JPH0366986B2 - - Google Patents
Info
- Publication number
- JPH0366986B2 JPH0366986B2 JP12856284A JP12856284A JPH0366986B2 JP H0366986 B2 JPH0366986 B2 JP H0366986B2 JP 12856284 A JP12856284 A JP 12856284A JP 12856284 A JP12856284 A JP 12856284A JP H0366986 B2 JPH0366986 B2 JP H0366986B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- spring
- spring material
- clad
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 claims description 8
- 238000005476 soldering Methods 0.000 description 4
- 238000005253 cladding Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Springs (AREA)
- Contacts (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、リレー，スイツチ，コレクター等の
電気部品に用いる板ばね，線ばね，角形ばね等の
ばね材に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to spring materials such as leaf springs, wire springs, and square springs used in electrical components such as relays, switches, and collectors.
（従来技術とその問題点）
従来よりリレー，スイツチ，コネクター等の電
気部品には板ばね，線ばね，角形ばねが多用され
ているが、近時電気機器の小型化，高信頼性長寿
命化，経済化に伴つて、その寸法は益々薄く且つ
細い小物材料になり、しかも特性は疲れ強さが高
く且つクリープが小さく、さらに耐食性，はんだ
付性，電気伝導性が良好なことが要求されてい
る。(Prior art and its problems) Plate springs, wire springs, and square springs have traditionally been widely used in electrical parts such as relays, switches, and connectors, but in recent years electrical equipment has become smaller, more reliable, and has a longer life. ,With economicization, the dimensions have become thinner and thinner, and small materials are required to have high fatigue strength and low creep, as well as good corrosion resistance, solderability, and electrical conductivity. There is.
ばね材料としてはベリリウム銅が他の材料より
も優れていて、多用されていることは良く知られ
ている。 It is well known that beryllium copper is superior to other materials as a spring material and is widely used.
しかしベリリウム銅は、表面のベリリウムが酸
化され易すく還元がむずかしい為はんだ付工程が
複雑になる。即ちばね材に打抜き後予備はんだを
行つていたので、前処理が必要であり、またばね
材が小物になると作業工数の増大となる。その上
変形も生じ易いものである。 However, with beryllium copper, the soldering process is complicated because the beryllium on the surface is easily oxidized and difficult to reduce. That is, since preliminary soldering was performed on the spring material after punching, pretreatment is required, and if the spring material becomes a small item, the number of work steps increases. Moreover, deformation is likely to occur.
また溶接法を採ると、小物のばね材の場合熱影
響が大きく、電気機器組立て後の機能の信頼性，
長寿命化，経済性を低下させていた。 In addition, when welding is used, the thermal effect is large in the case of small spring materials, and the reliability of the function after electrical equipment is assembled may be affected.
This led to longer lifespans and lower economic efficiency.
（発明の目的）
本発明は上記の問題を解消すべくなされたもの
で、はんだ付性の良い電気部品用ばね材を提供す
ることを目的とするものである。(Objective of the Invention) The present invention was made to solve the above-mentioned problems, and an object of the present invention is to provide a spring material for electrical components that has good solderability.
（発明の構成）
本発明の電気部品用ばね材は、ベリリウム銅よ
り成る電気部品用ばね材に於いて、はんだ付部分
に厚さ0.1μｍ以上の銅をクラツドして成るもので
ある。(Structure of the Invention) The spring material for electrical components of the present invention is a spring material for electrical components made of beryllium copper, in which the soldered portion is clad with copper having a thickness of 0.1 μm or more.
本発明の電気部品用ばね材に於いて、はんだ付
部分に銅をクラツドした理由は、銅がクラツド性
が良いこと、はんだ付性が良いこと、Cuが基材
のベリリウム銅に拡散してもベリリウム銅のばね
特性が変らないこと等による。またクラツドする
銅の厚みを0.1μｍ以上とした理由は、0.1μｍ未満
の圧延加工が不可能であるからである。 In the spring material for electrical parts of the present invention, the reason why copper is clad in the soldered part is that copper has good cladding properties, good solderability, and even if Cu diffuses into the beryllium copper base material. This is due to the fact that the spring characteristics of beryllium copper do not change. The reason why the thickness of the cladding copper is set to be 0.1 μm or more is that it is impossible to roll the copper to less than 0.1 μm.
（実施例）
本発明の電気部品用ばね材の一実施例を図によ
つて説明する。第１図に示す如くBe2重量％−Cu
より成る厚さ0.8mm，幅30mmのリボン１と、Cuよ
り成る厚さ0.05mm，幅２mmのリボン２とを圧延加
工してクラツドし、これを焼鈍し、以後圧延，焼
鈍を２回繰返してBe2重量％−Cuを加工率約75％
の0.2mmまで圧延して、第２図に示す如くBe2重
量％−CuにクラツドされたCuの厚みを0.01mmと
なした。このクラツドリボン３をプレス抜きして
第３図に示す如く長さ25mm，幅２mm，一端部下側
に円弧状の突出部４を形成せる板ばね５を得た。
この板ばね５を310℃で，60分間析出処理した後、
クラツドされたCuの部分にはんだ付を行つた処、
はんだが良く流れて極めてはんだ付性に優れてい
た。(Example) An example of the spring material for electrical components of the present invention will be described with reference to the drawings. As shown in Figure 1, Be2wt%-Cu
A ribbon 1 with a thickness of 0.8 mm and a width of 30 mm made of Cu and a ribbon 2 with a thickness of 0.05 mm and a width of 2 mm made of Cu were rolled and clad, and then annealed. After that, rolling and annealing were repeated twice. Be2 weight% - Cu processing rate approximately 75%
As shown in FIG. 2, the thickness of the Cu clad with Be2 weight %-Cu was 0.01 mm. This clad ribbon 3 was pressed out to obtain a leaf spring 5 having a length of 25 mm, a width of 2 mm, and an arcuate protrusion 4 formed on the lower side of one end, as shown in FIG.
After this leaf spring 5 was subjected to precipitation treatment at 310°C for 60 minutes,
When soldering was done to the clad Cu part,
The solder flowed well and the solderability was excellent.
然るにCuをクラツドしないBe2重量％−Cuの
ばね材にて作つた第３図と同様の板ばねにはんだ
付を行つた処、はんだがのらず、はんだ付性が悪
かつた。 However, when soldering was performed on a leaf spring similar to that shown in Fig. 3 made from a Be2wt%-Cu spring material without Cu cladding, the solder did not adhere and the solderability was poor.
（発明の効果）
以上の説明で判るように本発明の電気部品用ば
ね材は、ベリリウム銅のばね材のはんだ付部分に
銅がクラツドされているので、表面にベリリウム
の酸化物が生ぜず、はんだ付性に優れ、また基材
のベリリウム銅に銅が拡張してもベリリウム銅の
ばね特性が変化しないので、電気機器の小型化に
伴つて、ばね材が小物になつても高い信頼性と長
寿命を維持できるという効果がある。(Effects of the Invention) As can be seen from the above explanation, in the spring material for electrical parts of the present invention, copper is clad in the soldered part of the beryllium copper spring material, so no beryllium oxide is produced on the surface. It has excellent solderability, and the spring characteristics of beryllium copper do not change even when copper expands into the base material, so it maintains high reliability even when spring materials become smaller as electrical equipment becomes smaller. It has the effect of maintaining a long life.
第１図乃至第３図は本発明の電気部品用ばね材
の一実施例の製作工程を示す斜視図である。
1 to 3 are perspective views showing the manufacturing process of an embodiment of the spring material for electrical parts of the present invention.
Claims (1)
いて、はんだ付部分に厚さ0.1μｍ以上の銅をクラ
ツドして成る電気部品用ばね材。1. A spring material for electrical components made of beryllium copper, in which the soldered part is clad with copper with a thickness of 0.1 μm or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12856284A JPS619971A (en) | 1984-06-22 | 1984-06-22 | Spring material for electric parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12856284A JPS619971A (en) | 1984-06-22 | 1984-06-22 | Spring material for electric parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS619971A JPS619971A (en) | 1986-01-17 |
| JPH0366986B2 true JPH0366986B2 (en) | 1991-10-21 |
Family
ID=14987832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12856284A Granted JPS619971A (en) | 1984-06-22 | 1984-06-22 | Spring material for electric parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS619971A (en) |
-
1984
- 1984-06-22 JP JP12856284A patent/JPS619971A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS619971A (en) | 1986-01-17 |
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