それに対向する反対側の側面(図面右側の側
面)のガラス板36については、その内部電極寸
法個所を前記の左側の側面とは一層分ずらせて一
層おきに切込み38を設けて内部電極32の端面
を露出させるのである。 Next, as shown in FIG.
A glass plate 36 of about 0.1 mm is adhered with an epoxy adhesive, and the remaining two sides are simply covered with the same epoxy adhesive. Then, using a diamond blade having a thickness of 0.1 mm, cuts 38 with a depth of 150 μm are made at the locations corresponding to the internal electrodes of the glass plate 36 at intervals of 0.4 mm, as shown in FIG. In this case, cutouts 38 are formed every other layer at the locations corresponding to the internal electrodes of the glass plate 36 on one side (left side in the drawing) to expose the end surfaces of the internal electrodes 32, and the opposite side (on the right side in the drawing) is As for the glass plate 36 on the side surface, the internal electrode dimensions are shifted one more distance from the left side surface, and cuts 38 are provided in every other layer to expose the end surfaces of the internal electrodes 32.
そして最後に外部電極として導電性接着剤40
を各ガラス板36毎に、露出している内部電極を
接続するように、筆塗りあるいはデイツプコート
等の方法により形成して積層型圧電素子を得るの
である(同図E参照)。 Finally, conductive adhesive 40 is used as an external electrode.
is formed on each glass plate 36 by a method such as brush painting or dip coating so as to connect the exposed internal electrodes to obtain a laminated piezoelectric element (see E in the same figure).
なお各圧電セラミツク板30の分極は、基本的
には板単体の状態の時に行うが、場合によつては
積層接着した後に行つてもよい。 The polarization of each piezoelectric ceramic plate 30 is basically carried out when the plate is alone, but in some cases it may be carried out after the piezoelectric ceramic plates 30 are laminated and bonded.
以上本発明の好ましい一実施例について詳述し
たが、本発明はこのような構成のみに限定される
ものではない。内部電極として上記の実施例では
銀の焼付けを行つているが、ニツケルメツキ等で
導電層を形成することも可能である。圧電積層体
の側面に設ける絶縁物は、場合によつてはガラス
板等を用いず、樹脂の塗膜のみであつてもよい。
また内部電極を露出するための絶縁物の除去は機
械的に溝を形成する方法のみならずフオトエツチ
ング等により行うことも可能である。 Although a preferred embodiment of the present invention has been described above in detail, the present invention is not limited to only such a configuration. Although the internal electrodes are baked with silver in the above embodiment, it is also possible to form a conductive layer with nickel plating or the like. In some cases, the insulator provided on the side surface of the piezoelectric laminate may be only a resin coating without using a glass plate or the like.
Further, the removal of the insulating material to expose the internal electrodes can be carried out not only by mechanically forming grooves but also by photo-etching or the like.
[発明の効果]
本発明は上記のように焼結済み圧電セラミツク
板を積層接着し、側面に形成した絶縁物の一部を
除去して内部電極を露出し外部電極と接続するよ
うに構成したから、金属端子板等が不要となり、
大きな圧電セラミツク板を用いて積層接着しそれ
を切り出すことによつて多数の圧電積層体を一度
に得ることが可能となるため量産化できる。[Effects of the Invention] As described above, the present invention is configured such that sintered piezoelectric ceramic plates are laminated and bonded, and a part of the insulating material formed on the side surface is removed to expose the internal electrodes and connect them to the external electrodes. This eliminates the need for metal terminal plates, etc.
By laminating and adhering large piezoelectric ceramic plates and cutting them out, it is possible to obtain a large number of piezoelectric laminates at once, which allows for mass production.
また本発明は接着による結合方法だから、強固
な構造接着剤を用いることによつて機械的強度が
高く信頼性が向上するし、更に内部電極に安価な
電極材料を使用できるため、前記多数個の切り出
しが可能となることと相俟て極めて安価に製造で
きる効果がある。 Furthermore, since the present invention uses a bonding method using adhesive, the use of a strong structural adhesive increases mechanical strength and improves reliability.Furthermore, inexpensive electrode materials can be used for the internal electrodes. Coupled with the fact that it can be cut out, it has the effect of being extremely inexpensive to manufacture.
第1図A〜Eは本発明に係る積層型圧電素子の
製造方法の一実施例を示す工程説明図、第2図お
よび第3図はそれぞれ従来技術の説明図である。
30……焼結済の圧電セラミツク板、32……
内部電極、34……圧電積層体、36……ガラス
板、38……切込み、40……外部電極。
FIGS. 1A to 1E are process explanatory diagrams showing one embodiment of the method for manufacturing a laminated piezoelectric element according to the present invention, and FIGS. 2 and 3 are explanatory diagrams of the prior art, respectively. 30... Sintered piezoelectric ceramic plate, 32...
Internal electrode, 34... Piezoelectric laminate, 36... Glass plate, 38... Notch, 40... External electrode.
Claims (1)
セラミツク板を多数枚積層して接着剤により接着
一体化し、得られた圧電積層体の側面を絶縁物に
て覆い、その第1の側面の絶縁物の内部電極対応
個所を一層おきに除去して内部電極の端面を露出
させると共に、第2の側面の絶縁物の内部電極対
応個所を前記第1の側面とは一層分ずらせて一層
おきに除去して内部電極端面を露出させ、前記第
1および第2の側面にそれぞれ外部電極を設けて
各側面について各内部電極間を接続することを特
徴とする積層型圧電素子の製造方法。1 A large number of piezoelectric ceramic plates each having a conductive layer formed on the surface thereof to serve as an internal electrode are laminated and bonded together with an adhesive, and the side surfaces of the obtained piezoelectric laminate are covered with an insulating material, and the first side surface is insulated. The portions corresponding to the internal electrodes of the object are removed every other layer to expose the end faces of the internal electrodes, and the portions corresponding to the internal electrodes of the insulator on the second side are shifted one layer from the first side and removed every other layer. A method for manufacturing a laminated piezoelectric element, characterized in that the end surfaces of the internal electrodes are exposed, external electrodes are provided on each of the first and second side surfaces, and the internal electrodes are connected on each side surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61042169A JPS62199074A (en) | 1986-02-27 | 1986-02-27 | Manufacture of laminated type piezoelectric element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61042169A JPS62199074A (en) | 1986-02-27 | 1986-02-27 | Manufacture of laminated type piezoelectric element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62199074A JPS62199074A (en) | 1987-09-02 |
| JPH0366822B2 true JPH0366822B2 (en) | 1991-10-18 |
Family
ID=12628466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61042169A Granted JPS62199074A (en) | 1986-02-27 | 1986-02-27 | Manufacture of laminated type piezoelectric element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62199074A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5493165A (en) * | 1993-10-14 | 1996-02-20 | At&T Corp. | Force generator for electrostrictive actuators |
| WO2004068097A1 (en) * | 2003-01-28 | 2004-08-12 | Cimeo Precision Co., Ltd. | Pressure sensor |
| FR2978301B1 (en) | 2011-07-18 | 2013-08-02 | Renault Sa | METHOD FOR ASSEMBLING AN ULTRASONIC TRANSDUCER AND TRANSDUCER OBTAINED BY THE METHOD |
| CN107398415B (en) * | 2011-09-20 | 2020-04-21 | 新宁研究院 | Ultrasound transducer and method of making an ultrasound transducer |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58196068A (en) * | 1982-05-12 | 1983-11-15 | Nec Corp | Electrostrictive effect element |
| JPS59122200A (en) * | 1982-12-28 | 1984-07-14 | Nec Corp | Method for connecting electrically internal electrode of electrostrictive element |
| JPS60154581A (en) * | 1984-01-23 | 1985-08-14 | Sony Corp | Laminated piezoelectric body and manufacture thereof |
-
1986
- 1986-02-27 JP JP61042169A patent/JPS62199074A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62199074A (en) | 1987-09-02 |
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